CN201601892U - Circuit board directly prepared on aluminum base plate or aluminum base radiating plate - Google Patents
Circuit board directly prepared on aluminum base plate or aluminum base radiating plate Download PDFInfo
- Publication number
- CN201601892U CN201601892U CN2009202845613U CN200920284561U CN201601892U CN 201601892 U CN201601892 U CN 201601892U CN 2009202845613 U CN2009202845613 U CN 2009202845613U CN 200920284561 U CN200920284561 U CN 200920284561U CN 201601892 U CN201601892 U CN 201601892U
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- aluminium base
- aluminum base
- circuit board
- oxide layer
- aluminum
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Abstract
The utility model discloses a circuit board directly prepared on an aluminum base plate or an aluminum base radiating plate, which comprises the aluminum base plate or the aluminum base radiating plate (1), an aluminum-oxide layer (2) and a silver paste circuit layer (3). The circuit board is mainly characterized in that the aluminum-oxide layer (2) exists on the surface of the aluminum base plate or the aluminum base radiating plate (1); the silver paste circuit layer (3) is printed on the surface of the aluminum-oxide layer (2) integrated with the aluminum base plate or the aluminum base radiating plate (1); and the thickness of the aluminum-oxide layer (2) ranges from 0.05mm to 0.10mm. The circuit board has the advantages of reasonable structure, simple preparing process, lower process cost, fine insulation performance and radiating performance of products and the like, and is an ideal circuit board for manufacturing large-power LED integrated illuminating lamps.
Description
Technical field
What the utility model was related is circuit board technology, specifically, relates to a kind of circuit board that directly prepares on aluminium base or aluminium base heating panel.
Background technology
The Metal Substrate copper clad laminate of prior art (such as Chinese patent application numbers 200620165311.4), be by metal substrate (cu, Al, Fe), the tack coat (nitride of the oxide of aluminium or nitride and boron, mixture with resin) and the Copper Foil compoiste adhering form, and be the disclosed printed circuit board (PCB) of CN196518A such as the Chinese patent publication number, it is by aluminium base, and alumina layer, insulating material tack coat and Copper Foil (comprising aluminium foil and nickel foil) bonding is formed or the like.
Take a broad view of above-mentioned patent (application) as seen, prior art includes tack coat.That is to say that they are bonded together metal substrate and Copper Foil by tack coat.And then by printing, wet chemical cleaning etc. Copper Foil is processed into circuit.Along with electronics industry development, the circuit board of especially high-power, high power capacity such as LED integrated lighting lamp circuit board, requires the sort circuit plate, not only has very high insulativity, and should have very high heat radiation degree.To keep normal, the long-term work of described circuit board.But, although people are in the insulation property that improve described circuit board, improve its heat dispersion by every possible means, in tack coat, add the additive of high insulation low thermal resistance, alundum (Al, aluminium nitride and boron nitride that routine patent as described in the preceding is included or the like, but the capacity of heat transmission owing to resin in the tack coat is lower eventually, so that its heat dispersion is still not fully up to expectations.And at the heat dispersion of the described patent in back (application) because it exists al oxide layer and resin-bonded layer (pure resin), although and al oxide layer has the performance of high resistance low thermal resistance, eventually since resin-bonded layer (do not contain Al
2O
3Pure resin bed Deng additive) existence, and obviously reduced heat dispersion.
Can so, on aluminium base or aluminium base heating panel, directly prepare circuit board without tack coat with high insulating property and high heat dispersion? this just becomes the current important topic of research and development in the industry.
Summary of the invention
The purpose of this utility model is to provide a kind of have high insulating property and high heat dispersion, and the direct circuit board of preparation on aluminium base or aluminium base heating panel is satisfying the demand of current electronics industry development.
The utility model realizes that the technical scheme of its purpose is:
A kind of circuit board that on aluminium base or aluminium base heating panel, directly prepares, comprise aluminium base or aluminium base heating panel, its innovative point is, also comprises the al oxide layer that is present in aluminium base or aluminium base heating panel surface and is printed on the silver slurry circuit layer of aluminum oxide laminar surface; Described al oxide layer and aluminium base or aluminium base heating panel be one each other, and the thickness of al oxide layer is in 0.05～0.10mm scope.
Can understand that by above given technical scheme the utility model is with aluminium base or aluminium base heating panel,, make a surface of aluminium base or aluminium base heating panel by oxidation on metal surface method (anode oxidation method); Be oxidized to al oxide layer (Al
2O
3), and make the thickness of al oxide layer reach 0.05～0.10mm, thus constitute have sufficient intensity, (thermal resistance is 0.06 ℃/W) an al oxide layer for enough insulation property and enough heat dispersions; Directly print silver slurry circuit layer at the aluminum oxide laminar surface then, thereby realized the purpose that the utility model will be realized.
In order fully to ensure the operate as normal of silver slurry printed circuit, the utility model also at the pad of silver slurry printed circuit and the blank position of circuit, is laid with the welding resistance insulating barrier.
The utility model advocates that also the end face of described welding resistance insulating barrier is lower than silver slurry circuit layer.Such technical scheme can make things convenient for the laying welding of silver slurry circuit and electronic component.
The utility model is also advocated, described welding resistance insulating barrier is the colorful one resin ink lay.This technical scheme for the utility model technological process of production management with for the identification of multiple different product etc., all will be brought very favourable effect.
After technique scheme was implemented, the structure that the utility model had was simple relatively, and preparation technology is simple and easy, and the technology cost is relatively low, and product has characteristics such as good insulation performance performance and heat dispersion, is conspicuous.
Description of drawings
Fig. 1 is the layer structure schematic diagram (amplification) of a kind of embodiment on aluminium base 1 of the utility model.Aluminium base 1 shown in this figure is transformed at lateral surface and along its Width is furnished with the aluminium base heating panel of some heatsink transverse fins, be the layer structure schematic diagram of another kind of embodiment on aluminium base heating panel.
Embodiment
Ask for an interview accompanying drawing 1, a kind of circuit board that on aluminium base or aluminium base heating panel, directly prepares, comprise aluminium base or aluminium base heating panel 1, also comprise al oxide layer 2 that is present in aluminium base or aluminium base heating panel 1 surface and the silver slurry circuit layer 3 that is printed on al oxide layer 2 surfaces by silk screen printing; Described al oxide layer 2 and aluminium base or aluminium base heating panel 1 be one each other, and the thickness of al oxide layer (2) is in 0.05～0.10mm scope.Also comprise welding resistance insulating barrier 4; Described welding resistance insulating barrier 4 is laid in the pad of silver slurry circuit layer 3 and the blank position of circuit by silk screen printing.The end face of described welding resistance insulating barrier 4 is lower than silver slurry circuit layer 3.Described welding resistance insulating barrier 4 is the colorful one epoxy resin printing ink layers.
According to another data-searching, adopt the oxidation on metal surface method at present, the thickness of the al oxide layer on prepared aluminium base surface is only about 0.02mm.And the thickness of this described al oxide layer is the specification requirement that at all can't reach insulation.Therefore, in the preparation process of the described circuit board of prior art, have to add (or reservation) insulation adhesive layer, have enough insulation property to guarantee described circuit board.
So, the thickness of al oxide layer described in the utility model, how to reach 0.05～0.10mm again? the concise and to the point description that the utility model al oxide layer forms is, at sulfuric acid concentration is in the electrolyte of 20g/L, to be not less than 15 ℃ and be lower than 20 ℃ bath temperature, providing by Bai'an U.S. (Hong Kong) process for treating surface Co., Ltd, under normal temperature hardening oxidation and ornamental oxidation the participation with additive PL-EE 3% (volume ratio), anodized aluminum substrate or aluminium base heating panel, time is controlled in 1～2h scope, on a surface of aluminium base or aluminium base heating panel, promptly form the anode al oxide layer of thickness at 0.05～0.10mm.
The practical function of first sample LED integrated lighting lamp circuit board of the present utility model is very gratifying.
Range of application of the present utility model is not subjected to the restriction of this declarative description.
Claims (4)
- One kind on aluminium base or aluminium base heating panel directly the preparation circuit board, comprise aluminium base or aluminium base heating panel (1), it is characterized in that, also comprise the al oxide layer (2) that is present in aluminium base or aluminium base heating panel (1) surface and be printed on the surperficial silver slurry circuit layer (3) of al oxide layer (2); Described al oxide layer (2) and aluminium base or aluminium base heating panel (1) be one each other, and the thickness of al oxide layer (2) is in 0.05～0.10mm scope.
- 2. circuit board according to claim 1 is characterized in that, also comprises welding resistance insulating barrier (4); Described welding resistance insulating barrier (4) is laid in the pad of silver slurry circuit layer (3) and the blank position of circuit.
- 3. circuit board according to claim 2 is characterized in that, the end face of described welding resistance insulating barrier (4) is lower than silver slurry circuit layer (3).
- 4. according to claim 2 or 3 described circuit boards, it is characterized in that described welding resistance insulating barrier (4) is the colorful one resin ink lay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202845613U CN201601892U (en) | 2009-12-09 | 2009-12-09 | Circuit board directly prepared on aluminum base plate or aluminum base radiating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202845613U CN201601892U (en) | 2009-12-09 | 2009-12-09 | Circuit board directly prepared on aluminum base plate or aluminum base radiating plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201601892U true CN201601892U (en) | 2010-10-06 |
Family
ID=42812949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202845613U Expired - Lifetime CN201601892U (en) | 2009-12-09 | 2009-12-09 | Circuit board directly prepared on aluminum base plate or aluminum base radiating plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201601892U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102964921A (en) * | 2012-11-14 | 2013-03-13 | 宁波市柯玛士太阳能科技有限公司 | Ink for circuit board of LED (light-emitting diode) lamp aluminium substrate |
| CN103716980A (en) * | 2013-12-30 | 2014-04-09 | 重庆博耐特实业（集团）有限公司 | Positive electrode oxidation film printing substrate used for power module |
| CN106465533A (en) * | 2014-02-28 | 2017-02-22 | 奥特斯奥地利科技与系统技术有限公司 | Heat spreader in multilayer build ups |
| CN103889141B (en) * | 2012-12-20 | 2017-12-26 | 北京中科纳通科技有限公司 | A kind of high heat radiation aluminium-based LED circuit board and preparation method thereof |
| CN113133213A (en) * | 2019-12-30 | 2021-07-16 | 亚洲钢铁株式会社 | Method for manufacturing metal substrate and metal substrate manufactured by the method |
-
2009
- 2009-12-09 CN CN2009202845613U patent/CN201601892U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102964921A (en) * | 2012-11-14 | 2013-03-13 | 宁波市柯玛士太阳能科技有限公司 | Ink for circuit board of LED (light-emitting diode) lamp aluminium substrate |
| CN103889141B (en) * | 2012-12-20 | 2017-12-26 | 北京中科纳通科技有限公司 | A kind of high heat radiation aluminium-based LED circuit board and preparation method thereof |
| CN103716980A (en) * | 2013-12-30 | 2014-04-09 | 重庆博耐特实业（集团）有限公司 | Positive electrode oxidation film printing substrate used for power module |
| CN106465533A (en) * | 2014-02-28 | 2017-02-22 | 奥特斯奥地利科技与系统技术有限公司 | Heat spreader in multilayer build ups |
| CN113133213A (en) * | 2019-12-30 | 2021-07-16 | 亚洲钢铁株式会社 | Method for manufacturing metal substrate and metal substrate manufactured by the method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20101006 |
|
| CX01 | Expiry of patent term |