CN201601131U - LED light source with heat sink - Google Patents

Abstract

An LED light source with a heat sink relates to an LED light source. The conventional LED light source has low heat sink efficiency, big volume and lots of working procedures. The utility model includes a base, a plurality of LED chips arranged on the upper surface of the base and an electrode leading-out area connected with a drive power supply, and is characterized in that a convex rib is extended from the lower part of the base; a heat sink slot is arranged in the middle of the convex rib; the upper part of the base is provided with an LED chip carrier and the lower part of it is provided with the heat sink. Compared with a split type structure of the LED light source and the heat sink in prior art, the utility model avoids thermal resistance at the connection position therebetween; and heat generated in operation of the LED chip is directly transmitted to a radiating fin through the base and is not obstructed by the thermal resistance layer such as a bonding layer therebetween, thus greatly increasing the radiating efficiency, improving heat sink and quality of the LED lamp, and reducing volume of the lamp body for accepting the LED. The product is in standardization and serialization; the working procedure is less and the processing efficiency is high.

Description

The led light source of band heat abstractor

[technical field]

The utility model relates to a kind of led light source, refers to the led light source of band heat abstractor especially.

[background technology]

Because the LED lamp meets the low-carbon economy direction, so a lot of lamps ﹠ lanterns factory all transfers to produce the LED lamp.The LED lamp of producing on the market, go analysis can be divided into two classes from technical standpoint: a class is that for example the LED with three 1W puts into equilateral triangle with low power LED combination, and adding case becomes a lamp.What exteriorly, it sent is only uniform.In fact on its plane of illumination, the distribution of light is uneven.Under this illumination, work and very easily cause visual fatigue, the eyesight of harm people.

Another kind of is the lamp made from a led light source of integrated encapsulation method making, and this lamp is because have only a luminous element, and the consistency of illumination and uniformity are all relatively good.But the LED lamp except common light fixture to intensity of illumination with to the photochromic requirement, also have very important characteristics will dispel the heat exactly, and lamp can only rely on cross-ventilation heat radiation and small heat loss through radiation, and this has just caused the LED lamp body greatly long-pending, the defective of Heavy Weight.I have applied for one and have been called " LED heat sink for lamp and processing method thereof " patent of invention, proposed to adopt the mode of fin with the back clamping of pegging graft, reduced the weight and volume of LED lamp significantly, but Shang Youxu waits to improve, improve part, wherein led chip and heat abstractor are two independently parts, there is thermal resistance in both joint portions, have influenced the quality-improving of LED lamp.

[summary of the invention]

The technical assignment of the technical problems to be solved in the utility model and proposition is that the prior art scheme is improved and improved, and a kind of led light source with heat abstractor is provided, to reach the purpose of further reduction thermal resistance, raising LED quality.For this reason, the utility model is taked following technical scheme:

The led light source of band heat abstractor, the electrode draw-out area that comprises base, is located at a plurality of led chips of base upper surface and is convenient to be connected with driving power is characterized in that: described base bottom is extended with convex tendon, and the centre of described convex tendon offers radiating groove.Base top is the led chip supporting body, the bottom is a heat abstractor, different with led light source in the prior art with the heat abstractor split-type structural, avoid the generation of both junction thermal resistances, the heat that produces during led chip work directly passes to fin by base, thermoresistance layers such as middle no adhesive linkage, significantly improve radiating efficiency, improved the heat radiation of LED lamp, improved the quality of lamp, and can make the standardization of products, seriation.Convex tendon and radiating groove can increase area of dissipation, improve radiating efficiency, radiating groove can be used for the fin of pegging graft simultaneously, strengthen radiating effect, the two sides of the convex tendon of this moment just can be used as the force surface of clamping, the fin card that is plugged in the radiating groove is ended in radiating groove, and need not to adopt welding or bonding mode.

As the further of technique scheme improved and replenish, the utility model also comprises following additional technical feature:

That described convex tendon cross section is is trapezoidal, rectangle or involute profile, the fin of pegging graft in the described radiating groove, radiating groove and fin interference fit so that the fin card end in radiating groove.The heat that led chip produces is passed to convex tendon from the upper surface of base, and the two sides of convex tendon are used for the application of force makes radiating groove that the fin card is ended in groove, and being provided with of convex tendon increased area of dissipation simultaneously, improves radiating effect.Adopt mechanical pressing mode fixing cooling fins, increase work efficiency, guarantee product quality.Base adopts highly heat-conductive material, can be metal material or nonmetallic materials, for example carbon nanomaterial; Fin is made by light weight, material that thermal conductivity is high, can be laminar metal material, as copper or aluminium, also can be carbon materials, as graphite, nano-sized carbon, composite carbon element material etc., can also be ceramic material, as aluminium nitride, aluminium oxide etc.; Base and fin are made respectively, are guaranteeing effectively to reduce weight, the cost of heat abstractor under the prerequisite of function separately; Fin and radiating groove are interference fit so that the fin card ends in radiating groove, the heat radiation cell wall of fin and mount pad directly attaches, contact-making surface is big, and there is not thermal resistance material in the centre, and the heat that led chip produces is directly passed to the fin of being close to by base, heat is transmitted fast, rapid heat dissipation is compared the product of same radiating effect, and volume is little, in light weight, be convenient to Design of Luminaires, installation.If adopt the mode of welding between fin and the mount pad, though can obtain good hot link and mechanical strength, but the selection to fin has certain restriction, fin as carbon nanomaterial can't directly weld, even the fin of aluminum, welding be difficulty comparatively also, require operating personnel's weld horizontal height, otherwise easily produce situations such as leaking weldering, influence heat is transmitted; If adopt the mode of bonding, will form a tack coat between fin and the mount pad, the thermal conductivity of tack coat is no more than 2.0W/MK usually, and this will form thermal resistance one by between, influences radiating effect.

Described base is tabular, and described convex tendon parallel arrangement is in the back side of base.

Described base is column, and described convex tendon is the radial side that is arranged in base.It is "T"-shaped that the cross section of base can be, and the top is used for the fixing of chip, and the bottom is used for the fixing of fin, fin except that a side and radiating groove clamping, its upper lateral part can touch with base.

The upper surface of described base is the led chip loading end, and described led chip loading end is the plane, and a plurality of conduction regions that match with led chip are established in its top, is electrically connected between the led chip and adopts series, parallel or connection in series-parallel combination.One conduction region is put a led chip, and chip all is electrically connected with the electrode draw-out area.

Described conduction region comprises puts led chip district and intersection region, and the described area of putting the led chip district is greater than the led chip area, electric insulation between described conduction region and the base, electric insulation between the conduction region.The area of conduction region should be greater than the chip area that is placed in above it, and in order to heat radiation, intersection region is used for wiring, and led chip is connected.If base is an electric conductor, then need to establish insulating barrier between conduction region and the base, be used for insulating between the led chip, if heat dissipation base is made by the material of nonconducting high heat conduction, then can not establish insulating barrier, on heat dissipation base, directly make conduction region and electrode draw-out area and get final product.

The periphery of led chip loading end is provided with the frame that encloses that is higher than led chip.Enclose frame and be convenient to the coating of light transmission medium layer, prevent excessively, be higher than led chip, can prevent effectively that led chip from damaging in making, use, transportation because of enclosing frame.

A plurality of chips of being located at same led chip loading end are photochromic chip of the same race or are multiple photochromic chip.To satisfy the requirement of producing the photochromic light source of difference.

Described led chip top is covered with optical material layer or light-converting material layer.For example on the chip of blue light-emitting, cover fluorescent material, just can make white light LEDs.

Beneficial effect:

1. help improving the quality of products.Because light source links to each other with fin by the radiating groove of being located at base, base top is as the supporting body of led chip, the bottom is as the part of heat abstractor, simplified the technological process of system lamp significantly, remove the led light source welding from or otherwise be installed to operation on the independent radiator, eliminated the thermal resistance between led light source and radiator, reduce overall thermal resistance, improve functional reliability, guaranteed the life-span of LED, more can not take place because of loose contact between the two, heat conduction is bad, so that damages the situation generation of LED.

2. be convenient to realize the batch process of industrialization, fin is pegged graft and can be realized that to the convex tendon both sides application of force both reliably connect behind the radiating groove, adopts suitable anchor clamps, tool just can adapt to mechanized production, is convenient to produce in enormous quantities.

3. help seriation, the generalization of product, reasonably design after what a product, go for the plurality of specifications product.For example, former design is made the LED of a 5W with 70 12mil * 12mil chip, if make 3W LED into, as long as chip area is changed little one-tenth 9mil * 9mil, other structure all need not to change.As long as change the number of series connection chip, also need not to change other structures for different civil powers.

4. wide adaptability, it can both be suitable for planar structure chip, vertical stratification chip and flip-chip.

5. help the raising of whole lamp efficient, particularly the lamp efficient of power below 10W is had by a relatively large margin raising.Power is many below 12V at the LED driving voltage below the 10W at present, and electric current often reaches the hundreds of milliampere, and so the efficient of driving power is difficult to do height.Generally can only accomplish 50% ~ 60%.Using this method can bring up to voltage more than the 100V, and only tens milliamperes in electric current, the efficient of driving power is easy to accomplish more than 80%, has improved whole lamp efficient greatly.

[description of drawings]

Fig. 1 (a) is the base cross-sectional view;

Fig. 1 (b) is the base perspective view;

Fig. 2 (a) is a chip layout structure vertical view;

Fig. 2 (b) is Fig. 2 (a) cutaway view;

Fig. 3 sets up the understructure vertical view that encloses behind the frame;

Fig. 4 is planar structure chip three strings three and is electrically connected schematic diagram;

Fig. 5 is vertical stratification chip three strings three and is electrically connected schematic diagram;

Fig. 6 is a led light source structural representation of the present utility model;

Fig. 7 is another perspective view of base;

Fig. 8 is a LED bulb lamp structural representation.

[embodiment]

Below in conjunction with Figure of description the technical solution of the utility model is described in further detail.

As shown in Figure 6, the utility model comprises base 1, is located at a plurality of led chips 3 on base 1 top, connects the electric-conductor of chip 3, base 1 bottom is extended with convex tendon 11, have the radiating groove 12 of the fin 2 that is used to peg graft in the middle of the convex tendon, fin 2 and radiating groove 12 be interference fit so that fin 2 cards only in radiating groove 12; The convex tendon 11 of extension is established in base 1 bottom, and that convex tendon 11 cross sections are is trapezoidal, rectangle or involute profile, and its middle part has radiating groove 12.Base 1 can be had a multiple shape according to the difference of design, is tabular, and convex tendon 11 parallel arrangements are in the back side of base 1, and shown in Fig. 1 (a), Fig. 1 (b), base 1 side of being is tabular, and as shown in Figure 8, base 1 is discoideus; As shown in Figure 7, base 1 also can be column, and it is "T"-shaped that the cross section is, and the top is used for the fixing of chip 3, the uniform convex tendon 11 of the arc surface of base 1 bottom.The upper surface of base 1 is a led chip loading end 13, it is the plane, shown in Fig. 2 (a), above led chip loading end 13, establish conduction region 4 a plurality of and that led chip 3 matches and reach the electrode draw-out area 5 that is electrically connected with led chip 3, wherein conduction region 4 comprises and puts led chip district 41 and intersection region 42, the area of putting led chip district 41 is greater than led chip 3 areas, and led chip 3 tops are covered with optical material layer or light-converting material layer.As shown in Figure 3, the periphery of led chip loading end 13 be provided be higher than led chip 3 enclose frame 7.If base 1 is an electric conductor, then need between the base 1 of conduction region 4 and conduction, set up insulating barrier 6, make the electric insulation that reaches between the conduction region between conduction region and the electrode draw-out area, shown in Fig. 2 (b).

The led light source manufacture method of band heat abstractor may further comprise the steps:

1) base 1 procedure of processing is made the base 1 of being with convex tendon 11;

2) radiating groove 12 procedure of processings behind the centering positioning base 1, are opened corresponding radiating groove 12 with mach mode on convex tendon 11, the width of radiating groove 12 is slightly larger than fin 2 thickness;

3) grafting fin 2 steps are inserted fin 2 in the radiating groove 12;

4) distortion clamps step, is exerted pressure in convex tendon 11 both sides, makes radiating groove 12 to internal strain, and fin 2 cards are ended in radiating groove 12;

5) conduction region 4 procedure of processings if base 1 is an electric conductor, is then established insulating barrier 6, and cover conductive layer on insulating barriers 6 on the led chip loading end of base 1, conductive layer forms conduction region 4 and electrode draw-out area 5 after corroding; If base 1 be insulator, then directly base 1 cover conductive layer after corrosion formation conduction region 4 and electrode draw-out area;

6) establish and enclose frame 7 steps, base 1LED chip bearing face periphery is established and is enclosed frame 7, and adopting directly, mode bonding or clamping connects;

7) led chip 3 bondings, connection step are overlying on led chip 3 on the conduction region 4, and by lead led chip 3 are linked to each other with electrode draw-out area 5.

Make base 1 with a kind of highly heat-conductive material, the most frequently used material is exactly an alloy aluminum, also can use nonmetallic materials, for example carbon nanomaterial.The shape of base 1 can be any in " heat abstractor " patent, promptly can be circle, polygon etc.But this base 1 face must be the plane in the utility model.Drawn a kind of schematic diagram of the base of being convenient to make most 1 of Fig. 1, if the material of this base 1 is an aluminium, so can be according to the technology of general making aluminum-based circuit board, it is made a kind of aluminum-based circuit board that has the convex tendon 11 that dispels the heat of special novelty, promptly earlier doing insulating barrier 6 on the flat substantially one side, be covered with conductive layer again, then conductive layer made the figure that designs.Shown in Fig. 2 (a), each sub-district on the led chip loading end of base 1 is an independent conductive 4, base 1 insulation of it and aluminium matter, also with 4 insulation of adjacent conductive district, the area of conduction region 4 has two parts: a part is used to place chip 3, for putting led chip district 41, area is bigger, another part area is less, is intersection region 42, is used for wiring to power to chip 3 bottoms.Among Fig. 2, the usefulness that electrode draw-out area 5 supplies the terminal of chip 3 electrical ties to be connected with outer driving power.The area of chip 3 can be from 8mil * 8mil to 50mil * 50mil, to power little can use 8mil * 8mil or 12mil * 12mil chip 3.To power very big can use 40mil * 40mil, even large chip 3 more.Chip 3 quantity can be from several to dozens of even more than 100.The area of conduction region 4, shape and number are decided by chip 3 kinds and the quantity that adopt, and the area of conduction region 4 should be greater than chip 3 areas that are placed in above it, and big as far as possible, in order to heat radiation.Electrode draws the design of locating line so that the electrical connection between the chip 3 and deciding.If heat dissipation base 1 is made for non-conductive and material high heat conduction, that just can save the insulating barrier 6 shown in Fig. 2 (b), directly makes conduction region 4 and the electrode place of drawing district on heat dissipation base 1.Add that in the periphery of conduction region 4 and electrode draw-out area 5 one encloses frame 7, be convenient to the coating of light transmission medium layer and the protection of chip 3.As shown in Figure 3, so just become a kind of brand-new suitable integrated encapsulated LED base 1 that has possessed heat sinking function.

The installation of led chip, wiring are made, and led chip 3 are bondd or are welded to put in the led chip district 41, and each is put and lays a chip 3 in the led chip district 41, is electrically connected between chip 3 then.Can series, parallel or string and combination between them.For the led chip 3 of planar structure, because the positive and negative electrode of chip 3 is all at the upper surface of chip 3, the electrical connection between the chip 3 is very convenient.Be series, parallel or be connected into earlier several groups more in addition parallel connection all do not have difficulty, as shown in Figure 4.If usefulness is the chip 3 of vertical stratification, then to use the material of conduction, for example scolding tin, silver slurry.Chip 3 is installed on the conduction region 4, and the less part intersection region 42 of area has just become the lead-out wire of chip 3 bottom-side electrodes on the conduction region 4, just can be electrically connected by it.Fig. 5 a kind of schematic diagram that is electrically connected with vertical stratification chip 3 that drawn.The power of what and the LED that makes highly as required of the size of base 1 area, contained convex tendon 11 and deciding.Under the very little situation of power, can not insert fin, and under the bigger situation of power, for improving heat radiation, enhancing product performance reduces volume and weight simultaneously.Can adopt my invention in the method described in " heat abstractor " patent, promptly a radiating groove 12 is opened at convex tendon 11 tops, inserts nanometer carbon plate (also can be other high heat sink material thin slice).In the method, can adjust power by the size of selecting chip 3 after the typing with the heat radiation that designs of power consumption maximum in these series of products, institute is so that standardization, seriation.

The led chip 3 that is comprised among LED in the utility model can be bill one wavelength light, also can be that the led chip 3 of multiple different wavelengths of light is combined and made a LED.Adjust the electric current by each photochromic led chip 3, it is hundreds of photochromic just can to allow LED send, and realizes intelligent the illumination.

Because light source links to each other with fin 2 by the radiating groove 12 of being located at base 1, base 1 both as the supporting body of led chip 3 also as the part of heat abstractor, so simplified the technological process of system lamp significantly, remove the led light source welding from or otherwise be installed to the first-class operation of independent radiator, more exempt the drawback of led light source and radiator loose contact, improved the reliability of lamp greatly.Fig. 6 is a led light source overall diagram of making of the utility model.

For fixed led light source, mix suitable constant-current driving power supply, just can work.With present circuit production level, as the LED of driving power load, to connect manyly more, the efficient of power supply is high more, so method of the present utility model also is very favorable to the efficient that improves whole lamp.

Embodiment one:

Now adopt in the utility model the method that led chip 3 and heat abstractor are combined into one specifically to make a 3W white LED light source,

Method described in the making of LED base 1, application " heat abstractor " this patent, we adopt the LED base 1 of structure as shown in Figure 7.Is the front a diameter? 2 circle, the back side have 6 convex tendons 11, middle 4 convex tendons 11, and the centre of each convex tendon 11 has the radiating groove 12 of 0.6mm, is used for inserting the carbon nanometer fin 2 that thickness is 0.5mm or the fin 2 of other highly heat-conductive material.The height of fin 2 is determined according to the requirement of heat radiation and the situation of lamp body permission.High in this example for mechanical method it and convex tendon 11 being compressed after 2 insertions of 4mm fin.

Usefulness and the identical method of making aluminum-based circuit board are made the figure that led chip 3 is installed on the front of base 1.Adopt the blue chip 3 of 63 12mil * 12mil in the present embodiment, they are by 9 * 7 arranged, and all draw from electrode draw-out area 5 the series connection back.

Add an insulation in the periphery that led chip 3 is installed figure and enclose frame 7, limit glimmering smooth powder Rubber applying area, and the spun gold 8 of protection chip 3 and electrical connection.The later manufacture craft and the technology of general integrated encapsulation are similar, and is promptly solid before this brilliant, and chip 3 is installed on chip 3 installation sites that design, and subsequent processing is with spun gold 8 ultra-sonic welded, does all electrical connections of series connection.Next again operation is coating fluorescent material and solidifies that so just having formed collection led chip 3, a heat abstractor is the novel led light source of one.

Embodiment two:

Adopt method of the present utility model, make a 7W blue-ray LED.

Increased among the power ratio embodiment 1 because of LED a lot, so whole LED base 1 adopts the plinth 1 shown in Fig. 1.The planar section of plinth 1 is of a size of 24mm * 24mm, and there are 6 convex tendons 11 at the back, and height has radiating grooves 12 of 0.5-0.6mm at 2-10mm in the middle of middle 4 convex tendons, 11 each convex tendon 11, identical among effect and the embodiment one.

The front is also similar with embodiment one, makes chip 3 and lays the district.Adopt 14mil * 38 of 14mil blue chips to be arranged in 9 * 9 matrix in this example, all series connection.As shown in Figure 2, corresponding with square base 1, the outer frame 7 that encloses of chip 3 installing zones is also done squarely, is fixed on the base 1, and is identical among the step of making led light source thereafter and the embodiment 1, just this operation of coating fluorescent material made into transparent optical cement and gets final product.

Embodiment three:

Use the utility model method and make a colour changeable led light source.

Changeable colour LED forms with three kinds of chips of red, green, blue 3 in the market.Adopting emission wavelength in the present embodiment is 455nm, 525nm, and 585nm, four kinds of chips 3 of 630nm are formed the led light source that can change glow color.

In the present embodiment, identical among LED base 1 structure and the embodiment 2.Mixing us at the branch of chip 3 is that 3,27 emission wavelengths of 455nm chip are 525nm with 18 emission wavelengths, and 18 emission wavelengths are that 3,18 emission wavelengths of 585nm chip are 630nm chip 3, and every kind of chip 3 electrodes are drawn respectively.It is luminous to remove to drive four kinds of photochromic led chips 3 respectively with four adjustable power supplys of electric current.Each organizes the collocation of different electric currents, can obtain multicolour.

Above-mentioned light source and other device assembling back forms various light fixture, as when making a 3WLED bulb lamp, can adopt the led light source among the embodiment one owing to be in series by 63 blue chips 3, driving DC voltage up to 200V about, and electric current 15mA only.If behind the 220V commercial power rectification, step-down a little promptly can be used as the driving to led light source.Very general to tens milliamperes integrated drive electronics on the market, so can easily make the drive circuit of a high efficiency, small size.New light sources and driving power 9 appearance of packing into is had in the plastic chamber of air vent hole, and the top is case in addition, afterbody add electrical connector that E27 or E14 etc. are international a LED lamp, its profile and result are as shown in Figure 8.Easy to assembly, be easy to realize producing in batches.

Claims (9)

1. be with the led light source of heat abstractor, the electrode draw-out area that comprises base (1), is located at a plurality of led chips (3) of base (1) upper surface and is convenient to be connected with driving power, it is characterized in that: described base (1) bottom is extended with convex tendon (11), and the centre of described convex tendon (11) offers radiating groove (12).

2. the led light source of band heat abstractor according to claim 1, it is characterized in that: described convex tendon (11) cross section is trapezoidal, rectangle or involute profile, the fin of pegging graft in the described radiating groove, radiating groove (12) with fin (2) interference fit so that fin (2) card end in radiating groove (12).

3. the led light source of band heat abstractor according to claim 2 is characterized in that: described base (1) is tabular, and convex tendon (11) parallel arrangement is in the back side of base (1).

4. the led light source of band heat abstractor according to claim 2 is characterized in that: described base (1) is column, and described convex tendon (11) is the radial side that is arranged in base (1).

5. according to the led light source of the described band heat abstractor of the arbitrary claim of claim 1-4, it is characterized in that: the upper surface of described base (1) is led chip loading end (13), described led chip loading end (13) is the plane, a plurality of conduction regions (4) that match with led chip (3) are established in its top, are electrically connected between the led chip (3) to adopt series, parallel or connection in series-parallel combination.

6. the led light source of band heat abstractor according to claim 5, it is characterized in that: described conduction region (4) comprises puts led chip district (41) and intersection region (42), the described area in led chip district (41) of putting is greater than led chip (3) area, electric insulation between described conduction region (4) and the base (1), electric insulation between the conduction region (4).

7. the led light source of band heat abstractor according to claim 6 is characterized in that: the periphery of described led chip loading end (13) be provided be higher than led chip (3) enclose frame (7).

8. the led light source of band heat abstractor according to claim 7 is characterized in that: a plurality of chips of being located at same led chip loading end (13) are photochromic chip of the same race (3) or are multiple photochromic chip (3).

9. the led light source of band heat abstractor according to claim 8 is characterized in that: described led chip (3) top is covered with optical material layer or light-converting material layer.

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