CN201527866U - Surface mounted concave type electrode network resistor - Google Patents
Surface mounted concave type electrode network resistor Download PDFInfo
- Publication number
- CN201527866U CN201527866U CN2009202324391U CN200920232439U CN201527866U CN 201527866 U CN201527866 U CN 201527866U CN 2009202324391 U CN2009202324391 U CN 2009202324391U CN 200920232439 U CN200920232439 U CN 200920232439U CN 201527866 U CN201527866 U CN 201527866U
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Abstract
The utility model discloses a surface mounted concave type electrode network resistor. An insulating substrate is rectangular, and the two side surfaces of the substrate in which the long edges are positioned are sunk at intervals correspondingly to form a plurality of concave columns; front-electrodes are printed on the upper surface of the insulating substrate near the concave columns, and all the front-electrodes extend to the upper parts of the walls of the concave columns to form a side-electrode conducting layer; back-electrodes are arranged on the lower surface of the insulating substrate near the concave columns through sputtering; and sputtering layers are arranged on all the walls of the concave column through sputtering, so as to cover the side-electrode conducting layer and effectively form side-electrodes, thereby reducing quality hazard; resistor layers are printed between the front-electrodes on two sides on the upper surface of the insulating substrate; the front-electrodes at two ends are conducted through all the resistor layers; first protective layers are printed and covered between every two resistor layers; second protective layers are printed between the first protective layers and the front-electrodes; and nickel layers and tin layers are sequentially electroplated on the front-electrodes, the side-electrodes and the back-electrodes. Due to the adoption of the sputtering technology, the manufacture cost is reduced, and the market competitiveness of the network resistor is strengthened.
Description
Technical field
The utility model relates to a kind of resistor, particularly a kind of patch concave electrode network resistor.
Background technology
Patch concave electrode network resistor can be widely used in communication products such as each electric appliances, personal data storage, mobile phone, and promote the further miniaturization of this electronic product because little, the power of its small product size is big, dense arrangement, be easy to mount; Simultaneously less than normal relatively because of the spacing of its electrode, make its electrode that internal stress is installed and reduce and problem such as substrate fracture is reduced greatly.
Typical its side electrode of patch concave electrode network resistor prints the mode of grout and back up grout on hole wall forms by the front, following grout electrode, by on this, following grout electrode connects conducting and forms side electrode, it is right because insulated substrate inevitably exists song to stick up problem, make the vacuum of grout can produce inconsistent phenomenon, other adds the position difference of upper substrate perforation, make the inconsistent end electrode grout degree of depth that also can cause in path of air-flow can not guarantee unanimity, go up like this, the situation that following grout electrode just can occur unavoidably that electrode can not connect or not exclusively connect, will there be certain quality hidden danger in product when client is used, cause bad rising in the production process and client's satisfaction to descend.Again front electrode and backplate printing burn till the back thickness thicker, the raw material large usage quantity, and the printing raw material be to be the slug type slurry of main component with silver, its price is higher, causes production cost of products higher, the market competitiveness weakens.
Summary of the invention
In order to overcome above-mentioned defective, the utility model provides a kind of patch concave electrode network resistor, has improved the hidden danger of quality of patch concave electrode network resistor effectively, has saved manufacturing cost.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of patch concave electrode network resistor; comprise an insulated substrate; to use direction to be benchmark; this insulated substrate is rectangular; the corresponding respectively recessed post of some half round posts that has been recessed to form at interval in the two sides, place, long limit of this insulated substrate; the position that the upper surface of this insulated substrate closes on each recessed post all is printed with some front electrodes; and each front electrode extends to the wall top of recessed post and forms the side electrode conductting layer; there is backplate at the position of corresponding each front electrode of the lower surface of this insulated substrate all sputter; on the recessed post jamb face outside the side electrode conductting layer of described recessed post and this side electrode conductting layer all sputter sputtering layer is arranged; this side electrode conductting layer and sputtering layer are formed side electrode; correspondence is printed with resistive layer between the front electrode of these insulated substrate upper surface both sides; and each resistive layer extends on the close end of this resistive layer of the front electrode that covers its two ends; position between described each resistive layer and the resistive layer is all printed and is coated with first protective layer; all print on the insulated substrate between described first protective layer and each front electrode and be coated with second protective layer; described front electrode; all be electroplate with nickel dam on side electrode and the backplate, be electroplate with the tin layer on this nickel dam.
Described resistive layer is for being adjusted to the resistive layer of setting resistance by radium-shine laser.
Be printed with character code on described second protective layer.
The beneficial effects of the utility model are: backplate is that sputter forms, and the vacuum coating surface uniformity that sputter forms is good, the film layer structure densification, and its capability and performance is stable and manufacturing cost is lower, has strengthened product market competitiveness; Again because of the inevitable warpage issues that exists slightly of insulated substrate, and the inconsistent problem in grout path is printed in unavoidable existence in the printing grout technology of traditional patch concave electrode network resistor, may there be the shortcoming that can not be connected to form side electrode fully in the tradition patch concave electrode network resistor, and the mode by sputter on the side electrode conductting layer of recessed post and the recessed post jamb face outside this side electrode conductting layer all sputter sputtering layer is arranged, this side electrode conductting layer and sputtering layer are formed side electrode, guarantee formed side electrode conducting its pairing front electrode and backplate, greatly reduced hidden danger of quality.
Description of drawings
Fig. 1 is the utility model schematic diagram;
Fig. 2 is a generalized section of the present utility model.
Embodiment
Embodiment: a kind of patch concave electrode network resistor; comprise an insulated substrate 1; to use direction to be benchmark; this insulated substrate 1 is rectangular; the corresponding respectively recessed post of some half round posts that has been recessed to form at interval in the two sides, place, long limit of this insulated substrate 1; the position that the upper surface of this insulated substrate 1 closes on each recessed post all is printed with some front electrodes 22; and each front electrode 22 extends to the wall top of recessed post and forms the side electrode conductting layer; there is backplate 32 at the position of corresponding each front electrode 22 of the lower surface of this insulated substrate 1 all sputter; on the recessed post jamb face outside the side electrode conductting layer of described recessed post and this side electrode conductting layer all sputter sputtering layer is arranged; this side electrode conductting layer and sputtering layer are formed side electrode 33; correspondence is printed with resistive layer 6 between the front electrode 22 of these insulated substrate 1 upper surface both sides; and each resistive layer 23 extends on the front electrode 22 close ends of this resistive layer that cover its two ends; position between described each resistive layer and the resistive layer is all printed and is coated with first protective layer 24; all print on the insulated substrate between described first protective layer and each front electrode and be coated with second protective layer 25; described front electrode; all be electroplate with nickel dam 10 on side electrode and the backplate, be electroplate with tin layer 20 on this nickel dam 10.
Described resistive layer 6 is for being adjusted to the resistive layer of setting resistance by radium-shine laser.
Be printed with character code 27 on described second protective layer 25.
Backplate is that sputter forms, and the vacuum coating surface uniformity that sputter forms is good, the film layer structure densification, and its capability and performance is stable and manufacturing cost is lower, has strengthened product market competitiveness; Again because of the inevitable warpage issues that exists slightly of insulated substrate, and the inconsistent problem in grout path is printed in unavoidable existence in the printing grout technology of traditional patch concave electrode network resistor, may there be the shortcoming that can not be connected to form side electrode fully in the tradition patch concave electrode network resistor, and the mode by sputter on the side electrode conductting layer of recessed post and the recessed post jamb face outside this side electrode conductting layer all sputter sputtering layer is arranged, this side electrode conductting layer and sputtering layer are formed side electrode, guarantee formed side electrode conducting its pairing front electrode and backplate, greatly reduced hidden danger of quality.
Claims (3)
1. patch concave electrode network resistor; it is characterized in that: comprise an insulated substrate (1); to use direction to be benchmark; this insulated substrate (1) is rectangular; the corresponding respectively recessed post of some half round posts that has been recessed to form at interval in the two sides, place, long limit of this insulated substrate (1); the position that the upper surface of this insulated substrate (1) closes on each recessed post all is printed with some front electrodes (22); and each front electrode (22) extends to the wall top of recessed post and forms the side electrode conductting layer; there is backplate (32) at the position of corresponding each front electrode of the lower surface of this insulated substrate (1) (22) all sputter; on the recessed post jamb face outside the side electrode conductting layer of described recessed post and this side electrode conductting layer all sputter sputtering layer is arranged; this side electrode conductting layer and sputtering layer are formed side electrode (33); correspondence is printed with resistive layer (6) between the front electrode (22) of this insulated substrate (1) upper surface both sides; and each resistive layer (23) extends on the close end of this resistive layer of the front electrode (22) that covers its two ends; position between described each resistive layer and the resistive layer is all printed and is coated with first protective layer (24); all print on the insulated substrate between described first protective layer and each front electrode and be coated with second protective layer (25); described front electrode; all be electroplate with nickel dam (10) on side electrode and the backplate, be electroplate with tin layer (20) on this nickel dam (10).
2. patch concave electrode network resistor according to claim 1 is characterized in that: described resistive layer is for being adjusted to the resistive layer of setting resistance by radium-shine laser.
3. patch concave electrode network resistor according to claim 1 and 2 is characterized in that: be printed with character code (27) on described second protective layer (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202324391U CN201527866U (en) | 2009-09-18 | 2009-09-18 | Surface mounted concave type electrode network resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202324391U CN201527866U (en) | 2009-09-18 | 2009-09-18 | Surface mounted concave type electrode network resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201527866U true CN201527866U (en) | 2010-07-14 |
Family
ID=42519149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202324391U Expired - Lifetime CN201527866U (en) | 2009-09-18 | 2009-09-18 | Surface mounted concave type electrode network resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201527866U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104252936A (en) * | 2013-06-30 | 2014-12-31 | 天津市三环电阻有限公司 | Chip film fixed resistor with resistance of 10-1Momega |
| CN104252933A (en) * | 2013-06-30 | 2014-12-31 | 天津市三环电阻有限公司 | Chip film fixed resistor with resistance of 20-50Komega |
| CN108335811A (en) * | 2018-01-30 | 2018-07-27 | 旺诠科技(昆山)有限公司 | A method of producing reverse side concave electrode thick film chip resistor |
-
2009
- 2009-09-18 CN CN2009202324391U patent/CN201527866U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104252936A (en) * | 2013-06-30 | 2014-12-31 | 天津市三环电阻有限公司 | Chip film fixed resistor with resistance of 10-1Momega |
| CN104252933A (en) * | 2013-06-30 | 2014-12-31 | 天津市三环电阻有限公司 | Chip film fixed resistor with resistance of 20-50Komega |
| CN108335811A (en) * | 2018-01-30 | 2018-07-27 | 旺诠科技(昆山)有限公司 | A method of producing reverse side concave electrode thick film chip resistor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Sound technology (Xiamen) Co., Ltd. Assignor: Uniroyal Electronics Industry Co., Ltd. Contract record no.: 2012320010177 Denomination of utility model: Process for forming side electrode of chip concave type electrode network resistor Granted publication date: 20100714 License type: Exclusive License Record date: 20121031 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Sound technology (Xiamen) Co., Ltd. Assignor: Uniroyal Electronics Industry Co., Ltd. Contract record no.: 2012320010177 Date of cancellation: 20180619 |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20180706 Address after: 361100 Xiamen torch high tech Zone (Xiangan) Industrial Zone, Fujian, 301 Patentee after: Sound technology (Xiamen) Co., Ltd. Address before: 215334 No. 21, Xia Jia Bei Road, Kunshan economic and Technological Development Zone, Jiangsu Patentee before: Uniroyal Electronics Industry Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100714 |