CN201439545U

CN201439545U - Parcel plating device

Info

Publication number: CN201439545U
Application number: CN2009200728367U
Authority: CN
Inventors: 吕海波; 王振荣; 王洪
Original assignee: Shanghai Xinyang Semiconductor Material Co Ltd
Current assignee: Shanghai Xinyang Semiconductor Material Co Ltd
Priority date: 2009-05-22
Filing date: 2009-05-22
Publication date: 2010-04-21
Anticipated expiration: 2019-05-22

Abstract

The utility model discloses a parcel plating device, which comprises a plating fluid tank in which an anode is arranged. The utility model is characterized by comprising a hook support frame and more than two groups of hooks, wherein the hooks are arranged on the hook support frame, and the hooks are arranged along the direction parallel to the level of the plating fluid. The utility model has the advantages that the device is used conveniently, only a lead frame needs to be locally plated, material is saved, the parcel plating device at least can save more than 25 percent plating material, post processing technology is omitted, the operation is simple, time is saved, the efficiency is high, and the device has simple structure and is manufactured easily.

Description

The parcel plating device

Technical field

The utility model relates to a kind of parcel plating device.

Background technology

As shown in Figure 1, in the semicon industry, the electronic element 603 that a lot of equipment must use, it comprises pin 602, before use, need carry out the electroplating surface processing to electronic component 603 and pin 602.Because be applied in the semiconductor technology such as unicircuit, the volume of electronic element 603 and pin 602 is often very little.For adapting to needs of scale production; use limit muscle 604 with a plurality of electronic elements 603 with after pin 602 is connected; and on limit muscle 604, offer through hole 601; to overlap more and need galvanized electronic element and pin to electroplate in batch using a plurality of hooks on the hook carriage to pass through hole 601, limit muscle, electronic element and pin are collectively referred to as lead frame.Therefore, the limit muscle only is to use when lead frame is electroplated, and needs to cut away after plating is finished.As shown in Figure 2, the electroplating device that uses in the prior art, comprise electric bath groove 1 and hook (not shown), many group hooks are arranged on the hook rack 2 along arranging with the liquid level vertical direction, a plurality of lead frames 6 hang on the hook successively, and lead frame 6 also is along being arranged in parallel with liquid level vertical direction B (depth direction of electric bath groove just).During plating, for guaranteeing the electroplating effect of top lead frame, each hook and lead frame all are immersed in the electric bath groove, hook connects power supply one utmost point, anode is set in the electroplate liquid connects another utmost point of power supply, after the energising, the metallic cation in the electroplate liquid is subjected to lead frame to attract to converge on the lead frame, finishes plating.Though this equipment also can realize electroplating function, in electroplating process, muscle part in limit also is to be made by electro-conductive material, therefore, in electroplating process, also can electroplate layer of metal on the muscle of limit.And when reality was used, the limit muscle partly needed excision.Like this, the opposite side muscle is partly electroplated and has just been caused waste, has increased material cost, and the processing after the parcel plating of opposite side muscle also becomes thorny problem, directly abandons and will cause environmental pollution, as handle, need corresponding technology, increased processing links, then increase cost once more.And in hook and the equal immersion plating liquid of hook rack, hook rack and hook adopt electro-conductive material to make, and after its energising, also can electroplate the layer of metal material on hook and the hook rack, like this, electroplate in hook rack and hook surface, can waste plated material equally.Recycle as linking up with, after having electroplated a collection of lead frame, need carry out the strip processing, remove the metallic substance that its surface plates hook and hook rack with hook rack.Like this, the one, wasted plated material, the material of hook and hook rack electroplating surface accounts for more than 25% of employed plated material in the whole technological process, just will waste the plated material more than 25%; The 2nd, increased aftertreatment technology to hook and hook rack, make the whole process time prolong, efficient reduces.

The utility model content

The purpose of this utility model is in order to overcome deficiency of the prior art, a kind of parcel plating device that reduces plated material and water resource waste to be provided.

For realizing above purpose, the utility model is achieved through the following technical solutions:

The parcel plating device comprises electric bath groove, is provided with anode in the electric bath groove, it is characterized in that, also comprise hook carriage and two groups of above hooks, described hook is installed on the hook carriage, and two groups of above hooks are arranged along the direction parallel with the electroplate liquid liquid level.

Above-mentioned more than two groups, its implication comprises two groups.

Hook and hook carriage can adopt electro-conductive material to make, and during plating, only need the hook carriage is connect power supply one utmost point, can be energized to lead frame and electroplate.Adopt non-conducting material as hook and hook carriage, then use lead to switch in addition as lead frame.

Preferably, every group of hook number is two or more, two or more hook linear arrangement, and every group tangles a lead frame.Preferably, two hooks are one group, tangle a lead frame jointly.

Preferably, described hook carriage comprises frame parallel more than two and at least one crossbeam, two connect as one by crossbeam with upper side frame, hook is installed on the frame, and per the hook more than two is one group, lays respectively on the plural frame, described hook number is more than two groups, two groups of above hooks are arranged along the direction parallel with the electroplate liquid liquid level, and crossbeam or side frame are on the cell wall of electric bath groove

Preferably, also comprise the setting device that to adjust distance between liquid level and the cable address hook.

Preferably, described setting device is overflow groove or the overflow weir that is arranged on the electroplate liquid cell wall.

Preferably, described anode is the net formula.

Parcel plating device in the utility model, can make hook and the height of electroplating liquid level keep definite value, just can make when lead frame is electroplated needs galvanized part to be immersed in the electroplate liquid, electrode and limit muscle etc. do not need galvanized part can remain on more than the plating liquid level, in electroplating process, hook, hook carriage and limit muscle part can not plate plated material, reduced waste of material, and reduced the aftertreatment technology of limit muscle, electrode and hook carriage, both save material, simplified aftertreatment technology again.And, electroplated a collection of lead frame after, need not that hook carriage and hook are carried out strip and handle the plating just can proceed the next batch lead frame, saved the time, improved efficient.

Parcel plating device in the utility model is meant and can only electroplates need plated item surface, as to lead frame, just can only electroplate electronic element and pin.

The beneficial effects of the utility model are: easy to use, can only carry out parcel plating to lead frame, save material, use the parcel plating device in the utility model, can save plated material at least more than 25%, and saved aftertreatment technology, simple to operate, save time the efficient height, and device structure is simple, makes easily.

Description of drawings

Fig. 1 is the lead frame structure synoptic diagram;

Fig. 2 is an electroplanting device structural representation of the prior art;

Fig. 3 is hook carriage and the lead frame structure synoptic diagram among the utility model first embodiment;

Fig. 4 is that hook carriage C among Fig. 3 is to view;

Fig. 5 is the utility model first example structure synoptic diagram;

Fig. 6 is the electric bath groove front view among first embodiment in the utility model;

Fig. 7 is the anode network structural representation among the utility model first embodiment;

Fig. 8 is the electric bath groove front view among the utility model second embodiment;

Fig. 9 is the hook carriage vertical view among the utility model the 3rd embodiment;

Figure 10 is the hook carriage vertical view among the utility model the 4th embodiment.

Embodiment

Below in conjunction with accompanying drawing the utility model is described in detail:

Embodiment 1:

The parcel plating device, as shown in Figure 3, Figure 4, hook carriage 7 comprises two parallel frames 702 and a crossbeam 703, two frames 702 connect as one by crossbeam 703, crossbeam 703 exceeds frame 702 parts, conductive hook 701 is installed on the frame 702, per two hooks 701 are one group, lay respectively on two frames 702, described hook 701 numbers are more than two groups, two groups of above hooks 701 along with electroplate liquid liquid level parallel direction promptly the A direction among the figure arrange, the group number can be determined according to needs of production.Two hooks in every group are formed one group along linear arrangement, tangle a lead frame.

As shown in Figure 5, also comprise electric bath groove 5, crossbeam 703 exceeds the part frame of frame 702 on the cell wall of electric bath groove 5, be provided with anode network 501 in the electric bath groove 5, anode network 501 is provided with extraction electrode 502, and extraction electrode 502 stretches out outside the electroplate liquid, and anode network 501 and extraction electrode 502 are metallic substance and make, can conduct electricity, the anode network structure as shown in Figure 7; As shown in Figure 6, have overflow groove 505 on the cell wall of electric bath groove 5, liquid level is as surpassing overflow groove 505, and electroplate liquid overflows in overflow groove 505 automatically, reaches the function of automatic control electroplate liquid liquid level.

During use, electroplate liquid adds in the electric bath groove 5, and anode network 501 is put into electroplate liquid, extraction electrode 502 connects positive source, lead frame 6 is hung on one group of hook 701, in pin and electronic element immersion plating liquid, and make hook 701 and limit not contact electricity of muscle plating bath, hook 701 connects power cathode, connect power supply, the metallic cation galvanic deposit is to lead frame 6, behind the energising certain hour, plating is finished, and lead frame is taken out.

Embodiment 2

Its difference from Example 1 is, as shown in Figure 8, offers overflow weir 506 on electric bath groove 5 cell walls, and overflow weir 506 replaces the overflow groove of embodiment 1, and all the other structures are identical with embodiment 1.

Embodiment 3

Its difference from Example 1 is that as shown in Figure 9, described crossbeam 703 numbers are two, and two crossbeams 703 can guarantee whole frame stability placement, and minimizing is rocked, and all the other structures are identical with embodiment 1.

The number of crossbeam 703 also can be adjusted according to actual needs.

Embodiment 4

As shown in figure 10, on the basis of embodiment 3, offer tapped through hole 704 on the crossbeam 703, have on the cell wall of electric bath groove 5 and tapped through hole 704 corresponding hole (not shown)s, use the screw (not shown) to pass tapped through hole 704 and hole, crossbeam 703 is stably fixed on electric bath groove 5 walls.

Among the above embodiment, the each several part structure can be used in combination.

For clearly demonstrating the utility model, the utility model with the application in lead frame is electroplated as an example, but application of the present utility model is not limited only to this, when plating has miscellaneous equipment with the lead frame same structure, when perhaps needing the product part electroplated, also can use the utility model.

Embodiment in the utility model only is used for the utility model is described, and does not constitute the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in the utility model protection domain.

Claims

1. the parcel plating device comprises electric bath groove, is provided with anode in the electric bath groove, it is characterized in that, also comprise hook carriage and two groups of above hooks, described hook is installed on the hook carriage, and two groups of above hooks are arranged along the direction parallel with the electroplate liquid liquid level.

2. parcel plating device according to claim 1 is characterized in that, every group of hook number is two or more, two or more hook linear arrangement.

3. parcel plating device according to claim 1, it is characterized in that, described hook carriage comprises frame parallel more than two and at least one crossbeam, two connect as one by crossbeam with upper side frame, and hook is installed on the frame, and per the hook more than two is one group, lay respectively at two with upper side frame upper edge linear arrangement, described hook number is more than two groups, and two groups of above hooks are arranged along the direction parallel with the electroplate liquid liquid level, and crossbeam or side frame are on the cell wall of electric bath groove.

4. according to claim 1,2 or 3 described parcel plating devices, it is characterized in that, also comprise the setting device that to adjust distance between liquid level and the cable address hook.

5. parcel plating device according to claim 4 is characterized in that, described setting device is overflow groove or the overflow weir that is arranged on the electroplate liquid cell wall.

6. parcel plating device according to claim 1 is characterized in that, described anode is an anode network.