CN201256482Y - 柔性线路板的屏蔽及接地结构 - Google Patents
柔性线路板的屏蔽及接地结构 Download PDFInfo
- Publication number
- CN201256482Y CN201256482Y CNU200820095553XU CN200820095553U CN201256482Y CN 201256482 Y CN201256482 Y CN 201256482Y CN U200820095553X U CNU200820095553X U CN U200820095553XU CN 200820095553 U CN200820095553 U CN 200820095553U CN 201256482 Y CN201256482 Y CN 201256482Y
- Authority
- CN
- China
- Prior art keywords
- shielding
- circuit board
- flexible circuit
- copper sheet
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010276 construction Methods 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011889 copper foil Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 239000012528 membrane Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000003351 stiffener Substances 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims 1
- 235000002991 Coptis groenlandica Nutrition 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052737 gold Inorganic materials 0.000 abstract description 6
- 239000010931 gold Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 230000003068 static effect Effects 0.000 abstract description 5
- 230000005611 electricity Effects 0.000 abstract description 2
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 238000005728 strengthening Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000007639 printing Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200820095553XU CN201256482Y (zh) | 2008-07-17 | 2008-07-17 | 柔性线路板的屏蔽及接地结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU200820095553XU CN201256482Y (zh) | 2008-07-17 | 2008-07-17 | 柔性线路板的屏蔽及接地结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201256482Y true CN201256482Y (zh) | 2009-06-10 |
Family
ID=40739809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU200820095553XU Expired - Lifetime CN201256482Y (zh) | 2008-07-17 | 2008-07-17 | 柔性线路板的屏蔽及接地结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201256482Y (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101321434B (zh) * | 2008-07-17 | 2011-03-23 | 深圳市中兴新宇软电路有限公司 | 柔性线路板的屏蔽及接地结构 |
CN106714443A (zh) * | 2015-11-13 | 2017-05-24 | 建业科技电子(惠州)有限公司 | 高精度柔性电路板 |
-
2008
- 2008-07-17 CN CNU200820095553XU patent/CN201256482Y/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101321434B (zh) * | 2008-07-17 | 2011-03-23 | 深圳市中兴新宇软电路有限公司 | 柔性线路板的屏蔽及接地结构 |
CN106714443A (zh) * | 2015-11-13 | 2017-05-24 | 建业科技电子(惠州)有限公司 | 高精度柔性电路板 |
CN106714443B (zh) * | 2015-11-13 | 2024-02-06 | 建业科技电子(惠州)有限公司 | 高精度柔性电路板 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN XINYU TENGYUE ELECTRONICS CO., LTD. Free format text: FORMER NAME: SHENZHEN ZHONGXING XINYU FPC CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 518105 Guangdong city of Shenzhen province Baoan District Songgang Tantou town in the West Industrial Park building A27-A28 Patentee after: SHENZHEN XINYU TENGYUE ELECTRONICS CO., LTD. Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang Town Industrial Park West Lake Patentee before: Shenzhen Zhongxing Xinyu FPC Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20090610 |
|
CX01 | Expiry of patent term |