CN201060456Y - Heat radiator of microcomputer - Google Patents

Abstract

The utility model discloses a microcomputer radiating device, which comprises an adapting board, a radiating unit arranged on the adapting board and a gas guidance unit for a cross flow fan. The radiating unit is at least provided with heat conducting parts which are arranged on one side of the adapting board and radiating fin groups with a plurality of channels which are arranged between each heat conducting part, and an air outlet of the gas guidance unit corresponds to the channels of the radiating fin groups, thus the radiating device can be used in the microcomputer and ensures that the radiating unit works in with the gas guidance unit to radiate the origin of heat rapidly, thereby achieving better radiating effect.

Description

The heat abstractor of microcomputer

Technical field

The utility model relates to a kind of heat abstractor of microcomputer, refers to especially a kind ofly can fast thermal source be carried out dissipation, and reaches the heat abstractor of the microcomputer of preferable radiating effect.

Background technology

The heat abstractor of existing microcomputer be to dispose a radiating fin group on the central processing unit of motherboard, and this radiating fin group is covered on the central processing unit, is provided with an aerofoil fan in this radiating fin group top in addition; The mode of its heat radiation is to absorb the hot gas that central processing unit produced by the radiating fin group to enlarge heat source region, produces air-flow with aerofoil fan to the radiating fin group by the top again, the hot-fluid of radiating fin is flowed, to reach the effect of heat radiation by this to the four directions.

But, because the inner enclosure space that belongs to of main frame housing, and on this motherboard except that central processing unit, all the other each spare parts also can produce thermal source when operation, and in the enclosure space of this main frame housing inside, if produce air-flow to the radiating fin group by the top with aerofoil fan, the hot-fluid of radiating fin is flowed to the four directions, this kind mode also can't directly be discharged hot gas outside the host shell fully, and make that hot gas can be in the host shell inner loop, therefore, aerofoil fan produces the mode of air-flow to the radiating fin group by the top, only is to be flowed repeatedly at enclosure space by the inner original thermal current of host shell, and the radiating effect that is produced is not good, and can't reach fully the function of heat radiation, and it is too high and have work efficiency to reduce or take place when the situation of machine often to produce central processing unit Yin Wendu.

The utility model content

Therefore, defective at the heat abstractor of above-mentioned existing microcomputer, fundamental purpose of the present utility model is, a kind of heat abstractor that applies to the microcomputer in the microcomputer is disclosed, it utilizes the heat-conduction part of heat-sink unit that thermal source is conducted to microcomputer casing to dispel the heat, so that fast thermal source is carried out dissipation, and reaches better radiating effect.Its secondary objective is, hot gas is discharged to outside the casing, avoids hot gas in the host shell inner loop, so that fast thermal source is carried out dissipation, and reaches better radiating effect.

In order to achieve the above object, the heat abstractor of a kind of microcomputer of the present utility model, it comprises a bearing plate; One is located at the heat-sink unit on the bearing plate, and this heat-sink unit has at least to be located at the heat-conduction part on the bearing plate one side and to be located at the radiating fin group that has several channel parts between each heat-conduction part; And one be the gas guidance unit of cross flow fan, and the air outlet of this gas guidance unit is corresponding with the channel part of radiating fin group.

The beneficial effects of the utility model are, the heat abstractor of the utility model microcomputer can apply in the microcomputer, utilizing the heat-conduction part of heat-sink unit that thermal source is conducted to microcomputer casing dispels the heat, and cooperate gas guidance unit guiding gas to the radiating fin group of heat-sink unit, to dispel the heat simultaneously, use fast thermal source is carried out dissipation, and reach preferable radiating effect

Description of drawings

Fig. 1: be three-dimensional appearance synoptic diagram of the present utility model.

Fig. 2: be perspective exploded view of the present utility model.

Fig. 3: be assembled state synoptic diagram of the present utility model.

Fig. 4: be that synoptic diagram is finished in assembling of the present utility model.

Fig. 5: be to combine synoptic diagram with housing after assembling of the present utility model is finished.

Fig. 6: be the utility model radiating state synoptic diagram.

Fig. 7: be another radiating state synoptic diagram of the present utility model.

Fig. 8: be to combine synoptic diagram with housing after another assembling of the present utility model is finished.

[primary clustering symbol description]

1 bearing plate, 11,12 fixed orifices

13 fixation kits, 2 heat-sink units

21 heat-conduction parts, 22 radiating fin groups

221 channel parts, 3 gas guidance units

31 air outlets, 32 buckle ears

321 fixation kits, 4 microcomputers

40 main frames, 41 central processing units

42 housings, 43 rear panels

431 perforation, 44 front panels

45 storage elements

Embodiment

See also shown in Fig. 1,2, be respectively three-dimensional appearance synoptic diagram of the present utility model and perspective exploded view of the present utility model.As shown in the figure: the utility model is a kind of heat abstractor of microcomputer, it is made of a bearing plate 1, a heat-sink unit 2 and a gas guidance unit 3, this heat abstractor is applied in the microcomputer, make heat-sink unit cooperate the gas guidance unit fast thermal source to be carried out dissipation, and reach preferable radiating effect.

Have several fixed orifices 11,12 on the above-mentioned bearing plate of carrying 1.

This heat-sink unit 2 is to be located on the above-mentioned bearing plate 1, and this heat-sink unit 2 has at least to be located at the heat-conduction part 21 on bearing plate 1 one side and to be located at the radiating fin group 22 that 21 of each heat-conduction parts have several channel parts 221, and this bearing plate 1, heat-conduction part 21 and radiating fin group 22 are to make according to the one-body molded mode of required employing.

This gas guidance unit 3 is a cross flow fan, can be located on the above-mentioned bearing plate 1 (or being directly fixed on the motherboard); Perhaps when casing is designed to the array configuration of upper cover body cooperation lower base, can be located on the upper cover body, and the air outlet 31 of this gas guidance unit 3 is corresponding with the channel part 221 of radiating fin group 22, and the periphery of this gas guidance unit 3 has buckle ear 32, and each buckle ear 32 can cooperate fixation kit 321 and the wherein corresponding fixed orifice 11 of bearing plate 1 to be mutually permanently connected.In this way, constitute the heat abstractor of a brand-new microcomputer by above-mentioned structure.

See also shown in Fig. 3-5, be respectively assembled state synoptic diagram of the present utility model, assembling of the present utility model and finish and combine synoptic diagram with housing after synoptic diagram and assembling of the present utility model are finished.As shown in the figure: when the utility model in when assembling, bearing plate 1 correspondence is arranged on the central processing unit (CPU) 41 of these microcomputer 4 set motherboards 40, and fixedly connected with motherboard 40 with other fixed orifice 12 on several fixation kits 13 cooperation bearing plates 1, the bottom surface and the central processing unit 41 of this bearing plate 1 are fitted, and motherboard 40 is arranged in the housing 42, the heat-conduction part 21 of this heat-sink unit 2 is contacted with the inner face of housing 42, and make the channel part 221 of radiating fin group 22 corresponding with the perforation 431 of rear panel 43, and in the fixedly connected front panel 44 of the front end face of housing 42, so, can finish assembling of the present utility model, moreover, see also shown in Figure 8, for another assembling of the present utility model combines synoptic diagram with housing after finishing, above-mentioned microcomputer 4 outside surfaces more can be designed to the form of tool radiating fin, in order to quickening heat radiation.

See also shown in Fig. 6,7, be respectively the utility model radiating state synoptic diagram and another radiating state synoptic diagram of the present utility model.As shown in the figure: when microcomputer 4 starts, the central processing unit 41 of these microcomputer 4 inside, the thermal source that related electronic components such as storage element 45... then can produce, at this moment, this bearing plate 1 absorbs the thermal source of central processing unit 41, and the thermal source that the heat-conduction part 21 of this heat-sink unit 2 and radiating fin group 22 are absorbed on the bearing plates 1, and utilize heat-conduction part 21 that thermal source is conducted on the housing 42, reach the dissipation of thermal source with contacting of external environment condition by housing 42, and make gas guidance unit 3 gas that it produced be guided to the channel part 221 of radiating fin group 22 by air outlet 31 simultaneously, and when gas guidance unit 3 carries out the guiding of gas, can be in the lump housing 42 inner miscellaneous equipments or hot gas that related electronic components produced be attracted, allow gas discharge again by channel part 221 perforation 431 of panel 43 backward of radiating fin group 22, use and utilize gas guidance unit 3 to cooperate the channel part 221 of radiating fin group 22 that thermal source is discharged housing 42, so, promptly can cooperate gas guidance unit 3 to reach preferable radiating effect by heat-sink unit 2.

In sum, the heat abstractor of the utility model microcomputer can effectively improve existing various shortcoming, this heat abstractor is applied in the microcomputer, utilizing heat-sink unit that thermal source is conducted to microcomputer dispels the heat, and cooperate gas guidance unit guiding gas to heat-sink unit, to dispel the heat simultaneously, use fast thermal source is carried out dissipation, and reach preferable radiating effect, and then it is required to make generation of the present utility model can more progressive, more practical, more meet use.

In sum, though the utility model discloses above content with preferred embodiment, but be not in order to limit the scope that the utility model is implemented, any those skilled in the art, in not breaking away from spirit and scope of the present utility model, when doing a little change and retouching, promptly all equalizations of doing according to the utility model change and modify, and should be the utility model claim and contain.

Claims (5)

1. the heat abstractor of a microcomputer is characterized in that, it includes:

A bearing plate;

A heat-sink unit, it is located on the described bearing plate, and this heat-sink unit has the heat-conduction part on the face being located at bearing plate at least and is located at the radiating fin group that has several channel parts between each heat-conduction part; And

A gas guidance unit, it is a cross flow fan, and the air outlet of this gas guidance unit is corresponding with the channel part of radiating fin group.

2. the heat abstractor of microcomputer according to claim 1 is characterized in that: have several fixed orifices on this bearing plate.

3. the heat abstractor of microcomputer according to claim 1, it is characterized in that: this bearing plate, heat-conduction part and radiating fin group are formed in one.

4. the heat abstractor of microcomputer according to claim 1 is characterized in that: the periphery of this gas guidance unit has the buckle ear that cooperates fixation kit to fixedly connected with bearing plate.

5. the heat abstractor of microcomputer according to claim 1, it is characterized in that: this gas guidance unit is located on the bearing plate.

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