CN211628132U - High heat dissipation computer case - Google Patents
High heat dissipation computer case Download PDFInfo
- Publication number
- CN211628132U CN211628132U CN201922439579.2U CN201922439579U CN211628132U CN 211628132 U CN211628132 U CN 211628132U CN 201922439579 U CN201922439579 U CN 201922439579U CN 211628132 U CN211628132 U CN 211628132U
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- CN
- China
- Prior art keywords
- heat dissipation
- casing
- support frame
- heat
- high heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a high heat dissipation computer machine case, it includes casing and radiating fin, and the lower extreme of casing is equipped with the heat conduction copper, and radiating fin connects the lower extreme at the heat conduction copper, and a supporting shoe is respectively connected to both sides around the casing lower extreme, and radiating fin is located between two supporting shoes, connects the mainboard support frame on the heat conduction copper perpendicularly, and the mainboard support frame sets up in the inside of casing, has all opened a plurality of louvres on the lateral wall about the casing. The beneficial effects of the utility model are that: the heat conducting copper plate and the radiating fins are arranged, so that heat can be radiated through the heat conducting copper plate and the radiating fins, and the heat radiation rate is increased; the two sides are provided with heat dissipation holes, so that the heat dissipation rate is further improved; the louvre sets up down, and the dust is difficult for entering into quick-witted incasement through the louvre like this.
Description
Technical Field
The utility model relates to a high heat dissipation computer machine case belongs to computer accessories technical field.
Background
The case is used as a part of computer accessories and has the main function of placing and fixing the computer accessories, thereby having a supporting and protecting function. The computer case mainly comprises a mainboard, a memory, a hard disk, a power supply and the like, a large amount of heat can be generated in the operation process of the components, and if the heat dissipation performance of the computer case is not good, the temperature in the computer case is too high, the normal operation of a computer is influenced, and even the components are burnt out. At present, the heat dissipation of a computer case is slow through the air circulation heat dissipation through the opening at the back of the case.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in providing a high heat dissipation computer machine case, this case can add the piece heat dissipation through heat conduction copper and radiating fin.
The utility model discloses a following scheme realizes: the utility model provides a high heat dissipation computer machine case, its includes casing and radiating fin, the lower extreme of casing is equipped with the heat conduction copper, radiating fin connects the lower extreme of heat conduction copper, a supporting shoe is respectively connected to both sides around the casing lower extreme, radiating fin is located two between the supporting shoe, the last mainboard support frame of perpendicular connection of heat conduction copper, the mainboard support frame sets up the inside of casing, all open a plurality of louvres on the lateral wall about the casing.
The louvre sets up in the heat dissipation post, the heat dissipation post is towards the cylindrical structure of outside below slope, the louvre also is towards the structure of outside below slope, the louvre communicates with the external world.
The heat dissipation column is connected to the inner sides of the left side wall and the right side wall of the shell.
The mainboard support frame is connected with the left side wall of the shell through a connecting rod, and the mainboard support frame is connected with the inner side of the shell and is parallel to the side wall of the shell.
The shell is provided with a handle.
A gap is reserved between the main board support frame and the top of the shell.
The utility model has the advantages that:
1. the utility model relates to a high heat dissipation computer case, which is provided with a heat conducting copper plate and heat dissipation fins, so that heat can be dissipated through the heat conducting copper plate and the heat dissipation fins, and the heat dissipation rate is increased;
2. the two sides of the high-heat-dissipation computer case of the utility model are provided with the heat dissipation holes, so that the heat dissipation rate is further improved;
3. the utility model relates to a louvre of high heat dissipation computer machine case sets up down, and the dust is difficult for entering into quick-witted incasement through the louvre like this.
Drawings
Fig. 1 is a schematic view of a front view cross-sectional structure of a high heat dissipation computer case of the present invention.
Fig. 2 is a schematic side view of the high heat dissipation computer case of the present invention.
Fig. 3 is an enlarged schematic view of a portion a in fig. 1.
In the figure: 1 is the casing, 2 is radiating fin, 3 is the heat conduction copper, 4 is the supporting shoe, 5 is the mainboard support frame, 6 is the louvre, 7 is the heat dissipation post, 8 is the connecting rod, and 9 is the handle.
Detailed Description
The present invention will be further described with reference to fig. 1-3, but the scope of the present invention is not limited to the description.
In which like parts are designated by like reference numerals. It is noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component, and the drawings are in greatly simplified form and employ non-precise ratios, merely for the purpose of facilitating and distinctly aiding in the description of the embodiments of the present invention.
In the following description, for purposes of clarity, not all features of an actual implementation are described, well-known functions or constructions are not described in detail since they would obscure the invention with unnecessary detail, it being understood that in the development of any actual embodiment, numerous implementation details must be set forth in order to achieve the developer's specific goals, such as compliance with system-related and business-related constraints, changing from one implementation to another, and it being recognized that such development efforts may be complex and time consuming, but would nevertheless be a routine undertaking for those of ordinary skill in the art.
The utility model provides a high heat dissipation computer machine case, it includes casing 1 and radiating fin 2, the lower extreme of casing 1 is equipped with heat conduction copper 3, radiating fin 2 is connected at the lower extreme of heat conduction copper 3, a supporting shoe 4 is respectively connected to both sides around the casing 1 lower extreme, radiating fin 2 is located between two supporting shoes 4, connect mainboard support frame 5 perpendicularly on the heat conduction copper 3, mainboard support frame 5 sets up in the inside of casing 1, all open a plurality of louvres 6 on the lateral wall about casing 1.
The heat dissipation hole 6 is arranged in the heat dissipation column 7, the heat dissipation column 7 is of a cylindrical structure inclined towards the lower part of the outer side, the heat dissipation hole 6 is also of a structure inclined towards the lower part of the outer side, and the heat dissipation hole 6 is communicated with the outside.
The heat radiation columns 7 are connected to the inner sides of the left and right side walls of the housing 1.
The shell 1 is provided with a handle 9.
A gap is left between the main board support frame 5 and the top of the shell 1.
During the use, the computer mainboard sets up mainboard support frame 5 in casing 1, and on, during the operation, the heat dispels the heat through heat conduction copper 3 and radiating fin 2, also dispels the outside from the louvre 6 of both sides simultaneously.
Although the invention has been shown and described in detail with respect to the preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A high heat dissipation computer machine case which characterized in that: it includes casing (1) and radiating fin (2), the lower extreme of casing (1) is equipped with heat conduction copper (3), radiating fin (2) are connected the lower extreme of heat conduction copper (3), a supporting shoe (4) is respectively connected to both sides around casing (1) lower extreme, radiating fin (2) are located two between supporting shoe (4), perpendicular connection mainboard support frame (5) on heat conduction copper (3), mainboard support frame (5) set up the inside of casing (1), all open a plurality of louvres (6) on the lateral wall about casing (1).
2. The high heat dissipation computer case of claim 1, wherein: the heat dissipation holes (6) are arranged in the heat dissipation columns (7), the heat dissipation columns (7) are of cylindrical structures inclined towards the lower part of the outer side, the heat dissipation holes (6) are also of structures inclined towards the lower part of the outer side, and the heat dissipation holes (6) are communicated with the outside.
3. The high heat dissipation computer case of claim 2, wherein: the heat dissipation column (7) is connected to the inner sides of the left side wall and the right side wall of the shell (1).
4. The high heat dissipation computer case of claim 1, wherein: the main board support frame (5) is connected with the left side wall of the shell (1) through a connecting rod (8), and the main board support frame (5) is connected to the inner side of the shell (1) and is parallel to the side wall of the shell (1).
5. The high heat dissipation computer case of claim 1, wherein: the shell (1) is provided with a handle (9).
6. The high heat dissipation computer case of claim 1, wherein: a gap is reserved between the main board support frame (5) and the top of the shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922439579.2U CN211628132U (en) | 2019-12-30 | 2019-12-30 | High heat dissipation computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922439579.2U CN211628132U (en) | 2019-12-30 | 2019-12-30 | High heat dissipation computer case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211628132U true CN211628132U (en) | 2020-10-02 |
Family
ID=72633890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922439579.2U Expired - Fee Related CN211628132U (en) | 2019-12-30 | 2019-12-30 | High heat dissipation computer case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211628132U (en) |
-
2019
- 2019-12-30 CN CN201922439579.2U patent/CN211628132U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201002 Termination date: 20211230 |