CN206411582U - A kind of convection heat-dissipation computer housing - Google Patents
A kind of convection heat-dissipation computer housing Download PDFInfo
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Abstract
本实用新型公开了一种对流散热式电脑机箱,包括机箱本体,所述机箱本体包括机箱后板、机箱前板和机箱顶板,所述机箱后板、机箱前板和机箱顶板上均设有散热网孔,所述机箱后板设有第一散热风扇,所述机箱顶板设有第二散热风扇,所述机箱前板的前面设有一散热装置,所述散热装置包括与机箱前板连接的前框盖、设于前框盖四个顶角位置的安装凸台和设于安装凸台上的挡板,所述挡板与前框盖形成宽度为8mm‑12mm的用于透风的空隙,所述前框盖与机箱前板形成一个设有第三散热风扇的腔体;通过设置第一散热风扇、第二散热风扇和第三散热风扇,第一散热风扇送入冷风,第二散热风扇和第三散热风扇分别从机箱本体的顶部和前面送出热风、形成有效的散热路径,提高散热性能。
The utility model discloses a convection cooling type computer case, which comprises a case body. The case body includes a case back plate, a case front plate and a case top plate. mesh, the rear panel of the chassis is provided with a first cooling fan, the top panel of the chassis is provided with a second cooling fan, and the front of the front panel of the chassis is provided with a heat dissipation device, and the cooling device includes a front panel connected to the front panel of the chassis. The frame cover, the installation bosses located at the four top corners of the front frame cover and the baffles arranged on the installation bosses, the baffle and the front frame cover form a gap for ventilation with a width of 8mm-12mm, so The front frame cover and the chassis front plate form a cavity provided with a third cooling fan; by setting the first cooling fan, the second cooling fan and the third cooling fan, the first cooling fan sends in cold air, the second cooling fan and the third cooling fan The third heat dissipation fan sends out hot air from the top and the front of the chassis body respectively, forming an effective heat dissipation path and improving heat dissipation performance.
Description
技术领域technical field
本实用新型属于电脑机箱技术领域,具体涉及一种对流散热式电脑机箱。The utility model belongs to the technical field of computer cases, in particular to a convection heat dissipation type computer case.
背景技术Background technique
机箱作为电脑配件中的一部分,它起的主要作用是放置和固定各电脑配件,起到一个承托和保护作用,此外,电脑机箱具有电磁辐射的屏蔽的重要作用,由于机箱不像CPU、显卡、主板等配件能迅速提高整机性能,所以在DIY中一直不被列为重点考虑对象。目前,市面上大多数电脑机箱,散热性能差,同时随着电子信息产业的迅速发展,电脑中的CPU等发热电子元件向着高速度化、高功能化以及小型化发展,从而导致这些发热电子元件的发热量及热密度越来越大,若不及时有效地将这些发热电子元件产生的热量散去,将极大地影响这些发热电子元件的工作性能,同时还会缩短它们的使用寿命,现有的电脑机箱的散热方式大多为风冷散热,但仅仅安装了散热风扇,很少对机箱内部的热风散发路径进行规划和优化,使散热风扇没有发挥出有效的作用。As a part of computer accessories, the chassis plays a main role in placing and fixing various computer accessories, playing a role of support and protection. In addition, the computer chassis has an important role in shielding electromagnetic radiation. Because the chassis is not like CPU, graphics card , motherboard and other accessories can quickly improve the performance of the whole machine, so it has not been listed as a key consideration in DIY. At present, most of the computer cases on the market have poor heat dissipation performance. At the same time, with the rapid development of the electronic information industry, the heat-generating electronic components such as the CPU in the computer are developing towards high speed, high functionality and miniaturization, which leads to these heat-generating electronic components. The calorific value and heat density are getting bigger and bigger. If the heat generated by these heating electronic components is not dissipated in a timely and effective manner, it will greatly affect the performance of these heating electronic components, and at the same time shorten their service life. Most of the heat dissipation methods of computer cases are air-cooled, but only cooling fans are installed, and the hot air distribution path inside the case is rarely planned and optimized, so that the cooling fans do not play an effective role.
实用新型内容Utility model content
为了解决上述技术问题,本实用新型提供一种具备电脑机箱内部有效散热路径的对流散热式电脑机箱。In order to solve the above technical problems, the utility model provides a convection cooling computer case with an effective heat dissipation path inside the computer case.
为了解决上述问题,本实用新型按以下技术方案予以实现的:In order to solve the above problems, the utility model is realized according to the following technical solutions:
本实用新型所述对流散热式电脑机箱,包括机箱本体,所述机箱本体包括机箱后板、机箱前板和机箱顶板,所述机箱后板、机箱前板和机箱顶板上均设有散热网孔,所述机箱后板设有第一散热风扇,所述机箱顶板设有第二散热风扇,所述机箱前板的前面设有一散热装置,所述散热装置包括与机箱前板连接的前框盖、设于前框盖四个顶角位置的安装凸台和设于安装凸台上的挡板,所述挡板与前框盖形成宽度为8mm-12mm的用于透风的空隙,所述前框盖与机箱前板形成一个设有第三散热风扇的腔体;通过第一散热风扇将冷风送入机箱本体内部,再经过第二散热风扇和第三散热风扇将热风分别从机箱本体的顶部和前面送出;通过在机箱前板的前面设置用于装设第三散热风扇的散热装置,不占用机箱内部空间,便于拆卸清洗,且散热装置中前框盖与挡板形成空隙,可通过空隙从上下左右不同方位进行排风,提高散热性能。The convection heat dissipation computer case of the utility model includes a case body, and the case body includes a case back plate, a case front plate and a case top plate, and the case back plate, the case front plate and the case top plate are all provided with cooling mesh holes , the rear panel of the cabinet is provided with a first cooling fan, the top panel of the cabinet is provided with a second cooling fan, the front of the front panel of the cabinet is provided with a cooling device, and the cooling device includes a front frame cover connected to the front panel of the cabinet 1. Mounting bosses located at the four top corners of the front frame cover and baffles arranged on the installation bosses, the baffles and the front frame cover form a gap for ventilation with a width of 8mm-12mm, the front The frame cover and the front panel of the chassis form a cavity with a third cooling fan; the cold air is sent into the inside of the chassis body through the first cooling fan, and then the hot air is blown from the top of the chassis body through the second cooling fan and the third cooling fan. and the front; by setting the heat dissipation device for installing the third cooling fan in front of the front panel of the chassis, it does not occupy the internal space of the chassis, which is convenient for disassembly and cleaning, and the front frame cover and the baffle form a gap in the heat dissipation device, which can pass through the gap Exhaust air from different directions up, down, left, and right to improve heat dissipation.
优选的,所述空隙的宽度为10mm;所述挡板为全透明的钢化玻璃制成的。Preferably, the width of the gap is 10 mm; the baffle is made of fully transparent tempered glass.
进一步的,所述机箱顶板的散热网孔上设有防尘网盖,防止顶部灰尘从机箱本体顶部落入机箱本体内。Further, the heat dissipation mesh on the top plate of the chassis is provided with a dustproof net cover to prevent top dust from falling into the chassis body from the top of the chassis body.
进一步的,所述防尘网盖的四周边框设有软磁条,所述防尘网盖通过所述软磁条与机箱顶板通过磁性吸附连接;拆装免工具,便于拆装和清洗。Further, the surrounding frame of the dust-proof net cover is provided with soft magnetic strips, and the dust-proof net cover is connected to the top plate of the chassis through magnetic adsorption through the soft magnetic strips; tool-free disassembly and assembly are convenient for disassembly and cleaning.
进一步的,所述机箱本体包括机箱主板,所述机箱前板设有一向着机箱本体内部弯折的折片,所述折片与机箱主板之间卡设一硬盘;在不增加材料成本的情况下便可形成一个安装硬盘的安装孔位,且安装位置靠近第三散热风扇,提高散热性能。Further, the chassis body includes a chassis main board, and the front panel of the chassis is provided with a flap bent towards the inside of the chassis body, and a hard disk is clamped between the flap and the chassis main board; without increasing the material cost A mounting hole for installing the hard disk can be formed, and the mounting position is close to the third cooling fan, so as to improve the cooling performance.
进一步的,所述机箱本体包括机箱底板,所述机箱底板的顶部设有用于安装大硬盘、小硬盘的安装孔位,便于根据实际需要增加配置大硬盘或小硬盘,所述机箱底板的底部设有机箱脚垫。Further, the chassis body includes a chassis bottom plate, the top of the chassis bottom plate is provided with mounting holes for installing large hard disks and small hard disks, which is convenient for adding large hard disks or small hard disks according to actual needs, and the bottom of the chassis bottom plate is provided with There are case pads.
进一步的,所述机箱顶板与机箱后板的连接处设有一电源装置,所述电源装置靠近第二散热风扇,便于热量从机箱本体顶部散出。Further, a power supply unit is provided at the connection between the top plate of the chassis and the rear panel of the chassis, and the power supply unit is close to the second cooling fan to facilitate the dissipation of heat from the top of the chassis body.
与现有技术相比,本实用新型的有益效果是:Compared with the prior art, the beneficial effects of the utility model are:
本实用新型所述对流散热式电脑机箱,通过设置第一散热风扇、第二散热风扇和第三散热风扇,第一散热风扇送入冷风,第二散热风扇和第三散热风扇分别从机箱本体的顶部和前面送出热风,形成有效的散热路径,提高散热性能;通过在机箱前板的前面设置用于装设第三散热风扇的散热装置,不占用机箱内部空间,便于拆卸清洗,且散热装置中前框盖与挡板形成空隙,可通过空隙从上下左右不同方位进行排风,提高散热性能;将硬盘与电源装置分开设置,分别设于第二散热风扇和第三散热风扇旁边,使热量更快从机箱本体中散出。The convection heat dissipation computer case described in the utility model, by setting the first heat dissipation fan, the second heat dissipation fan and the third heat dissipation fan, the first heat dissipation fan is sent into the cold air, and the second heat dissipation fan and the third heat dissipation fan are fed from the case body respectively. Hot air is sent out from the top and the front to form an effective heat dissipation path and improve heat dissipation performance; by installing a heat dissipation device for installing a third cooling fan in front of the front panel of the chassis, it does not occupy the internal space of the chassis and is easy to disassemble and clean. The front frame cover and the baffle form a gap, through which the air can be exhausted from different directions up, down, left, and right to improve the heat dissipation performance; the hard disk and the power supply unit are installed separately, next to the second cooling fan and the third cooling fan, so that the heat is more efficient. Quickly release from the chassis body.
附图说明Description of drawings
下面结合附图对本实用新型的具体实施方式作进一步详细的说明,其中:Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is described in further detail, wherein:
图1是本实用新型所述对流散热式电脑机箱的整体结构示意图;Fig. 1 is the overall structure schematic diagram of the convection cooling type computer case described in the utility model;
图2是本实用新型所述对流散热式电脑机箱的分解结构示意图。Fig. 2 is a schematic diagram of an exploded structure of the convection cooling computer case of the present invention.
具体实施方式detailed description
以下结合附图对本实用新型的优选实施例进行说明,应当理解,此处所描述的优选实施例仅用于说明和解释本实用新型,并不用于限定本实用新型。The preferred embodiments of the present utility model are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present utility model, and are not intended to limit the present utility model.
如图1~图2所示,本实用新型所述对流散热式电脑机箱,包括机箱本体1,所述机箱本体1包括机箱后板11、机箱前板12、机箱顶板13、机箱主板14和机箱底板15,所述机箱后板11、机箱前板12和机箱顶板13上均设有散热网孔,所述机箱后板11设有第一散热风扇21,所述机箱顶板13设有第二散热风扇22,所述机箱前板12的前面设有一散热装置3,所述散热装置3包括与机箱前板12连接的前框盖31、设于前框盖31四个顶角位置的安装凸台32和设于安装凸台32上的挡板33,所述挡板33与前框盖31形成宽度为8mm-12mm的用于透风的空隙,在本实施例中,所述空隙的宽度为10mm,所述挡板33为全透明的钢化玻璃制成的,所述前框盖31与机箱前板12形成一个设有第三散热风扇23的腔体;通过第一散热风扇21将冷风送入机箱本体1内部,再经过第二散热风扇22和第三散热风扇23将热风分别从机箱本体1的顶部和前面送出。As shown in Figures 1 to 2, the convection heat dissipation computer case of the present invention includes a case body 1, and the case body 1 includes a case rear plate 11, a case front plate 12, a case top plate 13, a case main board 14 and a case Bottom plate 15, described cabinet rear plate 11, cabinet front plate 12 and cabinet top plate 13 are all provided with cooling mesh, described cabinet rear plate 11 is provided with first cooling fan 21, and described cabinet top plate 13 is provided with second cooling fan. Fan 22, a heat dissipation device 3 is provided on the front of the front panel 12 of the chassis, and the heat dissipation device 3 includes a front frame cover 31 connected to the front panel 12 of the chassis, and installation bosses located at the four corners of the front frame cover 31 32 and the baffle plate 33 located on the mounting boss 32, the baffle plate 33 and the front frame cover 31 form a gap with a width of 8mm-12mm for ventilation. In this embodiment, the width of the gap is 10mm , the baffle plate 33 is made of fully transparent tempered glass, the front frame cover 31 and the front panel 12 of the chassis form a cavity provided with the third cooling fan 23; Inside the chassis body 1, the hot air is sent out from the top and the front of the chassis body 1 through the second cooling fan 22 and the third cooling fan 23 respectively.
所述机箱顶板13的散热网孔上设有防尘网盖4,防止顶部灰尘从机箱本体1顶部落入机箱本体1内,所述防尘网盖4的四周边框设有软磁条,所述防尘网盖4通过所述软磁条与机箱顶板13通过磁性吸附连接,拆装免工具,便于拆装和清洗。The heat dissipation mesh of the chassis top plate 13 is provided with a dustproof net cover 4 to prevent top dust from falling into the chassis body 1 from the top of the chassis body 1, and the surrounding frame of the dustproof net cover 4 is provided with soft magnetic strips, so that The dust-proof net cover 4 is connected to the top plate 13 of the chassis through magnetic adsorption through the soft magnetic strip, and it is easy to disassemble and clean without tools.
所述机箱前板12设有一向着机箱本体1内部弯折的折片121,所述折片121与机箱主板14之间卡设一硬盘5;在不增加材料成本的情况下便可形成一个安装硬盘的安装孔位,且安装位置靠近第三散热风扇23,提高散热性能。The front panel 12 of the case is provided with a flap 121 bent toward the inside of the case body 1, and a hard disk 5 is clamped between the flap 121 and the main board 14 of the case; an installation can be formed without increasing the cost of materials. The installation hole position of the hard disk, and the installation location is close to the third cooling fan 23, so as to improve the cooling performance.
所述机箱底板15的顶部设有用于安装大硬盘、小硬盘的安装孔位151,便于根据实际需要增加配置大硬盘或小硬盘,所述机箱底板15的底部设有机箱脚垫152。The top of the chassis bottom plate 15 is provided with mounting holes 151 for installing large hard disks and small hard disks, which is convenient for adding large hard disks or small hard disks according to actual needs. The bottom of the chassis bottom plate 15 is provided with chassis foot pads 152 .
所述机箱顶板13与机箱后板11的连接处设有一电源装置6,所述电源装置6靠近第二散热风扇22,便于热量从机箱本体1顶部散出。A power supply unit 6 is provided at the junction of the chassis top plate 13 and the chassis rear panel 11 , and the power supply unit 6 is close to the second cooling fan 22 to facilitate the dissipation of heat from the top of the chassis body 1 .
本实用新型通过设置第一散热风扇、第二散热风扇和第三散热风扇,第一散热风扇送入冷风,第二散热风扇和第三散热风扇分别从机箱本体的顶部和前面送出热风,形成有效的散热路径,提高散热性能;通过在机箱前板的前面设置用于装设第三散热风扇的散热装置,不占用机箱内部空间,便于拆卸清洗,且散热装置中前框盖与挡板形成空隙,可通过空隙从上下左右不同方位进行排风,提高散热性能;将硬盘与电源装置分开设置,分别设于第二散热风扇和第三散热风扇旁边,使热量更快从机箱本体中散出。The utility model is provided with the first heat dissipation fan, the second heat dissipation fan and the third heat dissipation fan, the first heat dissipation fan sends in cold air, the second heat dissipation fan and the third heat dissipation fan send out hot air from the top and the front of the chassis body respectively, forming an effective The heat dissipation path improves the heat dissipation performance; by setting the heat dissipation device for installing the third cooling fan in front of the front panel of the chassis, the internal space of the chassis is not occupied, and it is easy to disassemble and clean, and the front frame cover and the baffle form a gap in the heat dissipation device The air can be exhausted from different directions through the gap to improve the heat dissipation performance; the hard disk and the power supply unit are installed separately, next to the second cooling fan and the third cooling fan, so that the heat can be dissipated from the chassis body faster.
本实施例所述对流散热式电脑机箱的其它结构参见现有技术。For other structures of the convection cooling computer case described in this embodiment, refer to the prior art.
以上所述,仅是本实用新型的较佳实施例而已,并非对本实用新型作任何形式上的限制,故凡是未脱离本实用新型技术方案内容,依据本实用新型的技术实质对以上实施例所作的任何修改、等同变化与修饰,均仍属于本实用新型技术方案的范围内。The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form, so if it does not depart from the technical solution content of the utility model, the above embodiments are made according to the technical essence of the utility model Any amendments, equivalent changes and modifications still belong to the scope of the technical solution of the present utility model.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107608481A (en) * | 2017-11-03 | 2018-01-19 | 成都汇丁科技有限公司 | A kind of desktop computer case with auxiliary radiating device |
| CN108376021A (en) * | 2018-03-14 | 2018-08-07 | 联想(北京)有限公司 | A kind of computer and its host |
| CN111007922A (en) * | 2019-10-09 | 2020-04-14 | 苏州浪潮智能科技有限公司 | Quick-witted case convenient to dismantle |
| WO2024174568A1 (en) * | 2023-02-21 | 2024-08-29 | 芜湖格蓝电子科技有限公司 | Efficient heat dissipation case for computer |
-
2017
- 2017-01-20 CN CN201720085483.9U patent/CN206411582U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107608481A (en) * | 2017-11-03 | 2018-01-19 | 成都汇丁科技有限公司 | A kind of desktop computer case with auxiliary radiating device |
| CN108376021A (en) * | 2018-03-14 | 2018-08-07 | 联想(北京)有限公司 | A kind of computer and its host |
| CN108376021B (en) * | 2018-03-14 | 2023-09-19 | 联想(北京)有限公司 | Computer and host thereof |
| CN111007922A (en) * | 2019-10-09 | 2020-04-14 | 苏州浪潮智能科技有限公司 | Quick-witted case convenient to dismantle |
| CN111007922B (en) * | 2019-10-09 | 2021-08-24 | 苏州浪潮智能科技有限公司 | An easy-to-remove chassis |
| WO2024174568A1 (en) * | 2023-02-21 | 2024-08-29 | 芜湖格蓝电子科技有限公司 | Efficient heat dissipation case for computer |
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Effective date of registration: 20250723 Address after: 511500 Guangdong Province Qingyuan City Qingcheng District Guangqing Avenue No. 92 Yunjing Zhonghui Garden Building 5, Elevator 1, 10th Floor, Room 04 Patentee after: Guangdong Shengda Electronic Technology Co.,Ltd. Country or region after: China Address before: 510800, No. 168, No. sixth, Dongguan economic community, Xinhua Village, Huadu District, Guangdong, Guangzhou Patentee before: GUANGZHOU SHENGSHI TENGLONG ELECTRONICS CO.,LTD. Country or region before: China |