CN210983287U - Computer hardware heat dissipation mechanism - Google Patents
Computer hardware heat dissipation mechanism Download PDFInfo
- Publication number
- CN210983287U CN210983287U CN201922295930.5U CN201922295930U CN210983287U CN 210983287 U CN210983287 U CN 210983287U CN 201922295930 U CN201922295930 U CN 201922295930U CN 210983287 U CN210983287 U CN 210983287U
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- heat dissipation
- heat
- quick
- fixed
- fan
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Abstract
The utility model discloses a computer hardware heat dissipation mechanism, including quick-witted case and radiating groove, the radiating groove is seted up on the inner wall of quick-witted case, and the radiating groove internal fixation has the heat dissipation cover, the inside intermediate position transverse connection of heat dissipation cover is fixed with the heat dissipation otter board, vertical welded fastening has heat radiation fins in the heat dissipation cover of heat dissipation otter board front side, and heat radiation fins be a plurality of, and the rear side surface of heat dissipation otter board is fixed with the fan, and the fan is four, the both sides surface of heat dissipation cover all is connected with the fixed plate, and the surface of the fixed plate and the quick-witted case surface of fixed plate rear side all are provided with the installation screw. The utility model discloses an open the radiating groove in the inside rear side of quick-witted case to at its inside fixed heat exchanger that looses, after the mainboard is installed at the quick-witted incasement of heat exchanger front side that looses, the during operation fan starts thereupon, and the abundant packing of heat that mainboard work produced is within heat radiation fins, then by the fan take it out quick-witted incasement outward, improvement that can be better changes radiating effect.
Description
Technical Field
The utility model relates to a computer hardware technical field specifically is a computer hardware heat dissipation mechanism.
Background
At present, the rapid development of computer technology brings a lot of convenience to people, computers replace a lot of manual operations, in the using process of computers, the computers need to perform standby work for a long time and under high load in many cases, hardware of the computers can generate a large amount of heat, in order to ensure the normal work of the hardware of the computers, the hardware of the computers needs to be cooled, and at the moment, the heat dissipation of the hardware of the computers needs to be realized by means of a heat dissipation mechanism.
However, the existing heat dissipation device for various computer hardware can only dissipate heat of a processor, a graphics card or a power supply which generate more heat for the computer, and a motherboard of the computer is also hardware with larger heat generation, and the heat dissipation effect of the chassis fan in the prior art on the motherboard is not good. Therefore, we propose a heat dissipation mechanism for computer hardware.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a computer hardware heat dissipation mechanism opens through the inside rear side at quick-witted case and is equipped with the radiating groove to at its inside fixed heat exchanger that looses, install at the mainboard after the quick-witted incasement of heat exchanger front side that looses, the during operation fan starts thereupon, the abundant packing of heat that mainboard work produced is within heat radiation fins, then outside taking it out quick-witted case by the fan again, the radiating effect that improvement that can be better changes, the problem that proposes in the background art has been solved.
In order to achieve the above object, the utility model provides a following technical scheme: a computer hardware heat dissipation mechanism comprises a case and a heat dissipation groove, wherein the heat dissipation groove is formed in the inner wall of the case, and a heat dissipation cover is fixed in the heat dissipation groove;
the heat dissipation cover is characterized in that a heat dissipation screen plate is transversely connected and fixed at the middle position inside the heat dissipation cover, heat dissipation fins are vertically welded and fixed in the heat dissipation cover on the front side of the heat dissipation screen plate, the heat dissipation fins are multiple, fans are fixed on the rear side surface of the heat dissipation screen plate, the fans are four, the surfaces of the two sides of the heat dissipation cover are connected with fixing plates, installation screw holes are formed in the surfaces of the fixing plates and the surface of a case on the rear side of the fixing plates, and the heat dissipation cover is fixed on one side of the case in a mode of being screwed in.
As a preferred embodiment of the present invention, the surface all around of the outside of the heat dissipation cover is provided with a ventilation net, and the ventilation net surrounds the outer ring of the heat dissipation cover.
As a preferred embodiment of the present invention, the heat dissipation mesh plate is a mesh-shaped plate made of stainless steel.
As a preferred embodiment of the present invention, the heat dissipation fins are made of aluminum thin sheets.
As a preferred embodiment of the present invention, the fan is electrically connected to the power supply of the computer through a wire.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a computer hardware heat dissipation mechanism opens through the inside rear side at quick-witted case and is equipped with the radiating groove to at its inside fixed heat exchanger that looses, after the mainboard is installed at the quick-witted incasement of heat exchanger front side that looses, the during operation fan starts thereupon, and the abundant packing of heat that mainboard work produced is within heat radiation fins, then outside taking out quick-witted case by the fan again, the radiating effect that improvement that can be better changes.
2. The utility model discloses a computer hardware heat dissipation mechanism, the surface all is provided with the ventilation net all around through the outside that makes the heat exchanger that looses, and the setting that the ventilation net encircleed is in the outer lane of heat exchanger that looses, and the outer lane of heat exchanger that looses all is provided with the ventilation net, can guarantee that the fan blows off the heat of quick-witted incasement portion is better.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic view of the overall structure of the computer hardware heat dissipation mechanism of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of the heat dissipation mechanism of the computer hardware of the present invention.
In the figure: 1. a chassis; 2. a heat sink; 3. a heat dissipation cover; 4. a fixing plate; 5. mounting a screw hole; 6. a fan; 7. heat dissipation fins; 8. a heat dissipation screen plate; 9. a ventilation net.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "disposed" are to be interpreted broadly, and may be, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed; the utility model discloses in provide only supply the reference with the model of electrical apparatus. For those skilled in the art, different types of electrical appliances with the same function can be replaced according to actual use conditions, and for those skilled in the art, the specific meaning of the above terms in the present invention can be understood in specific situations.
Referring to fig. 1-2, the present invention provides a technical solution: a computer hardware heat dissipation mechanism comprises a case 1 and a heat dissipation groove 2, wherein the heat dissipation groove 2 is formed in the inner wall of the case 1, and a heat dissipation cover 3 is fixed in the heat dissipation groove 2;
the inside intermediate position transverse connection of heat exchanger 3 is fixed with heat dissipation otter board 8, vertical welded fastening has heat radiation fins 7 in the heat exchanger 3 of heat dissipation otter board 8 front side, and heat radiation fins 7 be a plurality of, and the rear side surface of heat dissipation otter board 8 is fixed with fan 6, and fan 6 is four, the both sides surface of heat exchanger 3 all is connected with fixed plate 4, and the surface of fixed plate 4 and the quick-witted case 1 surface of fixed plate 4 rear side all are provided with installation screw 5, and the mode that heat exchanger 3 connects in installation screw 5 soon through the bolt is fixed in quick-witted case 1 one side.
In this embodiment (please refer to fig. 1 and 2), the heat dissipation groove 2 is formed at the rear side inside the case 1, the heat dissipation cover 3 is fixed inside the case, after the motherboard is installed in the case 1 at the front side of the heat dissipation cover 3, the fan 6 is started during operation, heat generated by the motherboard is fully filled in the heat dissipation fins 7, and then the heat is extracted out of the case 1 by the fan 6, so that the heat dissipation effect can be better improved.
Wherein, the outside surface all around of heat exchanger 3 all is provided with ventilation net 9, and the setting that ventilation net 9 encircles is at the outer lane of heat exchanger 3.
In this embodiment (see fig. 2), the ventilation nets 9 are disposed on the outer peripheral surfaces of the outer sides of the heat dissipation covers 3, the ventilation nets 9 are disposed around the outer rings of the heat dissipation covers 3, and the ventilation nets 9 are disposed on the outer rings of the heat dissipation covers 3, so that the fans 6 can blow out heat inside the chassis 1 well.
Wherein, the heat dissipation screen plate 8 is a reticular plate made of stainless steel material.
Wherein, the radiating fins 7 are made of aluminum thin sheets.
Wherein, the fan 6 is electrically connected with the power supply of the computer through a lead.
It should be noted that the utility model relates to a computer hardware heat dissipation mechanism, which comprises a case 1, a heat dissipation groove 2, a heat dissipation cover 3, a fixing plate 4, an installation screw hole 5, a fan 6, a heat dissipation fin 7, a heat dissipation screen plate 8 and a ventilation net 9, wherein the components are all universal standard components or components known by technicians in the field, the structure and principle of the heat dissipation mechanism can be known by technicians in the field through technical manuals or conventional experimental methods, when in use, the heat dissipation cover 3 is fixed in the heat dissipation groove 2 of the case 1, the installation screw hole 5 on the fixing plate 4 is aligned with the installation screw hole 5 on the case 1, the fixing hole of a mainboard to be installed is aligned with the installation screw hole 5, then the three are connected and fixed by bolts, the fixation of the heat dissipation cover 3 and the mainboard is realized, meanwhile, the lead of the fan 6 is connected to the power supply of the computer, when the computer is started to work, the fan 6 rotates simultaneously, heat generated by the work of the mainboard is distributed among the radiating fins 7, and then the heat is extracted to the ventilation net 9 of the radiating cover 3 by the fan 6 to be discharged, so that a better radiating effect on the mainboard is realized.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. The utility model provides a computer hardware heat dissipation mechanism, includes quick-witted case (1) and radiating groove (2), its characterized in that: the heat dissipation groove (2) is formed in the inner wall of the case (1), and a heat dissipation cover (3) is fixed in the heat dissipation groove (2);
the inside intermediate position transverse connection of heat exchanger (3) is fixed with heat dissipation otter board (8), vertical welded fastening has heat radiation fins (7) in heat exchanger (3) of heat dissipation otter board (8) front side, and heat radiation fins (7) are a plurality of, and the rear side surface of heat dissipation otter board (8) is fixed with fan (6), and fan (6) are four, the both sides surface of heat exchanger (3) all is connected with fixed plate (4), and the surface of fixed plate (4) and quick-witted case (1) surface of fixed plate (4) rear side all are provided with installation screw (5), and the mode that connects soon in installation screw (5) through the bolt of heat exchanger (3) is fixed in quick-witted case (1) one side.
2. The computer hardware heat dissipation mechanism of claim 1, wherein: the surface all around of the outside of heat dissipation cover (3) all is provided with ventilation net (9), and what ventilation net (9) encircleed sets up the outer lane at heat dissipation cover (3).
3. The computer hardware heat dissipation mechanism of claim 1, wherein: the heat dissipation screen plate (8) is a net-shaped plate made of stainless steel materials.
4. The computer hardware heat dissipation mechanism of claim 1, wherein: the radiating fins (7) are made of aluminum thin sheets.
5. The computer hardware heat dissipation mechanism of claim 1, wherein: the fan (6) is electrically connected with a power supply of the computer through a lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922295930.5U CN210983287U (en) | 2019-12-19 | 2019-12-19 | Computer hardware heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922295930.5U CN210983287U (en) | 2019-12-19 | 2019-12-19 | Computer hardware heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210983287U true CN210983287U (en) | 2020-07-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922295930.5U Expired - Fee Related CN210983287U (en) | 2019-12-19 | 2019-12-19 | Computer hardware heat dissipation mechanism |
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| Country | Link |
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| CN (1) | CN210983287U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115202448B (en) * | 2022-07-19 | 2023-12-12 | 武汉松泽源科技发展有限公司 | Calculator host with additional heat dissipation component externally mounted |
-
2019
- 2019-12-19 CN CN201922295930.5U patent/CN210983287U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115202448B (en) * | 2022-07-19 | 2023-12-12 | 武汉松泽源科技发展有限公司 | Calculator host with additional heat dissipation component externally mounted |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200710 Termination date: 20211219 |