CN201054345Y - A wafer top push system for solid crystal processing machine - Google Patents
A wafer top push system for solid crystal processing machine Download PDFInfo
- Publication number
- CN201054345Y CN201054345Y CNU2007201524743U CN200720152474U CN201054345Y CN 201054345 Y CN201054345 Y CN 201054345Y CN U2007201524743 U CNU2007201524743 U CN U2007201524743U CN 200720152474 U CN200720152474 U CN 200720152474U CN 201054345 Y CN201054345 Y CN 201054345Y
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- CN
- China
- Prior art keywords
- wafer
- ejection
- ejection system
- machine according
- solid brilliant
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a wafer ejection system used for a die bonder. The wafer ejection system comprises an ejector pin, an ejector axle, a base and a power device, wherein, the ejector axle is fixed and arranged on the base, and the ejector axle is hollow with the bottom being provided with holes, the bottom of the ejector pin is inserted into the holes at the bottom of the ejector axle, the top of the ejector pin is partially exposed in air, and the power device is connected with the base. The wafer ejection system further comprises a diaphragm adsorbing device and a wafer horizontal deviation device. The wafer ejection system can eject the wafer upward to separate the wafer from a polyester film layer, and ensure the wafer to be easily adsorbed, thereby the working efficiency and the quality of the die bonder are greatly improved.
Description
Technical field
The utility model relates to a kind of ejection system, refers in particular to the wafer ejection system that is used for solid brilliant machine.
Background technology
Gu brilliant machine is to produce imperative equipment in the light-emitting diode process, Gu brilliant purpose is: utilize bonding agent that wafer (chip) is attached to led support bowl cup bottom surface, it is bonded on the pedestal, be beneficial to bonding wire and pressing mold.
Because wafer is adsorbed on the laminated polyester film, therefore, it is brilliant solid brilliant to use traditional device to get, and wafer is difficult for separated and draws, and causes operating efficiency to descend.
The utility model content
In view of this, the purpose of this utility model is to address the above problem, and a kind of wafer ejection system is provided, and with the wafer jack-up that makes progress, wafer and laminated polyester film is broken away from.
The technical solution of the utility model is: a kind of wafer ejection system that is used for solid brilliant machine, it is characterized in that: comprise ejection pin, ejection axle, pedestal, power set, the ejection axle is fixedly mounted on the pedestal, the hole is established in ejection axle hollow and bottom, ejection pin bottom is inserted in the ejection axle base apertures, ejection pin top section is exposed in the air, and power set connect pedestal.
Described wafer ejection system further comprises the absorption diaphragm device.
Described absorption diaphragm device comprises vacuum generator, vacuum tube; Vacuum tube one end connects the hollow space of ejection axle inside, and the other end connects vacuum generator, in the described vacuum generator valve is set.
Described wafer ejection system further comprises the ejection cap, and described ejection crown portion establishes the hole, and ejection pin 101 bottoms are inserted in the ejection cap top-portion apertures, ejection cap bottom and ejection axle top tight fit.
Described valve is an electromagnetically operated valve.
Described wafer ejection system further comprises wafer, wafer offset assembly.
Described wafer offset assembly comprises cross slide way, cross slide way screw mandrel, cross slide way motor, longitudinal rail, longitudinal rail screw mandrel, longitudinal rail motor, wafer plate rail, wafer disks; Longitudinal rail is fixed on the machine deck, and cross slide way matches with longitudinal rail screw mandrel in the longitudinal rail, and the wafer plate rail connects the wafer disks arm, and the wafer disks arm matches with cross slide way screw mandrel in the cross slide way, and the wafer plate rail is on the wafer plate rail.
Described power set are stepper motors.
The lifting height of described wafer ejection system is half of wafer thickness.
The lifting height of described wafer ejection system is 1 millimeter.
The range of described cross slide way is 100mm.
The range of described longitudinal rail is 100mm.
The pressure of described vacuum generator is-630mmHg.
The beneficial effects of the utility model are: because wafer ejection system can upwards eject wafer, wafer and laminated polyester film are broken away from, make wafer be drawn easily, therefore, improved the operating efficiency and the quality of solid brilliant machine greatly.
Description of drawings
Fig. 1 is the utility model wafer ejection system configuration schematic diagram;
Fig. 2 is the utility model wafer and wafer offset assembly structural representation;
Fig. 3 is the utility model wafer ejection system work process schematic diagram.
Among the figure, 101: the ejection pin; 102: the ejection axle; 103: pedestal; 104: the ejection cap; 105: stepper motor; 201: vacuum generator; 202: vacuum tube; 203: electromagnetically operated valve; 301: wafer; 302: cross slide way; 303: the cross slide way screw mandrel; 304: the cross slide way motor; 305: longitudinal rail; 306: the longitudinal rail screw mandrel; 307: the longitudinal rail motor; 308: the wafer disks arm; 309: the wafer plate rail; 310: wafer disks; 311: suction nozzle; 312: laminated polyester film.
Embodiment
Below in conjunction with accompanying drawing the utility model is further described.
Please refer to Fig. 1, to further describe the structure of wafer ejection system.Wafer ejection system comprises pedestal 103, ejection cap 104, ejection axle 102, ejection pin 101, stepper motor 105, vacuum generator 201.Wafer ejection system is fixed on the machine deck, and is positioned at below, wafer disks 310 bottoms, and ejection pin 101 is aimed at wafer disks 310.Stepper motor 105 and vacuum generator 201 are positioned at machine intimate, and stepper motor 105 provides power for wafer ejection system, and vacuum generator 201 is connected on the pedestal 103 by connecting vacuum tube 202, and by electromagnetically operated valve 203 Control work.Ejection axle 102 is positioned at pedestal 103 centers, exceeds pedestal 103, and ejection pin 101 is contained in the ejection axle 102, and ejection cap 104 is threaded with ejection axle 102, and ejection pin 101 is fixed in the ejection axle 102.Ejection pin 101 exceeds ejection axle 102 and ejection cap 104, and part is exposed to aerial.
Please refer to Fig. 2, to further describe the structure of wafer 301 and wafer offset assembly.Longitudinal rail 305 is fixed on the machine deck, and cross slide way 302 matches with longitudinal rail screw mandrel 306 in the longitudinal rail 305, and wafer plate rail 309 connects wafer disks arms 308, and wafer disks arm 308 matches with cross slide way screw mandrel 303 in the cross slide way 302.Cross slide way motor 307 is opened, and 303 rotations of cross slide way screw mandrel drive wafer plate rail 309 and laterally move; 303 reverse rotations of cross slide way screw mandrel drive wafer plate rail 309 and oppositely move.Longitudinal rail motor 307 is opened, and 306 rotations of longitudinal rail screw mandrel drive cross slide way 302 and wafer plate rail 309 and vertically move, and 306 reverse rotations of longitudinal rail screw mandrel drive cross slide way 302 and wafer plate rail 309 vertically oppositely moves.310 of wafer disks are on wafer plate rail 309.Wafer plate rail 309 laterally, longitudinally forward farthest displacement be 100 millimeters, wafer plate rail 309 laterally, longitudinally oppositely farthest displacement also be 100 millimeters.
Please refer to Fig. 3, to further describe the course of work of wafer ejection system.Wafer ejection system is fixed on the machine deck, and ejection pin 101 horizontal levels maintain static.During work, by regulate longitudinal rail 305, cross slide way 302 is regulated the position of wafer disks 310, makes wafer on the wafer disks 310 be positioned at the top of ejection pin 101.Motor starting, ejection pin 101 rises, and wafer 301 is ejected, and wafer 301 breaks away from laminated polyester film 312.Suction nozzle 311 utilizes pull of vacuum that wafer 301 is siphoned away.Ejection pin 101 is simultaneously also with wafer disks 310 jack-up.In the time of motor starting, vacuum generator 201 work, ejection axle 102 lumens that are connected with vacuum tube 202 are evacuated, and ejection axle 102 inner and outer air pressure differences produce attraction, and drawing wafer disks 310 and other crystal grain can be because of self gravitation effect landing.Motor, vacuum generator 201 quit work, and ejection pin 101, wafer disks 310 set back.The maximum pressure value of vacuum generator 201 is-630mmHg.
For stablizing machine performance, after ejection pin 101 used a period of time, approximately some months needed to change.During replacing, unload the ejection cap, extract ejection pin 101, get a new ejection pin 101 and insert ejection axles 102, and tighten the ejection cap and get final product.In addition, ejection pin 101 is very sharp, should take care during use.
Claims (13)
1. wafer ejection system that is used for solid brilliant machine, it is characterized in that: comprise ejection pin (101), ejection axle (102), pedestal (103), power set, ejection axle (102) is fixedly mounted on the pedestal (103), the hole is established in ejection axle (102) hollow and bottom, ejection pin (101) bottom is inserted in ejection axle (102) base apertures, ejection pin (101) top section is exposed in the air, and power set connect pedestal (103).
2. the wafer ejection system that is used for solid brilliant machine according to claim 1 is characterized in that: described wafer ejection system further comprises the absorption diaphragm device.
3. the wafer ejection system that is used for solid brilliant machine according to claim 2 is characterized in that: described absorption diaphragm device comprises vacuum generator (201), vacuum tube (202); Vacuum tube (202) one ends connect the inner hollow space of ejection axle (102), and the other end connects vacuum generator (201), and described vacuum generator is provided with valve in (201).
4. the wafer ejection system that is used for solid brilliant machine according to claim 1, it is characterized in that: described wafer ejection system further comprises ejection cap (104), the hole is established at described ejection cap (104) top, ejection pin (101) bottom is inserted in ejection cap (104) top-portion apertures, ejection cap (104) bottom and ejection axle (102) top tight fit.
5. the wafer ejection system that is used for solid brilliant machine according to claim 3 is characterized in that: described valve is electromagnetically operated valve (203).
6. the wafer ejection system that is used for solid brilliant machine according to claim 1 is characterized in that: described wafer ejection system further comprises wafer (301), wafer offset assembly.
7. the wafer ejection system that is used for solid brilliant machine according to claim 6 is characterized in that: described wafer offset assembly comprises cross slide way (302), cross slide way screw mandrel (303), cross slide way motor (304), longitudinal rail (305), longitudinal rail screw mandrel (306), longitudinal rail motor (307), wafer plate rail (309), wafer disks (310); Longitudinal rail (305) is fixed on the machine deck, cross slide way (302) matches with longitudinal rail screw mandrel (306) in the longitudinal rail (305), wafer plate rail (309) connects wafer disks arm (308), wafer disks arm (308) matches with cross slide way screw mandrel (303) in the cross slide way (302), and wafer disks (310) frame is on wafer plate rail (309).
8. the wafer ejection system that is used for solid brilliant machine according to claim 1 is characterized in that: described power set are stepper motor (105).
9. the wafer ejection system that is used for solid brilliant machine according to claim 1 is characterized in that: the lifting height of described wafer ejection system is half of wafer (301) thickness.
10. the wafer ejection system that is used for solid brilliant machine according to claim 1 is characterized in that: the lifting height of described wafer ejection system is 1 millimeter.
11. the wafer ejection system that is used for solid brilliant machine according to claim 7, it is characterized in that: the range of described cross slide way (302) is 100mm.
12. the wafer ejection system that is used for solid brilliant machine according to claim 7, it is characterized in that: the range of described longitudinal rail (305) is 100mm.
13. the wafer ejection system that is used for solid brilliant machine according to claim 3 is characterized in that: the pressure of described vacuum generator (201) is-630mmHg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201524743U CN201054345Y (en) | 2007-06-04 | 2007-06-04 | A wafer top push system for solid crystal processing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201524743U CN201054345Y (en) | 2007-06-04 | 2007-06-04 | A wafer top push system for solid crystal processing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201054345Y true CN201054345Y (en) | 2008-04-30 |
Family
ID=39394005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201524743U Expired - Fee Related CN201054345Y (en) | 2007-06-04 | 2007-06-04 | A wafer top push system for solid crystal processing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201054345Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958380A (en) * | 2010-09-03 | 2011-01-26 | 深圳市因沃客科技有限公司 | Solid crystal machine head bonding mechanism |
| CN105489531A (en) * | 2015-12-09 | 2016-04-13 | 华南师范大学 | COB (chips on board) die-bonding and wire-soldering system and method |
-
2007
- 2007-06-04 CN CNU2007201524743U patent/CN201054345Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958380A (en) * | 2010-09-03 | 2011-01-26 | 深圳市因沃客科技有限公司 | Solid crystal machine head bonding mechanism |
| CN101958380B (en) * | 2010-09-03 | 2012-01-25 | 深圳市因沃客科技有限公司 | Solid crystal machine head bonding mechanism |
| CN105489531A (en) * | 2015-12-09 | 2016-04-13 | 华南师范大学 | COB (chips on board) die-bonding and wire-soldering system and method |
| CN105489531B (en) * | 2015-12-09 | 2018-06-05 | 华南师范大学 | A kind of COB die bonds wire bonding system and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YANG SHAOCHEN Free format text: FORMER OWNER: BIG WIN CNC EQUIPMENT ( SHENZHEN ) CO., LTD. Effective date: 20090814 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090814 Address after: Guangdong city of Shenzhen province Baoan District Fuyong new streets and community Fuyuan Road HUAFA Industrial Park, building A11, zip code: 518103 Patentee after: Yang Shaochen Address before: A road HUAFA Industrial Park in Baoan District Fuyong Town, Shenzhen city of Guangdong province Fuyuan first floor, zip code: 518103 Patentee before: Daying NC Equipment(Shenzhen) Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080430 Termination date: 20100604 |