CN117382975A - High-efficiency film sticking machine and film sticking method for high-frequency circuit board - Google Patents
High-efficiency film sticking machine and film sticking method for high-frequency circuit board Download PDFInfo
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- CN117382975A CN117382975A CN202311600315.5A CN202311600315A CN117382975A CN 117382975 A CN117382975 A CN 117382975A CN 202311600315 A CN202311600315 A CN 202311600315A CN 117382975 A CN117382975 A CN 117382975A
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- Prior art keywords
- frequency circuit
- circuit board
- piston rod
- film
- cylinder
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- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000002313 adhesive film Substances 0.000 claims abstract description 111
- 230000007246 mechanism Effects 0.000 claims abstract description 71
- 239000010410 layer Substances 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000012528 membrane Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000009194 climbing Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
- B65B33/02—Packaging small articles, e.g. spare parts for machines or engines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B41/00—Supplying or feeding container-forming sheets or wrapping material
- B65B41/02—Feeding sheets or wrapper blanks
- B65B41/04—Feeding sheets or wrapper blanks by grippers
- B65B41/06—Feeding sheets or wrapper blanks by grippers by suction-operated grippers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a high-efficiency film sticking machine for a high-frequency circuit board and a film sticking method, which relate to the technical field of sticking adhesive films on the high-frequency circuit board, wherein an adhesive film jacking mechanism, a flat belt conveying mechanism, a high-frequency circuit board jacking mechanism and a film driving mechanism are sequentially arranged on a table top of a workbench from left to right; the film driving mechanism comprises a vertical plate fixedly arranged on the workbench, a first horizontal cylinder and a second horizontal cylinder fixedly arranged on the right end face of the vertical plate, a piston rod of the vertical cylinder penetrates through the connecting plate, and a pinch roller is rotatably arranged on the extending end. The beneficial effects of the invention are as follows: the working intensity of workers is reduced, and the film pasting efficiency of the high-frequency circuit board is greatly improved.
Description
Technical Field
The invention relates to the technical field of adhesive film sticking on a high-frequency circuit board, in particular to a high-efficiency film sticking machine and a film sticking method for the high-frequency circuit board.
Background
The high-frequency circuit board has high transmission frequency, is widely arranged in a certain case and plays a role in controlling the operation of electrical elements in the case. When the high-frequency circuit board is primarily produced and formed, a layer of adhesive film is required to be attached to a designated position of the high-frequency circuit board in the process, the structure of the high-frequency circuit board 2 attached with the adhesive film 1 is shown in fig. 1, the adhesive film 1 plays a role in protecting circuits on the high-frequency circuit board 2, wherein the bottom surface of the adhesive film 1 is an adhesive layer, and the top surface of the adhesive film is made of a silica gel material.
The method for sticking the adhesive film 1 on the high-frequency circuit board 2 in the workshop comprises the following steps: a worker takes out a high-frequency circuit board 2 and places the high-frequency circuit board on a machine table, then takes out a glue film 1, and the worker primarily adheres an adhesive layer of the glue film 1 to the top surface of the high-frequency circuit board 2; after the primary pasting, a worker manually presses the top surface of the adhesive film 1 to drive away bubbles between the adhesive film 1 and the high-frequency circuit board 2, so that the adhesive film 1 is finally pasted on the high-frequency circuit board 2; finally, the worker turns the high-frequency circuit board 2 stuck with the adhesive film 1 into a subsequent packaging station; the above operation is repeated in such a manner that a layer of adhesive film 1 is stuck on the top surfaces of the plurality of high-frequency circuit boards 2.
However, the film sticking method in the workshop is capable of sticking the adhesive film 1 on the high-frequency circuit board 2, but the following technical drawbacks still exist in the art:
I. in the rubberizing membrane process, need artifical manual paste glued membrane 1 in the first step on high frequency circuit board 2, then still manual the driving out the bubble between glued membrane 1 and the high frequency circuit board 2, just can firmly paste glued membrane 1 on high frequency circuit board 2, whole operation is accomplished by manual work, has not only increased workman's working strength, has still increased the pad pasting time of high frequency circuit board 2 moreover, and then very big reduction the pad pasting efficiency of high frequency circuit board 2.
II. The high frequency circuit board 2 with the adhesive film 1 attached thereon needs to be manually transferred to a subsequent packaging station, which clearly further increases the work intensity of workers. Therefore, there is a need for a laminator and a laminating method that reduce the labor intensity of workers and greatly improve the laminating efficiency of high frequency circuit boards.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a high-efficiency film sticking machine and a film sticking method for a high-frequency circuit board, which can lighten the working intensity of workers and greatly improve the film sticking efficiency of the high-frequency circuit board.
The aim of the invention is achieved by the following technical scheme: the utility model provides a high-efficient pad pasting machine of high frequency circuit board, it includes the workstation, be provided with glued membrane climbing mechanism, flat belt conveying mechanism, high frequency circuit board climbing mechanism and driving mechanism in order from left to right on the mesa of workstation, still be provided with preliminary pad pasting mechanism on the workstation, preliminary pad pasting mechanism is including setting firmly the support on the workstation, set firmly the step motor at support top, set firmly the swivel mount on the output shaft of step motor, set firmly the lift cylinder on the swivel mount, set firmly the sucking disc on the action end of lift cylinder piston rod, a plurality of apertures that are linked together with its inner chamber have been seted up on the bottom surface of sucking disc, the sucking disc is connected with the vacuum pump, the sucking disc sets up directly over glued membrane climbing mechanism;
the film driving mechanism comprises a vertical plate fixedly arranged on the workbench, a first horizontal cylinder and a second horizontal cylinder fixedly arranged on the right end face of the vertical plate, a piston rod of the first horizontal cylinder penetrates through the vertical plate, a connecting plate is fixedly arranged on the extending end, a vertical cylinder is fixedly arranged on the top surface of the connecting plate, a piston rod of the vertical cylinder penetrates through the connecting plate, a pinch roller is rotatably arranged on the extending end, a piston rod of the second horizontal cylinder penetrates through the vertical plate, and a push plate is fixedly arranged on the extending end.
The adhesive film jacking mechanism comprises a first charging barrel fixedly arranged on the table surface of the workbench, a first jacking cylinder fixedly arranged on the bottom surface of the workbench, a piston rod of the first jacking cylinder penetrates through the workbench and extends into the first charging barrel, a first jacking plate is fixedly arranged at the extending end of the piston rod, a plurality of adhesive films are sequentially stacked on the top surface of the first jacking plate, the outer contour of the adhesive film is matched with the inner cavity of the first charging barrel, and an adhesive layer of the adhesive film positioned on the upper layer is supported on a silica gel layer of the adhesive film positioned on the lower layer.
The high-frequency circuit board jacking mechanism comprises a second charging barrel fixedly arranged on the table surface of the workbench and a second jacking cylinder fixedly arranged on the bottom surface of the workbench, a piston rod of the second jacking cylinder penetrates through the workbench and extends into the second charging barrel, a second jacking plate is fixedly arranged at the extending end of the piston rod, a plurality of high-frequency circuit boards are sequentially stacked on the top surface of the second jacking plate, and the outer contour of the high-frequency circuit boards is matched with the inner cavity of the second charging barrel.
The flat belt conveying mechanism is longitudinally arranged.
The bottom surface of the workbench is fixedly provided with a plurality of supporting legs which are supported on the ground.
The vacuum pump is fixedly arranged on the top surface of the sucker, and a working port of the vacuum pump is communicated with the inner cavity of the sucker.
The high-efficiency film sticking machine further comprises a controller, wherein the controller is electrically connected with the stepping motor, the lifting cylinder, the first horizontal cylinder, the second horizontal cylinder and the vertical cylinder through signal wires.
A high-efficiency film sticking method of a high-frequency circuit board comprises the following steps:
s1, controlling a piston rod of a first ejection cylinder of a glue film lifting mechanism to extend upwards, driving a first lifting plate to move upwards by the piston rod, driving all glue films stacked on the first lifting plate to move upwards by the first lifting plate, and controlling the first ejection cylinder to be closed by a controller after the piston rod extends to a set stroke, wherein the glue film at the top layer is just ejected out of a first material cylinder;
s2, controlling a piston rod of a second ejection cylinder of the high-frequency circuit board ejection mechanism to extend upwards, driving the second ejection plate to move upwards by the piston rod, driving all high-frequency circuit boards stacked on the second ejection plate to move upwards by the second ejection plate, and controlling the second ejection cylinder to be closed by a controller after the piston rod extends to a set stroke, wherein the topmost high-frequency circuit board is just ejected out of the second charging barrel;
s3, primarily adhering an adhesive film, wherein the specific operation steps are as follows:
s31, controlling a piston rod of a lifting cylinder of the primary film pasting mechanism to extend downwards, driving a sucker and a vacuum pump to synchronously move downwards, enabling the sucker to move towards the adhesive film on the topmost layer, and enabling the bottom surface of the sucker to just contact with the silica gel layer of the adhesive film after the piston rod of the lifting cylinder extends completely;
s32, controlling a vacuum pump to start, wherein the vacuum pump vacuumizes the inner cavity and the small hole of the sucker, and the adhesive film is adsorbed and fixed on the sucker under negative pressure;
s33, controlling a piston rod of the lifting cylinder to retract upwards, and driving the sucker to move upwards by the piston rod, and driving the adhesive film to move upwards by the sucker so as to lift the adhesive film;
s34, controlling a stepping motor of the preliminary film pasting mechanism to start, enabling the stepping motor to drive a rotating frame to rotate, enabling a lifting cylinder and a sucker to rotate, enabling the sucker to drive an absorbed adhesive film to synchronously rotate, and controlling the stepping motor to close after the adhesive film rotates 180 degrees, wherein the adhesive film is just above a high-frequency circuit board;
s35, controlling a piston rod of the lifting cylinder to extend downwards, driving the sucker to move downwards, driving the adhesive film to move downwards by the sucker, enabling an adhesive layer of the adhesive film to move towards the direction of the high-frequency circuit board, and controlling the lifting cylinder to be closed by the controller after the piston rod extends to a set distance, so that the adhesive layer of the adhesive film is just primarily adhered to the top surface of the high-frequency circuit board, and primarily adhering the adhesive film to the top surface of the high-frequency circuit board; after the adhesive is primarily stuck, the vacuum pump is controlled to be turned off, the adhesive film is not adsorbed on the sucker any more, and then the stepping motor is controlled to drive the sucker to reset;
s4, expelling bubbles between the adhesive film and the high-frequency circuit board, wherein the specific operation steps are as follows: s41, controlling a piston rod of a first horizontal cylinder of the film driving mechanism to extend out, driving a connecting plate to move leftwards by the piston rod, driving a vertical cylinder to synchronously move leftwards by the connecting plate, and driving a pressing wheel to move leftwards by the vertical cylinder, wherein the pressing wheel is right above the left end part of the adhesive film after the piston rod of the first horizontal cylinder extends out completely;
s42, controlling a piston rod of the vertical air cylinder to extend downwards, and driving the pinch roller to move downwards by the piston rod, wherein the pinch roller is just pressed on the top surface of the left end part of the adhesive film after the piston rod of the vertical air cylinder extends completely;
s43, controlling a piston rod of the first horizontal cylinder to retract rightwards, driving the pressing wheel to move rightwards, gradually rolling the adhesive film rightwards by the pressing wheel to gradually expel bubbles between the adhesive film and the high-frequency circuit board, and expelling all bubbles between the adhesive film and the high-frequency circuit board when the pressing wheel moves to the right end part of the adhesive film, so that the adhesive film is finally adhered to the high-frequency circuit board;
s44, controlling a piston rod of the second horizontal cylinder to move leftwards, driving a push plate to move leftwards by the piston rod, pushing a high-frequency circuit board adhered with a glue film to move leftwards by the push plate, moving the high-frequency circuit board towards the direction of the flat belt conveying mechanism, and conveying the high-frequency circuit board adhered with the glue film towards the direction of a packaging station by the flat belt after the high-frequency circuit board falls onto the flat belt of the flat belt conveying mechanism;
s5, the worker repeats the operations of the steps S1-S4, and the first charging barrels can be continuously and correspondingly adhered to the high-frequency circuit board in the second charging barrel.
The invention has the following advantages: the working intensity of workers is reduced, and the film pasting efficiency of the high-frequency circuit board is greatly improved.
Drawings
FIG. 1 is a schematic diagram of a high frequency circuit board with a glue film;
FIG. 2 is a schematic diagram of the structure of the present invention;
FIG. 3 is a schematic view of a preliminary film sticking mechanism;
FIG. 4 is a schematic structural view of a suction cup;
FIG. 5 is a bottom view of FIG. 4;
FIG. 6 is a schematic structural view of a film lifting mechanism;
FIG. 7 is a schematic view of a high frequency circuit board lifting mechanism;
FIG. 8 is a schematic structural view of a film driving mechanism;
FIG. 9 is a schematic view of a flat belt conveyor mechanism;
FIG. 10 is a top view of FIG. 9;
FIG. 11 is a schematic illustration of the topmost high frequency circuit board being ejected outside of the second cartridge;
FIG. 12 is a schematic view of the bottom surface of the suction cup contacting the silicone layer of the adhesive film;
FIG. 13 is a schematic view of lifting the adhesive film;
FIG. 14 is a schematic view of the adhesive film moving directly over the high frequency circuit board;
fig. 15 is a schematic view of the primary adhesion of an adhesive film on the top surface of a high frequency circuit board;
FIG. 16 is a schematic view of the puck pressing just against the top surface of the left end of the adhesive film;
FIG. 17 is a schematic diagram showing the removal of all bubbles between the adhesive film and the high frequency circuit board;
FIG. 18 is a schematic diagram of a push plate pushing a high frequency circuit board to move to the left;
in the figure:
1-adhesive film, 2-high frequency circuit board, 3-workbench, 4-adhesive film jacking mechanism, 5-flat belt conveying mechanism, 6-high frequency circuit board jacking mechanism, 7-film driving mechanism, 8-preliminary film pasting mechanism, 9-bracket, 10-stepper motor, 11-rotating frame, 12-lifting cylinder, 13-sucker, 14-small hole, 15-riser, 16-first horizontal cylinder, 17-second horizontal cylinder, 18-connecting plate, 19-vertical cylinder, 20-pinch roller, 21-push plate, 22-first feed cylinder, 23-first jacking cylinder, 24-first jacking plate, 25-second feed cylinder, 26-second jacking cylinder and 27-second jacking plate.
Detailed Description
The invention is further described below with reference to the accompanying drawings, the scope of the invention not being limited to the following:
as shown in fig. 2-10, a high-efficiency film sticking machine for a high-frequency circuit board comprises a workbench 3, a plurality of supporting legs supported on the ground are fixedly arranged on the bottom surface of the workbench 3, a film jacking mechanism 4, a flat belt conveying mechanism 5, a high-frequency circuit board jacking mechanism 6 and a film driving mechanism 7 are sequentially arranged on the table surface of the workbench 3 from left to right, the flat belt conveying mechanism 5 is longitudinally arranged, a preliminary film sticking mechanism 8 is further arranged on the workbench 3, the preliminary film sticking mechanism 8 comprises a support 9 fixedly arranged on the workbench 3, a stepping motor 10 fixedly arranged at the top end of the support 9, a rotating frame 11 is fixedly arranged on an output shaft of the stepping motor 10, a lifting cylinder 12 is fixedly arranged on the rotating frame 11, a sucker 13 is fixedly arranged at the acting end of a piston rod of the lifting cylinder 12, a plurality of small holes 14 communicated with an inner cavity of the sucker 13 are formed in the bottom surface of the sucker 13, the sucker 13 is connected with a vacuum pump, the sucker 13 is arranged right above the film jacking mechanism 4, the vacuum pump is fixedly arranged on the top surface of the sucker 13, and a working port of the vacuum pump is communicated with the inner cavity of the sucker 13.
The film driving mechanism 7 comprises a vertical plate 15 fixedly arranged on the workbench 3, a first horizontal cylinder 16 and a second horizontal cylinder 17 fixedly arranged on the right end face of the vertical plate 15, a piston rod of the first horizontal cylinder 16 penetrates through the vertical plate 15, a connecting plate 18 is fixedly arranged on the extending end, a vertical cylinder 19 is fixedly arranged on the top surface of the connecting plate 18, a piston rod of the vertical cylinder 19 penetrates through the connecting plate 18, a pinch roller 20 is rotatably arranged on the extending end, a piston rod of the second horizontal cylinder 17 penetrates through the vertical plate 15, and a push plate 21 is fixedly arranged on the extending end.
The adhesive film jacking mechanism 4 comprises a first charging barrel 22 fixedly arranged on the table surface of the workbench 3, and a first jacking air cylinder 23 fixedly arranged on the bottom surface of the workbench 3, wherein a piston rod of the first jacking air cylinder 23 penetrates through the workbench 3 and extends into the first charging barrel 22, a first jacking plate 24 is fixedly arranged at the extending end of the piston rod, a plurality of adhesive films 1 are sequentially stacked on the top surface of the first jacking plate 24, the outer contour of the adhesive film 1 is matched with the inner cavity of the first charging barrel 22, and an adhesive layer of the adhesive film 1 positioned on the upper layer is supported on a silica gel layer of the adhesive film 1 positioned on the lower layer.
The high-frequency circuit board jacking mechanism 6 comprises a second charging barrel 25 fixedly arranged on the table surface of the workbench 3, and a second jacking air cylinder 26 fixedly arranged on the bottom surface of the workbench 3, a piston rod of the second jacking air cylinder 26 penetrates through the workbench 3 and extends into the second charging barrel 25, a second jacking plate 27 is fixedly arranged at the extending end of the piston rod, a plurality of high-frequency circuit boards 2 are sequentially stacked on the top surface of the second jacking plate 27, and the outer contour of the high-frequency circuit board 2 is matched with the inner cavity of the second charging barrel 25.
The high-efficiency film sticking machine further comprises a controller, wherein the controller is electrically connected with the stepping motor 10, the lifting cylinder 12, the first horizontal cylinder 16, the second horizontal cylinder 17 and the vertical cylinder 19 through signal wires.
A high-efficiency film sticking method of a high-frequency circuit board comprises the following steps:
s1, controlling a piston rod of a first ejection cylinder 23 of a film jacking mechanism 4 to extend upwards, driving a first jacking plate 24 to move upwards by the piston rod, driving all films 1 stacked on the first jacking plate 24 to move upwards, and controlling the first ejection cylinder 23 to be closed by a controller after the piston rod extends to a set stroke, wherein the top film 1 is just ejected out of a first charging barrel 22;
s2, controlling a piston rod of a second ejection cylinder 26 of the high-frequency circuit board jacking mechanism 6 to extend upwards, driving a second jacking plate 27 to move upwards by the piston rod, driving all high-frequency circuit boards 2 stacked on the second jacking plate 27 to move upwards, and controlling the second ejection cylinder 26 to be closed by a controller after the piston rod extends to a set stroke, wherein the topmost high-frequency circuit board 2 is just ejected out of a second charging barrel 25 at the moment, as shown in FIG. 11;
s3, primarily adhering an adhesive film, wherein the specific operation steps are as follows:
s31, controlling a piston rod of a lifting cylinder 12 of the primary film pasting mechanism 8 to extend downwards, driving a sucking disc 13 and a vacuum pump to synchronously move downwards, enabling the sucking disc 13 to move towards the direction of the adhesive film 1 on the topmost layer, and enabling the bottom surface of the sucking disc 13 to just contact with the silica gel layer of the adhesive film 1 after the piston rod of the lifting cylinder 12 extends completely, as shown in FIG. 12;
s32, controlling a vacuum pump to start, wherein the vacuum pump vacuumizes the inner cavity and the small hole 14 of the sucker 13, and the adhesive film 1 is adsorbed and fixed on the sucker 13 under negative pressure;
s33, controlling a piston rod of the lifting cylinder 12 to retract upwards, wherein the piston rod drives the sucker 13 to move upwards, and the sucker 13 drives the adhesive film 1 to move upwards so as to lift the adhesive film 1, as shown in FIG. 13;
s34, controlling a stepping motor 10 of the preliminary film pasting mechanism 8 to start, enabling the stepping motor 10 to drive a rotating frame 11 to rotate, enabling the rotating frame 11 to drive a lifting cylinder 12 and a sucker 13 to rotate, enabling the sucker 13 to drive an absorbed adhesive film 1 to synchronously rotate, and controlling the stepping motor 10 to be closed by a controller after the adhesive film 1 rotates 180 degrees, wherein the adhesive film 1 is just above a high-frequency circuit board 2 at the moment, as shown in FIG. 14;
s35, controlling a piston rod of the lifting cylinder 12 to extend downwards, driving the sucking disc 13 to move downwards by the piston rod, driving the adhesive film 1 to move downwards by the sucking disc 13, enabling the adhesive layer of the adhesive film 1 to move towards the high-frequency circuit board 2, and controlling the lifting cylinder 12 to be closed by the controller after the piston rod extends to a set distance, wherein the adhesive layer of the adhesive film 1 is just primarily stuck on the top surface of the high-frequency circuit board 2, so that the adhesive film 1 is primarily stuck on the top surface of the high-frequency circuit board 2, as shown in FIG. 15; after preliminary pasting, the vacuum pump is controlled to be turned off, the adhesive film 1 is not adsorbed on the sucker 13 any more, and then the stepping motor 10 is controlled to drive the sucker 13 to reset;
s4, expelling bubbles between the adhesive film 1 and the high-frequency circuit board 2, wherein the specific operation steps are as follows: s41, controlling a piston rod of a first horizontal cylinder 16 of the film driving mechanism 7 to extend, driving a connecting plate 18 to move leftwards by the piston rod, driving a vertical cylinder 19 to synchronously move leftwards by the connecting plate 18, driving a pressing wheel 20 to move leftwards by the vertical cylinder 19, and enabling the pressing wheel 20 to be just above the left end part of the adhesive film 1 after the piston rod of the first horizontal cylinder 16 extends completely;
s42, controlling a piston rod of the vertical air cylinder 19 to extend downwards, and driving the pressing wheel 20 to move downwards by the piston rod, wherein when the piston rod of the vertical air cylinder 19 extends completely, the pressing wheel 20 just presses the top surface of the left end part of the adhesive film 1, as shown in FIG. 16;
s43, controlling a piston rod of the first horizontal cylinder 16 to retract rightwards, driving the pressing wheel 20 to move rightwards, gradually rolling the adhesive film 1 rightwards by the pressing wheel 20 so as to gradually expel air bubbles between the adhesive film 1 and the high-frequency circuit board 2, and expelling all air bubbles between the adhesive film 1 and the high-frequency circuit board 2 when the pressing wheel 20 moves to the right end part of the adhesive film 1, as shown in FIG. 17, so that the adhesive film 1 is finally adhered to the high-frequency circuit board 2;
s44, controlling a piston rod of the second horizontal cylinder 17 to move leftwards, driving the push plate 21 to move leftwards by the piston rod, and driving the high-frequency circuit board 2 adhered with the adhesive film 1 to move leftwards by the push plate 21, wherein as shown in FIG. 18, the high-frequency circuit board 2 moves towards the flat belt conveying mechanism 5, and after the high-frequency circuit board 2 falls onto a flat belt of the flat belt conveying mechanism 5, the flat belt conveys the high-frequency circuit board adhered with the adhesive film 1 towards a packaging station;
s5, the worker repeats the operations of the steps S1 to S4, so that the first charging barrels 22 can be respectively and correspondingly stuck on the high-frequency circuit board 2 in the second charging barrel 25 continuously.
Therefore, the film sticking machine can automatically and primarily stick the adhesive films 1 in the first charging barrel 22 on the high-frequency circuit board 2 in the second charging barrel 25 correspondingly, and then automatically roll the adhesive films 1 through the pinch roller 20 of the film driving mechanism 7 so as to thoroughly drive out air bubbles between the adhesive films 1 and the high-frequency circuit board 2, thereby finally sticking the adhesive films 1 on the high-frequency circuit board 2. Therefore, the film sticking machine does not need to manually stick the adhesive film 1 on the high-frequency circuit board 2 in a preliminary step, and then manually drives out bubbles between the adhesive film 1 and the high-frequency circuit board 2, so that the working intensity of workers is greatly reduced, the film sticking time is shortened, and the film sticking efficiency is greatly improved.
In addition, as can be seen from step S44, by controlling the extension of the piston rod of the second horizontal cylinder 17, the push plate 21 pushes the high-frequency circuit board 2 onto the flat belt of the flat belt conveying mechanism 5, and the flat belt directs the high-frequency circuit board 2 with the adhesive film adhered thereto to the subsequent packaging station, so that the automatic conveying of the high-frequency circuit board 2 is realized, and compared with the method in a workshop, the film sticking machine does not need to manually rotate the high-frequency circuit board 2 with the adhesive film 1 to the subsequent packaging station, thereby reducing the working intensity of workers.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A high-efficient sticking film machine of high-frequency circuit board, its characterized in that: the automatic film sticking machine comprises a workbench (3), wherein a film jacking mechanism (4), a flat belt conveying mechanism (5), a high-frequency circuit board jacking mechanism (6) and a film driving mechanism (7) are sequentially arranged on a table top of the workbench (3) from left to right, a preliminary film sticking mechanism (8) is further arranged on the workbench (3), the preliminary film sticking mechanism (8) comprises a support (9) fixedly arranged on the workbench (3), a stepping motor (10) fixedly arranged at the top end part of the support (9), a rotating frame (11) is fixedly arranged on an output shaft of the stepping motor (10), a lifting cylinder (12) is fixedly arranged on the rotating frame (11), a sucker (13) is fixedly arranged at the acting end of a piston rod of the lifting cylinder (12), a plurality of small holes (14) communicated with the inner cavity of the sucker (13) are formed in the bottom surface of the sucker (13), the sucker (13) is connected with a vacuum pump, and the sucker (13) is arranged right above the film jacking mechanism (4);
the film-driving mechanism (7) comprises a vertical plate (15) fixedly arranged on the workbench (3), a first horizontal cylinder (16) and a second horizontal cylinder (17) fixedly arranged on the right end face of the vertical plate (15), a piston rod of the first horizontal cylinder (16) penetrates through the vertical plate (15), a connecting plate (18) is fixedly arranged on the extending end, a vertical cylinder (19) is fixedly arranged on the top surface of the connecting plate (18), a piston rod of the vertical cylinder (19) penetrates through the connecting plate (18), a pressing wheel (20) is rotatably arranged on the extending end, a piston rod of the second horizontal cylinder (17) penetrates through the vertical plate (15), and a push plate (21) is fixedly arranged on the extending end.
2. The high-frequency circuit board high-efficiency film sticking machine according to claim 1, wherein: the adhesive film jacking mechanism (4) comprises a first charging barrel (22) fixedly arranged on the table top of the workbench (3), and a first ejection cylinder (23) fixedly arranged on the bottom surface of the workbench (3), a piston rod of the first ejection cylinder (23) penetrates through the workbench (3) and extends into the first charging barrel (22), a first jacking plate (24) is fixedly arranged at the extending end of the piston rod, a plurality of adhesive films (1) are sequentially stacked on the top surface of the first jacking plate (24), the outer contour of the adhesive film (1) is matched with the inner cavity of the first charging barrel (22), and an adhesive layer of the adhesive film (1) positioned on the upper layer is supported on a silica gel layer of the adhesive film (1) on the lower layer.
3. The high-frequency circuit board high-efficiency film sticking machine according to claim 1, wherein: the high-frequency circuit board jacking mechanism (6) comprises a second charging barrel (25) fixedly arranged on the table top of the workbench (3), a second jacking cylinder (26) fixedly arranged on the bottom surface of the workbench (3), a piston rod of the second jacking cylinder (26) penetrates through the workbench (3) and extends into the second charging barrel (25), a second jacking plate (27) is fixedly arranged at the extending end of the piston rod, a plurality of high-frequency circuit boards (2) are sequentially stacked on the top surface of the second jacking plate (27), and the outer contour of the high-frequency circuit boards (2) is matched with the inner cavity of the second charging barrel (25).
4. The high-frequency circuit board high-efficiency film sticking machine according to claim 1, wherein: the flat belt conveying mechanism (5) is longitudinally arranged.
5. The high-frequency circuit board high-efficiency film sticking machine according to claim 1, wherein: a plurality of supporting legs which are supported on the ground are fixedly arranged on the bottom surface of the workbench (3).
6. The high-frequency circuit board high-efficiency film sticking machine according to claim 1, wherein: the vacuum pump is fixedly arranged on the top surface of the sucker (13), and a working port of the vacuum pump is communicated with the inner cavity of the sucker (13).
7. The high-frequency circuit board high-efficiency film sticking machine according to claim 1, wherein: the high-efficiency film sticking machine further comprises a controller, wherein the controller is electrically connected with the stepping motor (10), the lifting cylinder (12), the first horizontal cylinder (16), the second horizontal cylinder (17) and the vertical cylinder (19) through signal wires.
8. The high-frequency circuit board high-efficiency film sticking machine and film sticking method are adopted, and are characterized in that: it comprises the following steps:
s1, controlling a piston rod of a first ejection cylinder (23) of a glue film lifting mechanism (4) to extend upwards, driving a first lifting plate (24) to move upwards by the piston rod, driving all glue films (1) stacked on the first lifting plate (24) to move upwards, and controlling the first ejection cylinder (23) to be closed by a controller after the piston rod extends to a set stroke, wherein the top-most glue film (1) is just ejected out of a first charging barrel (22);
s2, controlling a piston rod of a second ejection cylinder (26) of the high-frequency circuit board lifting mechanism (6) to extend upwards, driving a second lifting plate (27) to move upwards by the piston rod, driving all high-frequency circuit boards (2) stacked on the second lifting plate (27) to move upwards, and controlling the second ejection cylinder (26) to be closed by a controller after the piston rod extends to a set stroke, wherein the topmost high-frequency circuit board (2) is just ejected out of a second charging barrel (25);
s3, primarily adhering an adhesive film, wherein the specific operation steps are as follows:
s31, controlling a piston rod of a lifting cylinder (12) of the primary film pasting mechanism (8) to extend downwards, driving a sucker (13) and a vacuum pump to synchronously move downwards, enabling the sucker (13) to move towards the direction of a top-most adhesive film (1), and enabling the bottom surface of the sucker (13) to be just contacted with a silica gel layer of the adhesive film (1) after the piston rod of the lifting cylinder (12) extends completely;
s32, controlling a vacuum pump to start, wherein the vacuum pump vacuumizes an inner cavity and a small hole (14) of the sucker (13), and the adhesive film (1) is adsorbed and fixed on the sucker (13) under negative pressure;
s33, controlling a piston rod of the lifting cylinder (12) to retract upwards, driving the sucker (13) to move upwards by the piston rod, and driving the adhesive film (1) to move upwards by the sucker (13) so as to lift the adhesive film (1);
s34, controlling a stepping motor (10) of the preliminary film pasting mechanism (8) to start, enabling the stepping motor (10) to drive a rotating frame (11) to rotate, enabling the rotating frame (11) to drive a lifting cylinder (12) and a sucker (13) to rotate, enabling the sucker (13) to drive an absorbed adhesive film (1) to synchronously rotate, and controlling the stepping motor (10) to be closed by a controller after the adhesive film (1) rotates 180 degrees, wherein the adhesive film (1) is just above a high-frequency circuit board (2);
s35, controlling a piston rod of a lifting cylinder (12) to extend downwards, driving a sucker (13) to move downwards by the piston rod, driving a glue film (1) to move downwards by the sucker (13), enabling a sticky layer of the glue film (1) to move towards a high-frequency circuit board (2), and controlling the lifting cylinder (12) to be closed by a controller after the piston rod extends to a set distance, wherein the sticky layer of the glue film (1) is just primarily stuck on the top surface of the high-frequency circuit board (2), so that the glue film (1) is primarily stuck on the top surface of the high-frequency circuit board (2); after preliminary pasting, the vacuum pump is controlled to be closed, the adhesive film (1) is not adsorbed on the sucker (13) any more, and then the stepping motor (10) is controlled to drive the sucker (13) to reset;
s4, expelling bubbles between the adhesive film (1) and the high-frequency circuit board (2), wherein the specific operation steps are as follows: s41, controlling a piston rod of a first horizontal cylinder (16) of the film driving mechanism (7) to extend, driving a connecting plate (18) to move leftwards by the piston rod, driving a vertical cylinder (19) to synchronously move leftwards by the connecting plate (18), driving a pressing wheel (20) to move leftwards by the vertical cylinder (19), and when the piston rod of the first horizontal cylinder (16) extends completely, enabling the pressing wheel (20) to be just above the left end part of the adhesive film (1);
s42, controlling a piston rod of the vertical air cylinder (19) to extend downwards, and driving the pinch roller (20) to move downwards by the piston rod, wherein after the piston rod of the vertical air cylinder (19) extends completely, the pinch roller (20) is just pressed on the top surface of the left end part of the adhesive film (1);
s43, controlling a piston rod of the first horizontal cylinder (16) to retract rightwards, driving the pinch roller (20) to move rightwards, gradually rolling the adhesive film (1) rightwards by the pinch roller (20) so as to gradually expel air bubbles between the adhesive film (1) and the high-frequency circuit board (2), and expelling all air bubbles between the adhesive film (1) and the high-frequency circuit board (2) when the pinch roller (20) moves to the right end part of the adhesive film (1), so that the adhesive film (1) is finally adhered to the high-frequency circuit board (2);
s44, controlling a piston rod of the second horizontal cylinder (17) to move leftwards, driving a push plate (21) to move leftwards by the piston rod, pushing a high-frequency circuit board (2) adhered with a glue film (1) to move leftwards by the push plate (21), enabling the high-frequency circuit board (2) to move towards a flat belt conveying mechanism (5), and conveying the high-frequency circuit board adhered with the glue film (1) towards a packaging station after the high-frequency circuit board (2) falls onto a flat belt of the flat belt conveying mechanism (5);
s5, the worker repeats the operations of the steps S1-S4, so that the first charging barrels (22) can be respectively and correspondingly stuck on the high-frequency circuit board (2) in the second charging barrel (25) continuously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311600315.5A CN117382975A (en) | 2023-11-28 | 2023-11-28 | High-efficiency film sticking machine and film sticking method for high-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311600315.5A CN117382975A (en) | 2023-11-28 | 2023-11-28 | High-efficiency film sticking machine and film sticking method for high-frequency circuit board |
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| CN117382975A true CN117382975A (en) | 2024-01-12 |
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| CN202311600315.5A Pending CN117382975A (en) | 2023-11-28 | 2023-11-28 | High-efficiency film sticking machine and film sticking method for high-frequency circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117602159A (en) * | 2024-01-23 | 2024-02-27 | 四川英创力电子科技股份有限公司 | Automatic circuit board feeding device and method with film coating function |
| CN117656495A (en) * | 2024-01-30 | 2024-03-08 | 四川辰宇微视科技有限公司 | Device and method for sticking film on OLED display screen of direct-coupling fusion camera |
-
2023
- 2023-11-28 CN CN202311600315.5A patent/CN117382975A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117602159A (en) * | 2024-01-23 | 2024-02-27 | 四川英创力电子科技股份有限公司 | Automatic circuit board feeding device and method with film coating function |
| CN117602159B (en) * | 2024-01-23 | 2024-04-05 | 四川英创力电子科技股份有限公司 | Automatic circuit board feeding device and method with film coating function |
| CN117656495A (en) * | 2024-01-30 | 2024-03-08 | 四川辰宇微视科技有限公司 | Device and method for sticking film on OLED display screen of direct-coupling fusion camera |
| CN117656495B (en) * | 2024-01-30 | 2024-04-19 | 四川辰宇微视科技有限公司 | Device and method for sticking film on OLED display screen of direct-coupling fusion camera |
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