CN210392812U - Overturning feeding device of semiconductor packaging and chip bonding equipment - Google Patents
Overturning feeding device of semiconductor packaging and chip bonding equipment Download PDFInfo
- Publication number
- CN210392812U CN210392812U CN201921021896.6U CN201921021896U CN210392812U CN 210392812 U CN210392812 U CN 210392812U CN 201921021896 U CN201921021896 U CN 201921021896U CN 210392812 U CN210392812 U CN 210392812U
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- frame
- track
- motor
- turnover
- workbench
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title claims description 7
- 230000007306 turnover Effects 0.000 claims abstract description 52
- 238000003475 lamination Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 description 4
- 241000252254 Catostomidae Species 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model provides a upset loading attachment of semiconductor package bonding die equipment, include: (1) turning over a feeding device seat frame; (2) the frame supplying device, the frame placing table, a frame supplying device motor and a frame supplying position sensor; the bottom plate of the frame placing table is provided with two grooves, and the frame supply device can move forwards or backwards along the grooves under the driving of a motor; (3) the overturning and sucking frame device comprises an overturning and sucking frame device, an overturning and sucking frame device motor, a front limit inductor, a rear limit inductor, a workbench track and a workbench frame inductor; (4) the anti-lamination alarm device, the pushing device, the frame sucker and the pushing device motor are arranged on the frame; the material pushing device is arranged above one end of the workbench track, the anti-lamination alarm device 4 is arranged above the other end of the workbench track, and the frame sucker is arranged on one side of the workbench track and is parallel to the workbench track; the pushing device motor is arranged below the pushing device and is fixedly connected with the front end of the turnover feeding device seat frame.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor package equipment, concretely relates to upset loading attachment of semiconductor package bonding die equipment.
Background
At present, a technical scheme of a pull type slicing device is adopted by a turning feeding device of semiconductor packaging slicing equipment commonly used by enterprises, such as a feeding device of SS-DT01 slicing equipment, and the technical scheme has the defects that: in the operation process of the equipment, when the frames enter the track from the feeding device, the potential quality hazards such as deformation of the frame base island, scratching of the surface of the frame base island and the like are easily caused due to the friction between the upper and lower rows of frames, the incongruity of the in-and-out speed of the frames and the slicing device and the like, so that the product waste is caused, and the production cost of an enterprise is increased.
Disclosure of Invention
The utility model discloses a purpose aims at eliminating the loading attachment of current semiconductor package bonding equipment, especially SS-DT01 bonding equipment, causes quality hidden danger such as frame base island deformation, frame base island surface by scotch easily at the in-process of operation to improve the yield of product, reduce the manufacturing cost of enterprise.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a turnover feeding device of semiconductor packaging and chip bonding equipment comprises the following devices or components:
(1) the turnover feeding device seat frame comprises a bottom plate and two side plates, namely a left side plate and a right side plate, which are vertically connected with the bottom plate and symmetrically arranged on the left side and the right side of the bottom plate;
(2) the frame supplying device, the frame placing table, a frame supplying device motor and a frame supplying position sensor; the frame placing table is arranged at the top of the turnover feeding device seat frame and comprises a bottom plate and two side walls, namely a left side wall and a right side wall, which are arranged on the left side and the right side of the bottom plate and are vertically connected with the bottom plate; the frame supply position sensor is arranged at the front end of one side wall; the frame supply device is arranged on the top surface of the bottom plate of the frame placing table, and the frame supply device motor is arranged on the back surface of the bottom plate of the frame placing table; the bottom plate of the frame placing table is also provided with two parallel grooves extending longitudinally, and the frame replenishing device can move forwards or backwards along the grooves under the driving of a motor of the frame replenishing device;
(3) the overturning and sucking frame device comprises an overturning and sucking frame device, an overturning and sucking frame device motor, a front limit inductor, a rear limit inductor and a workbench track; the workbench track is arranged on the front end of the top of the turnover feeding device seat frame and comprises two parallel tracks extending transversely, namely a workbench track front track and a workbench track rear track; the overturning and sucking frame device, the front limit inductor and the rear limit inductor are arranged on the outer side of one side plate of the overturning and feeding device seat frame below the workbench track, and a rotating shaft of the overturning and sucking frame device penetrates through the side plate; the turnover suction frame device motor is arranged on the inner side of the side plate and drives the turnover suction frame device to rotate through the rotating shaft; a workbench frame sensor is also arranged at one end of the workbench track rear rail;
(4) the anti-lamination alarm device, the pushing device, the frame sucker and the pushing device motor are arranged on the frame; the material pushing device is arranged above one end of the workbench track, the anti-lamination alarm device is arranged above the other end of the workbench track, and the frame sucker is arranged on one side of the workbench track and is parallel to the workbench track; the pushing device motor is arranged below the pushing device and is fixedly connected with the front end of the turnover feeding device seat frame.
Further, the turnover suction frame device, the front limit sensor and the rear limit sensor are arranged on the outer side of a left side plate of a turnover feeding device seat frame below the workbench track, the front limit sensor is located on the left lower side of the turnover suction frame device, and the rear limit sensor is located right below the turnover suction frame device.
Further, the frame replenishment position sensor is provided at the front end of the right side wall.
Further, be provided with 3 frame sucking discs, 3 frame sucking disc parallel arrangement are between the rail behind rail before the workstation track and the workstation track, and are close to one side of rail before the workstation track.
Further, the front end of the top of the turnover feeding device seat frame is parallel to the ground, and the main body part behind the front end of the top of the turnover feeding device seat frame inclines downwards.
Further, an included angle between the main body part behind the front end of the top part of the turnover feeding device seat frame and the horizontal plane is 30 degrees.
Further, a frame placement table is provided on the main body portion behind the top front end of the flip-top loading attachment mount.
Further, the pushing device motor, the frame supply device motor and the frame overturning and sucking device motor are connected with a power supply in parallel.
Further, the motor of the material pushing device is connected with a control system of the semiconductor packaging and chip bonding equipment through a signal wire.
The utility model discloses following beneficial effect has:
the utility model discloses can place the platform, inhale frame device, workstation track, blevile of push, prevent lamination alarm device's position through adjusting frame replenishing device, frame, ensure that the frame is placed in upset loading attachment's workstation track and through blevile of push with the frame propelling movement to production facility's workstation track, reduce the base island of frame because of the quality hidden danger that the material loading caused, reduce the manufacturing cost of enterprise, improve the profit of product.
Drawings
Fig. 1A is a schematic front view of an embodiment of the present invention;
FIG. 1B is a partial enlarged view of FIG. 1A;
fig. 2A is a left side view schematic diagram of an embodiment of the present invention;
FIG. 2B is a partial enlarged view of FIG. 2A;
fig. 3 is a rear view schematic diagram of an embodiment of the present invention;
fig. 4A is a schematic top view of an embodiment of the present invention;
FIG. 4B is a partial enlarged view of FIG. 4A;
fig. 5 is a schematic perspective view of an embodiment of the present invention;
fig. 6A is an exploded perspective view of an embodiment of the present invention;
fig. 6B is a partially enlarged view of fig. 6A.
Reference numerals:
1-frame supply means; 2-a frame placing table;
201- (frame placing table) groove; 202- (frame table) left side wall;
203- (frame table) right side wall; 3, overturning and sucking the frame device:
301- (turnover suction frame device) rotating shaft; 4-anti-lamination alarm device;
501-front rail of a workbench track; 502-Table Rail Back Rail;
6-a material pushing device; 7-frame suction cup;
8-pusher motor; 9, overturning a feeding device seat frame;
10-frame replenishment location sensor; 11-a table frame sensor;
12-detecting a frame sensor; 13-frame supply motor;
14-a motor for overturning the suction frame device; 15-front limit sensor;
16-rear limit inductor
Detailed Description
An embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1A, fig. 2A, fig. 3, fig. 4A, fig. 5, and fig. 6A in combination with fig. 1B, fig. 2B, fig. 4B, and fig. 6B, an overturning and feeding device of a semiconductor package die bonding apparatus includes the following devices or components:
(1) the turnover feeding device seat frame 9 comprises a bottom plate and two side plates which are vertically connected with the bottom plate and symmetrically arranged on the left side and the right side of the bottom plate, the front ends of the top of the turnover feeding device seat frame 9 (namely the front ends of the top of the two side plates) are parallel to the ground, a main body part behind the front end of the top of the turnover feeding device seat frame 9 inclines downwards, and the inclination angle is 30 degrees (namely the included angle between the inclination angle and the horizontal plane is 30 degrees).
(2) A frame supply device 1, a frame placing table 2, a frame supply device motor 13, and a frame supply position sensor 10; the frame placing table 2 is arranged on the main body part behind the front end of the top part of the turnover feeding device seat frame 9, and the frame placing table 2 comprises a bottom plate and two side walls, namely a left wall 202 and a right wall 203, which are arranged on the left side and the right side of the bottom plate and are vertically connected with the bottom plate; the frame replenishment position sensor 10 is provided at the front end of one side wall (in the present embodiment, the frame replenishment position sensor 10 is provided at the front end of the right wall 203); the frame supply device 1 is arranged on the top surface of the bottom plate of the frame placing table 2, and the frame supply device motor 13 is arranged on the back surface of the bottom plate of the frame placing table 2; the bottom plate of the frame placing table 2 is further provided with two parallel, longitudinally extending grooves 201, and the frame replenishment device 1 can advance or retreat along the grooves 201 by being driven by the frame replenishment device motor 13.
(3) The overturning and sucking frame device 3, an overturning and sucking frame device motor 14, a front limit inductor 15, a rear limit inductor 16 and a workbench track; the workbench track is arranged on the front end of the top of the turnover feeding device seat frame 9 and comprises two parallel and transversely extending tracks, namely a workbench track front track 501 and a workbench track rear track 502; the turnover suction frame device 3, the front limit sensor 15 and the rear limit sensor 16 are arranged on the outer side of one side plate of the turnover feeding device seat frame 9 below the workbench track (for the embodiment, the turnover suction frame device 3, the front limit sensor 15 and the rear limit sensor 16 are arranged on the outer side of the left side plate of the turnover feeding device seat frame 9, the front limit sensor 15 is positioned on the lower left side of the turnover suction frame device 3, the rear limit sensor 16 is positioned right below the turnover suction frame device 3), and the rotating shaft 301 of the turnover suction frame device 3 penetrates through the side plate; the turnover suction frame device motor 14 is arranged at the inner side of the side plate and drives the turnover suction frame device 3 to rotate through a rotating shaft 301; a table frame sensor 11 is further provided at one end of the table rail back rail 502 (in the present embodiment, the table frame sensor 11 is provided at the right end of the table rail back rail 502).
(4) The anti-lamination alarm device 4, the pushing device 6, the frame sucker 7 and the pushing device motor 8; the material pushing device 6 is arranged above one end of the workbench track front rail 501, the anti-lamination alarm device 4 is arranged above the other end of the workbench track front rail 501, the frame suckers 7 comprise 3 frame suckers, and the 3 frame suckers are arranged between the workbench track front rail 501 and the workbench track rear rail 502 in parallel and are close to one side of the workbench track front rail 501; the pushing device motor 8 is arranged below the pushing device 6 and is fixedly connected with the front end of the turnover feeding device seat frame 9.
In the present embodiment, the pushing device motor 8, the frame replenishment device motor 13, and the frame turnover suction device motor 14 are connected in parallel, and the pushing device motor 8 is further connected to a control system of the semiconductor package die bonding apparatus (main apparatus) through a signal line.
The structural features of an embodiment of the present invention are described in detail above with reference to the accompanying drawings, and the working method thereof is further described below:
firstly, a frame is placed on a frame placing table 2 and placed well, a start switch is pressed, a frame replenishment position motor 13 drives a frame replenishment device 1 to push the frame to a position sensed by a frame replenishment position sensor 10 and then the frame is fixed, meanwhile, a frame turnover and suction device motor 14 drives a turnover and suction frame device 3 to move to the frame placing table 2, after a front limit sensor 15 senses the turnover and suction frame device 3, the frame replenishment device 1 pushes the frame to a frame sucker 7, the frame sucker 7 sucks the frame, after the frame is detected by a vacuum flow sensor, the turnover and suction frame device 3 brings the frame to a workbench track 5, (after the frame is sensed by a workbench frame sensor 11 on the track, the turnover and suction frame device 3 cannot move), after the main equipment returns to the workbench track 5, a rear limit sensor 16 senses the turnover and suction frame device 3, the main equipment sends out an instruction of operation of a material pushing device motor 8, the material pushing device motor 8 drives a material pushing device 6 to push the frame to a position set by the main equipment through the anti-lamination alarm device 4, and after the main equipment detects the frame, a hook claw on a machine table can operate immediately to hook the frame to a workbench rail of the equipment to carry out work.
Claims (9)
1. A turnover feeding device of semiconductor packaging and chip bonding equipment comprises the following devices or components:
(1) the turnover feeding device seat frame comprises a bottom plate and two side plates, namely a left side plate and a right side plate, which are vertically connected with the bottom plate and symmetrically arranged on the left side and the right side of the bottom plate;
(2) the frame supplying device, the frame placing table, a frame supplying device motor and a frame supplying position sensor; the frame placing table is arranged at the top of the turnover feeding device seat frame and comprises a bottom plate and two side walls, namely a left side wall and a right side wall, which are arranged on the left side and the right side of the bottom plate and are vertically connected with the bottom plate; the frame supply position sensor is arranged at the front end of one side wall; the frame supply device is arranged on the top surface of the bottom plate of the frame placing table, and the frame supply device motor is arranged on the back surface of the bottom plate of the frame placing table; the bottom plate of the frame placing table is also provided with two parallel grooves extending longitudinally, and the frame replenishing device can move forwards or backwards along the grooves under the driving of a motor of the frame replenishing device;
(3) the overturning and sucking frame device comprises an overturning and sucking frame device, an overturning and sucking frame device motor, a front limit inductor, a rear limit inductor and a workbench track; the workbench track is arranged on the front end of the top of the turnover feeding device seat frame and comprises two parallel tracks extending transversely, namely a workbench track front track and a workbench track rear track; the overturning and sucking frame device, the front limit inductor and the rear limit inductor are arranged on the outer side of one side plate of the overturning and feeding device seat frame below the workbench track, and a rotating shaft of the overturning and sucking frame device penetrates through the side plate; the turnover suction frame device motor is arranged on the inner side of the side plate and drives the turnover suction frame device to rotate through the rotating shaft; a workbench frame sensor is also arranged at one end of the workbench track rear rail;
(4) the anti-lamination alarm device, the pushing device, the frame sucker and the pushing device motor are arranged on the frame; the material pushing device is arranged above one end of the workbench track, the anti-lamination alarm device is arranged above the other end of the workbench track, and the frame sucker is arranged on one side of the workbench track and is parallel to the workbench track; the pushing device motor is arranged below the pushing device and is fixedly connected with the front end of the turnover feeding device seat frame.
2. The flip loading device of semiconductor package die attach apparatus as claimed in claim 1, wherein: the turnover suction frame device, the front limit sensor and the rear limit sensor are arranged on the outer side of a left side plate of a turnover feeding device seat frame below the workbench track, the front limit sensor is positioned on the left lower side of the turnover suction frame device, and the rear limit sensor is positioned under the turnover suction frame device.
3. The flip loading device of semiconductor package die attach apparatus as claimed in claim 1, wherein: the frame replenishment position sensor is disposed at a front end of the right side wall.
4. The flip loading device of the semiconductor package die bonding apparatus as claimed in claim 2, wherein: be provided with 3 frame sucking discs, 3 frame sucking disc parallel arrangement are between the rail behind rail before the workstation track and the workstation track, and are close to one side of rail before the workstation track.
5. The flip loading device of semiconductor package die attach apparatus as claimed in claim 1, wherein: the front end of the top of the turnover feeding device seat frame is parallel to the ground, and the main body part behind the front end of the top of the turnover feeding device seat frame inclines downwards.
6. The flip loading device of semiconductor package die attach apparatus as claimed in claim 1, wherein: and an included angle between the main body part behind the front end of the top of the turnover feeding device seat frame and the horizontal plane is 30 degrees.
7. The flip loading device of semiconductor package die attach apparatus as claimed in claim 1, wherein: the frame placement table is disposed on the body portion behind the top front end of the inverted feeder mount.
8. The flip-chip loading apparatus of a semiconductor package die attach apparatus as claimed in any one of claims 1 to 7, wherein: the pushing device motor, the frame supply device motor and the overturning and sucking frame device motor are connected with a power supply in parallel.
9. The flip-chip loading apparatus of a semiconductor package die attach apparatus as claimed in any one of claims 1 to 7, wherein: the motor of the material pushing device is connected with a control system of the semiconductor packaging and bonding equipment through a signal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921021896.6U CN210392812U (en) | 2019-07-03 | 2019-07-03 | Overturning feeding device of semiconductor packaging and chip bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921021896.6U CN210392812U (en) | 2019-07-03 | 2019-07-03 | Overturning feeding device of semiconductor packaging and chip bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210392812U true CN210392812U (en) | 2020-04-24 |
Family
ID=70352255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921021896.6U Withdrawn - After Issue CN210392812U (en) | 2019-07-03 | 2019-07-03 | Overturning feeding device of semiconductor packaging and chip bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210392812U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110255158A (en) * | 2019-07-03 | 2019-09-20 | 佛山市蓝箭电子股份有限公司 | The overturning feeding device of semiconductor packages die bonder |
-
2019
- 2019-07-03 CN CN201921021896.6U patent/CN210392812U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110255158A (en) * | 2019-07-03 | 2019-09-20 | 佛山市蓝箭电子股份有限公司 | The overturning feeding device of semiconductor packages die bonder |
| CN110255158B (en) * | 2019-07-03 | 2024-03-29 | 佛山市蓝箭电子股份有限公司 | Turnover feeding device of semiconductor packaging and bonding equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20200424 Effective date of abandoning: 20240329 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20200424 Effective date of abandoning: 20240329 |