CN110255158B - Turnover feeding device of semiconductor packaging and bonding equipment - Google Patents
Turnover feeding device of semiconductor packaging and bonding equipment Download PDFInfo
- Publication number
- CN110255158B CN110255158B CN201910592840.4A CN201910592840A CN110255158B CN 110255158 B CN110255158 B CN 110255158B CN 201910592840 A CN201910592840 A CN 201910592840A CN 110255158 B CN110255158 B CN 110255158B
- Authority
- CN
- China
- Prior art keywords
- frame
- workbench
- rail
- motor
- turnover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000007306 turnover Effects 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 238000003475 lamination Methods 0.000 claims abstract description 11
- 230000002265 prevention Effects 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G35/00—Mechanical conveyors not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/82—Rotary or reciprocating members for direct action on articles or materials, e.g. pushers, rakes, shovels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/04—Detection means
- B65G2203/042—Sensors
Abstract
The utility model provides a turnover feeding device of semiconductor packaging and bonding equipment, which comprises: (1) overturning a feeding device seat frame; (2) A frame replenishment device, a frame placement table, a frame replenishment device motor, and a frame replenishment position sensor; two grooves are formed in the bottom plate of the frame placing table, and the frame replenishing device can advance or retreat along the grooves under the drive of the motor; (3) The device comprises a turnover suction frame device, a turnover suction frame device motor, a front limit sensor, a rear limit sensor, a workbench track and a workbench frame sensor; (4) The device comprises an anti-lamination alarm device, a pushing device, a frame sucker and a pushing device motor; the pushing device is arranged above one end of the workbench track, the lamination prevention alarm device 4 is arranged above the other end of the workbench track, and the frame sucker is arranged on one side of the workbench track and parallel to the workbench track; the pushing device motor is arranged below the pushing device and fixedly connected with the front end of the overturning feeding device seat frame.
Description
Technical Field
The utility model belongs to the technical field of semiconductor packaging equipment, and particularly relates to a turnover feeding device of semiconductor packaging adhesive piece equipment.
Background
At present, the turnover feeding device of semiconductor packaging bonding equipment commonly used by enterprises, such as the feeding device of SS-DT01 bonding equipment, adopts the technical scheme of a drawing type slicing device, and the defects of the technical scheme are that: in the running process of the equipment, when the frames enter the track from the feeding device, quality hidden troubles such as deformation of the frame base island and scratch of the surface of the frame base island are easily caused due to friction between the upper row of frames and the lower row of frames, inconsistent speeds of the frames and the slicing device, and the like, so that the product is wasted, and the production cost of enterprises is increased.
Disclosure of Invention
The utility model aims to eliminate the quality hidden trouble that the frame base island is deformed, the surface of the frame base island is scratched and the like in the running process of the feeding device of the traditional semiconductor packaging and bonding equipment, in particular to the feeding device of the SS-DT01 bonding equipment, thereby improving the yield of products and reducing the production cost of enterprises.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the turnover feeding device of the semiconductor packaging and bonding equipment comprises the following components:
(1) The overturning feeding device seat frame comprises a bottom plate and two side plates, namely a left side plate and a right side plate, which are vertically connected with the bottom plate and are symmetrically arranged on the left side and the right side of the bottom plate;
(2) A frame replenishment device, a frame placement table, a frame replenishment device motor, and a frame replenishment position sensor; the frame placing table is arranged at the top of the overturning feeding device seat frame and comprises a bottom plate and two side walls, namely a left side wall and a right side wall, which are arranged at the left side and the right side of the bottom plate and are vertically connected with the bottom plate; the frame replenishment position sensor is arranged at the front end of one side wall; the frame replenishing device is arranged on the top surface of the bottom plate of the frame placing table, and the motor of the frame replenishing device is arranged on the back surface of the bottom plate of the frame placing table; the bottom plate of the frame placing table is also provided with two parallel grooves extending longitudinally, and the frame replenishing device can advance or retreat along the grooves under the drive of the motor of the frame replenishing device;
(3) The device comprises a turnover suction frame device, a turnover suction frame device motor, a front limit sensor, a rear limit sensor and a workbench track; the workbench rail is arranged on the front end of the top of the overturning feeding device seat frame and comprises two parallel rails which extend transversely, namely a workbench rail front rail and a workbench rail rear rail; the turnover suction frame device, the front limit sensor and the rear limit sensor are arranged on the outer side of one side plate of the turnover feeding device seat frame below the workbench track, and a rotating shaft of the turnover suction frame device penetrates through the side plate; the motor of the turnover suction frame device is arranged on the inner side of the side plate and drives the turnover suction frame device to rotate through the rotating shaft; a workbench frame sensor is arranged at one end of the workbench track rear rail;
(4) The device comprises an anti-lamination alarm device, a pushing device, a frame sucker and a pushing device motor; the pushing device is arranged above one end of the workbench track, the lamination prevention alarm device is arranged above the other end of the workbench track, and the frame sucker is arranged on one side of the workbench track and parallel to the workbench track; the pushing device motor is arranged below the pushing device and fixedly connected with the front end of the overturning feeding device seat frame.
Further, the frame device is inhaled in the upset, and front limit inductor, back limit inductor set up the outside at the left side board of the upset loading attachment seat frame of workstation track below, the front limit inductor is located the upset and inhales the left side below of frame device, and the back limit inductor is located the upset and inhales the frame device under.
Further, the frame replenishment position sensor is provided at a front end of the right side wall.
Further, 3 frame sucking discs are arranged, and the 3 frame sucking discs are arranged in parallel between the front rail of the workbench rail and the rear rail of the workbench rail and close to one side of the front rail of the workbench rail.
Further, the front end of the top of the turnover feeding device seat frame is parallel to the ground, and the main body part behind the front end of the top of the turnover feeding device seat frame is inclined downwards.
Further, the included angle between the main body part and the horizontal plane after the front end of the top of the overturning feeding device seat frame is 30 degrees.
Further, the frame placement table is provided on the main body portion behind the top front end of the flip-up loading device mount.
Further, the pushing device motor, the frame replenishing device motor and the overturning frame sucking device motor are connected with a power supply in a parallel mode.
Further, the motor of the pushing device is connected with a control system of the semiconductor packaging and bonding equipment through a signal wire.
The utility model has the following beneficial effects:
the utility model can ensure that the frame is placed in the workbench track of the overturning and feeding device and is pushed into the workbench track of the production equipment through the pushing device by adjusting the positions of the frame replenishing device, the frame placing table, the frame sucking device, the workbench track, the pushing device and the anti-lamination alarm device, thereby reducing the hidden quality trouble of a base island of the frame caused by feeding, reducing the production cost of enterprises and improving the profit of products.
Drawings
FIG. 1A is a schematic elevational structural view of one embodiment of the present utility model;
FIG. 1B is an enlarged view of a portion of FIG. 1A;
FIG. 2A is a schematic left-hand structural view of one embodiment of the present utility model;
FIG. 2B is an enlarged view of a portion of FIG. 2A;
FIG. 3 is a schematic rear view of an embodiment of the present utility model;
FIG. 4A is a schematic top view of one embodiment of the present utility model;
FIG. 4B is an enlarged view of a portion of FIG. 4A;
FIG. 5 is a schematic perspective view of an embodiment of the present utility model;
FIG. 6A is an exploded perspective view of one embodiment of the present utility model;
fig. 6B is a partial enlarged view of fig. 6A.
Reference numerals:
1-a frame replenishment device; 2-a frame placement table;
201- (frame placement stage) grooves; 202- (frame placement table) left side wall;
203- (frame placement table) right side wall; 3-overturning suction frame device: 301- (turnover suction frame device) rotation shaft; 4-anti-lamination alarm device;
501-a front rail of a workbench rail; 502—a table track rear rail;
6, a pushing device; 7, a frame sucker;
8-a pushing device motor; 9, overturning a feeding device seat frame;
10-a frame replenishment position sensor; 11-a table frame sensor; 12-detecting a frame sensor; 13-a frame replenishment device motor; 14-turning over the suction frame device motor; 15-a front limit sensor;
16-rear limit inductor
Detailed Description
An embodiment of the present utility model will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1A, 2A, 3, 4A, 5, and 6A in combination with fig. 1B, 2B, 4B, and 6B, a flip-chip loading device of a semiconductor package die attach apparatus includes the following components:
(1) The turnover feeding device seat frame 9, the turnover feeding device seat frame 9 comprises a bottom plate and two side plates which are vertically connected with the bottom plate and symmetrically arranged on the left side and the right side of the bottom plate, the top front end of the turnover feeding device seat frame 9 (namely, the top front ends of the two side plates) is parallel to the ground, the main body part behind the top front end of the turnover feeding device seat frame 9 is inclined downwards, and the inclination angle is 30 degrees (namely, the included angle between the main body part and the horizontal plane is 30 degrees).
(2) A frame replenishment device 1, a frame placement table 2, a frame replenishment device motor 13, and a frame replenishment position sensor 10; the frame placement table 2 is provided on a main body portion behind the top front end of the turnover loading device mount 9, and the frame placement table 2 includes a bottom plate and two side walls, namely a left wall 202 and a right wall 203, provided on the left and right sides of the bottom plate and vertically connected to the bottom plate; the frame replenishment position sensor 10 is provided at the front end of one side wall (in the present embodiment, the frame replenishment position sensor 10 is provided at the front end of the right wall 203); the frame replenishment device 1 is arranged on the top surface of the bottom plate of the frame placement table 2, and the frame replenishment device motor 13 is arranged on the back surface of the bottom plate of the frame placement table 2; two parallel, longitudinally extending grooves 201 are also provided in the floor of the frame placement table 2, and the frame replenishment device 1 can be advanced or retracted along the grooves 201 by driving the frame replenishment device motor 13.
(3) The turnover suction frame device comprises a turnover suction frame device 3, a turnover suction frame device motor 14, a front limit sensor 15, a rear limit sensor 16 and a workbench track; the workbench rail is arranged on the top front end of the turnover feeding device seat frame 9 and comprises two parallel and transversely extending rails, namely a workbench rail front rail 501 and a workbench rail rear rail 502; the overturning and sucking frame device 3, the front limit sensor 15 and the rear limit sensor 16 are arranged on the outer side of one side plate of the overturning and feeding device seat frame 9 below the workbench track (in the embodiment, the overturning and sucking frame device 3, the front limit sensor 15 and the rear limit sensor 16 are arranged on the outer side of the left side plate of the overturning and feeding device seat frame 9, the front limit sensor 15 is positioned at the left lower side of the overturning and sucking frame device 3, the rear limit sensor 16 is positioned under the overturning and sucking frame device 3), and the rotating shaft 301 of the overturning and sucking frame device 3 penetrates through the side plate; the turnover suction frame device motor 14 is arranged on the inner side of the side plate and drives the turnover suction frame device 3 to rotate through the rotating shaft 301; the table frame sensor 11 is further provided at one end of the table rail rear rail 502 (in the present embodiment, the table frame sensor 11 is provided at the right end of the table rail rear rail 502).
(4) The anti-lamination alarm device 4, the pushing device 6, the frame sucker 7 and the pushing device motor 8; the pushing device 6 is arranged above one end of the front rail 501 of the workbench rail, the lamination prevention alarm device 4 is arranged above the other end of the front rail 501 of the workbench rail, the frame sucker 7 comprises 3 frame suckers, and the 3 frame suckers are arranged between the front rail 501 of the workbench rail and the rear rail 502 of the workbench rail in parallel and close to one side of the front rail 501 of the workbench rail; the pushing device motor 8 is arranged below the pushing device 6 and fixedly connected with the front end of the overturning feeding device seat frame 9.
In the present embodiment, the circuit connection relationship among the pushing device motor 8, the frame replenishment device motor 13 and the flip-up frame device motor 14 is parallel, and the pushing device motor 8 is connected to the control system of the semiconductor package die bonding apparatus (main apparatus) through a signal line.
The structural features of one embodiment of the present utility model are described in detail above with reference to the accompanying drawings, and the working method thereof is further described below:
firstly, placing a frame on a frame placing table 2, pressing a start switch, driving a frame replenishing device 1 to push the frame to a position sensed by a frame replenishing position sensor 10 by a frame replenishing position motor 13, simultaneously driving a frame overturning and sucking device 3 to move to the frame placing table 2 by a frame overturning and sucking device motor 14, driving the frame overturning and sucking device 3 by a front limit sensor 15 to push the frame to a frame sucking disc 7 by the frame replenishing device 1 after sensing the frame overturning and sucking device 3 to bring the frame to a workbench rail 5 after being detected by a vacuum flow sensor, enabling a main device to immediately hook the frame on the workbench to move to the workbench after the frame overturning and sucking device 3 returns to the workbench rail 5 after sensing the frame overturning and sucking device 3 by a rear limit sensor 16, and enabling the main device to send a command for the operation of a pushing device motor 8, enabling the frame to pass through an anti-lamination alarm device 4 to be pushed to a position set by the main device, enabling the main device to immediately hook the workbench to move to the workbench after being detected by the frame sucking disc 7, and enabling the main device to immediately hook the workbench to move to the workbench to carry equipment.
Claims (9)
1. The turnover feeding device of the semiconductor packaging and bonding equipment comprises the following components:
(1) The overturning feeding device seat frame comprises a bottom plate and two side plates, namely a left side plate and a right side plate, which are vertically connected with the bottom plate and are symmetrically arranged on the left side and the right side of the bottom plate;
(2) A frame replenishment device, a frame placement table, a frame replenishment device motor, and a frame replenishment position sensor; the frame placing table is arranged at the top of the overturning feeding device seat frame and comprises a bottom plate and two side walls, namely a left side wall and a right side wall, which are arranged at the left side and the right side of the bottom plate and are vertically connected with the bottom plate; the frame replenishment position sensor is arranged at the front end of one side wall; the frame replenishing device is arranged on the top surface of the bottom plate of the frame placing table, and the motor of the frame replenishing device is arranged on the back surface of the bottom plate of the frame placing table; the bottom plate of the frame placing table is also provided with two parallel grooves extending longitudinally, and the frame replenishing device can advance or retreat along the grooves under the drive of the motor of the frame replenishing device;
(3) The device comprises a turnover suction frame device, a turnover suction frame device motor, a front limit sensor, a rear limit sensor and a workbench track; the workbench rail is arranged on the front end of the top of the overturning feeding device seat frame and comprises two parallel rails which extend transversely, namely a workbench rail front rail and a workbench rail rear rail; the turnover suction frame device, the front limit sensor and the rear limit sensor are arranged on the outer side of one side plate of the turnover feeding device seat frame below the workbench track, and a rotating shaft of the turnover suction frame device penetrates through the side plate; the motor of the turnover suction frame device is arranged on the inner side of the side plate and drives the turnover suction frame device to rotate through the rotating shaft; a workbench frame sensor is arranged at one end of the workbench track rear rail;
(4) The device comprises an anti-lamination alarm device, a pushing device, a frame sucker and a pushing device motor; the pushing device is arranged above one end of the workbench track, the lamination prevention alarm device is arranged above the other end of the workbench track, and the frame sucker is arranged on one side of the workbench track and parallel to the workbench track; the pushing device motor is arranged below the pushing device and fixedly connected with the front end of the overturning feeding device seat frame.
2. The flip-chip loading device of the semiconductor package die attach apparatus of claim 1, wherein: the turnover suction frame device, the front limit inductor and the rear limit inductor are arranged on the outer side of the left side plate of the turnover feeding device seat frame below the workbench track, the front limit inductor is positioned on the left lower side of the turnover suction frame device, and the rear limit inductor is positioned under the turnover suction frame device.
3. The flip-chip loading device of the semiconductor package die attach apparatus of claim 1, wherein: the frame replenishment position sensor is provided at the front end of the right side wall.
4. The flip-chip loading device of the semiconductor package die attach apparatus of claim 1, wherein: the frame sucking discs are arranged on the front rail of the workbench rail, and the frame sucking discs are arranged between the front rail of the workbench rail and the rear rail of the workbench rail in parallel and are close to one side of the front rail of the workbench rail.
5. The flip-chip loading device of the semiconductor package die attach apparatus of claim 1, wherein: the front end of the top of the overturning feeding device seat frame is parallel to the ground, and the main body part behind the front end of the top of the overturning feeding device seat frame is inclined downwards.
6. The flip-chip loading device of the semiconductor package die attach apparatus of claim 1, wherein: the included angle between the main body part behind the front end of the top of the overturning feeding device seat frame and the horizontal plane is 30 degrees.
7. The flip-chip loading device of the semiconductor package die attach apparatus of claim 1, wherein: the frame placement table is disposed on the main body portion behind the top front end of the flip loading device mount.
8. The flip-chip loading device of the semiconductor package die attach apparatus according to any one of claims 1 to 7, wherein: the pushing device motor, the frame replenishing device motor and the overturning and sucking frame device motor are connected with a power supply in a parallel mode.
9. The flip-chip loading device of the semiconductor package die attach apparatus according to any one of claims 1 to 7, wherein: the motor of the pushing device is connected with a control system of the semiconductor packaging and bonding equipment through a signal wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592840.4A CN110255158B (en) | 2019-07-03 | 2019-07-03 | Turnover feeding device of semiconductor packaging and bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592840.4A CN110255158B (en) | 2019-07-03 | 2019-07-03 | Turnover feeding device of semiconductor packaging and bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110255158A CN110255158A (en) | 2019-09-20 |
| CN110255158B true CN110255158B (en) | 2024-03-29 |
Family
ID=67924031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910592840.4A Active CN110255158B (en) | 2019-07-03 | 2019-07-03 | Turnover feeding device of semiconductor packaging and bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110255158B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110797289B (en) * | 2019-11-18 | 2022-03-25 | 大连佳峰自动化股份有限公司 | Semiconductor copper substrate feed mechanism |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE720151A (en) * | 1967-08-30 | 1969-02-03 | Libbey Owens Ford Glass Co | |
| CA2138315A1 (en) * | 1993-12-20 | 1995-06-21 | Antonius Johannes Henricus Berkers | Conveying system |
| CN105398834A (en) * | 2015-12-07 | 2016-03-16 | 上海网讯新材料科技股份有限公司 | Automatic transfer stacking robot |
| CN205906612U (en) * | 2016-08-15 | 2017-01-25 | 李保峰 | Whole transfer device of material trolley |
| CN210392812U (en) * | 2019-07-03 | 2020-04-24 | 佛山市蓝箭电子股份有限公司 | Overturning feeding device of semiconductor packaging and chip bonding equipment |
-
2019
- 2019-07-03 CN CN201910592840.4A patent/CN110255158B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE720151A (en) * | 1967-08-30 | 1969-02-03 | Libbey Owens Ford Glass Co | |
| CA2138315A1 (en) * | 1993-12-20 | 1995-06-21 | Antonius Johannes Henricus Berkers | Conveying system |
| CN105398834A (en) * | 2015-12-07 | 2016-03-16 | 上海网讯新材料科技股份有限公司 | Automatic transfer stacking robot |
| CN205906612U (en) * | 2016-08-15 | 2017-01-25 | 李保峰 | Whole transfer device of material trolley |
| CN210392812U (en) * | 2019-07-03 | 2020-04-24 | 佛山市蓝箭电子股份有限公司 | Overturning feeding device of semiconductor packaging and chip bonding equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110255158A (en) | 2019-09-20 |
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