CN110797289B - Semiconductor copper substrate feed mechanism - Google Patents
Semiconductor copper substrate feed mechanism Download PDFInfo
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- CN110797289B CN110797289B CN201911125318.1A CN201911125318A CN110797289B CN 110797289 B CN110797289 B CN 110797289B CN 201911125318 A CN201911125318 A CN 201911125318A CN 110797289 B CN110797289 B CN 110797289B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention discloses a semiconductor copper substrate feeding mechanism which comprises a rack, a bin mechanism, a correcting mechanism, a claw absorbing mechanism and a material pushing mechanism. According to the semiconductor copper substrate feeding mechanism, the copper substrate is hung upside down in the storage bin mechanism, part of frame adhesion can be reduced by using the gravity principle of the copper substrate, the sucked copper substrate is corrected to be vertical and clamped by using the correction mechanism, the copper substrate is ensured to be in a vertical state when being sucked by the suction claw, and meanwhile, scattered copper substrates are sucked by the suction claw mechanism and then fed by using the suction and discharge interval time, so that the situation that the feeding is influenced by the adhesion between the copper substrates is effectively avoided, the stable feeding is realized, and the normal operation of crystal sticking equipment is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging equipment, in particular to a semiconductor copper substrate feeding mechanism.
Background
In the die bonding process in the semiconductor packaging industry, the equipment realizes processes of independently picking up the copper substrates which are overlapped together through a full-automatic feeding mechanism and then entering an equipment track to realize die bonding by glue dispensing (soldering) and the like. Because the operating speed of gluing the brilliant is very fast to require its material loading mechanism to be enough stable, because the copper base plate shape is more complicated, its production technology adopts the punching press mode to make, this kind of manufacturing technology can lead to the copper base plate edge that produces to have the burr to produce along with punching press grinding apparatus number of times increases, thereby make the copper base plate because two adjacent base plate adhesions of burr reason in the packaging process, the equipment material loading mechanism that needs the crystalline substance process of gluing can stabilize the material loading when the copper base plate adhesion is serious, satisfy the normal production operation of high-speed crystalline substance equipment of gluing.
The existing feeding mechanism of the crystal bonding equipment adopts a vacuum suction mode to realize independent suction of the copper substrate to the equipment track, and because the copper substrate with more burrs is seriously adhered to the copper substrate, the copper substrate can be sucked by two or more times at one time, so that the copper substrate enters the equipment track and then equipment alarms, the suction failure is sometimes caused due to resistance increase, the equipment is stopped, the production efficiency is seriously influenced, and the production cost is increased.
Disclosure of Invention
The invention aims to provide a semiconductor copper substrate feeding mechanism, which is used for solving the problems in the prior art, avoiding the influence on feeding due to the adhesion of copper substrates, realizing stable feeding and ensuring the normal operation of crystal bonding equipment.
In order to achieve the purpose, the invention provides the following scheme:
the invention provides a semiconductor copper substrate feeding mechanism which comprises a rack, a bin mechanism, a correcting mechanism, a claw absorbing mechanism and a material pushing mechanism, wherein the bin mechanism comprises a bin, a pushing plate, a ball screw and a feeding motor, the bin is arranged above the rack, one end of the side wall of the bin is provided with an in-place sensor for detecting whether a copper substrate is in place or not, the feeding motor is fixedly arranged below a top plate of the rack, an output shaft of the feeding motor is in transmission connection with a screw rod in the ball screw, the screw rod is in rotary connection with the rack through a bearing, a nut in the ball screw is fixedly connected with the pushing plate through two sliding blocks, sliding grooves are formed in the top plate corresponding to the two sliding blocks, and the sliding blocks are in sliding fit with the corresponding sliding grooves;
the correcting mechanism comprises a correcting cylinder which is arranged at one end of the rack and is close to the in-place sensor, a correcting block is fixedly arranged at the top end of a top rod of the correcting cylinder, a plurality of stand columns are arranged at the top end of the correcting block, a buffering correcting block is arranged at the top end of each stand column, and a buffering cushion is arranged between the buffering correcting block and the stand columns;
the suction claw mechanism is positioned on one side of the correcting mechanism, which is far away from the rack, and comprises a suction claw Y-direction motor, a Y-direction ball screw, a suction claw Z-direction cylinder, a suction claw rotating motor and a feeding track, wherein an output shaft of the suction claw Y-direction motor is in transmission connection with a screw rod in the Y-direction ball screw, the suction claw Z-direction cylinder is fixedly connected with a nut in the Y-direction ball screw, the feeding track is fixedly connected with the top end of an ejector rod of the suction claw Z-direction cylinder, one side of the feeding track, which is close to the correcting mechanism, is rotatably provided with a mounting plate, a plurality of suction claws are arranged on the mounting plate, the mounting plate is rotatably connected with the feeding device through a rotating shaft, and an output shaft of the suction claw rotating motor is in transmission connection with one end of the rotating shaft;
the material pushing mechanism is arranged on the feeding track and comprises a material pushing motor arranged below the feeding track, a secondary rotating shaft which is flush with an output shaft of the material pushing motor is further arranged on the side wall of the feeding track, the material pushing motor is provided with an output shaft which is wound on a conveying belt, the bottom end of a connecting block is fixedly connected with the conveying belt, and the top end of the connecting block is fixedly connected with one end of a material pushing rod.
Preferably, the automatic tapping machine further comprises a tapping mechanism, the tapping mechanism is arranged at one end, close to the feed bin, of the in-place sensor, the tapping mechanism comprises a tapping motor, an installation block, a tapping block and an L-shaped connecting piece, the tapping block is connected with one end of the L-shaped connecting piece, the middle of a straight rod of the tapping block, far away from the L-shaped connecting piece, is rotatably connected with the installation block, a spring is arranged on the installation block, the other end of the L-shaped connecting piece can compress the spring and is provided with a rolling bearing, the tapping motor is fixedly arranged on the rack, an output shaft of the tapping motor is fixedly connected with the middle of a swing rod, the swing rod can downwards press the rolling bearing when rotating, and along with the downward movement of the rolling bearing, the swing rod is tangent to the rolling bearing.
Preferably, the distance between the two ends of the swing rod and the output shaft of the rapping motor is equal.
Preferably, the rack and the Y-direction motor of the four suction claws are fixedly arranged on the bottom plate, and each suction claw is a vacuum suction claw.
Preferably, the rotating shaft is connected and fixedly connected with the bottom end of the mounting plate.
Preferably, the top rod of the straightening cylinder is vertical.
Preferably, the inner wall of feed bin corresponds the copper base plate is provided with the base plate track, the copper base plate can with base plate track sliding fit.
Preferably, the lateral wall of material loading track is provided with the horizontal draw runner, be provided with the recess on the lateral wall of connecting block, the draw runner with recess sliding fit.
Compared with the prior art, the semiconductor copper substrate feeding mechanism has the following technical effects:
the semiconductor copper substrate feeding mechanism provided by the invention avoids the influence on feeding due to adhesion of the copper substrates, realizes stable feeding, and ensures normal operation of die bonding equipment. The semiconductor copper substrate feeding mechanism can reduce adhesion of a part of frames by adopting a mode of hanging copper substrates upside down in the storage bin mechanism, utilizes the gravity principle of the copper substrates to correct, vertically and tightly clamp the sucked copper substrates by utilizing the correction mechanism, ensures that the copper substrates are in a vertical state when being sucked by the suction claw, simultaneously utilizes the interval time between the sucking and the discharging to knock and break the copper substrates which are close together by the knocking mechanism to avoid adhesion, sucks and then feeds the broken copper substrates by the suction claw mechanism, effectively avoids the influence of the adhesion between the copper substrates on feeding, realizes stable feeding and ensures the normal operation of crystal sticking equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a first schematic structural diagram of a semiconductor copper substrate loading mechanism according to the present invention;
FIG. 2 is a second schematic structural view of a semiconductor copper substrate loading mechanism according to the present invention;
FIG. 3 is a third schematic structural view of a semiconductor copper substrate loading mechanism according to the present invention;
FIG. 4 is a fourth schematic structural view of the semiconductor copper substrate loading mechanism of the present invention;
FIG. 5 is a schematic view of a part of the structure of the semiconductor copper substrate loading mechanism of the present invention;
FIG. 6 is a schematic view of a second partial structure of the semiconductor copper substrate loading mechanism according to the present invention;
FIG. 7 is a third schematic view of a part of the structure of the semiconductor copper substrate loading mechanism according to the present invention;
FIG. 8 is a fifth schematic structural view of a semiconductor copper substrate loading mechanism according to the present invention;
FIG. 9 is a schematic view of a part of the structure of the semiconductor copper substrate loading mechanism of the present invention;
FIG. 10 is a schematic view of a part of the structure of the semiconductor copper substrate loading mechanism of the present invention;
FIG. 11 is a schematic structural diagram of a tapping mechanism in the semiconductor copper substrate feeding mechanism according to the present invention;
FIG. 12 is a schematic structural diagram of a straightening mechanism of the semiconductor copper substrate feeding mechanism according to the present invention;
FIG. 13 is a schematic structural view of a claw suction mechanism in the semiconductor copper substrate feeding mechanism according to the present invention;
FIG. 14 is a schematic structural diagram of a pushing mechanism in the semiconductor copper substrate loading mechanism according to the present invention;
wherein: 1-bin mechanism, 2-knocking mechanism, 3-correcting mechanism, 4-claw-sucking mechanism, 5-pushing mechanism, 6-feeding motor, 7-in-place sensor, 8-pushing plate, 9-copper base plate, 10-knocking motor, 11-knocking block, 12-sucking claw, 13-sucking claw Z-direction cylinder, 14-sucking claw Y-direction motor, 15-sucking claw rotating motor, 16-limiting plate, 17-buffering correcting block, 18-correcting cylinder, 19-pushing rod, 20-feeding rail, 21-base plate rail, 22-ball screw, 23-slide block, 24-swing rod, 25-rolling bearing, 26-spring, 27-mounting block, 28-correcting block, 29-buffering pad, 30-Y-direction ball screw, 31-pushing motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
The invention aims to provide a semiconductor copper substrate feeding mechanism, which is used for solving the problems in the prior art, avoiding the influence on feeding due to the adhesion of copper substrates, realizing stable feeding and ensuring the normal operation of crystal bonding equipment.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
As shown in fig. 1-14: the embodiment provides a semiconductor copper substrate 9 feed mechanism, which comprises a rack, a bin mechanism 1, a beating mechanism 2, a correcting mechanism 3, a suction claw mechanism 4 and a material pushing mechanism 5.
The storage bin mechanism 1 comprises a storage bin, a pushing plate 8, a ball screw 22 and a feeding motor 6, the storage bin is arranged above a rack, a position sensor 7 for detecting whether a copper substrate 9 is in position is arranged at the right end of the side wall of the storage bin, the feeding motor 6 is fixedly arranged below a top plate of the rack, an output shaft of the feeding motor 6 is in transmission connection with a screw rod in the ball screw 22, the screw rod is in rotary connection with the rack through a bearing, a nut in the ball screw 22 is fixedly connected with the pushing plate 8 through two sliding blocks 23, sliding grooves are formed in the top plate corresponding to the two sliding blocks 23, and the sliding blocks 23 are in sliding fit with the corresponding sliding grooves; the inner wall of feed bin corresponds copper base plate 9 and is provided with base plate track 21, and copper base plate 9 can with base plate track 21 sliding fit, and pay-off motor 6 can drive push plate 8 through ball 22 and slide along the spout in the feed bin to the propelling movement of realization to copper base plate 9.
The rapping mechanism 2 is arranged at the right end of the storage bin, the rapping mechanism 2 comprises a rapping motor 10, a mounting block 27, a rapping block 11 and an L-shaped connecting piece, the rapping block 11 is connected with one end of the L-shaped connecting piece, the middle part of a straight rod, far away from the rapping block 11, in the L-shaped connecting piece is rotatably connected with the mounting block 27, a spring 26 is arranged on the mounting block 27, the other end of the L-shaped connecting piece can compress the spring 26 and is provided with a rolling bearing 25, the rapping motor 10 is fixedly arranged on the rack, an output shaft of the rapping motor 10 is fixedly connected with the middle part of a swing rod 24, the distance between two ends of the swing rod 24 and the output shaft of the rapping motor 10 is equal, the rapping motor 10 can drive the swing rod 24 to do circular motion, two ends of the swing rod 24 can downwards press the rolling bearing 25 when the swing rod 24 rotates, the end part of the swing rod 24 is tangent to the rolling bearing 25 along with the downward motion of the rolling bearing 25, then the other end part of the swing rod 24 continuously presses the rolling bearing 25 downwards and finally is tangent to the rolling bearing 25, therefore, the driving motor can drive the L-shaped connecting piece to swing all the time through the swing rod 24, so that the beating block 11 at the end part of the L-shaped connecting piece is driven to beat the copper substrate 9, and the adhered copper substrate 9 is guaranteed to be broken up under the action of continuous beating.
The straightening mechanism 3 is including setting up at frame one end and being close to the correction cylinder 18 that targets in place sensor 7, the ejector pin of correction cylinder 18 is vertical, the top of the ejector pin of correction cylinder 18 has set firmly correction piece 28, the top of correction piece 28 is provided with a plurality of stand, the top of every stand all is provided with buffering correction piece 17, and be provided with blotter 29 between buffering correction piece 17 and the stand, the top of the right-hand member of feed bin still is provided with limiting plate 16, and limiting plate 16 is located buffering correction piece 17 directly over, correction cylinder 18 drives correction piece 28 and buffering correction piece 17 up-and-down motion, buffering correction piece 17 upward movement is tight with copper base plate vertical clamp with limiting plate 16 combined action when the top, will utilize the elasticity of blotter 29 to jack up copper base plate 9, it is perpendicular to correct, thereby avoid the swing of copper base plate.
The suction claw mechanism 4 is positioned on one side of the correcting mechanism 3, which is far away from the rack, the suction claw mechanism 4 comprises a suction claw Y-direction motor 14, a Y-direction ball screw 30, a suction claw Z-direction cylinder 13, a suction claw rotating motor 15 and a feeding track 20, an output shaft of the suction claw Y-direction motor 14 is in transmission connection with a screw in the Y-direction ball screw 30, the suction claw Z-direction cylinder 13 is fixedly connected with a nut in the Y-direction ball screw 30, the feeding track 20 is fixedly connected with the top end of an ejector rod of the suction claw Z-direction cylinder 13, a mounting plate is rotatably arranged on one side of the feeding track 20, which is close to the correcting mechanism 3, a plurality of suction claws 12 are arranged on the mounting plate, the mounting plate is rotatably connected with the feeding device through a rotating shaft, the rotating shaft is connected with the bottom end of the mounting plate, and an output shaft of the suction claw rotating motor 15 is in transmission connection with one end of the rotating shaft; the frame and the suction claw Y-direction motor 14 are all fixedly arranged on the bottom plate, the number of the suction claws 12 is four, and each suction claw 12 is a vacuum suction claw. The Y-direction motor 14 of the suction claw Y drives the Y-direction ball screw 30 to move so as to drive the feeding track 20, the mounting plate and the suction claw to move forwards, the suction claw Z is jacked up towards the cylinder 13 and then reaches a Y-direction suction position, the copper substrate 9 is sucked by the 4 suction claws 12, the rear suction claw Y moves backwards towards the motor 14 and reaches a working position, then the suction claw rotating motor 15 rotates 90 degrees to drive the mounting plate to rotate 90 degrees, the copper substrate on the suction claw is rotated onto the feeding track 20, then the suction claw Z descends towards the cylinder 13, and the action is completed.
The pushing mechanism 5 is arranged on the feeding track 20, the pushing mechanism 5 comprises a pushing motor 31 arranged below the feeding track 20, a secondary rotating shaft which is flush with an output shaft of the pushing motor 31 is further arranged on the side wall of the feeding track 20, a conveyor belt is wound on the output shaft of the pushing motor 31 and the secondary rotating shaft, the bottom end of a connecting block is fixedly connected with the conveyor belt, and the top end of the connecting block is fixedly connected with one end of a pushing rod 19. A horizontal sliding strip is arranged on the side wall of the feeding rail 20, a groove is formed in the side wall of the connecting block, and the sliding strip is in sliding fit with the groove; the pushing motor 31 drives the pushing rod 19 to move forward to push the copper substrate 9 on the feeding rail 20 forward, so as to complete the pushing action.
In the description of the present invention, it should be noted that the terms "center", "top", "bottom", "left", "right", "vertical", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above descriptions of the examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (7)
1. The utility model provides a semiconductor copper base plate feed mechanism which characterized in that: the copper substrate automatic correction device comprises a rack, a bin mechanism, a correction mechanism, a claw suction mechanism and a material pushing mechanism, wherein the bin mechanism comprises a bin, a pushing plate, a ball screw and a feeding motor, the bin is arranged above the rack, one end of the side wall of the bin is provided with an in-place sensor for detecting whether a copper substrate is in place or not, the feeding motor is fixedly arranged below a top plate of the rack, an output shaft of the feeding motor is in transmission connection with a screw rod in the ball screw, the screw rod is in rotational connection with the rack through a bearing, a nut in the ball screw is fixedly connected with the pushing plate through two sliding blocks, sliding grooves are formed in the top plate corresponding to the two sliding blocks, and the sliding blocks are in sliding fit with the corresponding sliding grooves;
the correcting mechanism comprises a correcting cylinder which is arranged at one end of the rack and is close to the in-place sensor, a correcting block is fixedly arranged at the top end of a top rod of the correcting cylinder, a plurality of stand columns are arranged at the top end of the correcting block, a buffering correcting block is arranged at the top end of each stand column, and a buffering cushion is arranged between the buffering correcting block and the stand columns;
the suction claw mechanism is positioned on one side of the correcting mechanism, which is far away from the rack, and comprises a suction claw Y-direction motor, a Y-direction ball screw, a suction claw Z-direction cylinder, a suction claw rotating motor and a feeding track, wherein an output shaft of the suction claw Y-direction motor is in transmission connection with a screw rod in the Y-direction ball screw, the suction claw Z-direction cylinder is fixedly connected with a nut in the Y-direction ball screw, the feeding track is fixedly connected with the top end of an ejector rod of the suction claw Z-direction cylinder, one side of the feeding track, which is close to the correcting mechanism, is rotatably provided with a mounting plate, a plurality of suction claws are arranged on the mounting plate, the mounting plate is rotatably connected with the feeding device through a rotating shaft, and an output shaft of the suction claw rotating motor is in transmission connection with one end of the rotating shaft;
the material pushing mechanism is arranged on the feeding track and comprises a material pushing motor arranged below the feeding track, a secondary rotating shaft which is flush with an output shaft of the material pushing motor is further arranged on the side wall of the feeding track, a conveying belt is wound on the output shaft of the material pushing motor and the secondary rotating shaft, the bottom end of a connecting block is fixedly connected with the conveying belt, and the top end of the connecting block is fixedly connected with one end of a material pushing rod;
the automatic tapping machine is characterized by further comprising a tapping mechanism, wherein the tapping mechanism is arranged at one end, close to the in-place sensor, of the storage bin, the tapping mechanism comprises a tapping motor, an installation block, a tapping block and an L-shaped connecting piece, the tapping block is connected with one end of the L-shaped connecting piece, the middle of a straight rod, far away from the tapping block, of the L-shaped connecting piece is rotatably connected with the installation block, a spring is arranged on the installation block, the other end of the L-shaped connecting piece can compress the spring and is provided with a rolling bearing, the tapping motor is fixedly arranged on the rack, an output shaft of the tapping motor is fixedly connected with the middle of a swing rod, the rolling bearing can be pressed downwards when the swing rod rotates, and the swing rod is tangent to the rolling bearing along with the downward movement of the rolling bearing;
hanging two sides of the copper substrate in the bin mechanism in an inverted mode, then utilizing the correction mechanism to correct and vertical the copper substrate, ensuring that the copper substrate is in a vertical state when being sucked by the suction claw, and utilizing the beating mechanism to beat and break the copper substrate which is close to each other.
2. The semiconductor copper substrate loading mechanism according to claim 1, wherein: and the distances between the two ends of the swing rod and the output shaft of the beating motor are equal.
3. The semiconductor copper substrate loading mechanism according to claim 1, wherein: the machine frame and the Y-direction motor of the suction claws are fixedly arranged on the bottom plate, the number of the suction claws is four, and each suction claw is a vacuum suction claw.
4. The semiconductor copper substrate loading mechanism according to claim 1, wherein: the rotating shaft is connected with the bottom end of the mounting plate.
5. The semiconductor copper substrate loading mechanism according to claim 1, wherein: and the mandril of the correcting cylinder is vertical.
6. The semiconductor copper substrate loading mechanism according to claim 1, wherein: the inner wall of feed bin corresponds the copper base plate is provided with the base plate track, the copper base plate can with base plate track sliding fit.
7. The semiconductor copper substrate loading mechanism according to claim 1, wherein: the lateral wall of the feeding track is provided with a horizontal sliding strip, the lateral wall of the connecting block is provided with a groove, and the sliding strip is in sliding fit with the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911125318.1A CN110797289B (en) | 2019-11-18 | 2019-11-18 | Semiconductor copper substrate feed mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911125318.1A CN110797289B (en) | 2019-11-18 | 2019-11-18 | Semiconductor copper substrate feed mechanism |
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| CN110797289A CN110797289A (en) | 2020-02-14 |
| CN110797289B true CN110797289B (en) | 2022-03-25 |
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| CN201911125318.1A Active CN110797289B (en) | 2019-11-18 | 2019-11-18 | Semiconductor copper substrate feed mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113644019B (en) * | 2021-08-09 | 2024-03-19 | 恩纳基智能科技无锡有限公司 | Composite feeding device of semiconductor chip mounter |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4225248A1 (en) * | 1992-07-31 | 1994-02-03 | Erfurt Umformtechnik Gmbh | Blank feeder for a press |
| CN204872739U (en) * | 2015-07-01 | 2015-12-16 | 杭州长川科技股份有限公司 | Integrated circuit feeding mechanism that overturns based on switching |
| CN205967797U (en) * | 2016-05-30 | 2017-02-22 | 大族激光科技产业集团股份有限公司 | Correction device |
| CN206857685U (en) * | 2017-06-13 | 2018-01-09 | 深圳市铭镭激光设备有限公司 | Material-pulling device and autoloader |
| CN108364891A (en) * | 2018-03-31 | 2018-08-03 | 广州明森科技股份有限公司 | A kind of disk type burning chip equipment |
| CN208271842U (en) * | 2018-06-08 | 2018-12-21 | 成都莱普科技有限公司 | A kind of chip strip band fetching and sending devices for chip sampling observation machine |
| CN109230519B (en) * | 2018-10-25 | 2024-04-05 | 广州明森合兴科技有限公司 | Chip loading attachment of chip burning equipment |
| CN110255158B (en) * | 2019-07-03 | 2024-03-29 | 佛山市蓝箭电子股份有限公司 | Turnover feeding device of semiconductor packaging and bonding equipment |
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