CN206864447U - A kind of suction means of ultra-thin chip - Google Patents
A kind of suction means of ultra-thin chip Download PDFInfo
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- CN206864447U CN206864447U CN201720659986.2U CN201720659986U CN206864447U CN 206864447 U CN206864447 U CN 206864447U CN 201720659986 U CN201720659986 U CN 201720659986U CN 206864447 U CN206864447 U CN 206864447U
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- platform
- thimble
- suction nozzle
- chip
- plane
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Abstract
It the utility model is related to a kind of suction means of ultra-thin chip, including the component suction nozzle being oppositely arranged up and down and absorption ejector pin component；Absorption ejector pin component includes drawing platform and is arranged on the three-stage thimble platform drawn in platform；Draw and multiple vacuum holes are distributed with platform；Elevating lever is provided with lower bottom base, and elevating lever upper end is connected with upper bed-plate；Upper bed-plate upper end is provided with multiple fix bars；Fix bar upper end is installed with the first thimble platform；In first thimble platform positioned at the upper end of upper bed-plate be provided with it is multiple can oscilaltion the first push rod；First push rod upper end is installed with the second thimble platform；Second push rod is arranged in fixed plate, above-mentioned fixed plate is arranged between multiple first push rods, and second push rod upper end be provided with the 3rd thimble platform, the utility model is jacked up the chip on mucous membrane for three sections using multisection type platform thimble point, progressively disengage chip and mucous membrane, viscosity of the mucous membrane to chip can be effectively reduced, is avoided that chip local pressure or unbalance stress cause chip cracks.
Description
Technical field
The utility model belongs to semiconductor die package field, more particularly to a kind of suction means of ultra-thin chip.
Background technology
, it is necessary to be placed into after bare chip is picked up from mucous membrane on base material, so as to complete during semiconductor die package
Into follow-up chip overall package.Current chip pickup mode uses thimble-type thimble seat and General Purpose Rubber suction nozzle, but in length
Find following deficiency be present during using thimble and common suction nozzle operation ultra-thin chip after the use of time：（1）Because thimble is
Combined type arranges, and thimble plane has injustice, causes partial dot to protrude, and causes chip local pressure；（2）Thimble is arranged due to setting
Defect is counted, thimble has certain gap in arrangement between thimble, it is impossible to provides chip and completely supports；（3）During thimble operation
Chip and mucous membrane are combined closely, it is not easy to are departed from；（4）General Purpose Rubber suction nozzle only has vacuum groove in centre, draws ultra-thin chip
The deformation of Shi Zaocheng chips, so as to bring many hidden danger to actual production and processing, the fraction defective of chip is high.
Utility model content
The purpose of the utility model is to provide one kind when chip picks up for overcome the deficiencies in the prior art, can be chip
Enough platforms are provided, point three sections of disengagings, reduce mucous membrane to the viscosity of chip, avoid chip broken between chip and mucous membrane
The suction means of the ultra-thin chip split.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：A kind of suction means of ultra-thin chip, including
The plane component suction nozzle and absorption ejector pin component being oppositely arranged up and down；The plane component suction nozzle include plane suction nozzle fixed seat and
It is arranged on the plane suction nozzle of plane suction nozzle fixed seat lower end；The lower surface of the plane suction nozzle is in plane, and plane suction nozzle
Multiple adsorption holes are provided with lower surface, for adsorbing chip；The absorption ejector pin component includes drawing platform and is arranged on absorption
Three-stage thimble platform in platform；Multiple vacuum holes are distributed with the absorption platform；The three-stage thimble platform includes
Lower bottom base, upper bed-plate, elevating lever, fix bar, the first thimble platform, the second push rod, the second thimble platform, fixed plate and the 3rd top
Pin platform；The lower bottom base is arranged at the center for drawing platform interior；Elevating lever is provided with the lower bottom base, and on elevating lever
End is connected with upper bed-plate；The upper bed-plate upper end is provided with multiple fix bars；The fix bar upper end is installed with the first thimble platform；
In the first thimble platform positioned at the upper end of upper bed-plate be provided with it is multiple can oscilaltion the first push rod；On first push rod
End is installed with the second thimble platform；Second push rod is arranged in fixed plate, and above-mentioned fixed plate is arranged on multiple first push rods
Between, and the second push rod upper end is provided with the 3rd thimble platform in the second thimble platform.
Preferably, the material of the plane suction nozzle is rubber；The lower surface of the plane suction nozzle is rectangle, and plane is inhaled
Mouth lower surface is provided with six row adsorption hole groups, and each column adsorption hole group includes four adsorption holes be arrangeding in parallel.
Preferably, it is additionally provided with spring between the upper bed-plate and lower bottom base.
Preferably, the shape of the first thimble platform and the second thimble platform is in " mouth " font；3rd thimble is put down
The shape of platform is rectangle.
Due to the utilization of above-mentioned technical proposal, the utility model has following advantages compared with prior art：
The suction means of the ultra-thin chip of the utility model is more while plane suction nozzle draws ultra-thin chip
Three sections of segmentation platform thimble point jacks up the chip on mucous membrane, during segmentation jacks up chip, make chip and mucous membrane by
Gradually depart from, can effectively reduce viscosity of the mucous membrane to chip, and thimble platform can provide effective planar support, meanwhile, plane
Suction nozzle lower surface is in plane, avoids chip local pressure or unbalance stress from causing chip cracks.
Brief description of the drawings
Accompanying drawing 1 is structural representation of the present utility model；
Accompanying drawing 2 is the planar structure schematic diagram of plane suction nozzle；
Accompanying drawing 3 is the top view of three-stage thimble platform；
Accompanying drawing 4 is to omit three-stage thimble platform after the first thimble platform, the second thimble platform and the 3rd thimble platform
Structural representation；
When accompanying drawing 5 is utility model works, the schematic flow sheet of chip and mucous membrane separation；
Wherein：1st, plane suction nozzle fixed seat；2nd, plane suction nozzle；3rd, chip；4th, mucous membrane；5th, three-stage thimble platform；6th, inhale
Make even platform；12nd, adsorption hole；50th, plane component suction nozzle；60th, ejector pin component is adsorbed；210th, lower bottom base；211st, upper bed-plate；212nd, rise
Bar drops；213rd, fix bar；214th, the first thimble platform；215th, the second push rod；216th, the second thimble platform；217th, fixed plate；
218th, the second push rod；219th, the 3rd thimble platform；200th, vacuum hole；312nd, spring.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment the utility model is described in further detail.
A kind of suction means of ultra-thin chip described in the utility model as shown in accompanying drawing 1-4, including set relatively up and down
The plane component suction nozzle 50 and absorption ejector pin component 60 put；The plane component suction nozzle 50 includes plane suction nozzle fixed seat 1 and set
Put the plane suction nozzle 2 in the lower end of plane suction nozzle fixed seat 1；The lower surface of the plane suction nozzle 2 is in plane, and plane suction nozzle 2
Lower surface on be provided with multiple adsorption holes 12, for adsorbing chip 3；The absorption ejector pin component 60 includes drawing platform 6 and set
Put and drawing the three-stage thimble platform 5 in platform 6；Multiple vacuum holes 200 are distributed with the absorption platform 6；Described three sections
Formula thimble platform 5 includes lower bottom base 210, upper bed-plate 211, elevating lever 212, fix bar 213, the first thimble platform 214, first top
Bar 215, the second push rod 218, the second thimble platform 216, the thimble platform 219 of fixed plate 217 and the 3rd；The lower bottom base 210 is set
Put at the center drawn inside platform 20；Elevating lever 212, and the upper end of elevating lever 212 and upper bottom are provided with the lower bottom base 210
Seat 211 is connected；The upper end of upper bed-plate 211 is provided with multiple fix bars 213；The upper end of fix bar 213 is installed with the first thimble
Platform 214；In the first thimble platform 214 positioned at the upper end of upper bed-plate 211 be provided with it is multiple can oscilaltion the first push rod
215；The upper end of first push rod 215 is installed with the second thimble platform 216；Second push rod 218 is arranged on fixed plate 217
On, above-mentioned fixed plate 217 is arranged between multiple first push rods 215, and the upper end of the second push rod 218 is provided with and put down positioned at the second thimble
The 3rd thimble platform 219 in platform 216.
The material of the plane suction nozzle 2 is rubber；The lower surface of the plane suction nozzle 2 is rectangle, and under plane suction nozzle 2
Surface is provided with six row adsorption hole groups, and each column adsorption hole group includes four adsorption holes 12 be arrangeding in parallel；The He of upper bed-plate 211
Spring 312 is additionally provided between lower bottom base 210；The shape of the first thimble platform 214 and the second thimble platform 216 is in " mouth " word
Type；The shape of the 3rd thimble platform 219 is rectangle.
Specifically, the upper surface flush of the first thimble platform, the second thimble platform and the 3rd thimble platform, and the first thimble
There is gap between platform and the second thimble platform and the second thimble platform and the 3rd thimble platform, wherein, the first thimble is put down
The area for total plane that the upper surface of platform, the second thimble platform and the 3rd thimble platform is formed is bigger than the area of chip lower end.
The separation process of mucous membrane and chip is as shown in Figure 5：
First, the chip with mucous membrane is placed on and drawn on platform, now for chip upper, mucous membrane utilizes plane under
Suction nozzle adsorbs chip, while the vacuum hole by drawing on platform lives mucosal absorption；
Then, the first step, elevating lever are opened, and upper bed-plate up moves so that the first thimble platform, the second thimble platform and
3rd thimble platform up moves simultaneously, and the first thimble platform jacks up chip so that positioned at the viscous of the first thimble platform surrounding
Film and chip are separated, second step, and the first push rod up moves, and the second thimble platform and the 3rd thimble platform are together toward moving up
Dynamic, the second thimble platform jacks up chip so that mucous membrane and chip positioned at the second thimble platform surrounding separate；3rd step, the
Two push rods up move, and the 3rd thimble platform up moves, and are jacked up chip using the 3rd thimble platform so that positioned at the 3rd top
Mucous membrane and the chip separation of pin platform upper end, such mucous membrane are just easily separated with chip, finally will using flat suction nozzle
Chip is picked and placed on support from mucous membrane, wherein because plane suction nozzle lower surface is plane, plane suction nozzle is being drawn
It will not cause the deformation of chip during chip, be maintained at formation state during chip pick-up.
Wherein, three-stage platform thimble can divide three steps to eject, and often walk and ejected in the way of successively decreasing, often walk ejection height
It can require to realize according to parameter setting.Its size can be adjusted according to product size.
The suction means of ultra-thin chip of the present utility model, it is engaged pair using three-stage platform thimble seat and plane suction nozzle
Ultra-thin chip is drawn, and in work, while plane suction nozzle draws ultra-thin chip, three sections of multisection type platform thimble point will
Chip on mucous membrane jacks up, and during segmentation jacks up chip, progressively disengages chip and mucous membrane, can effectively reduce mucous membrane
To the viscosity of chip, and thimble platform can provide effective planar support, meanwhile, plane suction nozzle lower surface is in plane, is kept away
Exempt from chip local pressure or unbalance stress causes chip cracks.
It the above is only concrete application example of the present utility model, do not form any limit to the scope of protection of the utility model
System.All technical schemes formed using equivalent transformation or equivalent replacement, all fall within the utility model rights protection scope it
It is interior.
Claims (4)
- A kind of 1. suction means of ultra-thin chip, it is characterised in that：Including the plane component suction nozzle being oppositely arranged up and down and absorption Ejector pin component；The component suction nozzle includes suction nozzle fixed seat and is arranged on the plane suction nozzle of suction nozzle fixed seat lower end；The plane suction nozzle Lower surface is in plane, and multiple adsorption holes are provided with the lower surface of plane suction nozzle, for adsorbing chip；The absorption ejector pin component includes drawing platform and is arranged on the three-stage thimble platform drawn in platform；Described draw is put down Multiple vacuum holes are distributed with platform；The three-stage thimble platform includes lower bottom base, upper bed-plate, elevating lever, fix bar, the first top Pin platform, the second push rod, the second thimble platform, fixed plate and the 3rd thimble platform；The lower bottom base, which is arranged on, to be drawn in platform At the center in portion；Elevating lever is provided with the lower bottom base, and elevating lever upper end is connected with upper bed-plate；The upper bed-plate upper end is provided with Multiple fix bars；The fix bar upper end is installed with the first thimble platform；Positioned at the upper of upper bed-plate in the first thimble platform End be provided with it is multiple can oscilaltion the first push rod；The first push rod upper end is installed with the second thimble platform；Second top Bar is arranged in fixed plate, and above-mentioned fixed plate is arranged between multiple first push rods, and the second push rod upper end is provided with and is located at second The 3rd thimble platform in thimble platform.
- 2. the suction means of ultra-thin chip according to claim 1, it is characterised in that：The material of the plane suction nozzle is rubber Glue；The lower surface of the plane suction nozzle is rectangle, and plane suction nozzle lower surface is provided with six row adsorption hole groups, each column adsorption hole Group includes four adsorption holes be arrangeding in parallel.
- 3. the suction means of ultra-thin chip according to claim 1, it is characterised in that：Between the upper bed-plate and lower bottom base It is additionally provided with spring.
- 4. the suction means of the ultra-thin chip according to any one of claim 1-3, it is characterised in that：First thimble The shape of platform and the second thimble platform is in " mouth " font；The shape of the 3rd thimble platform is rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720659986.2U CN206864447U (en) | 2017-06-08 | 2017-06-08 | A kind of suction means of ultra-thin chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720659986.2U CN206864447U (en) | 2017-06-08 | 2017-06-08 | A kind of suction means of ultra-thin chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206864447U true CN206864447U (en) | 2018-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720659986.2U Active CN206864447U (en) | 2017-06-08 | 2017-06-08 | A kind of suction means of ultra-thin chip |
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| Country | Link |
|---|---|
| CN (1) | CN206864447U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128846A (en) * | 2019-12-24 | 2020-05-08 | 颀中科技（苏州）有限公司 | Ejector pin device for chip packaging |
-
2017
- 2017-06-08 CN CN201720659986.2U patent/CN206864447U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128846A (en) * | 2019-12-24 | 2020-05-08 | 颀中科技（苏州）有限公司 | Ejector pin device for chip packaging |
| CN111128846B (en) * | 2019-12-24 | 2022-02-22 | 颀中科技（苏州）有限公司 | Ejector pin device for chip packaging |
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