CN201028446Y

CN201028446Y - Heat conducting construction for LED lighting device

Info

Publication number: CN201028446Y
Application number: CNU2007201036631U
Authority: CN
Inventors: 官有占
Original assignee: GUAN YOUZHAN QIU BAIDONG
Current assignee: Changshu CGPower Energy Corporation
Priority date: 2007-02-16
Filing date: 2007-02-16
Publication date: 2008-02-27
Anticipated expiration: 2017-02-16

Abstract

The utility model discloses a lead conducting structure of the LED light; a LED is connected with the circuit component of the head transmission base; a heat conducting base structure is provided to form a radiating structure; the LED is connected with the head transmission base body and the heat conducting base to radiate quickly; the utility model can enhance the power to enhance the quick radiating and enhance the service life.

Description

A kind of heat transfer structure of LED lighting

Technical field

The utility model relates to a kind of ligthing paraphernalia, more detailed it, refer in particular to about illuminator collocation heat transfer matrix loop member cross-over connection heat conduction substrate thus increasing heat radiation effect, reaching increases power, heat radiation and brightness, improves the heat transfer structure of the LED lighting in lighting service life.

Background technology

General habitual light emitting diode 1 assembling is used, as shown in Figure 1, all only be with electrode member 2 link circuits 3, the conducting electric current uses, but light emitting diode 1 can produce heat in the photoelectric action process, distribute via electrode member 2 transmission, can all send out in order to make light emitting diode produce heat, habitually practise and mostly electrode member 2 shapes are changed, but the volume of light emitting diode own is little, the area of dissipation of these electrode member 2 change of shape is also few relatively, and its distribute heat of is limited, and this light emitting diode 1 is because heat radiation is not enough, be easy to cause heat history, make this light emitting diode 1 temperature own raise relatively, operating temperature also rises, this is easy to cause this light emitting diode 1 luminous efficiency significantly to reduce, even causes the crystal inside damage, influences result of use, significantly reduce the life-span; Especially recently the power of light emitting diode is high-power towards adding gradually, or with a most light emitting diode string, parallel connection is combined into the increasing power development, habitual relatively light emitting diode is used as radiator structure with electrode member merely, area, the volume narrow and small effect that is not enough to bring into play that all seems, and lighting more demand is more high-power or integrated, combination increases power, radiator structure seems particularly not enough relatively, limited the development of LED lighting, how to increase the most set of LED, combination increases power can increase the heat conduction and heat radiation ability relatively, then is the eager primary work of making great efforts solution of dealer institute.

The inventor is manufacturing and the design of being engaged in illumination and energy equipment relevant device with it for many years, in view of using the electrode of LED, habitual illuminating lamp dispels the heat merely, and can't effectively get rid of heat, the restriction power of LED own and form set power, must improve the integral body that illuminating lamp uses LED, making can increase power and use, more can improve the life-span and strengthen brightness of illumination and use, and is the active research improvement, then exploitation of the present utility model is arranged.

Summary of the invention

The main purpose of the heat transfer structure of the utility model LED lighting is that light emitting diode connects heat transfer matrix, heat conduction substrate and loop member, and heat conduction simultaneously increases heat-sinking capability to vast heat radiation matrix, can increase overall power, improve the person in service life.

The secondary objective of the heat transfer structure of the utility model LED lighting, light emitting diode connect heat conduction substrate and can utilize heat conduction, the multiple approach of heat radiation to reach quick efficiently radiates heat.

For achieving the above object, the utility model adopts following concrete technical scheme:

A kind of heat transfer structure of LED lighting, it is that this loop member connects power supply, provides this light emitting diode conducting electric current to use by most light emitting diodes series connection, in parallel and connect a loop member and constitute path, wherein:

This loop member is the insulating barrier that is fixed in a heat transfer matrix with a guide wire, and this heat transfer matrix is established certain hyte part, connects this loop member and fixing for this light emitting diode;

One heat conduction substrate is to be provided with a holder to contact this heat transfer matrix and fix, and this heat transfer matrix engages this heat conduction substrate and constitutes vast heat transfer structure.

The heat transfer structure of above-mentioned LED lighting, wherein, holder build-in one heat-conductive assembly of this heat conduction substrate, this heat conduction substrate form direct conduction and directly get rid of double radiation structure.

The heat transfer structure of above-mentioned LED lighting, wherein, this holder forms most convex shape and arranges according to setting spacing.

The heat transfer structure of above-mentioned LED lighting, wherein, this heat conduction substrate bottom side is provided with a radiator.

The heat transfer structure of above-mentioned LED lighting, wherein, this heat transfer matrix is bonded to this heat conduction substrate and one-body molded, and this loop member of direct coating is for connecting power supply on this heat transfer matrix; This heat transfer matrix is to should being provided with a good conductor by loop member placement position, and this light emitting diode is fixed in this heat transfer matrix and connects this loop member, contacts this good conductor simultaneously and spreads out of heat.

The heat transfer structure of above-mentioned LED lighting, wherein, this heat conduction substrate is provided with the expansion side of a setting gradient extension, this expansion side forms multiple angles and extends, this heat transfer matrix is bonded to this heat conduction substrate and is complying with this expansion side and forms the multiple angles extension, this light emitting diode is fixed in this heat transfer matrix and connects this loop member, and this light emitting diode forms multiple angles direction, position set, and this light emitting diode emission light can enlarge range of exposures.

The heat transfer structure of above-mentioned LED lighting, wherein, this heat conduction substrate forms whole airtight, this light emitting diode is fixed in this heat transfer matrix and connects this loop member, one clamshell engages this heat conduction substrate one side, covers this light emitting diode, and this heat conduction substrate opposite side directly exposes heat conduction and water proof and dust proof.

Advantage of the present utility model and beneficial effect:

The heat transfer structure of the utility model LED lighting, constitute broad volume and area conduction heat with light emitting diode connection heat transfer matrix, heat conduction substrate, heat transfer matrix, heat conduction substrate connect quick heat extraction in conjunction with heat-conductive assembly and radiator, constitute multipath, multilayer conduction heat, heat radiation, guarantee the quick heat extraction of light emitting diode, improve radiating effect, improve the practical effect in life-span.

Description of drawings

Fig. 1 is the schematic diagram of known light emitting diode electrode member heat radiation;

Fig. 2 is the schematic diagram of the utility model first preferred embodiment combination;

Fig. 3 is fixed in heat transfer matrix cross-over connection heat conduction substrate part cross-sectional schematic for the light emitting diode of the utility model first preferred embodiment;

Fig. 4 is that the heat transfer body portion of Fig. 3 of the utility model first preferred embodiment amplifies cross-sectional schematic;

Fig. 5 is fixed in heat transfer matrix joint heat conduction substrate cross-sectional schematic for the light emitting diode of the utility model first preferred embodiment;

Fig. 6 is the heat transfer body portion cross-sectional schematic of the loop member of the utility model second preferred embodiment;

Fig. 7 is the heat conduction substrate part cross-sectional schematic of the utility model the 3rd preferred embodiment.

The specific embodiment

Can obtain further understanding for understanding the purpose of this utility model, feature and effect, lift three preferred embodiments now, and cooperation be illustrated as follows:

Shown in Fig. 2,3, the heat transfer structure of the utility model LED lighting, first preferred embodiment, its general structure comprises a light emitting diode 20, a loop member 30 and a heat conduction substrate 40:

Shown in Fig. 3,4, this light emitting diode 20 is that a transparent body 21 coats an electrode member 22, but these electrode member 22 set luminescence chips, and this electrode member 22 is extended with a positive pole 23, one negative poles 24.

Shown in Fig. 3,4, this loop member 30 is to set firmly a guide wire 33 on the insulating barrier 32 of a heat transfer matrix 31 according to circuit layout, and 31 pairs of this heat transfer matrixes should member 30 layouts in loop be provided with two positioning components 34; This positioning component 34 establishes perforation, shown in Fig. 2,4, wear this heat transfer matrix 31, this loop member 30, these positioning component 34 perforation madial walls are provided with the separation layer 35 of an insulation, these separation layer 35 central authorities are provided with an aperture 36, guide wire 33 welding that the positive pole 23 of this light emitting diode 20, negative pole 24 run through this aperture 36, can connect this loop member 30 are fixing.

This heat conduction substrate 40, it is the holder 41 that the metallic aluminium material is made, upside forms most convex shape, this holder 41 is discharged to according to setting spacing, these holder 41 bossings are provided with through hole can embed a heat-conductive assembly 42 tight sets, this heat-conductive assembly 42 protrudes out this holder 41 and the distolateral condenser 43 that is provided with, form recessed trough valley 44 between this holder 41, these heat conduction substrate 40 downsides are provided with a radiator 45.

When using by the assembling of said structure the utility model, as shown in Figure 4, should loop member 30 positions with 22 pairs of the electrode members of this light emitting diode 20, again should

positive pole

23,24 pairs at negative pole is should positioning component 34, this positive pole 23, negative pole 24 cover the aperture 36 of this positioning component 34, the positioning component 34 that separates this heat transfer matrix 31 by this separation layer 35 is established perforation formation insulation, and this positive pole 23, negative pole 24 connect these guide wires 33 and can weld fixing.

This heat transfer matrix 31 is cross-placed on the holder 41 of this heat conduction substrate 40, shown in Fig. 3,4, these loop member 30 welding positions are placed in trough valley 44 positions, prevent to be contacted with this heat conduction substrate 40 short circuits, as shown in Figure 5, utilize securing member this positive and

negative electrode

23,24 positions of staggering simultaneously, with the lock holder 41 of this heat transfer matrix 31 and this heat conduction substrate 40 of securing member, these holder 41 fluid-tight engagement of these heat transfer matrix 31 cross-over connections, this heat transfer matrix 31 and this heat conduction substrate 40 engage and form broad volume and area raising heat-conducting effect.

This light emitting diode 20 is according to layout, 22 pairs of this electrode members should loop member 30 positions be pegged graft and welds and fix, shown in Fig. 3,5, it is fixing again should heat transfer matrix 31 to be cross-placed on this heat conduction substrate 40, again with overall fixed in a lamp housing 50 inside, as shown in Figure 2, this light emitting diode 20 forms different the arrangement and the shape arrangement, and this light emitting diode 20 can provide the broad range illumination to use.

When the utility model connects the power supply use, these loop member 30 guiding electric currents are supplied this light emitting diode 20 operating currents, these light emitting diode 20 photoelectric actions emit light and heat, the heat of this generation is transmitted to this loop member 30, this heat transfer matrix 31 via this electrode member 22, this heat transfer matrix 31 is connected across this holder 41 and directly transmits the thermosetting thermally conductive pathways, this heat transfer matrix 31 and conductor hot basal body 40 form the entity of huge heat radiation, can provide big calorimetric to distribute fast.

Shown in Fig. 3,4, these heat-conductive assembly 42 these holder 41 through holes of tight set, this heat-conductive assembly 42 is made with the copper metal material, utilize copper, this heat-conductive assembly 42 of aluminium material characteristic the heat energy at these holder 41 positions can be carried out fast, this condenser 43 distribute heat fast forms the lower temperature end, this heat-conductive assembly 42 protrude out this holder 41, can be in a large number and get rid of heat fast, simultaneously this heat conduction substrate 40 pass ground heat, can also utilize this radiator 45 of downside to discharge heats.

The heat that this light emitting diode 20 produces is delivered to this heat conduction substrate 40, can transmit fast, get rid of via above-mentioned two paths, this heat transfer matrix 31 and heat conduction substrate 40 form the entity of huge heat radiation, a large amount of heat transmission can be provided, distribute fast, the heat that this light emitting diode 20 produces can be transmitted fast in good time and distribute, this light emitting diode 20 can keep normal temperature when work, luminous efficiency is improved, and increases the person in service life.

The utility model second embodiment, as shown in Figure 6, itself and last embodiment broadly similar, it does not exist together is the one-body molded heat transfer matrix 31 of a side aluminium material of this heat conduction substrate 40, the insulating barrier 37 of one-body molded anodized processing on this heat transfer matrix 31, anodised insulating barrier 37 directly supplies guide wire 33 coatings of this loop member 30 on this heat transfer matrix 31, the guide wire 33 of this loop member 30 forms these heat transfer matrix 31 transmission heat of directly contact, heat-conducting effect is good, and the effect of this heat conduction substrate 40, heat transfer matrix 31 one-body molded direct heat transfers is good; 31 pairs of this heat transfer matrixes should member 30 certain bits in loop install a groove seat 38; One good conductor 39 embeds this groove seat 38, and this good conductor 39 of the utility model is to adopt the metallic copper material to make, whole heat transfer, the good structure of heat-conducting effect of forming.

As shown in Figure 6, the positive pole 23 of this light emitting diode 20, negative pole 24 connect the guide wire 33 of this loop member 30, this light emitting diode 20 also is fixed in this heat transfer matrix 31, and these light emitting diode 20 bottom radiating blocks 28 these good conductors 39 of contact, and both constitute fluid-tight engagement; This heat conduction substrate 40 uses aluminium, this good conductor 39 uses copper material, utilize copper heat absorption and aluminium heat radiation, copper, aluminium heat conduction and the difference characteristic of dispelling the heat good, the heat that these light emitting diode 20 work produce is via these good conductor 39 fast Absorption transmission, and distribute fast by this heat conduction substrate 40, this heat conduction substrate 40 increase heat-sinking capabilities, can appropriateness, discharge heat fast in good time; These light emitting diode 20 bottoms directly contact this good conductor 39, and this good conductor 39 directly is connected with this heat transfer matrix 31; Can exempt commonly use light emitting diode at interval heat conduction intercept heat conduction disappearance far below isolated formation of the plastic insulating layer of metal, but these light emitting diode 20 series, parallel of the utility model are formed light fixture appropriateness and are increased the power of light fixture and improve luminous efficiency.

Being provided with this heat-conductive assembly 42 and this radiator 45 simultaneously in this heat conduction substrate 40 can be in a large number and the heat of inside is spread out of distribute fast, as shown in Figure 5, this heat conduction substrate 40, heat transfer matrix 31 and this loop member 30, good conductor 39 form directly and thermal conductivity fruit favourable structure; This heat conduction substrate 40 can keep the low temperature situation, provides heat that this light emitting diode 20 produces can the fast Absorption transmission, and these light emitting diode 20 smooth and easy eliminating heats are guaranteed normal working temperature, and this light emitting diode 20 can improve luminous efficiency, increases service life; Lighting luminous intensity, life-span are significantly improved.

The utility model the 3rd embodiment, as shown in Figure 7, itself and last embodiment broadly similar, it does not exist together is one of the aluminium material central flat straight section 46 of this heat conduction substrate 40, its both sides are equipped with one and set the expansion side 47 that gradient is extended, 47 pairs of this expansion sides should form the multiple angles extension by central flat straight section 46, this heat transfer matrix 31 is bonded to this heat conduction substrate 40, and complying with these expansion side 47 formation multiple angles and extending, this light emitting diode 20 is fixed in this heat transfer matrix 31 and connects this loop member 30, this light emitting diode 20 is fixed in this central flat straight section 46 and forms towards upper and lower to luminous irradiation, this light emitting diode 20 is fixed in this expansion side 47 and forms towards the luminous irradiation of outside different angles direction, this light emitting diode 20 constitutes the multiple angles direction, the position set, these light emitting diode 20 multiple angles directions, position emission light, these light emitting diode 20 collocation different densities and power distribution fixed bits, can produce enough luminous intensities and different irradiating angle, provide to enlarge the range of exposures use.

This heat conduction substrate 40 can utilize the polylith amalgamation to form the multi-angle oblique extension, and these heat conduction substrate 40 1 sides form whole airtight, this heat conduction substrate 40 can also extend according to molded formation multi-angle oblique, this heat conduction substrate 40 is whole airtightly can directly to expose heat conduction, and water proof and dust proof, this light emitting diode 20 is fixed in this heat transfer matrix 31 and connects this loop member 30, this light emitting diode 20 is positioned at this heat conduction substrate 40 whole airtight sides in addition, it is whole airtight that the clamshell 48 of one printing opacity engages this heat conduction substrate 40, cover this light emitting diode, this heat conduction substrate 40 engages this clamshell 48 whole airtight and water proof and dust proofs.

The heat transfer structure of the utility model LED lighting connects biography with light emitting diode in sum Hot basal body, heat conduction substrate consist of broad volume and area conduction heat, heat transfer matrix, heat conduction substrate knot Close heat-conductive assembly and radiator and connect quick heat extraction, consist of multipath, multilayer heat by conduction, heat radiation, guarantee The quick heat extraction of light emitting diode, raising radiating effect improve the practical effect in life-span.

Claims

1. the heat transfer structure of a LED lighting, it is that this loop member connects power supply, provides this light emitting diode conducting electric current to use, and it is characterized in that by most light emitting diodes series connection and/or in parallel and connect a loop member and constitute path:

One heat conduction substrate is to be provided with a holder to contact this heat transfer matrix and fix, and this heat transfer matrix engages this heat conduction substrate to constitute vast heat transfer structure.

2. the heat transfer structure of LED lighting according to claim 1 is characterized in that, holder build-in one heat-conductive assembly of this heat conduction substrate, this heat conduction substrate form direct conduction and directly get rid of the double radiation structure of heat.

3. the heat transfer structure of LED lighting according to claim 1 is characterized in that, this holder forms most convex shape and arranges according to setting spacing.

4. the heat transfer structure of LED lighting according to claim 1 is characterized in that, this heat conduction substrate bottom side is provided with a radiator.

5. the heat transfer structure of LED lighting according to claim 1 is characterized in that, this heat transfer matrix is bonded to this heat conduction substrate and one-body molded, and this loop member of direct coating is for connecting power supply on this heat transfer matrix; This heat transfer matrix is to should being provided with a good conductor by loop member placement position, and this light emitting diode is fixed in this heat transfer matrix and connects this loop member, contacts this good conductor simultaneously and spreads out of heat.

6. the heat transfer structure of LED lighting according to claim 1, it is characterized in that, this heat conduction substrate is provided with the expansion side of a setting gradient extension, this expansion side forms multiple angles and extends, this heat transfer matrix is bonded to this heat conduction substrate and is complying with this expansion side and forms the multiple angles extension, this light emitting diode is fixed in this heat transfer matrix and connects this loop member, and this light emitting diode forms multiple angles direction, position set, and this light emitting diode emission light can enlarge range of exposures.

7. the heat transfer structure of LED lighting according to claim 1, it is characterized in that, this heat conduction substrate forms whole airtight, this light emitting diode is fixed in this heat transfer matrix and connects this loop member, one clamshell engages this heat conduction substrate one side, covers this light emitting diode, this heat conduction substrate opposite side directly exposes, so that heat conduction and water proof and dust proof.