CN1998080B - 篡改响应覆盖件 - Google Patents

篡改响应覆盖件 Download PDF

Info

Publication number
CN1998080B
CN1998080B CN200580018891.2A CN200580018891A CN1998080B CN 1998080 B CN1998080 B CN 1998080B CN 200580018891 A CN200580018891 A CN 200580018891A CN 1998080 B CN1998080 B CN 1998080B
Authority
CN
China
Prior art keywords
tamper respondent
coating member
covering according
respondent covering
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200580018891.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN1998080A (zh
Inventor
斯蒂芬·亨特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates UK Ltd
Original Assignee
WL Gore and Associates UK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WL Gore and Associates UK Ltd filed Critical WL Gore and Associates UK Ltd
Publication of CN1998080A publication Critical patent/CN1998080A/zh
Application granted granted Critical
Publication of CN1998080B publication Critical patent/CN1998080B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0208—Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Security & Cryptography (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Burglar Alarm Systems (AREA)
  • Storage Device Security (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN200580018891.2A 2004-04-08 2005-04-06 篡改响应覆盖件 Expired - Fee Related CN1998080B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0407972.9 2004-04-08
GB0407972A GB2412996B (en) 2004-04-08 2004-04-08 Tamper respondent covering
PCT/GB2005/001318 WO2005098950A1 (en) 2004-04-08 2005-04-06 Tamper respondent covering

Publications (2)

Publication Number Publication Date
CN1998080A CN1998080A (zh) 2007-07-11
CN1998080B true CN1998080B (zh) 2013-05-08

Family

ID=32320555

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580018891.2A Expired - Fee Related CN1998080B (zh) 2004-04-08 2005-04-06 篡改响应覆盖件

Country Status (8)

Country Link
US (1) US7978070B2 (enExample)
EP (1) EP1751798B1 (enExample)
JP (1) JP4965430B2 (enExample)
CN (1) CN1998080B (enExample)
AU (1) AU2005231051B2 (enExample)
CA (1) CA2563240C (enExample)
GB (1) GB2412996B (enExample)
WO (1) WO2005098950A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108229631A (zh) * 2016-12-22 2018-06-29 Em微电子-马林有限公司 具备防篡改回路的双通信频率rfid电路

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007003227A1 (de) * 2005-06-30 2007-01-11 Siemens Aktiengesellschaft Hardwareschutz in form von zu halbschalen tiefgezogenen leiterplatten
US7640658B1 (en) * 2005-10-18 2010-01-05 Teledyne Technologies Incorporated Methods for forming an anti-tamper pattern
US7760086B2 (en) * 2006-11-03 2010-07-20 Gore Enterprise Holdings, Inc Tamper respondent sensor and enclosure
US9283029B2 (en) * 2007-01-31 2016-03-15 Alma Lasers Ltd. Skin treatment using a multi-discharge applicator
US20080192446A1 (en) 2007-02-09 2008-08-14 Johannes Hankofer Protection For Circuit Boards
DE102007020656B4 (de) 2007-04-30 2009-05-07 Infineon Technologies Ag Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips
US8522051B2 (en) 2007-05-07 2013-08-27 Infineon Technologies Ag Protection for circuit boards
US7787256B2 (en) 2007-08-10 2010-08-31 Gore Enterprise Holdings, Inc. Tamper respondent system
US7726579B2 (en) * 2008-01-10 2010-06-01 Sony Corporation In-chassis TV chip with dynamic purse
FR2934110B1 (fr) * 2008-07-16 2010-10-22 Ingenico Sa Dispositif de protection d'un composant electronique.
US20100123469A1 (en) * 2008-11-19 2010-05-20 Edward Craig Hyatt System and method for protecting circuit boards
FR2938953B1 (fr) * 2008-11-21 2011-03-11 Innova Card Dispositif de protection d'un boitier de circuit integre electronique contre les intrusions par voie physique ou chimique.
US8325486B2 (en) * 2009-01-13 2012-12-04 Dy 4 Systems Inc. Tamper respondent module
US8278948B2 (en) * 2009-08-10 2012-10-02 Apple Inc. Mechanisms for detecting tampering of an electronic device
TWI446669B (zh) 2011-03-22 2014-07-21 Wistron Corp 防止散熱不良並具靜電放電保護功能之電子裝置及其之保護方法
US8811072B2 (en) * 2012-03-13 2014-08-19 Honeywell International Inc. Magnetoresistive random access memory (MRAM) package including a multilayer magnetic security structure
US8854870B2 (en) 2012-03-13 2014-10-07 Honeywell International Inc. Magnetoresistive random access memory (MRAM) die including an integrated magnetic security structure
KR20130126804A (ko) 2012-04-24 2013-11-21 이철재 불법 조작 반응 덮개
GB2504479A (en) * 2012-07-27 2014-02-05 Johnson Electric Sa Security wrap comprising conductor pattern to protect electronic device.
CN103582299B (zh) * 2012-07-27 2018-08-21 德昌电机(深圳)有限公司 保护装置
GB2504481A (en) * 2012-07-27 2014-02-05 Johnson Electric Sa Security wrap for protecting electronic device with x-ray impervious screen or x-ray invisible conductive tracks
GB2505176A (en) * 2012-08-20 2014-02-26 Johnson Electric Sa Security wrap for protecting electronic device with x-ray impervious screen or x-ray invisible conductive tracks
CN103034155B (zh) * 2012-11-22 2014-11-12 福建联迪商用设备有限公司 保护液晶信号的pcb板及手持设备
US9130752B2 (en) 2012-11-26 2015-09-08 Honeywell International Inc. Tamper-resistant coating for an integrated circuit
CN103140056B (zh) * 2012-12-21 2015-09-23 福建联迪商用设备有限公司 保护安全器件及安全信号的pcb板、方法及手持设备
US9159209B2 (en) 2013-03-15 2015-10-13 Ut-Battelle, Llc Conductive fabric seal
GB2515996A (en) 2013-04-15 2015-01-14 Johnson Electric Sa Security wrap with tearable substrate
US9298956B2 (en) 2013-10-04 2016-03-29 Square, Inc. Tamper protection mesh in an electronic device
US9521764B2 (en) * 2013-12-09 2016-12-13 Timothy Steiner Tamper respondent apparatus
US9392734B1 (en) 2014-02-11 2016-07-12 Lockheed Martin Corporation Security wrapper for an electronic assembly and methods for forming such a wrapper
WO2016064933A1 (en) 2014-10-20 2016-04-28 Bedrock Automation Platforms Inc. Tamper resistant module for industrial control system
US10579833B1 (en) 2014-12-16 2020-03-03 Thales Esecurity, Inc. Tamper detection circuit assemblies and related manufacturing processes
US10243286B2 (en) 2014-12-17 2019-03-26 Hewlett Packard Enterprise Development Lp Disabling device including adhesive to disable an electrical interface
US10007811B2 (en) 2015-02-25 2018-06-26 Private Machines Inc. Anti-tamper system
US9560737B2 (en) 2015-03-04 2017-01-31 International Business Machines Corporation Electronic package with heat transfer element(s)
US10426037B2 (en) 2015-07-15 2019-09-24 International Business Machines Corporation Circuitized structure with 3-dimensional configuration
US9911012B2 (en) 2015-09-25 2018-03-06 International Business Machines Corporation Overlapping, discrete tamper-respondent sensors
US9924591B2 (en) 2015-09-25 2018-03-20 International Business Machines Corporation Tamper-respondent assemblies
US9578764B1 (en) 2015-09-25 2017-02-21 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
US10175064B2 (en) 2015-09-25 2019-01-08 International Business Machines Corporation Circuit boards and electronic packages with embedded tamper-respondent sensor
US10098235B2 (en) 2015-09-25 2018-10-09 International Business Machines Corporation Tamper-respondent assemblies with region(s) of increased susceptibility to damage
US9894749B2 (en) 2015-09-25 2018-02-13 International Business Machines Corporation Tamper-respondent assemblies with bond protection
US9591776B1 (en) 2015-09-25 2017-03-07 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s)
US10172239B2 (en) * 2015-09-25 2019-01-01 International Business Machines Corporation Tamper-respondent sensors with formed flexible layer(s)
US10143090B2 (en) 2015-10-19 2018-11-27 International Business Machines Corporation Circuit layouts of tamper-respondent sensors
US9978231B2 (en) 2015-10-21 2018-05-22 International Business Machines Corporation Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s)
US9913389B2 (en) * 2015-12-01 2018-03-06 International Business Corporation Corporation Tamper-respondent assembly with vent structure
US10327343B2 (en) 2015-12-09 2019-06-18 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US9555606B1 (en) 2015-12-09 2017-01-31 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US9554477B1 (en) 2015-12-18 2017-01-24 International Business Machines Corporation Tamper-respondent assemblies with enclosure-to-board protection
US9887847B2 (en) 2016-02-03 2018-02-06 International Business Machines Corporation Secure crypto module including conductor on glass security layer
US9916744B2 (en) 2016-02-25 2018-03-13 International Business Machines Corporation Multi-layer stack with embedded tamper-detect protection
US9904811B2 (en) 2016-04-27 2018-02-27 International Business Machines Corporation Tamper-proof electronic packages with two-phase dielectric fluid
US9913370B2 (en) 2016-05-13 2018-03-06 International Business Machines Corporation Tamper-proof electronic packages formed with stressed glass
US9881880B2 (en) 2016-05-13 2018-01-30 International Business Machines Corporation Tamper-proof electronic packages with stressed glass component substrate(s)
CN106132071B (zh) * 2016-06-28 2019-04-12 Oppo广东移动通信有限公司 印制电路板及移动终端
US9858776B1 (en) 2016-06-28 2018-01-02 International Business Machines Corporation Tamper-respondent assembly with nonlinearity monitoring
US10251260B1 (en) 2016-08-29 2019-04-02 Square, Inc. Circuit board to hold connector pieces for tamper detection circuit
US10192076B1 (en) 2016-08-29 2019-01-29 Square, Inc. Security housing with recesses for tamper localization
US10321589B2 (en) 2016-09-19 2019-06-11 International Business Machines Corporation Tamper-respondent assembly with sensor connection adapter
US10299372B2 (en) 2016-09-26 2019-05-21 International Business Machines Corporation Vented tamper-respondent assemblies
US10271424B2 (en) 2016-09-26 2019-04-23 International Business Machines Corporation Tamper-respondent assemblies with in situ vent structure(s)
US10595400B1 (en) 2016-09-30 2020-03-17 Square, Inc. Tamper detection system
US9999124B2 (en) 2016-11-02 2018-06-12 International Business Machines Corporation Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
ES2877773T3 (es) * 2017-01-27 2021-11-17 Aselsan Elektronik Sanayi Ve Ticaret As Un sistema de protección de zona sensible electrónico
US10327329B2 (en) 2017-02-13 2019-06-18 International Business Machines Corporation Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor
US10548216B2 (en) 2017-03-21 2020-01-28 International Business Machines Corporation Employing conductive track writing in a tamper-respondent system
CN110892432B (zh) * 2017-03-30 2024-03-08 莫列斯有限公司 防篡改支付读取器
US10504096B1 (en) 2017-04-28 2019-12-10 Square, Inc. Tamper detection using ITO touch screen traces
US11623388B2 (en) 2017-07-28 2023-04-11 Hewlett-Packard Development Company, L.P. Additive manufacturing methods for printing tamper evident security structures with horizontal and vertical serpentine patterns
US10490943B2 (en) * 2017-08-09 2019-11-26 Micron Technology, Inc. Securing a memory card
US10306753B1 (en) 2018-02-22 2019-05-28 International Business Machines Corporation Enclosure-to-board interface with tamper-detect circuit(s)
US10740499B2 (en) 2018-03-12 2020-08-11 Nuvoton Technology Corporation Active shield portion serving as serial keypad
US11122682B2 (en) 2018-04-04 2021-09-14 International Business Machines Corporation Tamper-respondent sensors with liquid crystal polymer layers
EP3550466B1 (en) 2018-04-06 2023-08-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Puf-film and method for producing the same
EP3550475A1 (en) 2018-04-06 2019-10-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Puf-film and method for producing the same
EP3550623B1 (en) 2018-04-06 2020-07-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Puf-film and method for producing the same
US11089675B2 (en) 2018-10-22 2021-08-10 Te Connectivity Corporation Tamper sensor
US10595401B1 (en) 2019-05-29 2020-03-17 International Business Machines Corporation Tamper detection at enclosure-to-board interface
CN110263898A (zh) * 2019-07-19 2019-09-20 云南纳光科技有限公司 通过检测网络电阻实现防篡改检测的无源nfc防伪芯片
US11663368B2 (en) * 2019-09-30 2023-05-30 Block, Inc. Tamper detection based on removal of fastener from recess
US10810570B1 (en) 2019-09-30 2020-10-20 Square, Inc. Point of sale device with cradle for mobile computing device
US11665817B2 (en) 2019-09-30 2023-05-30 Block, Inc. Tamper detection based on flexible member connecting circuitry elements
CN110785005B (zh) * 2019-11-15 2020-08-28 苏师大半导体材料与设备研究院(邳州)有限公司 一种气垫防护式电路板
US11893146B2 (en) * 2020-03-04 2024-02-06 Arm Limited Tamper detection techniques
US12393925B2 (en) 2020-09-24 2025-08-19 Sumup Payments Ltd. Communication system and display synchronization
US11861053B2 (en) 2020-12-16 2024-01-02 Intel Corporation Techniques for tamper detection and protection of a memory module
JP7784313B2 (ja) * 2022-01-20 2025-12-11 ニデックインスツルメンツ株式会社 プリント基板
US12414229B2 (en) 2022-10-10 2025-09-09 International Business Machines Corporation Tearing security feature of printed circuit substrates

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1200570A (zh) * 1997-02-24 1998-12-02 通用仪器公司 用于集成电路的反篡改屏蔽连接线
DE19738990A1 (de) * 1997-09-05 1999-03-11 Siemens Ag Einrichtung zum Schutz gegen Mißbrauch einer Chipkarte
CN1246730A (zh) * 1999-09-13 2000-03-08 后健慈 集成电路封装盒的保全结构
FR2801999A1 (fr) * 1999-12-01 2001-06-08 Gemplus Card Int Procede de protection physique de puces electroniques et dispositifs electroniques ainsi proteges
US6496119B1 (en) * 1998-11-05 2002-12-17 Infineon Technologies Ag Protection circuit for an integrated circuit

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8814471D0 (en) * 1988-06-17 1988-07-20 Gore & Ass Security enclosure
JPH0793149B2 (ja) * 1989-06-09 1995-10-09 松下電器産業株式会社 固体二次電池とその製造法
US5027397A (en) * 1989-09-12 1991-06-25 International Business Machines Corporation Data protection by detection of intrusion into electronic assemblies
GB9113455D0 (en) * 1991-06-21 1991-08-07 Gore W L & Ass Uk Improvements in security enclosures
GB9113437D0 (en) * 1991-06-21 1991-08-07 Gore W L & Ass Uk Improvements in security enclosures
GB9113436D0 (en) * 1991-06-21 1991-08-07 Gore W L & Ass Uk Improvements in security enclosures
GB9115972D0 (en) * 1991-07-24 1991-09-11 Gore W L & Ass Uk Improvements in security enclosures
JP3048429B2 (ja) * 1991-08-14 2000-06-05 株式会社東芝 半導体集積回路装置
US5233505A (en) * 1991-12-30 1993-08-03 Yeng-Ming Chang Security device for protecting electronically-stored data
GB2270785B (en) * 1992-09-22 1996-05-08 Gore & Ass Improvements in security enclosure manufacture
GB2275914B (en) * 1993-03-12 1997-01-29 Gore & Ass Tamper respondent enclosure
TW471144B (en) * 1995-03-28 2002-01-01 Intel Corp Method to prevent intrusions into electronic circuitry
JP3440763B2 (ja) * 1996-10-25 2003-08-25 富士ゼロックス株式会社 暗号化装置、復号装置、機密データ処理装置、及び情報処理装置
JPH10133582A (ja) * 1996-10-31 1998-05-22 Sony Chem Corp 開封防止テープ
US5880523A (en) * 1997-02-24 1999-03-09 General Instrument Corporation Anti-tamper integrated circuit
JPH10301495A (ja) * 1997-04-30 1998-11-13 Media Roboteitsukusu:Kk 封印用シール
GB9721932D0 (en) * 1997-10-17 1997-12-17 Gore W L & Ass Uk Tamper respondent enclosure
JPH11353237A (ja) * 1998-06-05 1999-12-24 Fujitsu Ltd 電子取引装置
EP0964361A1 (en) * 1998-06-08 1999-12-15 International Business Machines Corporation Protection of sensitive information contained in integrated circuit cards
JP2001118045A (ja) * 1999-10-20 2001-04-27 Iwaki Electronics Corp Ｉｃモジュール
WO2001059544A2 (en) * 2000-02-14 2001-08-16 Rainbow Technologies B.V., Netherlands Security module system, apparatus and process
JP2002049317A (ja) * 2000-05-23 2002-02-15 Teikoku Tsushin Kogyo Co Ltd 電気的引き剥がし検知シート
US6686539B2 (en) * 2001-01-03 2004-02-03 International Business Machines Corporation Tamper-responding encapsulated enclosure having flexible protective mesh structure
JP2003302907A (ja) * 2002-04-12 2003-10-24 Matsushita Electric Ind Co Ltd シール
JP4190231B2 (ja) * 2002-08-23 2008-12-03 パナソニック株式会社 不正改造検出機能を持つ決済端末装置
EP1462907A1 (en) * 2003-03-25 2004-09-29 Bourns, Inc. A security enclosure for a circuit
US7247791B2 (en) * 2004-05-27 2007-07-24 Pitney Bowes Inc. Security barrier for electronic circuitry
US7549064B2 (en) * 2005-05-10 2009-06-16 Hewlett-Packard Development Company, L.P. Secure circuit assembly
US7468664B2 (en) * 2006-04-20 2008-12-23 Nve Corporation Enclosure tamper detection and protection
US7760086B2 (en) * 2006-11-03 2010-07-20 Gore Enterprise Holdings, Inc Tamper respondent sensor and enclosure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1200570A (zh) * 1997-02-24 1998-12-02 通用仪器公司 用于集成电路的反篡改屏蔽连接线
DE19738990A1 (de) * 1997-09-05 1999-03-11 Siemens Ag Einrichtung zum Schutz gegen Mißbrauch einer Chipkarte
US6496119B1 (en) * 1998-11-05 2002-12-17 Infineon Technologies Ag Protection circuit for an integrated circuit
CN1246730A (zh) * 1999-09-13 2000-03-08 后健慈 集成电路封装盒的保全结构
FR2801999A1 (fr) * 1999-12-01 2001-06-08 Gemplus Card Int Procede de protection physique de puces electroniques et dispositifs electroniques ainsi proteges

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108229631A (zh) * 2016-12-22 2018-06-29 Em微电子-马林有限公司 具备防篡改回路的双通信频率rfid电路
CN108229631B (zh) * 2016-12-22 2020-10-27 Em微电子-马林有限公司 具备防篡改回路的双通信频率rfid电路

Also Published As

Publication number Publication date
EP1751798A1 (en) 2007-02-14
EP1751798B1 (en) 2012-12-26
JP2007533129A (ja) 2007-11-15
CN1998080A (zh) 2007-07-11
WO2005098950A1 (en) 2005-10-20
GB2412996B (en) 2008-11-12
AU2005231051A2 (en) 2005-10-20
US20080284610A1 (en) 2008-11-20
JP4965430B2 (ja) 2012-07-04
CA2563240C (en) 2013-03-12
AU2005231051A1 (en) 2005-10-20
GB0407972D0 (en) 2004-05-12
GB2412996A (en) 2005-10-12
AU2005231051B2 (en) 2011-06-09
US7978070B2 (en) 2011-07-12
CA2563240A1 (en) 2005-10-20

Similar Documents

Publication Publication Date Title
CN1998080B (zh) 篡改响应覆盖件
US9576450B2 (en) Security wrap with breakable conductors
TWI574591B (zh) 安全保護裝置
TWI617943B (zh) 帶有可撕裂基板的安全保護裝置
JP2007533129A5 (enExample)
CN108027869B (zh) 具有成形柔性层的篡改响应传感器
US7679921B2 (en) Security cloth design and assembly
US9224280B2 (en) Security wrap
US9730314B2 (en) Stackable security wraps
JP2018531446A6 (ja) 形成されたフレキシブル層を備える不正開封反応センサ
US9481499B2 (en) Security wrap
EP1407477A2 (en) Improved connection assembly for integrated circuit sensors

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Open date: 20070711

CI01 Publication of corrected invention patent application

Correction item: Rejection of patent application

Correct: Dismiss

False: Reject

Number: 32

Volume: 26

ERR Gazette correction

Free format text: CORRECT: PATENT APPLICATION REJECTION OF AFTER PUBLICATION; FROM: REJECTION TO: REVOCATION REJECTED

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130508

Termination date: 20210406

CF01 Termination of patent right due to non-payment of annual fee