CN1971848A - Manufacturing method of flexible array base plate - Google Patents
Manufacturing method of flexible array base plate Download PDFInfo
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- CN1971848A CN1971848A CN 200610166950 CN200610166950A CN1971848A CN 1971848 A CN1971848 A CN 1971848A CN 200610166950 CN200610166950 CN 200610166950 CN 200610166950 A CN200610166950 A CN 200610166950A CN 1971848 A CN1971848 A CN 1971848A
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- base plate
- flexible
- pliability
- hard substrate
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Abstract
This invention discloses one process method of rolling array baseboard, which comprises the following steps: firstly adding one rolling baseboard onto one hard baseboard; then cutting the baseboard of the hard baseboard into several rolling blocks to form one baseboard module; then processing one film forming process on the rolling block.
Description
Technical field
The present invention relates to a kind of manufacture method of array base palte, particularly a kind of manufacture method of bendable array base palte.
Background technology
Whether flat-panel screens possesses pliability, depends on its employed baseplate material.When the employed substrate of flat-panel screens is hard substrate (as glass substrate), flat-panel screens will not have pliability.Otherwise when the employed substrate of flat-panel screens was flexible base plate (as plastic base), flat-panel screens promptly had good pliability.At present, the technology of making thin-film transistor on hard substrate is gradually ripe, but the technology of making thin-film transistor still remains to be developed on flexible base plate.In general,, need usually earlier flexible base plate to be attached on the hard substrate, just carry out a series of film-forming process afterwards if will on flexible base plate, make thin-film transistor.Because the thermal expansion coefficient difference (thermal expansion coefficient mis-match) of flexible base plate and hard substrate is very big; when carrying out different film-forming process (high-temperature technology), photoetching process and etch process on flexible base plate, regular meeting makes flexible base plate produce warpage because operating temperature raises.It should be noted that on the flexible base plate of serious warpage and carry out various film-forming process, will make the serious mis-alignment (mis-alignment) of generations between rete and the rete, and then cause technology to be failed.Therefore, the handicraft product qualification rate of flexible array base plate is difficult to improve always.
Summary of the invention
The manufacture method that the purpose of this invention is to provide a kind of flexible array base plate, it can improve the handicraft product qualification rate of flexible array base plate.
Another object of the present invention provides a kind of substrate module, and it can improve the mis-alignment problem between the rete and rete on the flexible base plate.
For achieving the above object, the present invention proposes a kind of manufacture method of flexible array base plate, it comprises the following steps.At first, a flexible base plate is attached to a hard substrate.Then, the flexible base plate that is attached on the hard substrate is cut into a plurality of pliability blocks.Afterwards, on the pliability block, carry out a film-forming process.
For achieving the above object, the invention allows for the manufacture method of another kind of flexible array base plate, it comprises the following steps.At first, a flexible base plate is cut into a plurality of pliability blocks.Then, the pliability block is attached on the hard substrate.Afterwards, on the pliability block, carry out a film-forming process.
For realizing above-mentioned purpose of the present invention, the invention allows for a kind of manufacture method of flexible array base plate, it comprises the following steps.At first, a flexible base plate is cut into a plurality of pliability blocks.Afterwards, on the pliability block, carry out a film-forming process.
In one embodiment of this invention, above-mentioned film-forming process comprises active device array technology, color filter technology, or the combination of active device array technology and color filter technology.Wherein, active device array technology for example is amorphous silicon membrane transistor array technology, poly-silicon thin film transistor array technology or OTFT (Organic Thin Film Transistor) array processes.
In one embodiment of this invention, after finishing film-forming process, the manufacture method of flexible array base plate can further make the pliability block separate with hard substrate.
In one embodiment of this invention, above-mentioned flexible base plate is a plastic base for example, and hard substrate for example is a glass substrate.
In one embodiment of this invention, the method that flexible base plate is cut into the pliability block comprises laser cutting (laser cutting) or machine cuts (mechanical cutting).
In one embodiment of this invention, the method that flexible base plate is attached to hard substrate for example is to form earlier colloid on hard substrate, engages flexible base plate and hard substrate by colloid again.In another embodiment of the present invention, the method that flexible base plate is attached to hard substrate also can be to form earlier colloid on flexible base plate, engages flexible base plate and hard substrate by colloid again.
In order to realize purpose of the present invention, the invention allows for a kind of substrate module, it comprises that a hard substrate and is attached to the flexible base plate on the hard substrate.Wherein, flexible base plate comprises a plurality of pliability blocks, and the area of each pliability block is less than the area of hard substrate.
In one embodiment of this invention, the pliability block for example is to arrange or be arranged on the hard substrate with non-array way with array way.
In the manufacture method of flexible array base plate of the present invention, because flexible base plate is cut into a plurality of undersized pliability blocks, and the warpage degree that each undersized pliability block is taken place in film-forming process is less, therefore the present invention can improve the mis-alignment problem that warpage causes, and then improves the handicraft product qualification rate of flexible array base plate.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A, Figure 1B, Fig. 1 C and Fig. 1 D show the manufacture method of flexible array base plate according to an embodiment of the invention.
Fig. 2 A, Fig. 2 B, Fig. 2 C and Fig. 2 D show the manufacture method of flexible array base plate according to another embodiment of the present invention.
Fig. 3 shows the schematic perspective view of substrate module according to an embodiment of the invention.
Wherein, description of reference numerals is as follows:
100,200: flexible array base plate 110,210,320: flexible base plate
110a, 210a, 320a: pliability block 120,220,3 10: hard substrate
130,230: colloid 140,240: film-forming process
300: substrate module
Embodiment
Because flexible base plate can produce significantly warpage because of being heated in various film-forming process, make that the handicraft product qualification rate of flexible array base plate is very low.Therefore, the present invention earlier cuts into a plurality of pliability blocks with flexible base plate, carries out film-forming process afterwards on each pliability block, with the problem of warpage significantly after improving flexible base plate and being heated.Hereinafter will enumerate several embodiment and describe, yet these embodiment only being in order to the explanation embodiments of the present invention, is not in order to limit the present invention.
Figure 1A, Figure 1B, Fig. 1 C and Fig. 1 D show the manufacture method of flexible array base plate according to an embodiment of the invention.At first, please refer to Figure 1A, flexible base plate 110 is attached on the hard substrate 120.Wherein, the method that flexible base plate 110 is attached to hard substrate 120 for example is to form colloid 130 earlier on hard substrate 120, engages flexible base plate 110 and hard substrate 120 by colloid 130 again.Certainly, the step that flexible base plate 110 is attached to hard substrate 120 also can be to form colloid 130 earlier on flexible base plate 110, engages flexible base plate 110 and hard substrate 120 by colloid 130 again.In the present embodiment, flexible base plate 110 can be that a plastic base is (as polyethylene terephthalate (polyethylene terephthalate, PET), polyether sulfone (polyethersulfone, PES), polyimides (polyimide, and hard substrate 120 for example is a glass substrate the made substrate of plastic material such as PI)).
Then please refer to Figure 1B, the flexible base plate 110 that is attached on the hard substrate 120 is cut into a plurality of pliability block 110a.Wherein, the method that flexible base plate 110 is cut into pliability block 110a for example is laser cutting or machine cuts.At this moment, flexible base plate 110 can be cut into plural pliability block 110a, and the area of each pliability block 110a is all less than the area of originally flexible base plate 110.In the present embodiment, the size of pliability block 110a for example is corresponding to the size of a display floater (panel) or corresponding to the size of a plurality of display floaters, and pliability block 110a is arranged in hard substrate 120 with array way or with non-array way.
Then please refer to Fig. 1 C, on pliability block 110a, carry out a film-forming process 140.In the present embodiment, film-forming process 140 comprises the combination of active device array technology, color filter technology or active device array technology and color filter technology.Wherein, active device array technology for example is amorphous silicon membrane transistor array technology, poly-silicon thin film transistor array technology or organic thin film transistor array technology.By Fig. 1 C as can be known, because flexible base plate 110 has been cut into plural pliability block 110a, the size of pliability block 110a will certainly be less than the size of flexible base plate 110, so the amount of warpage that produced in the back that is heated of the pliability block 110a amount of warpage that can produced in the back that be heated less than flexible base plate 110.Under the situation that amount of warpage is suppressed effectively, the mis-alignment problem between last each rete of pliability block 110a just obtains improvement to a certain degree.In other words, the manufacture method of flexible array base plate of the present invention can improve the making product percent of pass of flexible array base plate.
Please refer to Fig. 1 D, after finishing above-mentioned film-forming process 140, the manufacture method of flexible array base plate of the present invention can further make pliability block 110a separate with hard substrate 120, to obtain flexible array base plate 100.The method that pliability block 110a is separated with hard substrate 120 for example can adopt the mode of heating, reduces so that be engaged in the stickiness of the colloid 130 between pliability block 110a and the hard substrate 120.Certainly, the method that pliability block 110a is separated with hard substrate 120 also can adopt alternate manner, and the present invention does not do special qualification to this.
Fig. 2 A, Fig. 2 B, Fig. 2 C and Fig. 2 D show the manufacture method of flexible array base plate according to another embodiment of the present invention.Please refer to Fig. 2 A, at first, a flexible base plate 210 is cut into a plurality of pliability block 210a.In the present embodiment, the method that flexible base plate 210 is cut into pliability block 210a comprises laser cutting or machine cuts, and flexible base plate 210 for example is plastic base (as made substrates of plastic material such as polyethylene terephthalate, polyether sulfone, polyimides).
Then, please refer to Fig. 2 B, provide a hard substrate 220, and this hard substrate 220 for example is a glass substrate.Afterwards, one or more pliability block 210a is attached on the hard substrate 220.By Fig. 2 B as can be known, the area that is attached to the pliability block 210a on the hard substrate 220 can be less than the area of hard substrate 220, and more than one pliability block 210a is arranged in hard substrate 220 with array way, and pliability block 210a also can non-array way be arranged on the hard substrate 220 in addition.In the present embodiment, the method that pliability block 210a is attached to hard substrate 220 for example is to form colloid 230 earlier on hard substrate 220, engages pliability block 210a and hard substrate 220 (shown in Fig. 2 B) by colloid 230 again.In addition, the method that pliability block 210a is attached to hard substrate 220 also can be to form colloid 230 earlier on pliability block 210a, engages pliability block 210a and hard substrate 220 by colloid 230 again.
Please refer to Fig. 2 C, with after hard substrate 220 engages, then on pliability block 210a, carry out a film-forming process 240 at pliability block 210a.Similar with last embodiment, this film-forming process 240 comprises active device array technology, color filter technology, or the combination of aforementioned technology.Wherein, active device array technology for example is amorphous silicon membrane transistor array technology, poly-silicon thin film transistor array technology or organic thin film transistor array technology.By Fig. 2 C as can be known, because the size of pliability block 210a is less than the size of flexible base plate 210, so the amount of warpage that produced in the back that is heated of the pliability block 210a amount of warpage that can produced in the back that be heated less than flexible base plate 210.Under the situation that amount of warpage is suppressed effectively, the mis-alignment problem between last each rete of pliability block 210a just obtains improvement to a certain degree.In other words, the manufacture method of flexible array base plate of the present invention can improve the making product percent of pass of flexible array base plate.
Then, please refer to Fig. 2 D, after finishing film-forming process 240, the manufacture method of flexible array base plate of the present invention can further make pliability block 210a separate with hard substrate 220, to obtain flexible array base plate 200.The method that pliability block 210a is separated with hard substrate 220 for example can adopt the mode of heating, reduces so that be engaged in the stickiness of the colloid 230 between pliability block 210a and the hard substrate 220.Certainly, the method that pliability block 210a is separated with hard substrate 220 also can adopt alternate manner, and the present invention does not do special qualification to this.
According to the manufacture method of above-mentioned various flexible array base plates, the invention allows for a kind of substrate module, its stereogram is as shown in Figure 3.Substrate module 300 comprises a hard substrate 3 10 and a flexible base plate 320, and flexible base plate 320 is attached on the hard substrate 310.Wherein, flexible base plate 320 for example is a plastic base (as made substrates of plastic material such as polyethylene terephthalate, polyether sulfone, polyimides), and hard substrate 310 comprises a glass substrate.In addition, flexible base plate 320 comprises one or more pliability block 320a, and the area of each pliability block 320a is less than the area of hard substrate 310.In the present embodiment, pliability block 320a for example is with arranged in array mode, and in other embodiments, pliability block 320a can also be with non-arranged in array mode on hard substrate 310.
In sum, in the manufacture method of flexible array base plate of the present invention, the back amount of warpage is less because the pliability block is heated, and when film-forming process, is difficult for producing the alignment error between each rete.That is to say that the manufacture method of flexible base plate of the present invention can improve the handicraft product qualification rate.In addition, substrate module proposed by the invention is applied on the various film-forming process, can make the contraposition between each rete comparatively accurate.Generally, the manufacture method of flexible array base plate of the present invention and substrate module can improve the handicraft product qualification rate of flexible array base plate and the quality of manufactured goods.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any those of ordinary skill in the art should do some and change and retouching, so protection scope of the present invention is when being as the criterion with appending claims without departing from the spirit and scope of the present invention.
Claims (13)
1. the manufacture method of a flexible array base plate may further comprise the steps:
One flexible base plate is cut into a plurality of pliability blocks; And
On described pliability block, carry out a film-forming process.
2. the manufacture method of flexible array base plate as claimed in claim 1, wherein described a flexible base plate is cut into the step of a plurality of pliability blocks before, also comprise the step that this flexible base plate is attached to a hard substrate, and after finishing this film-forming process, also comprise making described pliability block and this hard substrate separation steps.
3. the manufacture method of flexible array base plate as claimed in claim 2, wherein this hard substrate comprises a glass substrate.
4. the manufacture method of flexible array base plate as claimed in claim 2, the wherein said step that this flexible base plate is attached to a hard substrate comprises:
On this hard substrate, form colloid; And
Engage this flexible base plate and this hard substrate by this colloid.
5. the manufacture method of flexible array base plate as claimed in claim 2, the wherein said step that this flexible base plate is attached to a hard substrate comprises:
On this flexible base plate, form colloid; And
Engage this flexible base plate and this hard substrate by this colloid.
6. the manufacture method of flexible array base plate as claimed in claim 1, the wherein combination of this film-forming process active device array technology, color filter technology or described active device array technology and described color filter technology.
7. the manufacture method of flexible array base plate as claimed in claim 6, wherein this active device array technology amorphous silicon film transistor array processes, poly-silicon thin film transistor array technology or organic thin film transistor array technology.
8. the manufacture method of flexible array base plate as claimed in claim 1, wherein this flexible base plate comprises a plastic base.
9. the manufacture method of flexible array base plate as claimed in claim 1, the method that wherein this flexible base plate is cut into described pliability block comprises laser cutting or machine cuts.
10. the manufacture method of flexible array base plate as claimed in claim 1, wherein described a flexible base plate is cut into the step of a plurality of pliability blocks after, also comprise at least one pliability block is attached to step on the hard substrate.
11. the manufacture method of flexible array base plate as claimed in claim 10, the wherein said step that at least one pliability block is attached on the hard substrate comprises:
On this hard substrate, form colloid; And
Engage described at least one pliability block and this hard substrate by this colloid.
12. the manufacture method of flexible array base plate as claimed in claim 10, the wherein said step that at least one pliability block is attached on the hard substrate comprises:
On described at least one pliability block, form colloid; And
Engage described at least one pliability block and this hard substrate by this colloid.
13. the manufacture method of flexible array base plate as claimed in claim 10 wherein after finishing this film-forming process, also comprises making this at least one pliability block and this hard substrate separation steps.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610166950 CN1971848A (en) | 2006-12-13 | 2006-12-13 | Manufacturing method of flexible array base plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610166950 CN1971848A (en) | 2006-12-13 | 2006-12-13 | Manufacturing method of flexible array base plate |
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| CN1971848A true CN1971848A (en) | 2007-05-30 |
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| CN 200610166950 Pending CN1971848A (en) | 2006-12-13 | 2006-12-13 | Manufacturing method of flexible array base plate |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101916022A (en) * | 2010-07-06 | 2010-12-15 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN102280371A (en) * | 2011-04-06 | 2011-12-14 | 友达光电股份有限公司 | Flexible electronic component and method for manufacturing the same |
| CN102455453A (en) * | 2010-10-21 | 2012-05-16 | 元太科技工业股份有限公司 | Method for manufacturing flexible color filter substrate |
| CN104332394A (en) * | 2014-10-20 | 2015-02-04 | 深圳市华星光电技术有限公司 | Method of manufacturing flexible substrate |
| CN104867872A (en) * | 2015-04-24 | 2015-08-26 | 京东方科技集团股份有限公司 | Manufacturing method of flexible display substrate, and manufacturing method of flexible display panel |
| CN108447800A (en) * | 2018-01-31 | 2018-08-24 | 北京铂阳顶荣光伏科技有限公司 | The manufacturing method of hull cell |
| CN109713168A (en) * | 2019-01-02 | 2019-05-03 | 南京中电熊猫平板显示科技有限公司 | A kind of flexible display device, display device and preparation method thereof |
-
2006
- 2006-12-13 CN CN 200610166950 patent/CN1971848A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101916022A (en) * | 2010-07-06 | 2010-12-15 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN101916022B (en) * | 2010-07-06 | 2012-10-10 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN102455453A (en) * | 2010-10-21 | 2012-05-16 | 元太科技工业股份有限公司 | Method for manufacturing flexible color filter substrate |
| CN102280371A (en) * | 2011-04-06 | 2011-12-14 | 友达光电股份有限公司 | Flexible electronic component and method for manufacturing the same |
| CN102280371B (en) * | 2011-04-06 | 2014-03-26 | 友达光电股份有限公司 | Flexible electronic component and method for manufacturing the same |
| CN104332394A (en) * | 2014-10-20 | 2015-02-04 | 深圳市华星光电技术有限公司 | Method of manufacturing flexible substrate |
| CN104332394B (en) * | 2014-10-20 | 2017-04-19 | 深圳市华星光电技术有限公司 | Method of manufacturing flexible substrate |
| CN104867872A (en) * | 2015-04-24 | 2015-08-26 | 京东方科技集团股份有限公司 | Manufacturing method of flexible display substrate, and manufacturing method of flexible display panel |
| CN104867872B (en) * | 2015-04-24 | 2018-05-18 | 京东方科技集团股份有限公司 | The production method of flexible display substrates and the production method of flexible display panels |
| CN108447800A (en) * | 2018-01-31 | 2018-08-24 | 北京铂阳顶荣光伏科技有限公司 | The manufacturing method of hull cell |
| CN109713168A (en) * | 2019-01-02 | 2019-05-03 | 南京中电熊猫平板显示科技有限公司 | A kind of flexible display device, display device and preparation method thereof |
| CN109713168B (en) * | 2019-01-02 | 2022-04-01 | 南京京东方显示技术有限公司 | Flexible display device, display device and manufacturing method thereof |
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