CN100463107C - Method for producing flexible array substrate board - Google Patents
Method for producing flexible array substrate board Download PDFInfo
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- CN100463107C CN100463107C CNB2007100915087A CN200710091508A CN100463107C CN 100463107 C CN100463107 C CN 100463107C CN B2007100915087 A CNB2007100915087 A CN B2007100915087A CN 200710091508 A CN200710091508 A CN 200710091508A CN 100463107 C CN100463107 C CN 100463107C
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- base plate
- resilient coating
- flexible
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- flexible base
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Abstract
This invention relates to a manufacturing method for flexible array base boards, which first of all provides a hard base board , forms a buffer layer on the board and adheres a flexible base board on the buffer layer to form a base board module and then films on the flexible base board, in which, warp generated by heat expansion and contraction in the process of filming of the flexible base board is reduced because of the stress and physical property generated when forming the buffer layer on the hard base board and it's not easy to generate warp or distortion so as to increase the production rate of flexible array base boards.
Description
Technical field
The invention relates to the manufacture method of a kind of substrate module and array base palte, and particularly relevant for the manufacture method of a kind of substrate module and flexible array base plate.
Background technology
Whether flat-panel screens possesses pliability, depends on its employed baseplate material.When the employed substrate of flat-panel screens is hard substrate (as glass substrate), flat-panel screens will not have pliability.Otherwise, when the employed substrate of flat-panel screens is flexible base plate (as plastic substrate), just flat-panel screens has good pliability.
At present, the technology of making thin-film transistor on hard substrate is gradually ripe, but the technology of making thin-film transistor still remains to be developed on flexible base plate.In general,, need usually earlier flexible base plate to be adhered on the hard substrate, carry out a series of film forming manufacturing process afterwards again if will on flexible base plate, make thin-film transistor.Because the thermal expansion coefficient difference (thermalexpansion coefficient mis-match) of flexible base plate and hard substrate is very big; when carrying out different film forming manufacturing process (high temperature manufacturing process), lithographic fabrication processes and etching manufacturing process on flexible base plate, regular meeting makes flexible base plate produce warpage because operating temperature raises.It should be noted that on the flexible base plate of serious warpage and carry out the film forming manufacturing process, will make the serious mis-alignment (mis-alignment) of generations between rete and the rete, and then cause manufacturing process to be failed.Therefore, the manufacturing process yields of flexible array base plate is difficult to promote always.
Summary of the invention
The present invention provides a kind of manufacture method of flexible array base plate, to improve the problem of flexible base plate generation warpage.
The present invention provides a kind of substrate module, to promote the manufacturing process yields of flexible array base plate.
The present invention proposes a kind of manufacture method of flexible array base plate, and it may further comprise the steps.At first, provide a hard substrate.Then, form resilient coating on hard substrate, make resilient coating and hard substrate produce first bending direction.Then, flexible base plate is adhered on the resilient coating.Thereupon, on flexible base plate, carry out the film forming manufacturing process.Wherein, when carrying out the film forming manufacturing process, flexible base plate produces second bending direction, and first bending direction is opposite with second bending direction.
The present invention proposes a kind of manufacture method of flexible array base plate in addition.At first, provide hard substrate.Then, form resilient coating on hard substrate, wherein the material of resilient coating comprises metal or metallic compound.Then, flexible base plate is adhered on the resilient coating.Thereupon, on flexible base plate, carry out the film forming manufacturing process.
The present invention also proposes a kind of manufacture method of flexible array base plate.At first, provide hard substrate.Then, on hard substrate, form resilient coating.Subsequently, by adhesion coating flexible base plate is engaged with resilient coating.Then, on flexible base plate, carry out the film forming manufacturing process.
In one embodiment of this invention, the thermal coefficient of expansion of above-mentioned resilient coating is less than the thermal coefficient of expansion of hard substrate or equal the thermal coefficient of expansion of hard substrate.In addition, the thermal coefficient of expansion of resilient coating also can be between the thermal coefficient of expansion of the thermal coefficient of expansion of hard substrate and flexible base plate.
In one embodiment of this invention, the above-mentioned step that flexible base plate is adhered to resilient coating comprises prior to forming adhesion coating on the resilient coating, then engages flexible base plate and resilient coating by adhesion coating again.Or, prior to forming adhesion coating on the flexible base plate, engage flexible base plate and resilient coating by adhesion coating again.
In one embodiment of this invention, after finishing the film forming manufacturing process, also comprise making flexible base plate separate with resilient coating.
In one embodiment of this invention, above-mentioned flexible base plate comprises plastic substrate, and hard substrate comprises glass substrate.
In one embodiment of this invention, above-mentioned film forming manufacturing process comprises active cell array manufacturing process, colored filter manufacturing process, or the combination of aforementioned manufacturing process.Wherein, the active cell array manufacturing process for example is amorphous silicon membrane transistor array manufacturing process or poly-silicon thin film transistor array manufacturing process.
In one embodiment of this invention, the material of above-mentioned resilient coating comprises metal or metallic compound.In detail, the material of resilient coating for example is metal or its compounds such as aluminium, copper, molybdenum, titanium, chromium, tantalum or tungsten.
The present invention proposes a kind of substrate module again.This substrate module comprises hard substrate, resilient coating, adhesion coating and flexible base plate.Resilient coating is disposed on the hard substrate, and adhesion coating is disposed on the resilient coating, and flexible base plate engages with resilient coating by adhesion coating in addition.
The present invention also proposes a kind of substrate module.This substrate module comprises hard substrate, resilient coating and flexible base plate.Resilient coating is disposed on the hard substrate, and the material of resilient coating comprises metal or metallic compound.In addition, flexible base plate is adhered on the resilient coating.
In one embodiment of this invention, the thermal coefficient of expansion of above-mentioned resilient coating is less than the thermal coefficient of expansion of hard substrate or equal the thermal coefficient of expansion of hard substrate.In addition, the thermal coefficient of expansion of resilient coating also can be between the thermal coefficient of expansion of the thermal coefficient of expansion of hard substrate and flexible base plate.
In one embodiment of this invention, above-mentioned substrate module also comprises an adhesion coating, so that flexible base plate engages with resilient coating by adhesion coating.
In one embodiment of this invention, above-mentioned substrate module more comprises an array structure, and this array structure is formed on the flexible base plate.In addition, above-mentioned array structure comprises an active cell array, a colorful optical filter array or combinations thereof.Wherein, active cell array comprises an amorphous silicon film transistor array or a poly-silicon thin film transistor array.
In one embodiment of this invention, above-mentioned flexible base plate comprises a plastic substrate, and hard substrate comprises a glass substrate.
In one embodiment of this invention, the material of above-mentioned resilient coating comprises metal or metallic compound.In fact, the material of resilient coating for example is metal or its compounds such as aluminium, copper, molybdenum, titanium, chromium, tantalum or tungsten.
Because the present invention adheres to flexible base plate on one resilient coating, so flexible base plate expands because of temperature change and shrinks the internal stress that the stress that is produced can be cushioned layer and offset.So, flexible base plate is carrying out in the middle of the film forming manufacturing process, is difficult for causing because of the warpage of flexible base plate or deformation the manufacturing process failure.
Description of drawings
Figure 1A is the manufacturing process profile of the flexible array base plate of one embodiment of the invention to Fig. 1 D.
Fig. 1 E is the stereogram of the substrate module of one embodiment of the invention.
Drawing reference numeral
100: substrate module
110: hard substrate
120: resilient coating
130: flexible base plate
132: panel
140: adhesion coating
150: the film forming manufacturing process
160: array structure
B1: first bending direction
B2: second bending direction
Embodiment
For purpose of the present invention, feature and advantage can be become apparent, embodiment cited below particularly, and conjunction with figs. are described in detail below.
Figure 1A is the manufacturing process profile of the flexible array base plate of one embodiment of the invention to Fig. 1 D, and Fig. 1 E is the stereogram of the substrate module of one embodiment of the invention.
Please refer to Figure 1A, at first, provide a hard substrate 110, this hard substrate 110 for example is glass substrate, quartz base plate or silicon substrate etc.Then, on hard substrate 110, form resilient coating 120.Specifically, resilient coating 120 for example is made up of metals such as aluminium, copper, molybdenum, titanium, chromium, tantalum or tungsten or its compound.In the present embodiment, the generation type of resilient coating 120 for example is with metal or metallic compound is formed on the hard substrate 110 by modes such as physical vapor deposition (as sputter) or chemical vapor depositions.In the process that forms resilient coating 120, present embodiment can be by adjusting physical vapor deposition or chemical vapor deposited fabrication process condition, for example manufacturing process temperature, reaction gas flow, manufacturing process pressure etc. are so that the metal or the metallic compound that are formed on the hard substrate 110 have different stress states.The bending that manufacturing process adjustment during in the present embodiment, by formation resilient coating 120 can make resilient coating 120 and hard substrate 110 produce to the first bending direction B1.
Then please refer to Figure 1B, engage flexible base plate 130 and resilient coating 120, for example is that flexible base plate 130 is adhered on the resilient coating 120.Particularly, present embodiment can engage flexible base plate 130 and resilient coating 120 by adhesion coating 140 again prior to forming adhesion coating 140 on the resilient coating 120.Yet, in other embodiments, also can earlier adhesion coating 140 be formed on the flexible base plate 130, engage flexible base plate 130 and resilient coating 120 by adhesion coating 140 again.Wherein, flexible base plate 130 for example is the plastic substrate that possesses good pliability (flexibility).
Then please refer to Fig. 1 C, on flexible base plate 130, carry out film forming manufacturing process 150, on flexible base plate 130, to form array structure 160.Generally speaking, film forming manufacturing process 150 for example is active cell array manufacturing process, colored filter manufacturing process, or the combination of aforementioned manufacturing process.When the film forming manufacturing process 150 of being carried out was the active cell array manufacturing process, formed array structure 160 was an active cell array on the flexible base plate 130; When the film forming manufacturing process 150 of being carried out was the colored filter manufacturing process, formed array structure 160 was colorful optical filter array on the flexible base plate 130.On the other hand, when the film forming manufacturing process 150 of being carried out comprised active cell array manufacturing process and colored filter manufacturing process simultaneously, 160 of formed array structures were COA (color filter on Array) array structure or AOC (array on color filter) array structure on the flexible base plate 130.Hold above-mentionedly, the active cell array manufacturing process for example is amorphous silicon membrane transistor array manufacturing process or poly-silicon thin film transistor array manufacturing process.
Generally speaking, film forming manufacturing process 150 is when carrying out, and regular meeting follows variation of temperature, and flexible base plate 130 has the bigger coefficient of expansion, and there is significant change in volume in regular meeting in the middle of the process of cooling that heats up.During row film forming manufacturing process 150, Chang Yinwei is adhered to the expansion of the flexible base plate 130 on the hard substrate 110 or contraction and makes flexible base plate 130 produce warpage or the distortion of the second bending direction B2, and then causes exposure or burnt poly-problem such as bad.Therefore, the present invention proposes to be configured to reduce flexible base plate 130 produces warpage in film forming manufacturing process 150 degree by resilient coating 120.Specifically, when the thermal coefficient of expansion of resilient coating 120 between flexible base plate 130 and hard substrate 110, then the thermal expansion of resilient coating 120 can slow down the warping phenomenon that flexible base plate 130 produces with shrinking in film forming manufacturing process 150.Yet, if the thermal coefficient of expansion of resilient coating 120 is less than or equal to the thermal coefficient of expansion of hard substrate 110, flexible base plate 130 produces the thermal expansion contraction in film forming manufacturing process 150 stress performance is offset in the stress performance that produces in the time of then can passing through to form resilient coating 120.In the present embodiment, when forming resilient coating 120, can make the second bending direction B2 of first crooked bending direction B1 of resilient coating 120 and hard substrate 110 generations and flexible base plate 130 generation warpages roughly opposite by the control of fabrication process condition.Thus, flexible base plate 130 can significantly reduce because of temperature change generation change in volume causes the amount towards the second bending direction B2 warpage, also therefore makes the manufacturing process yields of flexible array base plate be raised effectively.
Next, please refer to Fig. 1 D, after finishing film forming manufacturing process 150, present embodiment can adopt processing modes such as heating, cooling or illumination that flexible base plate 130 is separated with hard substrate 110.Particularly, present embodiment takes off flexible base plate 130 after can utilizing processing modes such as heating, cooling or illumination that adhesion coating 140 viscosity are reduced earlier again on hard substrate 110.In fact, please refer to the stereogram of the substrate module 100 that Fig. 1 E illustrated, flexible base plate 130 for example can be cut into the panel 132 of a plurality of reduced sizes again.In detail, before flexible base plate 130 taken off, for example can earlier flexible base plate 130 be cut into a plurality of panels 132 on hard substrate 110, flexible base plate 130 is separated with hard substrate 110.Or, in flexible base plate 130 and hard substrate 110 after separatings, again flexible base plate 130 is cut into a plurality of panels 132.Wherein, the method for cutting flexible base plate 130 for example is to adopt the laser cutting or the mode of machine cuts.
In sum, in the manufacture method of substrate module of the present invention and flexible array base plate, can buffer layer deposition formed stress state on the hard plate plate be adjusted to some extent according to different demands by different fabrication process condition.When resilient coating was less than or equal to the thermal coefficient of expansion of hard substrate because of thermal coefficient of expansion, the adjustment by fabrication process condition can make resilient coating shrink the stress performance that is produced in the stress performance that produces on the hard substrate and flexible base plate thermal expansion among the film forming manufacturing process and cancel out each other.On the other hand, when the thermal coefficient of expansion of resilient coating between bendable substrate and hard substrate, then the deflection that caused in through the film forming manufacturing process of flexible base plate is now as effectively reducing.Therefore, warpage or deflection that flexible base plate rises or descends and produce along with temperature can significantly reduce, and make the contraposition precision of film forming manufacturing process improve, and the manufacturing process yields of flexible array base plate also can improve thereupon.
Though the present invention discloses as above with embodiment; yet it is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; can do a little change and retouching, so protection scope of the present invention is worked as with being as the criterion that claim was defined.
Claims (10)
1. the manufacture method of a flexible array base plate is characterized in that, this method comprises:
One hard substrate is provided;
On described hard substrate, form a resilient coating, make described resilient coating and described hard substrate produce one first bending direction;
Engage a flexible base plate and described resilient coating; And
Carry out a film forming manufacturing process on described flexible base plate, when wherein carrying out described film forming manufacturing process, described flexible base plate produces one second bending direction, and described first bending direction and described second bending direction are opposite.
2. the manufacture method of flexible array base plate as claimed in claim 1 is characterized in that, the thermal coefficient of expansion of described resilient coating is less than or equal to the thermal coefficient of expansion of described hard substrate.
3. the manufacture method of flexible array base plate as claimed in claim 1 is characterized in that, the thermal coefficient of expansion of described resilient coating is between the thermal coefficient of expansion of the thermal coefficient of expansion of described hard substrate and described flexible base plate.
4. the manufacture method of flexible array base plate as claimed in claim 1 is characterized in that, the step that engages described flexible base plate and described resilient coating comprises:
Form an adhesion coating on described resilient coating; And
Engage described flexible base plate and described resilient coating by described adhesion coating.
5. the manufacture method of flexible array base plate as claimed in claim 1 is characterized in that, the step that engages described flexible base plate and described resilient coating comprises:
Form an adhesion coating on described flexible base plate; And
Engage described flexible base plate and described resilient coating by described adhesion coating.
6. the manufacture method of flexible array base plate as claimed in claim 1 is characterized in that, after finishing described film forming manufacturing process, also comprises making described flexible base plate separate with described resilient coating.
7. the manufacture method of flexible array base plate as claimed in claim 1 is characterized in that, described flexible base plate comprises a plastic substrate or a glass substrate.
8. the manufacture method of flexible array base plate as claimed in claim 1 is characterized in that, described film forming manufacturing process comprises the combination of active cell array manufacturing process, colored filter manufacturing process or aforementioned manufacturing process.
9. the manufacture method of flexible array base plate as claimed in claim 1 is characterized in that, the material of described resilient coating comprises metal or metallic compound.
10. the manufacture method of flexible array base plate as claimed in claim 1 is characterized in that, the material of described resilient coating comprises aluminium, copper, molybdenum, titanium, chromium, tantalum or tungsten.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100915087A CN100463107C (en) | 2007-03-26 | 2007-03-26 | Method for producing flexible array substrate board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100915087A CN100463107C (en) | 2007-03-26 | 2007-03-26 | Method for producing flexible array substrate board |
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| CN101026090A CN101026090A (en) | 2007-08-29 |
| CN100463107C true CN100463107C (en) | 2009-02-18 |
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| CNB2007100915087A Active CN100463107C (en) | 2007-03-26 | 2007-03-26 | Method for producing flexible array substrate board |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101617280B1 (en) * | 2009-10-21 | 2016-05-03 | 엘지디스플레이 주식회사 | Methode of fabricating display device using flexible plastic substrate |
| TWI432835B (en) | 2010-06-24 | 2014-04-01 | Au Optronics Corp | Flexible display panel and method of fabricating the same |
| CN101916022B (en) * | 2010-07-06 | 2012-10-10 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN104425514A (en) * | 2013-08-30 | 2015-03-18 | 群创光电股份有限公司 | Element substrate, display device and manufacturing method for element substrate |
| TW201609403A (en) * | 2014-09-01 | 2016-03-16 | 中華映管股份有限公司 | Manufacturing method of display panel |
| CN106847862A (en) * | 2016-12-28 | 2017-06-13 | 深圳市华星光电技术有限公司 | A kind of flexible display substrate and preparation method thereof, flexible display preparation method |
| CN114141810A (en) * | 2021-11-30 | 2022-03-04 | 深圳市华星光电半导体显示技术有限公司 | Preparation method of display substrate and display panel |
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|---|---|---|---|---|
| JPH0697615A (en) * | 1992-09-14 | 1994-04-08 | Asahi Chem Ind Co Ltd | Flexible printed wiring board |
| JP2004088059A (en) * | 2002-02-05 | 2004-03-18 | Toray Ind Inc | Member for circuit board and manufacturing method for electronic component mounting circuit board using it |
| JP2004319659A (en) * | 2003-04-15 | 2004-11-11 | Somar Corp | Method of manufacturing flexible circuit board, and laminate |
| JP2005178248A (en) * | 2003-12-22 | 2005-07-07 | Nippon Steel Chem Co Ltd | Laminate and its production method |
| US20070040258A1 (en) * | 2005-08-18 | 2007-02-22 | Intelleflex Corporation | Method of packaging and interconnection of integrated circuits |
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2007
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697615A (en) * | 1992-09-14 | 1994-04-08 | Asahi Chem Ind Co Ltd | Flexible printed wiring board |
| JP2004088059A (en) * | 2002-02-05 | 2004-03-18 | Toray Ind Inc | Member for circuit board and manufacturing method for electronic component mounting circuit board using it |
| JP2004319659A (en) * | 2003-04-15 | 2004-11-11 | Somar Corp | Method of manufacturing flexible circuit board, and laminate |
| JP2005178248A (en) * | 2003-12-22 | 2005-07-07 | Nippon Steel Chem Co Ltd | Laminate and its production method |
| US20070040258A1 (en) * | 2005-08-18 | 2007-02-22 | Intelleflex Corporation | Method of packaging and interconnection of integrated circuits |
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| CN101026090A (en) | 2007-08-29 |
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