CN1964003A - 一种自对准难溶金属硅化合物阻挡层的刻蚀方法 - Google Patents
一种自对准难溶金属硅化合物阻挡层的刻蚀方法 Download PDFInfo
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- CN1964003A CN1964003A CN 200510110122 CN200510110122A CN1964003A CN 1964003 A CN1964003 A CN 1964003A CN 200510110122 CN200510110122 CN 200510110122 CN 200510110122 A CN200510110122 A CN 200510110122A CN 1964003 A CN1964003 A CN 1964003A
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- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
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CNB2005101101227A CN100452324C (zh) | 2005-11-08 | 2005-11-08 | 一种自对准难熔金属硅化合物阻挡层的刻蚀方法 |
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CNB2005101101227A CN100452324C (zh) | 2005-11-08 | 2005-11-08 | 一种自对准难熔金属硅化合物阻挡层的刻蚀方法 |
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CN1964003A true CN1964003A (zh) | 2007-05-16 |
CN100452324C CN100452324C (zh) | 2009-01-14 |
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CNB2005101101227A Active CN100452324C (zh) | 2005-11-08 | 2005-11-08 | 一种自对准难熔金属硅化合物阻挡层的刻蚀方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102403190A (zh) * | 2010-09-08 | 2012-04-04 | 无锡华润上华半导体有限公司 | 圆片清洗方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US6530380B1 (en) * | 1999-11-19 | 2003-03-11 | Chartered Semiconductor Manufacturing Ltd. | Method for selective oxide etching in pre-metal deposition |
CN1144272C (zh) * | 2000-09-04 | 2004-03-31 | 中国科学院半导体研究所 | 采用teos源pecvd生长氧化硅厚膜的方法 |
CN100338758C (zh) * | 2002-02-01 | 2007-09-19 | 旺宏电子股份有限公司 | 选择性局部自对准硅化物的制作方法 |
CN1270362C (zh) * | 2002-09-18 | 2006-08-16 | 上海宏力半导体制造有限公司 | 形成自行对准金属硅化物的方法 |
CN1306595C (zh) * | 2003-08-28 | 2007-03-21 | 力晶半导体股份有限公司 | 自动对准金属硅化物制造方法 |
CN1591860A (zh) * | 2003-09-01 | 2005-03-09 | 上海宏力半导体制造有限公司 | 深次微米制程的静电放电保护装置的制造方法 |
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2005
- 2005-11-08 CN CNB2005101101227A patent/CN100452324C/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102403190A (zh) * | 2010-09-08 | 2012-04-04 | 无锡华润上华半导体有限公司 | 圆片清洗方法 |
CN102403190B (zh) * | 2010-09-08 | 2014-04-23 | 无锡华润上华半导体有限公司 | 圆片清洗方法 |
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Publication number | Publication date |
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CN100452324C (zh) | 2009-01-14 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140108 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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TR01 | Transfer of patent right |
Effective date of registration: 20140108 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |