CN1920587B - 多层配线基板及bvh断线检查方法 - Google Patents

多层配线基板及bvh断线检查方法 Download PDF

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Publication number
CN1920587B
CN1920587B CN200610094310XA CN200610094310A CN1920587B CN 1920587 B CN1920587 B CN 1920587B CN 200610094310X A CN200610094310X A CN 200610094310XA CN 200610094310 A CN200610094310 A CN 200610094310A CN 1920587 B CN1920587 B CN 1920587B
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CN
China
Prior art keywords
mentioned
layer
wiring board
layered wiring
bvh
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN200610094310XA
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English (en)
Chinese (zh)
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CN1920587A (zh
Inventor
大谷克宽
小熊悟
东海林康男
武田格
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Mitsumi Electric Co Ltd
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Mitsumi Electric Co Ltd
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Publication date
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Publication of CN1920587A publication Critical patent/CN1920587A/zh
Application granted granted Critical
Publication of CN1920587B publication Critical patent/CN1920587B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
CN200610094310XA 2005-08-22 2006-06-29 多层配线基板及bvh断线检查方法 Expired - Fee Related CN1920587B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005239792 2005-08-22
JP2005-239792 2005-08-22
JP2005239792A JP4844714B2 (ja) 2005-08-22 2005-08-22 多層配線基板

Publications (2)

Publication Number Publication Date
CN1920587A CN1920587A (zh) 2007-02-28
CN1920587B true CN1920587B (zh) 2011-07-13

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ID=37778349

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200610094310XA Expired - Fee Related CN1920587B (zh) 2005-08-22 2006-06-29 多层配线基板及bvh断线检查方法

Country Status (2)

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JP (1) JP4844714B2 (ja)
CN (1) CN1920587B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5400823B2 (ja) * 2011-03-28 2014-01-29 住友電気工業株式会社 プリント配線板およびプリント配線板の製造方法
CN103269564B (zh) * 2013-03-28 2015-11-18 淳华科技(昆山)有限公司 多层板局部单层区域内层切割工艺

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125711A (ja) * 1984-11-26 1986-06-13 Matsushita Electric Works Ltd 多層印刷配線板の孔穿設位置検出法
JPS62181811A (ja) * 1986-02-07 1987-08-10 Japan Steel Works Ltd:The 多層プリント基板の基準穴加工方法
JPS62230095A (ja) * 1986-03-31 1987-10-08 松下電器産業株式会社 多層配線板の層間ずれ確認法
JPS63155668A (ja) * 1986-12-18 1988-06-28 Sanyo Electric Co Ltd 半導体装置の製造方法
JPH0391993A (ja) * 1989-09-04 1991-04-17 Fujitsu Ltd 多層プリント配線板の内層ずれ測定方法
JPH04186798A (ja) * 1990-11-20 1992-07-03 Fujitsu Ltd 多層プリント配線板および層間ずれチェック方法
JP2001251062A (ja) * 2000-03-03 2001-09-14 Sony Corp 多層型プリント配線基板及び多層型プリント配線基板の検査方法
JP2002100845A (ja) * 2000-09-25 2002-04-05 Hitachi Kokusai Electric Inc ブラインドビアホール位置ずれ検査用回路パターン
JP2003283145A (ja) * 2002-03-26 2003-10-03 Sumitomo Bakelite Co Ltd 多層配線板の位置ずれ検査方法
JP4119702B2 (ja) * 2002-07-30 2008-07-16 エルナー株式会社 多層プリント配線板の検査方法

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Publication number Publication date
JP2007059454A (ja) 2007-03-08
JP4844714B2 (ja) 2011-12-28
CN1920587A (zh) 2007-02-28

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110713

Termination date: 20170629

CF01 Termination of patent right due to non-payment of annual fee