CN1917190A

CN1917190A - Heat sink for heat pipe

Info

Publication number: CN1917190A
Application number: CNA2005100367596A
Authority: CN
Inventors: 夏万林; 李涛; 校敏奇
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2005-08-19
Filing date: 2005-08-19
Publication date: 2007-02-21
Anticipated expiration: 2025-08-19
Also published as: CN100414692C

Abstract

Being installed on CPU etc. exothermal electronic components, the heat sink of heat pipe includes following parts and structures: the base plate possesses up, low surfaces; bend outstretched grooves are formed on up surface; heat pipes are embedded in the grooves; multiple first and second thermolysis fins arranged in parallel are installed on up, low surfaces of the base plate. The groove includes segments: being near to a fringe of base plate, first segment of groove is extend along direction perpendicular to the first thermolysis fins; second segment of groove is far away from the first segment of groove; the third segment of groove is positioned between the first segment of groove and the second segment of groove. Being matched to form of grooves, heat pipe is stretched inside grooves. The disclosed heat sink of heat pipe gives full play to character of quick heat transfer rate of heat pipe, and takes full advantage of character of lowest temperature at ingress of airflow.

Description

Heat-pipe radiating apparatus

[technical field]

The present invention relates to a kind of heat abstractor, be meant a kind of heat-pipe radiating apparatus that dispels the heat on the electronic component that is installed on especially.

[background technology]

Along with electronic industry constantly develops, electronic component (particularly central processing unit) speed of service and overall performance are in continuous lifting.Yet its caloric value also increases thereupon, and volume is more and more littler on the other hand, and heating is also just more concentrated, makes industry use the heat abstractor of metal solid heat transfer can't satisfy the radiating requirements of high-end electronic component merely.

For this reason, industry is brought into use the heat abstractor that has heat pipe.Heat pipe is mainly to be made up of capillary structure that is provided with on vacuum-packed tubular shell, its inwall (as powder sintered thing, groove structure, screen net structure etc.) and interior hydraulic fluid of packing in right amount (as water, alcohol, fluorine Lyons, acetone etc.) thereof.Heat pipe be carry out after being heated by hydraulic fluid that liquid vapour two phase change absorb, release heat to be to reach the heat transfer purpose, and is fast and heat transfer distances is long is used widely owing to Heat Transfer of Heat Pipe on Heat Pipe.

China's utility model patent has disclosed a kind of heat abstractor that uses heat pipe No. 02248248.2, and it comprises several heat pipes that folder is established between a heat transfer plate that contacts with thermal source, the radiating fin of being located at the some equidistant arrangements on the heat transfer plate and heat transfer plate and the radiating fin.Parallel several relative tanks that is provided with the heat transfer plate junction of this heat transfer plate upper surface middle part zone and above-mentioned some radiating fins, and tank common combination that should correspondence forms a through hole, plugs above-mentioned heat pipe in this through hole.Because Heat Transfer of Heat Pipe on Heat Pipe speed is very fast, can very fast being diffused on the heat transfer plate with the heat of thermal source, and then promote radiating efficiency to improve.But the heat pipe of this heat abstractor substantially all concentrates on the central region of heat transfer plate, and heat pipe configuration direction is single, fails heat fully is spread in whole heat transfer plate.

[summary of the invention]

By the following examples the present invention is illustrated.

The heat-pipe radiating apparatus of the embodiment of the invention, comprise a substrate, this substrate has upper and lower surface, its upper surface forms the groove of bending extension, be embedded heat pipe in the groove, first and second radiating fin that majority is arranged in parallel is installed on the upper and lower surface of substrate respectively, this groove comprises first a ditch section of extending near substrate one edge and along the direction vertical with first radiating fin, away from the second ditch section of this substrate edges and between the 3rd ditch section between the two, heat pipe coupling groove shape and extending within it.

This execution mode compared with prior art has following advantage: because this heat abstractor groove has close substrate one edge and first ditch section that the edge direction vertical with first radiating fin extended and the second ditch section that is positioned at the substrate middle part, from this structure as can be known, the temperature at this first ditch section place is lower when air-flow is blown into by substrate one end that is provided with the first ditch section, make win ditch section and the temperature difference increase on every side of the second ditch section, even the heat pipe two ends temperature difference that is embedded in the groove increases, its heat delivered power is strengthened, give full play to the fireballing characteristic of adopting heat pipes for heat transfer and make full use of the low characteristics of temperature at the air flow inlet place of heat abstractor, effectively improve radiating efficiency.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

[description of drawings]

Fig. 1 is the three-dimensional exploded view of heat-pipe radiating apparatus of the present invention.

Fig. 2 is the part assembling stereogram of heat-pipe radiating apparatus of the present invention.

Fig. 3 is the substrate heat transmission path schematic diagram of heat-pipe radiating apparatus of the present invention.

Fig. 4 is the three-dimensional combination figure of heat-pipe radiating apparatus of the present invention.

[embodiment]

Heat-pipe radiating apparatus of the present invention is to dispel the heat in order to be installed on central processing unit 100 heat-generating electronic elements such as grade.See also Fig. 1 to Fig. 4, the heat-pipe radiating apparatus of one embodiment of the invention comprises a substrate 10, be arranged on two heat pipes 20 of these substrate 10 upper surfaces, be separately positioned on first fin 30 and second fin 40 of substrate 10 upper and lower surfaces.

This substrate 10 is roughly rectangular, and it has a pair of long parallel ora terminalis 10a and a pair of short parallel ora terminalis 10b.These substrate 10 upper surfaces offer two grooves 12 that cooperate with above-mentioned heat pipe 20.This two groove 12 all takes the shape of the letter U and is interconnected in opposite directions, each groove 12 1 end is positioned at the correspondence of substrate 10 and the position of central processing unit is installed and is bent to form the first ditch section 122 parallel with ora terminalis 10b, its other end is extending to the position that second fin 40 is set of substrate 10 and is being bent to form the second ditch section 124 parallel with ora terminalis 10b again with ora terminalis 10a parallel direction, thereby form the 2 first ditch sections 122 and the 2 second ditch sections 124 that are parallel to each other respectively and stagger, the length that wherein is positioned at the first ditch section 122 in the relative substrate 10 middle parts outsides and the second ditch section 124 is bigger, first of each groove 12, the second ditch section 122, the extension is the 3rd ditch section between 124.These substrate 10 corresponding close ora terminalis 10a positions that the position of central processing unit is installed are provided with fixing hole 16.

This heat pipe 20 bends to roughly and takes the shape of the letter U, be embedded at substrate 10 upper surfaces with groove 12 shapes are complementary, its exposed surface was roughly concordant with substrate 10 surfaces when this heat pipe 20 was arranged in the groove 12, because the heat transfer rate of heat pipe 20 is very fast, when producing heat, thermal source forms the heat transmission belt that roughly takes the shape of the letter U on this substrate 10.

This first fin 30 is arranged in parallel at a certain distance by some radiating fins 32 and is combined to form, and each radiating fin 32 up and down relatively two edges bend in the same way and be extended with flanging, thereby form the gas channel that open at two ends between the adjacent radiating fin 32.This first fin 30 is attached at the upper surface of substrate 10 and contacts with the exposed surface of heat pipe 20, and the both side edges of each radiating fin 32 and groove 12 the 3rd ditch section run parallel to the opposite end edge 10b of substrate 10.

This second fin 40 also is arranged in parallel at a certain distance by some radiating fins 42 and is combined to form, and the opposite end up and down of each radiating fin 42 bends in the same way and be extended with flanging, thereby forms the gas channel that open at two ends between the adjacent radiating fin 42.This second fin 40 is attached on the lower surface of respective grooves 12 second ditch sections of substrate 10, and one lateral margin and groove 12 the 3rd ditch section run parallel to substrate 10 middle parts.

As shown in Figure 3, from said structure as can be known, first of the horizontal expansion direction of the gas channel of this heat-pipe radiating apparatus and groove 12, two ditch sections 122,124 is vertical, be first of air current A direction and groove 12, the second ditch section 122,124 is vertical, make the full contact of air current A and heat pipe 20 heat transmission belts, improve the utilance of heat pipe 20, improve radiating efficiency, when especially an end of respective grooves 12 second ditch sections 124 is the air current A inlet, the heat B of central processing unit 100 is reached the first ditch section, 122 places of groove 12 and is conducted to the air current A porch rapidly by heat pipe 20, the temperature that makes substrate rely on the air current A porch reduces, make heat pipe 20 two ends environment temperature differences maximize, give full play to the heat pipe characteristic, can with thermal source heat B rapidly fully band from, make the radiating efficiency maximization.

Claims

1. heat-pipe radiating apparatus, comprise a substrate, this substrate has upper and lower surface, its upper surface forms the groove of bending extension, be embedded heat pipe in the groove, first and second radiating fin that majority is arranged in parallel is installed on the upper and lower surface of substrate respectively, it is characterized in that: this groove comprises first a ditch section of extending near substrate one edge and along the direction vertical with first radiating fin, away from the second ditch section of this substrate edges and between the 3rd ditch section between the two, heat pipe coupling groove shape and extending within it.

2. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: described groove takes the shape of the letter U, and first and second ditch section is parallel and vertical with the 3rd ditch section.

3. heat-pipe radiating apparatus as claimed in claim 2, it is characterized in that: be formed with the groove that takes the shape of the letter U on the described substrate in addition, this groove also has first, second, third ditch section, and close mutually respectively and parallel staggering of first and second ditch section of two grooves, the 3rd ditch section also is parallel to each other.

4. heat-pipe radiating apparatus as claimed in claim 3, it is characterized in that: described two grooves are staggered to form on substrate, wherein the first ditch section of a groove is between the first and second ditch sections of another groove, and the second ditch section of another groove is between the first and second ditch sections of last groove.

5. heat-pipe radiating apparatus as claimed in claim 3 is characterized in that: form the gas channel that open at two ends between the described radiating fin.

6. heat-pipe radiating apparatus as claimed in claim 5, it is characterized in that: the both side edges of described first radiating fin is parallel with groove the 3rd ditch section and extend to substrate two ora terminalis, second radiating fin is located at the part that is provided with the groove first ditch section of counterpart substrate, and the one lateral margin is parallel with groove the 3rd ditch section and extend in the middle part of the substrate.

7. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: described heat pipe has exposed surface in upper surface of base plate, contacts with the heat pipe exposed surface when this first radiating fin is attached at upper surface of base plate.