TWM267830U - Heat sink structure with high conductivity - Google Patents

Heat sink structure with high conductivity Download PDF

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Publication number
TWM267830U
TWM267830U TW93218946U TW93218946U TWM267830U TW M267830 U TWM267830 U TW M267830U TW 93218946 U TW93218946 U TW 93218946U TW 93218946 U TW93218946 U TW 93218946U TW M267830 U TWM267830 U TW M267830U
Authority
TW
Taiwan
Prior art keywords
heat sink
high conductivity
sink structure
conductivity
heat
Prior art date
Application number
TW93218946U
Other languages
Chinese (zh)
Inventor
Guo-Ren Lin
Guo-Shing Chen
Original Assignee
Cpumate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cpumate Inc filed Critical Cpumate Inc
Priority to TW93218946U priority Critical patent/TWM267830U/en
Publication of TWM267830U publication Critical patent/TWM267830U/en

Links

TW93218946U 2004-11-25 2004-11-25 Heat sink structure with high conductivity TWM267830U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93218946U TWM267830U (en) 2004-11-25 2004-11-25 Heat sink structure with high conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93218946U TWM267830U (en) 2004-11-25 2004-11-25 Heat sink structure with high conductivity

Publications (1)

Publication Number Publication Date
TWM267830U true TWM267830U (en) 2005-06-11

Family

ID=36592581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93218946U TWM267830U (en) 2004-11-25 2004-11-25 Heat sink structure with high conductivity

Country Status (1)

Country Link
TW (1) TWM267830U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100414692C (en) * 2005-08-19 2008-08-27 富准精密工业(深圳)有限公司 Heat sink for heat pipe
CN100444364C (en) * 2005-09-02 2008-12-17 富准精密工业(深圳)有限公司 Heat pipe radiator
CN100481408C (en) * 2005-11-10 2009-04-22 富准精密工业(深圳)有限公司 Heat radiator
TWI573521B (en) * 2014-06-17 2017-03-01 奇鋐科技股份有限公司 Heat dissipation structure of handheld electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100414692C (en) * 2005-08-19 2008-08-27 富准精密工业(深圳)有限公司 Heat sink for heat pipe
CN100444364C (en) * 2005-09-02 2008-12-17 富准精密工业(深圳)有限公司 Heat pipe radiator
CN100481408C (en) * 2005-11-10 2009-04-22 富准精密工业(深圳)有限公司 Heat radiator
TWI573521B (en) * 2014-06-17 2017-03-01 奇鋐科技股份有限公司 Heat dissipation structure of handheld electronic device

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees