TWI316173B - Liquid-cooling heat sink - Google Patents
Liquid-cooling heat sinkInfo
- Publication number
- TWI316173B TWI316173B TW95143755A TW95143755A TWI316173B TW I316173 B TWI316173 B TW I316173B TW 95143755 A TW95143755 A TW 95143755A TW 95143755 A TW95143755 A TW 95143755A TW I316173 B TWI316173 B TW I316173B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- heat sink
- cooling heat
- cooling
- sink
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95143755A TWI316173B (en) | 2006-11-27 | 2006-11-27 | Liquid-cooling heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95143755A TWI316173B (en) | 2006-11-27 | 2006-11-27 | Liquid-cooling heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200823640A TW200823640A (en) | 2008-06-01 |
TWI316173B true TWI316173B (en) | 2009-10-21 |
Family
ID=44771227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95143755A TWI316173B (en) | 2006-11-27 | 2006-11-27 | Liquid-cooling heat sink |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI316173B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI688742B (en) * | 2019-01-24 | 2020-03-21 | 新加坡商雲網科技新加坡有限公司 | Heat dissipation device |
US11257737B2 (en) | 2019-01-24 | 2022-02-22 | Nanning Fugui Precision Industrial Co., Ltd. | Heat dissipation device |
-
2006
- 2006-11-27 TW TW95143755A patent/TWI316173B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI688742B (en) * | 2019-01-24 | 2020-03-21 | 新加坡商雲網科技新加坡有限公司 | Heat dissipation device |
US11257737B2 (en) | 2019-01-24 | 2022-02-22 | Nanning Fugui Precision Industrial Co., Ltd. | Heat dissipation device |
Also Published As
Publication number | Publication date |
---|---|
TW200823640A (en) | 2008-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |