TWI688742B - Heat dissipation device - Google Patents

Abstract

A heat dissipation device is provided which includes a base, a plurality of conduct and a driving module. The conduct includes an inlet, an extension structure, and an outlet. The extension structure is connected to the base. The driving module includes a housing, a segment member, and two magnetic driving members. The segment member, being a thin plate structure and including a magnetic element, is positioned in the housing and defines a first chamber and a second chamber for storing cooling liquid. The first chamber and the second chamber are each connected to the inlet and the outlet of at least one of the conducts configuration that cooling liquid is guided to leave the first chamber and the second chamber are discharged into the first chamber and the second chamber again.

Description

Radiator

The invention relates to a heat dissipation device, in particular to a heat dissipation device with a cooling liquid driving component.

When an electronic device (for example, a computer central processing unit) is operated, a large amount of thermal energy is usually generated. These thermal energy must be quickly removed from the central processing unit to avoid the central processing unit being unstable or damaged. Generally speaking, a heat dissipation device is often attached to the surface of the central processing unit to absorb the heat energy from the central processing unit. The heat energy absorbed by the heat sink is then dissipated by ambient air.

Traditionally, the heat dissipation device includes a metal substrate attached to a central processor, and a plurality of fins are formed on the substrate. The substrate is close to the central processor and must be sufficiently cooled to ensure the normal operation of the central processor. Most of the heat energy accumulated on the substrate is first transferred to the fins, and then dissipated by the fins. However, as electronic technology continues to advance, the heat generated by advanced central processing units also increases. The traditional heat dissipation device can no longer effectively remove the heat energy from the central processing unit.

In view of the above situation, it is necessary to provide a heat dissipation device with better heat dissipation efficiency to solve the above problems.

An embodiment of the present disclosure provides a heat dissipation device, including: a heat dissipation base, a plurality of conduits, and a driving assembly. The catheter sequentially includes an inlet end, an extension structure, and an outlet end. The extension structure is connected to the heat dissipation base. The drive assembly includes: a housing and a zone Separator, two electromagnetic drive parts. The partition is disposed in the housing and defines a first cavity and a second cavity in the housing to store the cooling liquid. The partition is a thin plate structure and includes a magnetic element. The two electromagnetic driving parts are opposite to the partition and are arranged on both sides of the housing. The first cavity and the second cavity are respectively connected to the inlet end and the outlet end of at least one of the conduits to guide the cooling liquid to leave the first cavity and the second cavity and flow into the first cavity and the second cavity, respectively body.

The heat dissipation device disclosed by the invention can quickly dissipate the heat energy generated by the electronic device, and can achieve the purpose of controlling the heat dissipation efficiency through the action of the driving element.

1: heat sink

10: cooling base

11: cylinder

115: channel

12: upper surface

120: groove

13: cooling fins

14: Lower surface

140: groove

20: Catheter

21: entrance side

22: Extended structure

221: U-shaped section

222: Link segment

225: U-shaped section

224: Link segment

225: U-shaped section

23: exit end

30: drive assembly

31: Shell

311: the first cavity

312: Second cavity

313: Platform

314: Platform

32: Shell

321: Liquid injection hole

322: Liquid injection hole

33: Shell

34: Partition

35: Electromagnetic drive part (first electromagnetic drive part)

36: Electromagnetic drive part (second electromagnetic drive part)

37: Current controller

40: Thermally conductive bottom plate

41: Groove

50: Check valve

55: Check valve

L: Long axis direction

T: horizontal axis

OP: Flat

P: period

t1: time difference

t2: time difference

FIG. 1 shows a schematic diagram of a heat dissipation device according to an embodiment of the invention.

FIG. 2 shows an exploded view of the structure of the heat dissipation device of FIG. 1.

FIG. 3 shows a longitudinal cross-sectional view of the heat dissipation device of FIG. 1, wherein the partition member is attracted to move toward the inside of the first cavity by external force.

4 shows an exploded view of the structure of a driving element according to an embodiment of the invention.

FIG. 5 shows a schematic diagram of a catheter coupling driving element according to an embodiment of the invention.

FIG. 6 shows a block diagram of the connection relationship between the heat dissipation base, the duct and the driving component in an embodiment of the invention.

7 is a diagram showing the relationship between the current supplied by the current controller of the driving element and time according to an embodiment of the invention.

FIG. 8 shows a longitudinal cross-sectional view of the heat dissipation device of FIG. 1, wherein the partition member is attracted by an external force and moves toward the inside of the first cavity.

The following disclosure provides many different embodiments or preferred examples to implement the different features of this case. Of course, the present disclosure can also be implemented in many different forms, and is not limited to the embodiments described below. The following disclosure details each structure in conjunction with the drawings The specific examples of the components and their arrangement are to simplify the description and make the disclosure more thorough and complete, so as to fully convey the scope of the disclosure to those skilled in the art.

The spatially related terms used in the following, such as "below", "below", "lower", "above", "higher" and similar terms, are for the convenience of description. The relationship between one element or feature and another element or features. In addition to the orientation shown in the drawings, these spatially related terms are also intended to include different orientations of the device in use or in operation. The device may be turned to different orientations (rotated 90 degrees or other orientations), and the spatially related terms used here can also be interpreted in the same way.

It must be understood that elements not specifically shown or described can exist in various forms well known to those skilled in the art. In addition, if the embodiment describes that a first feature is formed on or above a second feature, it means that it may include the case where the first feature is in direct contact with the second feature, or may include additional features. It is formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact.

In the following different embodiments, the same element numbers and/or words may be used repeatedly. These repetitions are for the purpose of simplicity and clarity, and are not intended to limit the specific relationship between the different embodiments and/or structures in question. In the drawings, the shape or thickness of the structure may be enlarged to simplify or facilitate marking.

FIG. 1 shows a schematic diagram of a heat sink 1 according to an embodiment of the invention, and FIG. 2 shows an exploded view of the structure of the heat sink 1 of FIG. 1. According to an embodiment of the present invention, the heat dissipation device includes a heat dissipation base 10, a plurality of ducts 20, a driving assembly 30, and a thermally conductive bottom plate 40. The duct 20 is used to guide the cooling liquid from the driving element 30 through the heat dissipation base 10 and the thermally conductive base plate 40 to dissipate the heat from the heat conductive base 40 through the heat dissipation base 10.

In an embodiment, the heat dissipation base 10 has a column 11, a plurality of heat dissipation fins 13 are arranged in the circumference of the column 11, and extend a predetermined length in the radial direction of the column 11 degree. In one embodiment, the pillar 11 and the heat dissipation fin 13 are integrally formed, and are made of high thermal conductivity materials (for example, aluminum alloy and high thermal conductivity graphite sheet).

FIG. 3 shows a longitudinal cross-sectional view of the heat sink 1 of FIG. 1. In one embodiment, the long axis direction (Z-axis direction) of the column 11 has a height. The cylinder 11 has an upper surface 12 and a lower surface 14. A groove 120 is formed on the upper surface 12. The shape of the groove 120 corresponds to the shape of the element of the partial driving element 30 to accommodate the partial driving element 30 therein. Moreover, a groove 140 is formed on the lower surface 14. The shape of the groove 140 corresponds to the shape of the thermally conductive bottom plate 40 to accommodate a portion of the thermally conductive bottom plate 40 therein. In one embodiment, the groove 120 has a semi-circular cross section, and the groove 140 has a rectangular cross section.

In an embodiment, as shown in FIG. 3, a plurality of channels 115 extend parallel to the long-axis direction L (Z-axis direction) in the column 11 (for simplicity, FIG. 3 only shows the closest drive elements 35, 36 Two channels of 115). In one embodiment, the channel 115 extends from the upper surface 12 of the cylinder 11 to the bottom surface of the groove 140. The upper surface 12 of the column 11 may be parallel to the bottom surface of the groove 140 and perpendicular to the above-mentioned long-axis direction L (Z-axis direction). In one embodiment, as shown in FIG. 2, the opening of the channel 115 on the upper surface 12 is located between the edge of the groove 120 and the outer edge of the column 11.

FIG. 4 shows an exploded view of the structure of the driving element 30 according to an embodiment of the invention. In an embodiment, the driving assembly 30 includes a housing 31, a partition 34, and a plurality of electromagnetic driving members (for example, the first electromagnetic driving member 35 and the second electromagnetic driving member 36). In an embodiment, the housing 31 is a spherical structure, and includes two semicircular shell members 32 and 33. The shells 32 and 33 can be made of high temperature resistant plastic, respectively.

The partition 34 is disposed in the housing 31 and defines a first cavity 311 and a second cavity 312 in the housing 31 to store the cooling liquid. In one embodiment, the partition 34 is a circular thin plate structure, and its diameter is slightly larger than the inner diameter of the housing 31. When assembling the driving element 30, the edge of the partition 34 is sandwiched between the shells 32 and 33, and the shells 32 and 33 can be combined by ultrasonic welding to fix the partition 34 inside the housing 31. Shell A sealing ring may be provided between 32 and 33 to increase the sealing characteristics of the housing 31. The housings 32, 33 may include a liquid injection hole 321, 322, respectively. The two liquid injection holes 321 and 322 communicate with the first cavity 311 and the second cavity 312 respectively for injecting cooling liquid into the first cavity 311 and the second cavity 312. The liquid injection holes 321 and 322 can be sealed by being covered with a lid.

In one embodiment, the partition 34 includes a magnetic element. The thin plate structure of the partition 34 may be made of magnetic elements (for example, the partition is a metal sheet having magnetic permeability). Alternatively, the magnetic element can be manufactured separately from the thin plate structure and then fixed on the thin plate structure. When the magnetic element is attracted or repelled by the magnetic force, the thin plate structure deforms and moves toward the first cavity or the second cavity.

The first electromagnetic driving member 35 and the second electromagnetic driving member 36 are respectively connected to the housing 31 and arranged on the horizontal axis T, where the horizontal axis T is perpendicular to the plane OP where the undeformed partition 34 extends. In one embodiment, the housing 31 includes a platform 313, 314 protruding from the outer surface of the shell 32, 33, respectively. The first electromagnetic driving member 35 and the second electromagnetic driving member 36 are respectively disposed on the platforms 313 and 314. In an embodiment, the first electromagnetic driving member 35 and the second electromagnetic driving member 36 are respectively an electromagnet, and are electrically connected to a current controller 37. The current controller 37 is configured to control the current applied to the first electromagnetic driving member 35 and the second electromagnetic driving member 36 to generate a magnetic force that attracts/repulses the partition 34.

FIG. 5 shows a schematic view of the catheter 20 connected to the driving element 30. In an embodiment, each duct 20 includes an inlet end 21, an extension structure 22, and an outlet end 23 connected in sequence. In an embodiment, the heat dissipation device 1 includes two ducts 20. The inlet end 21 and the outlet end 23 of one of the ducts 20 are respectively connected to corresponding openings in the shell 31. The inlet end 21 and the outlet end 23 of the other duct 20 are respectively connected to corresponding openings in the shell 32. In this way, the two conduits 20 and the first cavity 311 and the second cavity 312 respectively form two closed circuits for cooling liquid to flow. In one embodiment, the inlet end 21 is farther away from the partition 34 than the outlet end 23 (the intersection of the first shell member 32 and the second shell member 33). And, the entrance 21 and the area The angle between the partition 34 is greater than the angle between the outlet end 23 and the partition 34 to facilitate the cooling liquid to exit the first cavity 311 or the second cavity 312.

In one embodiment, the extension structure 22 includes a plurality of U-shaped segments 221, 223, 225 and a plurality of connecting segments 222, 224. The inlet end 21, the U-shaped section 221, the connection section 222, the U-shaped section 223, the connection section 224, the U-shaped section 225, and the outlet end 23 are connected in order. The U-shaped segment portions 221, 223, and 225 extend parallel to the height direction (Z-axis direction) of the heat dissipation base 30. In addition, the U-shaped segment portions 221, 223, and 225 are arranged in a direction parallel to the horizontal axis T and have different widths. Specifically, the width of the U-shaped segment 223 is greater than the U-shaped segment 221, and the width of the U-shaped segment 225 is greater than the U-shaped segment 223.

Please also refer to FIGS. 2 and 3. In an embodiment, the vertically extending portions of the U-shaped segments 221, 223, and 225 are disposed inside the channel 115, and the laterally extending portions of the U-shaped segments 221, 223, and 225 are exposed to The groove 140 directly contacts the thermally conductive bottom plate 40 disposed in the groove 140. In an embodiment, the thermally conductive bottom plate 40 includes a plurality of grooves 41, and portions of the U-shaped segment portions 221, 223, and 225 that extend laterally are disposed in the groove 41. On the other hand, the connecting segment portions 222 and 224 protrude from the upper surface 12 of the column 11. In the circumferential direction of the column 11, the connecting segment portions 222 and 224 are located between the inlet end 21 and the outlet end 23.

FIG. 6 shows a block diagram of the connection relationship between the heat dissipation base 10, the duct 20 and the driving assembly 30 in an embodiment of the invention. In one embodiment, the height of the inlet end 21 of the duct 20 is closer to the heat dissipation base 10 than the outlet end 23, and the liquid surface of the cooling liquid injected into the first cavity 311 or the second cavity 312 is not 23 higher than the exit end. In this way, when the driving element 30 is actuated, the cooling liquid will not pass through the outlet end 23.

In another embodiment, as shown in FIG. 6, the inlet end 21 and the outlet end 23 of the conduit 20 are respectively connected with a check valve 50 and a check valve 55 to restrict the flow direction of the cooling liquid. The one-way valve 50 restricts the cooling liquid injected into the first cavity 311 or the second cavity 312 to flow into the duct 20 only through the inlet end 21, and does not allow the cooling liquid in the duct 20 to flow in Inside the first cavity 311 or the second cavity 312. The one-way valve 50 restricts the cooling liquid in the conduit 20 to flow into the first cavity 311 or the second cavity 312 only through the outlet end 23, but does not allow the cooling liquid injected into the first cavity 311 or the second cavity 312 It flows into the duct 20 through the outlet end 23.

According to an embodiment of the present invention, the usage of the heat dissipation device 1 is described as follows:

In one embodiment, the heat conductive bottom plate 40 of the heat dissipation device 1 is disposed on a heat source (not shown, for example, a chip). The heat conductive bottom plate 40 can be connected to the heat source through a heat conductive glue to increase the heat conduction efficiency. Next, the heating device 1 controls the driving assembly 30 to operate to achieve the purpose of dissipating the heat energy of the heating source.

FIG. 7 is a diagram showing the relationship between the current and the time sent by the current controller 37 of the driving element 30 according to an embodiment of the invention. In one embodiment, the current controller 37 first applies a predetermined current to the first electromagnetic driving member 35 and maintains it for a predetermined time. At this time, as shown in FIG. 3, the partition 34 will be attracted and deformed by the magnetic force generated by the first electromagnetic driving member 35 (FIG. 3 shows the two states of the movement process of the partition 34 under the magnetic force), and toward the first A cavity 311 moves inside. Thus, the partition 34 squeezes the cooling liquid injected into the first cavity 311 so that the cooling liquid flows into the duct 20 through the inlet end 21 and flows into the first cavity 311 again through the outlet end 23 after passing through the extension structure 22.

Then, the current controller 37 stops applying current to the first electromagnetic driving member 35, and applies a predetermined current to the second electromagnetic driving member 36 for a predetermined time. At this time, as shown in FIG. 8, the partition 34 will be attracted and deformed by the magnetic force generated by the second electromagnetic driving member 36 (FIG. 8 shows two states of the partition 34 moving process by the magnetic force), and toward the first The second cavity 312 moves inside. Then, the partition 34 squeezes the cooling liquid injected into the second cavity 312, so that the cooling liquid leaves the second cavity 312, flows into the duct 20 through the inlet end 21 and passes through the outlet end 23 again after passing through the extension structure 22 Flow into the second cavity 312.

In one embodiment, the current controller 37 sequentially supplies current to the first electromagnetic driving member 35 and the second electromagnetic driving member 36 during the period P, and repeats continuously to drive the cooling liquid in two different closed circuits (the first A cavity and a conduit connected thereto, a second cavity and a conduit connected thereto, so as to conduct more heat energy of the thermally conductive bottom plate 40 to the heat dissipation base 20 and disperse it.

In one embodiment, the current controller 37 applies current to the operation of the first electromagnetic driving member 35 and the second electromagnetic driving member 36 with a time difference t1. Moreover, there is a time difference t2 between the above cycles. During the above time difference t1 and time difference t2, the current controller 37 stops applying current to the first electromagnetic driving element 35 and the second electromagnetic driving element 36, so the partition 34 will not be attracted by the magnetic force. Therefore, the cooling liquid located in the duct 20 can freely flow into the first cavity 311 or the second cavity 312.

In another embodiment, the operation of the current controller 37 to apply current to the first electromagnetic drive 35 is immediately following the operation of the current controller 37 to apply current to the second electromagnetic drive 36. The first cavity 311 or the second cavity 312 reserves a space without being completely filled with cooling liquid.

The current provided by the current controller 37 to the first electromagnetic driving member 35 and the second electromagnetic driving member 36 is a predetermined value. Alternatively, the current value provided by the current controller 37 to the first electromagnetic drive member 35 and the second electromagnetic drive member 36 gradually decreases to gradually reduce the magnetic attraction force to the partition 34 to increase the cooling liquid in the duct 20 Time to improve heat dissipation efficiency.

The heat dissipation device of the embodiment of the present invention drives the cooling liquid in the conduit through the driving element to quickly conduct the heat energy from the heat source to the heat dissipation base, thereby achieving the purpose of efficient heat dissipation.

Although the embodiments and their advantages have been described in detail above, it should be understood that various changes, substitutions, and modifications can be made to the present disclosure without departing from the spirit and scope of the present disclosure defined by the scope of the appended patent application. In addition, the scope of this application It is not intended to be limited to the specific embodiments of the processes, machines, manufacturing, material composition, tools, methods, and steps described in the specification. As a person of ordinary skill in the art will easily understand from the present disclosure, according to the present disclosure, existing or future developments can be utilized to perform substantially the same functions or implementations as the corresponding embodiments described in the present disclosure. The results of the process, machine, manufacturing, material composition, tools, methods or steps. Therefore, the scope of the attached patent application is intended to include these processes, machines, manufacturing, material composition, tools, methods or steps within their scope. In addition, each patent application scope constitutes a separate embodiment, and combinations of different patent application scopes and embodiments are within the scope of the present disclosure.

1: heat sink

10: cooling base

11: cylinder

115: channel

12: upper surface

120: groove

13: cooling fins

14: Lower surface

140: groove

221: U-shaped section

223: U-shaped section

225: U-shaped section

31: Shell

311: the first cavity

312: Second cavity

313: Platform

314: Platform

32: Shell

321: Liquid injection hole

322: Liquid injection hole

33: Shell

34: Partition

35: Electromagnetic drive part (first electromagnetic drive part)

36: Electromagnetic drive part (second electromagnetic drive part)

37: Current controller

40: Thermally conductive bottom plate

41: Groove

L: Long axis direction

Claims (9)

A heat dissipation device includes: a heat dissipation base 20; a plurality of conduits 42.44, including an inlet end, an extension structure, and an outlet end in sequence, the extension structure is connected to the heat dissipation base; a driving assembly 30, including: a shell A partition, disposed in the housing and defining a first cavity and a second cavity in the housing to store the cooling liquid, wherein the partition is a thin plate structure and includes a magnetic element; and two An electromagnetic driving member is disposed on both sides of the housing opposite to the partition; wherein the first cavity and the second cavity are respectively connected to the inlet end and the outlet end of at least one of the conduits to guide Leading the cooling liquid out of the first cavity and the second cavity and into the first cavity and the second cavity; and a current controller configured to supply current sequentially in a cycle To the two electromagnetic driving parts, there is a time difference between the actions of the current controller supplying current to the two electromagnetic driving parts in each cycle. The heat dissipation device as described in item 1 of the patent application scope, wherein each of the ducts forms a closed flow path with the corresponding first cavity or the second cavity. The heat dissipation device as described in item 1 of the patent application scope, wherein the extension structure of each of the ducts includes a U-shaped section, and the U-shaped section extends in the height direction of the heat dissipation base. The heat dissipation device as described in item 1 of the patent application, wherein the partition is a metal sheet with magnetic permeability. The heat dissipation device as described in item 1 of the patent application scope, wherein the housing includes two shell members, and the edge of the partition member is sandwiched between the two shell members. The heat dissipation device as described in Item 1 of the patent application scope, wherein the heat dissipation device further includes a thermally conductive bottom plate directly contacting the extension structures of the conduits. The heat dissipation device as described in item 6 of the patent application range, wherein the heat dissipation base has an upper surface and a lower surface opposite to the upper surface, the upper surface and the lower surface respectively have a groove, and the housing is disposed on the The groove on the upper surface directly contacts the bottom of the groove on the upper surface, and the thermally conductive bottom plate is disposed in the groove on the lower surface. The heat dissipation device as described in item 1 of the scope of the patent application, wherein the two electromagnetic driving elements are arranged along a horizontal axis that is perpendicular to the plane where the partition element extends without deformation. The heat dissipation device as described in item 1 of the patent application scope, wherein the heat dissipation device further includes a plurality of one-way valves, and the inlet end and the outlet end of each of the conduits are respectively connected to one of the one-way valves to limit Cooling liquid flow direction.

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