CN1885620A - 连接装置 - Google Patents
连接装置 Download PDFInfo
- Publication number
- CN1885620A CN1885620A CN 200610095916 CN200610095916A CN1885620A CN 1885620 A CN1885620 A CN 1885620A CN 200610095916 CN200610095916 CN 200610095916 CN 200610095916 A CN200610095916 A CN 200610095916A CN 1885620 A CN1885620 A CN 1885620A
- Authority
- CN
- China
- Prior art keywords
- noble metal
- aforesaid right
- require described
- alloy
- described jockey
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Conductive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005029105.8 | 2005-06-23 | ||
DE200510029105 DE102005029105B4 (de) | 2005-06-23 | 2005-06-23 | Kontaktiervorrichtung |
DE102006017758.4 | 2006-04-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1885620A true CN1885620A (zh) | 2006-12-27 |
Family
ID=37544824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200610095916 Pending CN1885620A (zh) | 2005-06-23 | 2006-06-23 | 连接装置 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1885620A (de) |
DE (1) | DE102005029105B4 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014003962B4 (de) | 2014-03-20 | 2017-11-02 | Tdk-Micronas Gmbh | Verfahren zum Prüfen eines CMOS-Transistors |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3734647A1 (de) * | 1986-10-14 | 1988-04-21 | Feinmetall Gmbh | Nadelkarte |
US5952843A (en) * | 1998-03-24 | 1999-09-14 | Vinh; Nguyen T. | Variable contact pressure probe |
US6566898B2 (en) * | 2000-03-06 | 2003-05-20 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
-
2005
- 2005-06-23 DE DE200510029105 patent/DE102005029105B4/de active Active
-
2006
- 2006-06-23 CN CN 200610095916 patent/CN1885620A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
DE102005029105B4 (de) | 2013-08-08 |
DE102005029105A1 (de) | 2007-01-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Open date: 20061227 |