CN1851948A - 通孔垂直结构的半导体芯片或器件 - Google Patents
通孔垂直结构的半导体芯片或器件 Download PDFInfo
- Publication number
- CN1851948A CN1851948A CNA2006100815563A CN200610081556A CN1851948A CN 1851948 A CN1851948 A CN 1851948A CN A2006100815563 A CNA2006100815563 A CN A2006100815563A CN 200610081556 A CN200610081556 A CN 200610081556A CN 1851948 A CN1851948 A CN 1851948A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 127
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 105
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 105
- 239000010703 silicon Substances 0.000 claims abstract description 105
- 229910052751 metal Inorganic materials 0.000 claims abstract description 51
- 239000002184 metal Substances 0.000 claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 137
- 238000001465 metallisation Methods 0.000 claims description 92
- 238000000034 method Methods 0.000 claims description 34
- 238000009792 diffusion process Methods 0.000 claims description 32
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 28
- 229910052733 gallium Inorganic materials 0.000 claims description 28
- 229910005540 GaP Inorganic materials 0.000 claims description 27
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 22
- 239000011241 protective layer Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 18
- 239000011701 zinc Substances 0.000 claims description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 229910002601 GaN Inorganic materials 0.000 claims description 16
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 16
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 claims description 16
- 229910052725 zinc Inorganic materials 0.000 claims description 16
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 15
- -1 for example Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 239000004411 aluminium Substances 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910002056 binary alloy Inorganic materials 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 12
- 229910002059 quaternary alloy Inorganic materials 0.000 claims description 12
- 229910052738 indium Inorganic materials 0.000 claims description 11
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims description 8
- 239000011574 phosphorus Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000002096 quantum dot Substances 0.000 claims description 2
- 229910002704 AlGaN Inorganic materials 0.000 claims 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 230000004913 activation Effects 0.000 abstract 1
- CHPZKNULDCNCBW-UHFFFAOYSA-N gallium nitrate Chemical compound [Ga+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O CHPZKNULDCNCBW-UHFFFAOYSA-N 0.000 description 28
- 229940044658 gallium nitrate Drugs 0.000 description 14
- 239000010931 gold Substances 0.000 description 12
- 229910052737 gold Inorganic materials 0.000 description 10
- 241000218202 Coptis Species 0.000 description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 238000005457 optimization Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 238000013517 stratification Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910007486 ZnGa2O4 Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- QZQVBEXLDFYHSR-UHFFFAOYSA-N gallium(III) oxide Inorganic materials O=[Ga]O[Ga]=O QZQVBEXLDFYHSR-UHFFFAOYSA-N 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100815563A CN100452460C (zh) | 2006-05-29 | 2006-05-29 | 通孔垂直结构的半导体芯片及其制造方法 |
US11/807,121 US20070272939A1 (en) | 2006-05-29 | 2007-05-25 | Tunnel vertical semiconductor devices or chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100815563A CN100452460C (zh) | 2006-05-29 | 2006-05-29 | 通孔垂直结构的半导体芯片及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1851948A true CN1851948A (zh) | 2006-10-25 |
CN100452460C CN100452460C (zh) | 2009-01-14 |
Family
ID=37133421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100815563A Expired - Fee Related CN100452460C (zh) | 2006-05-29 | 2006-05-29 | 通孔垂直结构的半导体芯片及其制造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070272939A1 (zh) |
CN (1) | CN100452460C (zh) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009097786A1 (zh) * | 2008-01-31 | 2009-08-13 | Jin, Peng | 垂直结构的半导体芯片 |
CN102136531A (zh) * | 2011-02-12 | 2011-07-27 | 西安神光安瑞光电科技有限公司 | 发光二极管及其制造方法 |
CN102185068A (zh) * | 2011-05-06 | 2011-09-14 | 西安神光安瑞光电科技有限公司 | 发光二极管及其制备方法 |
CN102185070A (zh) * | 2011-05-06 | 2011-09-14 | 西安神光安瑞光电科技有限公司 | 发光二极管及其制备方法 |
CN102231421A (zh) * | 2011-07-15 | 2011-11-02 | 中国科学院半导体研究所 | 发光二极管封装结构的制作方法 |
CN102255034A (zh) * | 2011-07-15 | 2011-11-23 | 中国科学院半导体研究所 | 发光二极管封装结构 |
CN102593287A (zh) * | 2011-01-10 | 2012-07-18 | 展晶科技(深圳)有限公司 | 发光二极管晶粒及其制造方法、发光二极管封装结构 |
CN102792471A (zh) * | 2010-04-01 | 2012-11-21 | 松下电器产业株式会社 | 发光二极管元件及发光二极管装置 |
CN104078544A (zh) * | 2014-07-22 | 2014-10-01 | 深圳市兆明芯科技控股有限公司 | 免打线封装的led芯片及封装工艺 |
CN104508811A (zh) * | 2012-08-07 | 2015-04-08 | 皇家飞利浦有限公司 | Led封装和制造方法 |
TWI488227B (zh) * | 2010-12-23 | 2015-06-11 | Osram Opto Semiconductors Gmbh | 製造光電半導體元件之方法 |
CN105023975A (zh) * | 2015-06-08 | 2015-11-04 | 严敏 | 一种红色倒装晶片的制造方法和红色倒装晶片 |
CN104064641B (zh) * | 2014-07-04 | 2018-04-27 | 映瑞光电科技(上海)有限公司 | 通孔垂直型led的制作方法 |
CN108281532A (zh) * | 2018-01-25 | 2018-07-13 | 扬州乾照光电有限公司 | 一种柔性led芯片及其制作方法、封装方法 |
CN109698264A (zh) * | 2017-10-20 | 2019-04-30 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
CN110416229A (zh) * | 2019-07-31 | 2019-11-05 | 云谷(固安)科技有限公司 | 一种显示面板及其制作方法、显示装置 |
CN110707203A (zh) * | 2019-09-04 | 2020-01-17 | 厦门三安光电有限公司 | 发光器件及其制作方法和含该发光器件的发光器件模组 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100446288C (zh) * | 2006-08-01 | 2008-12-24 | 金芃 | 通孔垂直结构的半导体芯片及其制造方法 |
DE102007022947B4 (de) | 2007-04-26 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
DE102008003182A1 (de) * | 2008-01-04 | 2009-07-09 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US7781780B2 (en) | 2008-03-31 | 2010-08-24 | Bridgelux, Inc. | Light emitting diodes with smooth surface for reflective electrode |
DE102008045653B4 (de) * | 2008-09-03 | 2020-03-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
DE102009022966A1 (de) * | 2009-05-28 | 2010-12-02 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbarer optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Halbleiterchips |
US8901586B2 (en) * | 2010-07-12 | 2014-12-02 | Samsung Electronics Co., Ltd. | Light emitting device and method of manufacturing the same |
CN102593302B (zh) * | 2011-01-10 | 2014-10-15 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
KR101766298B1 (ko) * | 2011-03-30 | 2017-08-08 | 삼성전자 주식회사 | 발광소자 및 그 제조방법 |
US8488645B2 (en) | 2011-07-31 | 2013-07-16 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Semiconductor device having a vertical cavity surface emitting laser (VCSEL) and a protection diode integrated therein and having reduced capacitance to allow the VCSEL to achieve high operating speeds |
KR101886156B1 (ko) * | 2012-08-21 | 2018-09-11 | 엘지이노텍 주식회사 | 발광소자 |
FR3066320B1 (fr) * | 2017-05-11 | 2019-07-12 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'un dispositif d'affichage emissif a led |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5008718A (en) * | 1989-12-18 | 1991-04-16 | Fletcher Robert M | Light-emitting diode with an electrically conductive window |
US5376580A (en) * | 1993-03-19 | 1994-12-27 | Hewlett-Packard Company | Wafer bonding of light emitting diode layers |
JP2004343138A (ja) * | 2001-11-19 | 2004-12-02 | Sanyo Electric Co Ltd | 化合物半導体発光素子の製造方法 |
CN1632958A (zh) * | 2005-01-10 | 2005-06-29 | 金芃 | 新型垂直结构的氮化镓基半导体发光二极管及其生产工艺 |
CN1329988C (zh) * | 2005-07-22 | 2007-08-01 | 金芃 | 带有防静电二极管的金属化硅芯片及其制造工艺 |
-
2006
- 2006-05-29 CN CNB2006100815563A patent/CN100452460C/zh not_active Expired - Fee Related
-
2007
- 2007-05-25 US US11/807,121 patent/US20070272939A1/en not_active Abandoned
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009097786A1 (zh) * | 2008-01-31 | 2009-08-13 | Jin, Peng | 垂直结构的半导体芯片 |
CN102792471A (zh) * | 2010-04-01 | 2012-11-21 | 松下电器产业株式会社 | 发光二极管元件及发光二极管装置 |
US9634155B2 (en) | 2010-12-23 | 2017-04-25 | Osram Opto Semiconductors Gmbh | Method for producing an electrical terminal support |
TWI488227B (zh) * | 2010-12-23 | 2015-06-11 | Osram Opto Semiconductors Gmbh | 製造光電半導體元件之方法 |
CN102593287A (zh) * | 2011-01-10 | 2012-07-18 | 展晶科技(深圳)有限公司 | 发光二极管晶粒及其制造方法、发光二极管封装结构 |
CN102593287B (zh) * | 2011-01-10 | 2015-07-08 | 展晶科技(深圳)有限公司 | 发光二极管晶粒及其制造方法、发光二极管封装结构 |
CN102136531A (zh) * | 2011-02-12 | 2011-07-27 | 西安神光安瑞光电科技有限公司 | 发光二极管及其制造方法 |
CN102185068A (zh) * | 2011-05-06 | 2011-09-14 | 西安神光安瑞光电科技有限公司 | 发光二极管及其制备方法 |
CN102185070A (zh) * | 2011-05-06 | 2011-09-14 | 西安神光安瑞光电科技有限公司 | 发光二极管及其制备方法 |
CN102255034B (zh) * | 2011-07-15 | 2013-05-08 | 中国科学院半导体研究所 | 发光二极管封装结构 |
CN102231421B (zh) * | 2011-07-15 | 2013-01-23 | 中国科学院半导体研究所 | 发光二极管封装结构的制作方法 |
CN102231421A (zh) * | 2011-07-15 | 2011-11-02 | 中国科学院半导体研究所 | 发光二极管封装结构的制作方法 |
CN102255034A (zh) * | 2011-07-15 | 2011-11-23 | 中国科学院半导体研究所 | 发光二极管封装结构 |
CN104508811B (zh) * | 2012-08-07 | 2017-09-22 | 皇家飞利浦有限公司 | Led封装和制造方法 |
CN104508811A (zh) * | 2012-08-07 | 2015-04-08 | 皇家飞利浦有限公司 | Led封装和制造方法 |
CN104064641B (zh) * | 2014-07-04 | 2018-04-27 | 映瑞光电科技(上海)有限公司 | 通孔垂直型led的制作方法 |
CN104078544A (zh) * | 2014-07-22 | 2014-10-01 | 深圳市兆明芯科技控股有限公司 | 免打线封装的led芯片及封装工艺 |
CN105023975A (zh) * | 2015-06-08 | 2015-11-04 | 严敏 | 一种红色倒装晶片的制造方法和红色倒装晶片 |
CN105023975B (zh) * | 2015-06-08 | 2017-10-27 | 严敏 | 一种红色倒装晶片的制造方法和红色倒装晶片 |
CN109698264A (zh) * | 2017-10-20 | 2019-04-30 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
CN109698264B (zh) * | 2017-10-20 | 2020-08-18 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
CN108281532A (zh) * | 2018-01-25 | 2018-07-13 | 扬州乾照光电有限公司 | 一种柔性led芯片及其制作方法、封装方法 |
CN110416229A (zh) * | 2019-07-31 | 2019-11-05 | 云谷(固安)科技有限公司 | 一种显示面板及其制作方法、显示装置 |
CN110707203A (zh) * | 2019-09-04 | 2020-01-17 | 厦门三安光电有限公司 | 发光器件及其制作方法和含该发光器件的发光器件模组 |
Also Published As
Publication number | Publication date |
---|---|
CN100452460C (zh) | 2009-01-14 |
US20070272939A1 (en) | 2007-11-29 |
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