CN1848305B - 电子部件用导线以及由该导线构成的扁平电缆 - Google Patents

电子部件用导线以及由该导线构成的扁平电缆 Download PDF

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Publication number
CN1848305B
CN1848305B CN2006100727098A CN200610072709A CN1848305B CN 1848305 B CN1848305 B CN 1848305B CN 2006100727098 A CN2006100727098 A CN 2006100727098A CN 200610072709 A CN200610072709 A CN 200610072709A CN 1848305 B CN1848305 B CN 1848305B
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China
Prior art keywords
alloy layer
coating
flat cable
snzn
lead
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CN2006100727098A
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English (en)
Chinese (zh)
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CN1848305A (zh
Inventor
中村雅一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzuki Wire (hongkong) Co Ltd
Misuzu K K
Original Assignee
Suzuki Wire (hongkong) Co Ltd
Misuzu K K
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Application filed by Suzuki Wire (hongkong) Co Ltd, Misuzu K K filed Critical Suzuki Wire (hongkong) Co Ltd
Publication of CN1848305A publication Critical patent/CN1848305A/zh
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Publication of CN1848305B publication Critical patent/CN1848305B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/4557—Plural coating layers
    • H01L2224/45572—Two-layer stack coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
CN2006100727098A 2005-04-06 2006-04-06 电子部件用导线以及由该导线构成的扁平电缆 Active CN1848305B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2005110003 2005-04-06
JP2005110003 2005-04-06
JP2005-110003 2005-04-06
JP2005207607 2005-07-15
JP2005-207607 2005-07-15
JP2005207607 2005-07-15
JP2006076122A JP2007046150A (ja) 2005-04-06 2006-03-20 電子部品用リード線及び該リード線よりなるフラットケーブル
JP2006-076122 2006-03-20
JP2006076122 2006-03-20

Publications (2)

Publication Number Publication Date
CN1848305A CN1848305A (zh) 2006-10-18
CN1848305B true CN1848305B (zh) 2010-08-18

Family

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Family Applications (1)

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CN2006100727098A Active CN1848305B (zh) 2005-04-06 2006-04-06 电子部件用导线以及由该导线构成的扁平电缆

Country Status (3)

Country Link
JP (1) JP2007046150A (ja)
CN (1) CN1848305B (ja)
HK (1) HK1096194A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101051535B (zh) * 2006-04-06 2012-09-19 日立电线株式会社 配线用导体及其制造方法、终端连接部、无铅焊锡合金
CN101308713B (zh) * 2007-05-16 2012-04-11 住友电气工业株式会社 扁平电缆
JP5479766B2 (ja) * 2008-03-31 2014-04-23 古河電気工業株式会社 接続部品用金属角線材およびその製造方法
JP5479767B2 (ja) * 2008-03-31 2014-04-23 古河電気工業株式会社 接続部品用金属角線材およびその製造方法
JP5181876B2 (ja) * 2008-06-30 2013-04-10 住友電気工業株式会社 フラットケーブルの製造方法
CN102575369B (zh) * 2009-06-29 2015-08-05 Om产业股份有限公司 电气元件的制造方法和电气元件
CN102082001B (zh) * 2009-11-30 2013-12-18 住友电气工业株式会社 扁平电缆及其制造方法
JP2012124025A (ja) * 2010-12-08 2012-06-28 Hitachi Cable Ltd めっき被覆銅線およびその製造方法
CN103103525B (zh) * 2012-11-26 2016-02-03 晶锋集团股份有限公司 一种镀层中不含铅的铝导线的制造方法
WO2015147213A1 (ja) * 2014-03-26 2015-10-01 新日鉄住金マテリアルズ株式会社 導電体及び太陽電池用インターコネクター
CN104392773B (zh) * 2014-11-13 2016-06-08 无锡信大气象传感网科技有限公司 铜合金导电线和制造方法
JP6839952B2 (ja) * 2016-10-05 2021-03-10 Ｄｏｗａメタルテック株式会社 Ｓｎめっき材およびその製造方法
CN109509731A (zh) * 2017-09-14 2019-03-22 屏东科技大学 半导体的锡银接合结构及其制造方法
CN111261317B (zh) * 2020-04-09 2021-08-31 江东合金技术有限公司 一种特种电缆用高性能抗氧化铜导体材料的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330340A (ja) * 1998-05-21 1999-11-30 Hitachi Ltd 半導体装置およびその実装構造体
JP2000123637A (ja) * 1998-10-15 2000-04-28 Hitachi Cable Ltd 電子部品用リード
JP2000156450A (ja) * 1998-11-19 2000-06-06 Hitachi Cable Ltd 電子部品用リード
JP2002317295A (ja) * 2001-04-19 2002-10-31 Furukawa Electric Co Ltd:The リフロー処理Ｓｎ合金めっき材料、それを用いた嵌合型接続端子
JP2005048205A (ja) * 2003-07-29 2005-02-24 Fujikura Ltd フレキシブルフラットケーブル、フレキシブルプリント配線基板等の電解めっき端子部とコネクタ嵌合部の熱処理方法
JP4367149B2 (ja) * 2004-01-30 2009-11-18 日立電線株式会社 フラットケーブル用導体及びその製造方法並びにフラットケーブル

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CN1848305A (zh) 2006-10-18
HK1096194A1 (en) 2007-05-25
JP2007046150A (ja) 2007-02-22

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