HK1096194A1 - Electronic assembly wire and flat cable comprising same - Google Patents

Electronic assembly wire and flat cable comprising same

Info

Publication number
HK1096194A1
HK1096194A1 HK07103072.8A HK07103072A HK1096194A1 HK 1096194 A1 HK1096194 A1 HK 1096194A1 HK 07103072 A HK07103072 A HK 07103072A HK 1096194 A1 HK1096194 A1 HK 1096194A1
Authority
HK
Hong Kong
Prior art keywords
same
flat cable
electronic assembly
assembly wire
wire
Prior art date
Application number
HK07103072.8A
Other languages
English (en)
Inventor
Masakazu Nakamura
Original Assignee
Misuzu Co Ltd
Misuzu Seisen Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Misuzu Co Ltd, Misuzu Seisen Ltd filed Critical Misuzu Co Ltd
Publication of HK1096194A1 publication Critical patent/HK1096194A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/4557—Plural coating layers
    • H01L2224/45572—Two-layer stack coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Insulated Conductors (AREA)
  • Electroplating Methods And Accessories (AREA)
HK07103072.8A 2005-04-06 2007-03-22 Electronic assembly wire and flat cable comprising same HK1096194A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005110003 2005-04-06
JP2005207607 2005-07-15
JP2006076122A JP2007046150A (ja) 2005-04-06 2006-03-20 電子部品用リード線及び該リード線よりなるフラットケーブル

Publications (1)

Publication Number Publication Date
HK1096194A1 true HK1096194A1 (en) 2007-05-25

Family

ID=37849220

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07103072.8A HK1096194A1 (en) 2005-04-06 2007-03-22 Electronic assembly wire and flat cable comprising same

Country Status (3)

Country Link
JP (1) JP2007046150A (xx)
CN (1) CN1848305B (xx)
HK (1) HK1096194A1 (xx)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101051535B (zh) * 2006-04-06 2012-09-19 日立电线株式会社 配线用导体及其制造方法、终端连接部、无铅焊锡合金
CN101308713B (zh) * 2007-05-16 2012-04-11 住友电气工业株式会社 扁平电缆
JP5479766B2 (ja) * 2008-03-31 2014-04-23 古河電気工業株式会社 接続部品用金属角線材およびその製造方法
JP5479767B2 (ja) * 2008-03-31 2014-04-23 古河電気工業株式会社 接続部品用金属角線材およびその製造方法
JP5181876B2 (ja) * 2008-06-30 2013-04-10 住友電気工業株式会社 フラットケーブルの製造方法
WO2011001737A1 (ja) * 2009-06-29 2011-01-06 オーエム産業株式会社 電気部品の製造方法及び電気部品
CN102082001B (zh) * 2009-11-30 2013-12-18 住友电气工业株式会社 扁平电缆及其制造方法
JP2012124025A (ja) * 2010-12-08 2012-06-28 Hitachi Cable Ltd めっき被覆銅線およびその製造方法
CN103103525B (zh) * 2012-11-26 2016-02-03 晶锋集团股份有限公司 一种镀层中不含铅的铝导线的制造方法
JPWO2015147213A1 (ja) * 2014-03-26 2017-04-13 新日鉄住金マテリアルズ株式会社 導電体及び太陽電池用インターコネクター
CN104392773B (zh) * 2014-11-13 2016-06-08 无锡信大气象传感网科技有限公司 铜合金导电线和制造方法
JP6839952B2 (ja) * 2016-10-05 2021-03-10 Ｄｏｗａメタルテック株式会社 Ｓｎめっき材およびその製造方法
CN109509731A (zh) * 2017-09-14 2019-03-22 屏东科技大学 半导体的锡银接合结构及其制造方法
CN111261317B (zh) * 2020-04-09 2021-08-31 江东合金技术有限公司 一种特种电缆用高性能抗氧化铜导体材料的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330340A (ja) * 1998-05-21 1999-11-30 Hitachi Ltd 半導体装置およびその実装構造体
JP2000123637A (ja) * 1998-10-15 2000-04-28 Hitachi Cable Ltd 電子部品用リード
JP2000156450A (ja) * 1998-11-19 2000-06-06 Hitachi Cable Ltd 電子部品用リード
JP2002317295A (ja) * 2001-04-19 2002-10-31 Furukawa Electric Co Ltd:The リフロー処理Ｓｎ合金めっき材料、それを用いた嵌合型接続端子
JP2005048205A (ja) * 2003-07-29 2005-02-24 Fujikura Ltd フレキシブルフラットケーブル、フレキシブルプリント配線基板等の電解めっき端子部とコネクタ嵌合部の熱処理方法
JP4367149B2 (ja) * 2004-01-30 2009-11-18 日立電線株式会社 フラットケーブル用導体及びその製造方法並びにフラットケーブル

Also Published As

Publication number Publication date
CN1848305B (zh) 2010-08-18
JP2007046150A (ja) 2007-02-22
CN1848305A (zh) 2006-10-18

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