CN1829082A - 声表面波器件及多频移动电话 - Google Patents
声表面波器件及多频移动电话 Download PDFInfo
- Publication number
- CN1829082A CN1829082A CNA2005100334959A CN200510033495A CN1829082A CN 1829082 A CN1829082 A CN 1829082A CN A2005100334959 A CNA2005100334959 A CN A2005100334959A CN 200510033495 A CN200510033495 A CN 200510033495A CN 1829082 A CN1829082 A CN 1829082A
- Authority
- CN
- China
- Prior art keywords
- acoustic wave
- surface acoustic
- saw
- piezoelectric membrane
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 103
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000012528 membrane Substances 0.000 claims description 26
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 18
- 239000011787 zinc oxide Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 2
- 239000002210 silicon-based material Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 6
- 238000010295 mobile communication Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010327 methods by industry Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200510033495A CN1829082B (zh) | 2005-03-04 | 2005-03-04 | 声表面波器件及多频移动电话 |
US11/306,495 US7327069B2 (en) | 2005-03-04 | 2005-12-29 | Surface acoustic wave device and method for making same and mobile phone having same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200510033495A CN1829082B (zh) | 2005-03-04 | 2005-03-04 | 声表面波器件及多频移动电话 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1829082A true CN1829082A (zh) | 2006-09-06 |
CN1829082B CN1829082B (zh) | 2010-05-26 |
Family
ID=36943470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200510033495A Expired - Fee Related CN1829082B (zh) | 2005-03-04 | 2005-03-04 | 声表面波器件及多频移动电话 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7327069B2 (zh) |
CN (1) | CN1829082B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102386885A (zh) * | 2011-06-20 | 2012-03-21 | 清华大学 | 一种具有大机电耦合系数和低插入损耗的声表面波滤波器及其专用压电薄膜 |
CN105391420A (zh) * | 2015-12-03 | 2016-03-09 | 电子科技大学 | 一种具有低插入损耗的mems压电谐振器 |
CN107451572A (zh) * | 2017-08-07 | 2017-12-08 | 吴露 | 超声波指纹识别模组及电子设备 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100007444A1 (en) * | 2006-04-20 | 2010-01-14 | Anis Nurashikin Nordin | GHz Surface Acoustic Resonators in RF-CMOS |
US8143681B2 (en) * | 2006-04-20 | 2012-03-27 | The George Washington University | Saw devices, processes for making them, and methods of use |
US8018010B2 (en) * | 2007-04-20 | 2011-09-13 | The George Washington University | Circular surface acoustic wave (SAW) devices, processes for making them, and methods of use |
US20090124513A1 (en) * | 2007-04-20 | 2009-05-14 | Patricia Berg | Multiplex Biosensor |
JP5154285B2 (ja) * | 2007-05-28 | 2013-02-27 | 和彦 山之内 | 弾性境界波機能素子 |
US8960004B2 (en) | 2010-09-29 | 2015-02-24 | The George Washington University | Synchronous one-pole surface acoustic wave resonator |
CN113302841A (zh) * | 2019-01-18 | 2021-08-24 | 住友电气工业株式会社 | 接合体及表面弹性波器件 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3996535A (en) * | 1975-07-09 | 1976-12-07 | Rca Corporation | Microwave bulk acoustic delay device having two transducers on the same surface and method of making same |
JPS57145419A (en) * | 1981-03-05 | 1982-09-08 | Clarion Co Ltd | Surface acoustic wave element |
JPS59231911A (ja) * | 1983-06-14 | 1984-12-26 | Clarion Co Ltd | 表面弾性波素子 |
JPS6021862A (ja) * | 1983-07-18 | 1985-02-04 | 松下電器産業株式会社 | 高周波スパツタリング用タ−ゲツト |
JPS60124109A (ja) * | 1983-12-09 | 1985-07-03 | Clarion Co Ltd | 表面弾性波素子 |
JPS6116610A (ja) * | 1985-04-30 | 1986-01-24 | Clarion Co Ltd | 表面弾性波素子 |
JPS6318708A (ja) * | 1986-07-09 | 1988-01-26 | Fujitsu Ltd | 弾性表面波フイルタの周波数調整方法 |
JPH01114110A (ja) * | 1987-10-27 | 1989-05-02 | Fujitsu Ltd | 圧電薄膜弾性表面波装置 |
JPH02290316A (ja) * | 1989-06-23 | 1990-11-30 | Clarion Co Ltd | 表面弾性波素子 |
JP3168925B2 (ja) * | 1995-11-21 | 2001-05-21 | 株式会社村田製作所 | 表面波装置 |
JPH10209801A (ja) * | 1997-01-28 | 1998-08-07 | Murata Mfg Co Ltd | 表面波装置 |
US6127768A (en) * | 1997-05-09 | 2000-10-03 | Kobe Steel Usa, Inc. | Surface acoustic wave and bulk acoustic wave devices using a Zn.sub.(1-X) Yx O piezoelectric layer device |
JP3880150B2 (ja) * | 1997-06-02 | 2007-02-14 | 松下電器産業株式会社 | 弾性表面波素子 |
EP1282226A4 (en) * | 2000-03-24 | 2009-03-25 | Seiko Epson Corp | ACOUSTIC SURFACE WAVE ELEMENT |
US6566983B2 (en) * | 2000-09-02 | 2003-05-20 | Lg Electronics Inc. | Saw filter using a carbon nanotube and method for manufacturing the same |
US7011134B2 (en) * | 2000-10-13 | 2006-03-14 | Chien-Min Sung | Casting method for producing surface acoustic wave devices |
JP4817350B2 (ja) * | 2001-07-19 | 2011-11-16 | 株式会社 東北テクノアーチ | 酸化亜鉛半導体部材の製造方法 |
JP4038400B2 (ja) * | 2001-09-11 | 2008-01-23 | 日本碍子株式会社 | セラミック積層体、セラミック積層体の製造方法、圧電/電歪デバイス、圧電/電歪デバイスの製造方法及びセラミック焼結体 |
JP2004080408A (ja) * | 2002-08-19 | 2004-03-11 | Alps Electric Co Ltd | ラダー型sawフィルタ及びラダー型sawフィルタの製造方法 |
-
2005
- 2005-03-04 CN CN200510033495A patent/CN1829082B/zh not_active Expired - Fee Related
- 2005-12-29 US US11/306,495 patent/US7327069B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102386885A (zh) * | 2011-06-20 | 2012-03-21 | 清华大学 | 一种具有大机电耦合系数和低插入损耗的声表面波滤波器及其专用压电薄膜 |
CN105391420A (zh) * | 2015-12-03 | 2016-03-09 | 电子科技大学 | 一种具有低插入损耗的mems压电谐振器 |
CN107451572A (zh) * | 2017-08-07 | 2017-12-08 | 吴露 | 超声波指纹识别模组及电子设备 |
CN107451572B (zh) * | 2017-08-07 | 2020-07-03 | 成都亦道科技合伙企业(有限合伙) | 超声波指纹识别模组及电子设备 |
Also Published As
Publication number | Publication date |
---|---|
CN1829082B (zh) | 2010-05-26 |
US20060197408A1 (en) | 2006-09-07 |
US7327069B2 (en) | 2008-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170828 Address after: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee after: Shanghai State Intellectual Property Services Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Co-patentee before: HON HAI PRECISION INDUSTRY Co.,Ltd. Patentee before: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100526 |
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CF01 | Termination of patent right due to non-payment of annual fee |