CN1820307A - 用于构造硬盘驱动器的电连接以及构件装配 - Google Patents

用于构造硬盘驱动器的电连接以及构件装配 Download PDF

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CN1820307A
CN1820307A CNA038269449A CN03826944A CN1820307A CN 1820307 A CN1820307 A CN 1820307A CN A038269449 A CNA038269449 A CN A038269449A CN 03826944 A CN03826944 A CN 03826944A CN 1820307 A CN1820307 A CN 1820307A
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circuit
bonding pad
ball
circuit substrate
conductive material
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吴荔星
张流俊
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SAE Magnetics HK Ltd
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    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
    • G11B33/121—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules the apparatus comprising a single recording/reproducing device
    • G11B33/122—Arrangements for providing electrical connections, e.g. connectors, cables, switches
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/486—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls

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Abstract

本发明披露了一种电连接以及电耦合的方法。在一个实施例中，带有第一组电路的电路基底具有安装到电路板表面上的结合片。该结合片电耦合到该第一组电路。带有第二组电路的柔性电路基底具有安装到柔性电路基底的面对电路板表面的表面上的连接片。该连接片电耦合到第二组电路。导电材料球体安装到结合片上。夹紧装置将连接片压到导电材料球体。

Description

用于构造硬盘驱动器的电连接以及构件装配
技术领域
本发明涉及一种硬磁盘驱动器。更具体的，本发明涉及一种将柔性电路组件电耦合到电路板的方法。
背景技术
图1给出典型磁盘驱动器的示意。该典型磁盘驱动器具有磁头悬架组件(HGA)，该组件构造成从硬磁盘101进行读写。该HGA和硬磁盘101安装到主板103的基底102。通过主轴电动机104磁盘101相对于基底102旋转。该HGA一般具有致动器臂105和负载梁106。该HGA将磁性读/写滑块107支撑并定位在硬磁盘101的上方。该滑块可具有变换器以便执行读/写功能。通过致动器架109，该HGA相对于基底102沿着枢轴支承组件108的轴线旋转。该致动器架109具有由磁铁111驱动的致动器线圈110。中继柔性印刷电路112将板单元113连接到磁性读/写滑块107的变换器。来自该变换器的信号沿着中继柔性印刷电路112经由耦合到架109的印刷电路板(PCB)114传输。
柔性印刷电路组件112可利用许多不同的方法电耦合到印刷电路板114。图2给出根据现有技术的一种用于将柔性电路组件112电耦合到印刷电路板114的方法的示意。柔性印刷电路组件112的柔性基底201位于印刷电路板114的电路基底202的上方。电路基底202可以是刚性的或者柔性的。在此情形，结合片203安装到电路基底202上并且电耦合到印刷电路板114内的电路。连接片204安装到柔性基底201上并且电耦合到柔性电路组件112中的电路。结合片203和连接片204相对准。然后，将焊锡隆起205置于结合片203和连接片204上。该焊锡隆起205可具有铜芯206。然后使用加热的端头207以软熔焊锡隆起205。可使用激光或超声波能量加热该端头207。端头207以预定的时间段将柔性基底201压靠到电路基底202上，并且来自端头207的热量将相对的焊锡隆起205熔化到一起以形成粘结。铜芯206形成接触以产生电连接。
图3给出根据现有技术的将柔性电路组件112电耦合到印刷电路板114的可选方法的示意。柔性印刷电路组件112的柔性基底201位于印刷电路板14的电路基底202的上方。结合片203安装到电路基底202上并且电耦合到印刷电路板114内的电路。连接片204安装到柔性基底201上并且电耦合到柔性电路组件112内的电路。在此情形，结合片203和连接片204涂覆有金。将各向异性导电薄膜(ACF)施加到结合片203。结合片203和连接片204相对准。然后加热的端头207以预定的时间段将柔性基底201压靠到电路基底202上。来自端头207的热量将ACF熔化到连接片204以形成粘结。
激光加热的端头207的使用要求很高的精度。而且，执行该方法所需的工具也是非常昂贵的。在对准过程中要求的准确度也大大降低了该粘结过程的效率。
附图简要说明
图1给出典型磁盘驱动器的示意。
图2给出根据现有技术的将柔性电路组件电耦合到印刷电路板的一种方法的示意。
图3给出根据现有技术的将柔性电路组件电耦合到印刷电路板的一种可选方法的示意。
图4给出根据本发明的用于将柔性电路组件电耦合到印刷电路板的过程的一个实施例的示意。
图5给出根据本发明的用于将柔性电路组件电耦合到印刷电路板的过程的一个可选实施例的示意。
图6给出根据本发明的硬盘驱动器的电连接的一个实施例的截面示意。
图7给出根据本发明的MP3播放器的电连接的一个实施例的截面示意。
具体实施方式
这里披露了一种电连接以及电耦合的方法。在一个实施例中，带有第一组电路的电路基底具有安装到电路板表面上的结合片。该结合片电耦合到该第一组电路。带有第二组电路的柔性电路基底具有安装到柔性电路基底的面对电路板表面的表面上的连接片。该连接片电耦合到第二组电路。导电材料球体安装到结合片上。夹紧装置将连接片压靠到导电材料球体。这些结合片的相互连接放松了将连接片与结合片进行对准所要求的公差。这允许一定量的几何公差或者变形，并且在装配过程中容许有片缺陷。
图4给出根据本发明的用于将柔性电路组件电耦合到印刷电路板(PCB)的过程的一个实施例的示意。柔性印刷电路组件的柔性基底401位于安装到致动器架109的印刷电路板的电路基底402的上方。该电路基底402可以是刚性的或柔性的。结合片403安装到电路基底402的表面上并且电耦合到印刷电路板内的电路。连接片404安装到柔性基底401的面向电路基底的表面上并且电耦合到柔性电路组件内的电路。可将多于一个的结合片403安装到电路基底402上并且将适当数目的连接片404安装到柔性基底401上。结合片403和连接片404可由金制成，并且适当地对准。金属材料球405安装到每个结合片403。金属材料球405可由金制成。然后，夹紧装置406压迫连接片404使其接触金球405。夹紧装置可包括多种装置例如螺钉和螺母、销子或夹子中的任何一种。金球405在结合片403和连接片404之间产生电连接。
图5给出用于将柔性电路组件电耦合到印刷电路板的过程的一个可选实施例的示意。柔性印刷电路组件的柔性基底401位于安装到致动器架109的印刷电路板的电路基底402的上方。结合片403安装到电路基底402上并且电耦合到印刷电路板内的电路。连接片404安装到柔性基底401上并且电耦合到柔性电路组件内的电路。可将多于一个的结合片403安装到电路基底402上并且将适当数目的连接片404安装到柔性基底401上。在该实施例中，结合片403具有带铜芯的焊锡隆起501。结合片403和连接片404相对准。焊锡球502安装到每个结合片403。夹紧装置406压迫连接片404使其接触焊锡球502。如图4的实施例，夹紧装置406可包括多种装置例如螺钉和螺母、销子或夹子中的任何一种，焊锡球502在结合片403和连接片404之间产生电连接。
图6给出硬盘驱动器601的电连接的一个实施例的截面示意。柔性印刷电路组件的柔性基底401位于安装到致动器架109的印刷电路板的电路基底402的上方。结合片403安装到电路基底402上并且电耦合到印刷电路板内的电路。连接片404安装到柔性基底401上并且电耦合到柔性电路组件内的电路。将多于一个的结合片403安装到电路基底402上并且将相等数目的连接片404安装到柔性基底401上。结合片403具有带铜芯的焊锡隆起501。结合片403和连接片404相对准。焊锡球502安装到每个结合片403。在该实施例中，利用螺钉602和螺母603保持连接片404与焊锡球502相接触。该电连接可用于电耦合硬驱(hard drive)的任何两个部件，例如将板单元电耦合到主轴电动机。
图7给出MP3播放器701的电连接的一个实施例的截面示意。柔性印刷电路组件的柔性基底401位于安装到致动器架109的印刷电路板的电路基底402的上方。该电路基底402可以是刚性的或柔性的。结合片403安装到电路基底402上并且电耦合到印刷电路板内的电路。连接片404安装到柔性基底401上并且电耦合到柔性电路组件内的电路。可将多于一个的结合片403安装到电路基底402上，并且将相等数目的连接片404安装到柔性基底401上。结合片403和连接片404可以是金片。结合片403和连接片404相对准。金球405安装到每个结合片403。在该实施例中，利用弹簧夹702保持连接片404与金球405相接触。

Claims (20)

1.一种电路组件，包括：
带有第一组电路的电路基底；
安装到所述电路基底的表面的结合片，该结合片电耦合到所述第一组电路；
带有第二组电路的柔性电路基底；
安装到所述柔性电路基底的面对电路板表面的表面上的连接片，并且该连接片电耦合到所述第二组电路；
安装到所述结合片上的导电材料球体；以及
用于将所述连接片压到所述导电材料球体的夹紧装置。
2.根据权利要求1所述的电路组件，其中所述导电材料球体由金制成。
3.根据权利要求1所述的电路组件，其中所述导电材料球体为焊锡。
4.根据权利要求1所述的电路组件，其中所述结合片涂覆有金。
5.根据权利要求1所述的电路组件，其中所述将焊锡隆起置于所述结合片上。
6.根据权利要求1所述的电路组件，还包括：
耦合到所述电路基底表面的多个结合片；
耦合到所述柔性电路基底的面对所述电路板表面的表面上的多个连接片；以及
安装到每个结合片上的导电材料球体。
7.根据权利要求1所述的电路组件，其中所述夹紧装置是包括螺钉和螺母、销子和夹子的组中的一个。
8.一种硬盘驱动器，包括：
用于存储数据的磁盘；
具有用于从所述磁盘读取数据的磁变换器的滑块；
用于将所述滑块悬挂在所述磁盘上方的磁头万向架组件；
用于相对于所述磁盘移动所述磁头万向架组件的音圈电动机；
带有第一组电路以控制所述磁变换器和所述音圈电动机的电路基底；
安装到所述电路基底的表面的结合片，该结合片电耦合到所述第一组电路；
带有第二组电路的柔性电路基底；
耦合到所述柔性电路基底的面对电路板表面的表面上的连接片，且该连接片电耦合到所述第二组电路；
安装到所述结合片上的导电材料球体；以及
用于将所述连接片压到所述导电材料球体的夹紧装置。
9.根据权利要求8所述的硬盘驱动器，其中所述导电材料球体由金制成。
10.根据权利要求8所述的硬盘驱动器，其中所述导电材料球体为焊锡。
11.根据权利要求8所述的硬盘驱动器，其中所述结合片涂覆有金。
12.根据权利要求8所述的硬盘驱动器，其中所述焊锡隆起被置于所述结合片上。
13.根据权利要求8所述的硬盘驱动器，还包括：
耦合到所述电路基底表面的多个结合片；
耦合到所述柔性电路基底的面对电路板表面的表面上的多个连接片；以及
安装到每个结合片上的导电材料球体。
14.根据权利要求8所述的硬盘驱动器，其中所述夹紧装置是包括螺钉和螺母、销子和夹子的组中的一个。
15.一种方法，包括：
将结合片安装到电路基底表面；
电耦合所述电路基底的第一组电路；
将连接片安装到柔性电路基底的面对电路板表面的表面上；
电耦合所述柔性电路基底的第二组电路；
将导电材料球体安装到所述结合片上；以及
将所述连接片夹紧到导电材料球体。
16.根据权利要求15所述的方法，其中所述导电材料球体由金制成。
17.根据权利要求15所述的方法，其中所述导电材料球体为焊锡。
18.根据权利要求15所述的方法，其中所述结合片镀有金。
19.根据权利要求15所述的方法，其中将焊锡隆起置于所述结合片上。
20.根据权利要求15所述的方法，还包括：
将多个结合片耦合到所述电路板表面；
将多个连接片耦合到所述柔性电路基底的面对所述电路基底表面的表面；以及
将导电材料球体安装到每个结合片上。
CNB038269449A 2003-08-21 2003-08-21 用于构造硬盘驱动器的电路组件及其方法 Expired - Fee Related CN100380450C (zh)

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