CN1805131A - Liquid-cooled heat sink - Google Patents
Liquid-cooled heat sink Download PDFInfo
- Publication number
- CN1805131A CN1805131A CN 200510032796 CN200510032796A CN1805131A CN 1805131 A CN1805131 A CN 1805131A CN 200510032796 CN200510032796 CN 200510032796 CN 200510032796 A CN200510032796 A CN 200510032796A CN 1805131 A CN1805131 A CN 1805131A
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- Prior art keywords
- liquid
- reserve tank
- heat
- radiator
- liquid reserve
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Abstract
The invention relates to a liquid cooling heat radiation device, which comprises a heat radiator contacting the heating electric element, a liquid storage bank containing the liquid and at least one heat pipe. Wherein, the liquid storage bank is independent from the heat radiator and mounted on the frame; one end of heat pipe is connected to the heat radiator, while another end is connected to the liquid storage bank and dipped in the liquid. The invention has simple structure, lower cost, less noise and better heat radiation effect.
Description
[technical field]
The invention relates to a kind of heat abstractor, particularly about a kind of liquid-cooling heat radiator that is used for computer system heat radiation.
[background technology 1
The more and more miniaturization of volume of and electronic product increasing along with the caloric value of electronic components such as central processing unit, the restriction of multiple factors such as traditional radiator is subjected to taking up room, cost, its heat dispersion is difficult to significantly promote, and noise problem receives publicity all the more simultaneously.Therefore, in the heat dissipation problem of PC product severe day by day today, utilize the vehicular heat sinking device of liquid once becoming the favorite of the research and the application in heat radiation field because of advantages such as low noises, and some liquid, as glassware for drinking water numerous advantages such as specific heat is big, pollution-free, cost is low are arranged, make liquid-cooling heat radiator in market, heat radiation field in the future, have more advantage.
At present, industry is also constantly released various liquid-cooling heat radiators.A kind of liquid-cooling heat radiator as No. 545870 exposure of TaiWan, China patent announcement, this heat abstractor comprises a radiator, a fan and a pumping device, this radiator is made up of body construction up and down, and have interconnected all multiloops, runner and pipeline or the like, and this fan and pumping device are all installed on this radiator, and its structure is very complicated, make trouble and cost height, unsafe problems such as occur easily leaking, overall weight is bigger, easily makes mainboard bear excess load and causes damaging.
The TaiWan, China patent announcement also discloses another kind of liquid-cooling heat radiator No. 555073, and this heat abstractor comprises box body and a pumping approaching with electronic component-sized, and by some pipelines box body and pumping is coupled together and to circulate therein for cooling liquid.Though the some dividing plates that are provided with in the box body can increase the heat exchange area with cooling liquid, the volume of this box body own is too little, and its heat exchange area that can provide can be very not big.In addition, box body mainly is outwards to distribute by the circulation of liquid from the heat that electronic component absorbs, and radiating rate is very limited.This device is from the electronic component heat absorption or outwards heat radiation is not very desirable.
In addition, aforementioned two patents all utilize pumping to drive the circulation of cooling liquid in heat abstractor, and not only pumping itself needs cost, and the work of pumping also needs extra power such as electric energy to drive, this causes that cost raises, and owing to use pumping, brings noise problem unavoidably.
[summary of the invention]
Technical problem to be solved by this invention be to provide a kind of simple in structure, cost is low, noise is little, the liquid-cooling heat radiator of good heat dissipation effect.
Technical problem to be solved by this invention is achieved through the following technical solutions: liquid-cooling heat radiator of the present invention, comprise that a radiator that contacts with heat-generating electronic elements, is loaded with liquid reserve tank and at least one heat pipe of liquid, this liquid reserve tank is independent of radiator and is installed in the suitable position of cabinet, this heat pipe one end is connected with radiator, and the other end is connected with liquid reserve tank and is soaked in its liquid.
Compared with prior art, liquid-cooling heat radiator of the present invention is combined by radiator, liquid reserve tank and heat pipe, and is simple in structure, easily manufactured, reduces manufacturing cost relatively, and liquid reserve tank is independent of radiator and by the heat pipe connection, its installing space is arranged in pairs or groups well; Next is that heat-storage medium in the liquid reserve tank does not circulate, and pipe joint is few, and the sealing cost is low; Moreover, need not in this heat abstractor pumping and fan etc. are set, its production cost is decreased and can not consume other energy, and significantly reduce the noise source; Also have, a part of heat is by radiator heat-dissipation in this heat abstractor, and to liquid reserve tank and by heat accumulation liquid heat accumulation, its quantity of heat storage is big by adopting heat pipes for heat transfer for another part heat, and liquid reserve tank is outwards heat radiation again, and heat radiation is stable, can reach best radiating effect.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is that liquid-cooling heat radiator of the present invention is installed on the stereoscopic-state figure in the cabinet.
Fig. 2 is a liquid-cooling heat radiator three-dimensional combination figure of the present invention.
Fig. 3 is a liquid-cooling heat radiator three-dimensional exploded view of the present invention.
[embodiment]
See also Fig. 1 to Fig. 3, liquid-cooling heat radiator 10 of the present invention comprises that the radiator 12, that carries out heat transmission on the electronic components such as central processing unit (figure does not show) that are installed in the cabinet 20 is independent of radiator 12 and is installed on the liquid reserve tank 14 of cabinet 20 suitable positions and connects several heat pipes 16 of this radiator 12 and storage tank 14 respectively by its two ends.
Above-mentioned radiator 12 comprises on the contact electronic component and is fixed in arranges the some radiating fins 122 that form on pedestal 120 on the circuit board 30 and this pedestal 120, also be provided with several grooves 124 on this pedestal 120, for the hot connection of above-mentioned heat pipe 16 1 ends.
Above-mentioned each heat pipe 16 has the evaporation section 162 that is connected with the pedestal 120 of above-mentioned radiator 12 and absorbs heat, is extended and a adiabatic section 164 between radiator 12 and liquid reserve tank 14 and extended by this adiabatic section 164 and to insert liquid reserve tanks 14 and to be soaked in a condensation segment 166 in the liquid in the liquid reserve tank 14 by this evaporation section 162.Wherein, laterally can suitably adjust in the degree of depth in these condensation segment 166 insertion liquid reserve tanks 14 and this opening 146 scopes, make distance and angle between above-mentioned radiator 12 and the liquid reserve tank 14 all can suitably adjust, thereby arrange in pairs or groups in the more convenient space of heat abstractor 10 in cabinet 20 in of installing.
In the present embodiment, the electronic component adstante febre that brings into operation, one part heat distributes by above-mentioned radiator 12, and another part heat is sent to liquid in the liquid reserve tank 14 by above-mentioned several heat pipes 16, carries out heat exchange by heat pipe 16 condensation segments 166 and liquid in the liquid reserve tank 14 and rejects heat in the liquid in the liquid reserve tank 14.Liquid in the liquid reserve tank 14 carries out heat exchange with the inwall of liquid reserve tank 14 again, and heat is transferred to liquid reserve tank 14 surfaces, and then utilizes the big radiating surface of liquid reserve tank 14 outer walls that heat is dispersed in the ambient air again.The heat that above-mentioned radiator 12 and liquid reserve tank 14 are distributed when being positioned at cabinet inside can be expelled to cabinet 20 outsides by system fan 40.
Among the present invention, liquid mainly is as a kind of heat-storage medium, and it does not circulate in heat abstractor 10, therefore, need not higher sealing cost, and pipe joint is few, is difficult for taking place problems such as leakage during use.In addition, need not to be provided with pumping and fan in this heat abstractor 10, its production cost is decreased and can not consume other energy, and significantly reduce the noise source.
Claims (8)
1. liquid-cooling heat radiator, comprise that a radiator that contacts with heat-generating electronic elements, is loaded with liquid reserve tank and at least one heat pipe of liquid, it is characterized in that: this liquid reserve tank is independent of radiator and is installed in the suitable position of cabinet, this heat pipe one end is connected with radiator, and the other end is connected with liquid reserve tank and is soaked in its liquid.
2. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: described liquid reserve tank is the cuboid cavity substantially, is loaded with water in it.
3. liquid-cooling heat radiator as claimed in claim 2 is characterized in that: described liquid reserve tank surface is provided with the little cuboid cavity that is connected with liquid reserve tank of an increase liquid reserve tank volume.
4. as each described liquid-cooling heat radiator in the claim 1 to 3, it is characterized in that: described liquid reserve tank outer wall is provided with fold or some fin.
5. liquid-cooling heat radiator as claimed in claim 4 is characterized in that: described liquid reserve tank inwall is provided with fold or some fin.
6. liquid-cooling heat radiator as claimed in claim 5 is characterized in that: described liquid reserve tank is provided with feed liquor valve and bleeder valve.
7. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: described liquid reserve tank is provided with an opening for above-mentioned heat pipe one end insertion, and this opening seals by a seal member after inserting heat pipe.
8. liquid-cooling heat radiator as claimed in claim 1 is characterized in that: described liquid reserve tank is located at the bottom of casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510032796XA CN100372107C (en) | 2005-01-10 | 2005-01-10 | Liquid-cooled heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200510032796XA CN100372107C (en) | 2005-01-10 | 2005-01-10 | Liquid-cooled heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1805131A true CN1805131A (en) | 2006-07-19 |
| CN100372107C CN100372107C (en) | 2008-02-27 |
Family
ID=36867061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200510032796XA Expired - Fee Related CN100372107C (en) | 2005-01-10 | 2005-01-10 | Liquid-cooled heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100372107C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101907908A (en) * | 2009-06-04 | 2010-12-08 | 富准精密工业(深圳)有限公司 | Electronic equipment and box thereof |
| CN104735958A (en) * | 2015-01-14 | 2015-06-24 | 深圳市英维克科技股份有限公司 | Liquid-cooling type heat pipe radiator |
| CN104932648A (en) * | 2015-07-17 | 2015-09-23 | 中国移动通信集团广东有限公司 | Water-cooled type heat pipe radiator and manufacturing method thereof |
| CN107979946A (en) * | 2016-10-24 | 2018-05-01 | 全球能源互联网欧洲研究院 | A kind of cooling system and method |
| CN108012501A (en) * | 2016-10-27 | 2018-05-08 | 昇业科技股份有限公司 | Hybrid Cooling Module with heat accumulation component |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002189535A (en) * | 2000-12-20 | 2002-07-05 | Hitachi Ltd | Liquid cooling system and personal computer using the same |
| CN2526979Y (en) * | 2002-01-11 | 2002-12-18 | 上海新东蒸发器有限公司 | Heat pipe radiator |
| CN2591667Y (en) * | 2002-10-22 | 2003-12-10 | 罗云 | Computer cooler |
| CN2658820Y (en) * | 2002-12-14 | 2004-11-24 | 张小樵 | CPU, power source water cooler of computer |
| CN2657080Y (en) * | 2003-11-14 | 2004-11-17 | 吉林大学 | Cooling device for computer heating element |
-
2005
- 2005-01-10 CN CNB200510032796XA patent/CN100372107C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101907908A (en) * | 2009-06-04 | 2010-12-08 | 富准精密工业(深圳)有限公司 | Electronic equipment and box thereof |
| CN101907908B (en) * | 2009-06-04 | 2013-03-13 | 富准精密工业(深圳)有限公司 | Electronic equipment and box thereof |
| CN104735958A (en) * | 2015-01-14 | 2015-06-24 | 深圳市英维克科技股份有限公司 | Liquid-cooling type heat pipe radiator |
| CN104932648A (en) * | 2015-07-17 | 2015-09-23 | 中国移动通信集团广东有限公司 | Water-cooled type heat pipe radiator and manufacturing method thereof |
| CN104932648B (en) * | 2015-07-17 | 2019-02-26 | 中国移动通信集团广东有限公司 | A kind of water-cooled heat-pipe radiator and its manufacturing method |
| CN107979946A (en) * | 2016-10-24 | 2018-05-01 | 全球能源互联网欧洲研究院 | A kind of cooling system and method |
| CN107979946B (en) * | 2016-10-24 | 2020-03-06 | 全球能源互联网欧洲研究院 | Cooling system and method |
| CN108012501A (en) * | 2016-10-27 | 2018-05-08 | 昇业科技股份有限公司 | Hybrid Cooling Module with heat accumulation component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100372107C (en) | 2008-02-27 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080227 Termination date: 20120110 |