CN104735958A - Liquid-cooling type heat pipe radiator - Google Patents
Liquid-cooling type heat pipe radiator Download PDFInfo
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- CN104735958A CN104735958A CN201510018311.5A CN201510018311A CN104735958A CN 104735958 A CN104735958 A CN 104735958A CN 201510018311 A CN201510018311 A CN 201510018311A CN 104735958 A CN104735958 A CN 104735958A
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Abstract
A liquid-cooling type heat pipe radiator comprises radiator substrates, heat pipe radiator bodies and a centralized cooling pipe, wherein the radiator substrates make contact with the surfaces of electronic components, the heat pipe radiator bodies are connected with the radiator substrates, and the centralized cooling pipe is connected with the multiple heat pipe radiator bodies. The heat pipe radiator bodies are arranged at intervals, and condensation sections of the heat pipe radiator bodies extend into the centralized cooling pipe in a sealed connection mode. The centralized cooling pipe comprises a cooling pipe body, a cooling liquid inlet pipe and a cooling liquid outlet pipe, wherein the cooling pipe body contains cooling liquid, and the cooling liquid inlet pipe and the cooling liquid outlet pipe are communicated with the interior of the cooling pipe body. The cooling liquid inlet pipe and the cooling liquid outlet pipe are connected with an external cooling liquid circulation system. By the adoption of the centralized cooling pipe, the heat pipe radiator bodies are cooled in a centralized mode at the same time, the cooling liquid circulates inside the centralized cooling pipe, and therefore the heat exchanging efficiency is improved.
Description
Technical field
The present invention relates to a kind of radiator, more particularly, relate to a kind of heat-pipe radiator.
Background technology
In electronic devices and components, in order to ensure the reliability service of device, a large amount of heat-pipe radiator that adopts dispels the heat.The volume of heat-pipe radiator and the reliability service of radiating effect to system have extreme influence.Air-cooled heat-pipe radiator is generally adopted in prior art.Although air-cooled heat-pipe radiator thermal conductivity is very high, but condensation segment adopts air-cooled mode to be taken away from hot intraductal working medium by heat, need to configure fan, and in order to ensure radiating effect, need for condensation segment cover fin is to expand area of dissipation, this takies a large amount of volume on the one hand, add the size of equipment, too increase fan in addition, efficiency is not high yet, also easy operation after affect radiating effect because of laying dust.
Liquid-cooled heat-pipe radiator is another kind of heat-pipe radiator, it is without the need to arranging fan, reduce installation volume, there is the advantage of low noise compared with air-cooled heat-pipe radiator simultaneously, notification number is that the Chinese invention patent of CN1805131A discloses a kind of liquid-cooling heat radiator, comprise a radiator contacted with heat-generating electronic elements, and be loaded with the liquid reserve tank of liquid and at least one heat pipe, this liquid reserve tank is independent of radiator, one end of heat pipe is connected with radiator, and the other end is connected with liquid reserve tank and is soaked in its liquid.The heat part that electronic component produces is by radiator heat-dissipation, and a part by heat accumulation liquid heat accumulation, outwards to be dispelled the heat by liquid reserve tank to liquid reserve tank by adopting heat pipes for heat transfer again, and heat radiation is stable.This radiator adopt liquid reserve tank strengthen radiating effect, this liquid reserve tank is outwards distributed by heat by natural heat dissipation, the heat accumulation liquid in liquid reserve tank and the side temperature of heat pipe contact high, opposite side temperature is low, non-uniform temperature, and radiating efficiency is low.
Summary of the invention
The object of this invention is to provide the liquid-cooled heat-pipe radiator that a kind of radiating efficiency is high.
To achieve these goals, the present invention takes following technical solution:
A kind of liquid-cooled heat-pipe radiator, comprises the radiator base plate, the heat-pipe radiator be connected with radiator base plate and the concentrated cooling water pipe be connected with multiple heat-pipe radiator that contact with electronic device surface; Described heat-pipe radiator is spaced, and the condensation segment of heat-pipe radiator stretches in described concentrated cooling water pipe, with described concentrated cooling water pipe and is tightly connected; Described concentrated cooling water pipe comprises cooling water pipe main body that cooling fluid is housed and goes out to manage with the cooling fluid inlet pipe be communicated with in described cooling water pipe main body and cooling fluid respectively, and described cooling fluid inlet pipe and cooling fluid go out pipe and be connected with the coolant circulation system of outside.
In the concentrated cooling water pipe of liquid-cooled heat-pipe radiator of the present invention, cooling fluid arrival end and cooling liquid outlet end are respectively arranged with shunt.
Be provided with spaced apart central dividing plate in the concentrated cooling water pipe of liquid-cooled heat-pipe radiator of the present invention, described central dividing plate is arranged along coolant flow direction, and the condensation segment of described heat-pipe radiator stretches to by the separated space of central dividing plate.
The heat-pipe radiator interval dislocation of liquid-cooled heat-pipe radiator of the present invention is connected with described concentrated cooling water pipe.
From above technical scheme, multiple heat-pipe radiator is connected with a concentrated cooling water pipe by the present invention, cooling water pipe is concentrated to be connected with external refrigeration fluid circulation, can simultaneously for multiple heat-pipe radiator carries out concentrating heat radiation by a concentrated cooling water pipe, adopt the cooling liquid of circulation low-temperature receiver, adopt the mode heat exchange of liquid convection between cooling fluid and the condensation end of heat-pipe radiator, heat density is high, comparatively natural heat dissipation efficiency is higher, and radiating effect is better.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention, simple introduction is done below by the accompanying drawing used required in embodiment or description of the prior art, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the embodiment of the present invention 1;
Fig. 2 is the structural representation along arrow A direction in Fig. 1;
Fig. 3 is the structural representation of the embodiment of the present invention 2;
Fig. 4 is the structural representation along arrow B direction in Fig. 3.
Embodiment
Describe the present invention below in conjunction with accompanying drawing; when describing the embodiment of the present invention in detail, for ease of illustrating, represent that the accompanying drawing of device architecture can be disobeyed general ratio and be done partial enlargement; and described schematic diagram is example, it should not limit the scope of protection of the invention at this.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, the clearly aid illustration embodiment of the present invention.
With reference to Fig. 1, liquid cooling heat-pipe radiator of the present invention, comprises radiator base plate 1, heat-pipe radiator 2 and concentrated cooling water pipe 3.Radiator base plate 1 contacts with electronic device surface to be dispelled the heat.Heat-pipe radiator 2 is connected with radiator base plate 1, same as the prior art, and heat-pipe radiator 2 comprises heat pipe evaporator section 2-1 and heat pipe condenser section 2-2, and heat-pipe radiator inwall is provided with capillary pipe structure.Heat pipe evaporator section 2-1 is connected with radiator base plate 1, and the heat on electronic device surface dispels the heat to heat pipe evaporator section 2-1 conduction by radiator base plate 1.Heat pipe condenser section 2-2 stretches in concentrated cooling water pipe 3, is tightly connected with concentrated cooling water pipe 3.The present embodiment adopts sealing nut 4 to be connected with concentrated cooling water pipe 3 by heat-pipe radiator 2, and the mode of welding also can be adopted between the two to be connected.Heat pipe condenser section can adopt the liquid cooling not producing phase transformation or the liquid cooling mode producing phase transformation.A concentrated cooling water pipe 3 is connected with multiple heat-pipe radiator 2.
Shown in composition graphs 2, concentrated cooling water pipe 3 of the present invention comprise cooling fluid is housed cooling water pipe main body 3-1, go out pipe 3-3 with the cooling fluid inlet pipe 3-2 that is communicated with in cooling water pipe main body 3-1 and cooling fluid, cooling fluid inlet pipe 3-2 and cooling fluid go out pipe 3-3 and are connected with outside coolant circulation system (not shown), make the cooling fluid of circulation cycle in cooling water pipe main body 1, thus the condensation segment of opposite heat tube radiator carries out cooling.As one embodiment of the present invention, in cooling water pipe main body 3-1, cooling fluid arrival end and cooling liquid outlet end are respectively arranged with shunt 3-4, shunt 3-4 is connected with cooling fluid inlet pipe 3-2, the cooling fluid entering concentrated cooling water pipe 3 from cooling fluid inlet pipe 3-2 is divided into the tributary flowing to different directions through shunt 3-4, to ensure that cooling fluid can each heat pipe condenser section of average flow direction, make the homogeneous temperature of each heat pipe condenser section.Spaced apart central dividing plate 3-5 is also set in concentrated cooling water pipe 3 simultaneously, central dividing plate 3-5 is arranged along coolant flow direction (vertical direction in Fig. 2), be some column spaces by concentrated cooling water pipe 3 interior separation, each row is upper arranges multiple heat-pipe radiator, heat-pipe radiator in concentrated cooling water pipe separates by central dividing plate 3-4, after cooling fluid enters concentrated cooling water pipe 3, streamwise enters in each row respectively, ensures that the condensation end (radiating end) of each heat-pipe radiator is cooled by the feed liquor temperature of same temperature.
Embodiment 2
With reference to Fig. 3 and Fig. 4, the present embodiment place different from embodiment 1 is: concentrate in cooling water pipe and do not arrange central dividing plate, cooling water pipe 3 is concentrated to be connected with multiple heat-pipe radiator 2, the dislocation of heat-pipe radiator 2 interval is arranged, the heat-pipe radiator 2 of cooling fluid through being staggeredly arranged entered in concentrated cooling water pipe 3 from shunt 3-3 flows to cooling fluid and goes out pipe 3-2, make the condensation end of each heat-pipe radiator can be cooled by the feed liquor temperature of same temperature as much as possible, ensure radiating effect.
Employing of the present invention concentrates cooling water pipe to carry out concentrating heat radiation to multiple heat-pipe radiator simultaneously, and liquid circulation circulates in concentrated cooling water pipe, once can dispel the heat for multiple electronic device, reduces the volume of heat-pipe radiator.Compared with air-cooled heat-pipe radiator, liquid cooling mode radiating and cooling is adopted to condensation segment, improves heat exchange efficiency, thus can the condensation end of shortening heat tube radiator, reduce integral heat pipe volume, thus reduce the manufacturing cost of heat-pipe radiator itself.
Above embodiment is only in order to illustrate that technical scheme of the present invention is not intended to limit, although with reference to above-described embodiment to invention has been detailed description, those of ordinary skill in the field are to be understood that, still can modify to the specific embodiment of the present invention or equivalent replacement, and not departing from any amendment of spirit and scope of the invention or equivalent replacement, it all should be encompassed among right of the present invention.
Claims (4)
1. a liquid-cooled heat-pipe radiator, comprises the radiator base plate, the heat-pipe radiator be connected with radiator base plate and the concentrated cooling water pipe be connected with multiple heat-pipe radiator that contact with electronic device surface;
It is characterized in that:
Described heat-pipe radiator is spaced, and the condensation segment of heat-pipe radiator stretches in described concentrated cooling water pipe, with described concentrated cooling water pipe and is tightly connected;
Described concentrated cooling water pipe comprises cooling water pipe main body that cooling fluid is housed and goes out to manage with the cooling fluid inlet pipe be communicated with in described cooling water pipe main body and cooling fluid respectively, and described cooling fluid inlet pipe and cooling fluid go out pipe and be connected with the coolant circulation system of outside.
2. liquid-cooled heat-pipe radiator according to claim 1, is characterized in that: in described concentrated cooling water pipe, cooling fluid arrival end and cooling liquid outlet end are respectively arranged with shunt.
3. liquid-cooled heat-pipe radiator according to claim 1 and 2, it is characterized in that: in described concentrated cooling water pipe, be provided with spaced apart central dividing plate, described central dividing plate is arranged along coolant flow direction, and the condensation segment of described heat-pipe radiator stretches to by the separated space of central dividing plate.
4. liquid-cooled heat-pipe radiator according to claim 1 and 2, is characterized in that: the dislocation of described heat-pipe radiator interval is connected with described concentrated cooling water pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510018311.5A CN104735958A (en) | 2015-01-14 | 2015-01-14 | Liquid-cooling type heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510018311.5A CN104735958A (en) | 2015-01-14 | 2015-01-14 | Liquid-cooling type heat pipe radiator |
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| CN104735958A true CN104735958A (en) | 2015-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510018311.5A Pending CN104735958A (en) | 2015-01-14 | 2015-01-14 | Liquid-cooling type heat pipe radiator |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017084338A1 (en) * | 2015-11-19 | 2017-05-26 | 中车株洲电力机车研究所有限公司 | Heat exchange device |
| CN107979962A (en) * | 2018-01-09 | 2018-05-01 | 无锡巨日电子科技有限公司 | Water-cooled circuit plate heat dissipating device |
| CN108601287A (en) * | 2018-02-11 | 2018-09-28 | 北京百度网讯科技有限公司 | Overhead refrigerating method and overhead refrigeration unit |
| CN112467170A (en) * | 2020-11-23 | 2021-03-09 | 国网北京市电力公司 | Heat radiator |
| CN112802811A (en) * | 2021-03-31 | 2021-05-14 | 度亘激光技术（苏州）有限公司 | Semiconductor device heat dissipation structure and preparation method thereof |
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| US20060039112A1 (en) * | 2004-08-20 | 2006-02-23 | Rintaro Minamitani | Liquid cooling system and an electronic apparatus applying the same therein |
| CN1777355A (en) * | 2005-08-18 | 2006-05-24 | 嘉善华昇电子热传科技有限公司 | Liquid-cooled column-shaped heat pipe radiator |
| CN1805131A (en) * | 2005-01-10 | 2006-07-19 | 富准精密工业(深圳)有限公司 | Liquid-cooled heat sink |
| CN101893921A (en) * | 2010-04-08 | 2010-11-24 | 山东高效能服务器和存储研究院 | Noise-free energy-saving server |
| CN102802384A (en) * | 2012-08-30 | 2012-11-28 | 中国北车集团大连机车研究所有限公司 | IGBT (Insulated Gate Bipolar Transistor) water cooling radiator |
| CN204598536U (en) * | 2015-01-14 | 2015-08-26 | 深圳市英维克科技股份有限公司 | Liquid-cooled heat-pipe radiator |
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2015
- 2015-01-14 CN CN201510018311.5A patent/CN104735958A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20060039112A1 (en) * | 2004-08-20 | 2006-02-23 | Rintaro Minamitani | Liquid cooling system and an electronic apparatus applying the same therein |
| CN1805131A (en) * | 2005-01-10 | 2006-07-19 | 富准精密工业(深圳)有限公司 | Liquid-cooled heat sink |
| CN1777355A (en) * | 2005-08-18 | 2006-05-24 | 嘉善华昇电子热传科技有限公司 | Liquid-cooled column-shaped heat pipe radiator |
| CN101893921A (en) * | 2010-04-08 | 2010-11-24 | 山东高效能服务器和存储研究院 | Noise-free energy-saving server |
| CN102802384A (en) * | 2012-08-30 | 2012-11-28 | 中国北车集团大连机车研究所有限公司 | IGBT (Insulated Gate Bipolar Transistor) water cooling radiator |
| CN204598536U (en) * | 2015-01-14 | 2015-08-26 | 深圳市英维克科技股份有限公司 | Liquid-cooled heat-pipe radiator |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017084338A1 (en) * | 2015-11-19 | 2017-05-26 | 中车株洲电力机车研究所有限公司 | Heat exchange device |
| CN107979962A (en) * | 2018-01-09 | 2018-05-01 | 无锡巨日电子科技有限公司 | Water-cooled circuit plate heat dissipating device |
| CN107979962B (en) * | 2018-01-09 | 2024-02-20 | 无锡巨日电子科技有限公司 | Water-cooled circuit board heat abstractor |
| CN108601287A (en) * | 2018-02-11 | 2018-09-28 | 北京百度网讯科技有限公司 | Overhead refrigerating method and overhead refrigeration unit |
| CN112467170A (en) * | 2020-11-23 | 2021-03-09 | 国网北京市电力公司 | Heat radiator |
| CN112802811A (en) * | 2021-03-31 | 2021-05-14 | 度亘激光技术（苏州）有限公司 | Semiconductor device heat dissipation structure and preparation method thereof |
| CN112802811B (en) * | 2021-03-31 | 2021-06-25 | 度亘激光技术（苏州）有限公司 | Semiconductor device heat dissipation structure and preparation method thereof |
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Application publication date: 20150624 |
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