CN2651942Y - Liquid circulating heat conductive radiator - Google Patents
Liquid circulating heat conductive radiator Download PDFInfo
- Publication number
- CN2651942Y CN2651942Y CN 02236224 CN02236224U CN2651942Y CN 2651942 Y CN2651942 Y CN 2651942Y CN 02236224 CN02236224 CN 02236224 CN 02236224 U CN02236224 U CN 02236224U CN 2651942 Y CN2651942 Y CN 2651942Y
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- heat
- liquid
- conducting
- radiating device
- liquid circulation
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Abstract
A heat conducting head contacting a heating element or a refrigerating element utilizes heating conducting liquid to adsorb heat adsorbed by the heat conducting head and is arranged on an external radiator through a heat conducting tube and drive provided by a liquid transfer pump for the liquid, which is remarkably characterized in that: a heat adsorption and conduction heat, a tube joint, a radiator and a liquid transfer pump are connected in series to form a hermetic liquid passageway. The liquid passageway is filled with heat conducting liquid. Due to the technical scheme, heat radiation and conduction can be effectively carried out to heating elements of different devices on various occasions, thus overcoming noise of traditional fan radiation and large size of radiating mechanisms.
Description
Affiliated technical field
The utility model relates to a kind of liquid circulation heat conducting and heat radiating device, especially the liquid circulation heat conducting and heat radiating device that dispels the heat with electronics.
Background technology
The patent No.: 99212818.8, title: a kind of microcomputer heat abstractor; Relate to a kind of liquid circulation heat-transfer device, can be used for the heat conduction and heat radiation of microcomputer.This patent structure comprises a pump, connecting tube system.Heat sink, heat abstractor are connected into the heat sink and the heat abstractor of a peripheral passage.
Summary of the invention
The purpose of this utility model provides aforesaid liquid circulating heat conduction and dissipation device application aspect semiconductor refrigerating and heat radiation and widely.
The technical scheme in the invention for solving the technical problem is: connect heat conduction head, radiator, liquid delivery pump successively by fluid pipeline, series connection forms the fluid path of a sealing.Paste on the heat generating components in the electronic installation and touched the heat conduction head, utilize heat-conducting liquid to draw the heat that the heat conduction head is drawn, promote heat-conducting liquid by liquid delivery pump and be directed to radiator through conveyance conduit, realization heat conduction circulation, paste on the refrigeration part in electronic installation and touch the heat that the heat conduction head utilizes heat-conducting liquid absorption radiator to collect, promote heat-conducting liquid by liquid delivery pump and be directed to heat conduction head realization kind of refrigeration cycle through conveyance conduit.
The beneficial effects of the utility model are; Owing to taked such scheme effectively to carry out heat conduction, overcome the bulky of noise that the conventional fan heat radiation brings and heat-conducting mechanism to the parts of the different device of multiple occasion.
Description of drawings
Further specify this usefulness is novel below in conjunction with drawings and Examples.
Fig. 1 is catenation principle figure of the present utility model
Fig. 2 is the conductive structure figure to the cold and hot two ends of semiconductor chilling plate
Fig. 3 is the radiator structure figure in water dispenser semiconductor chilling plate hot junction
Embodiment
In Fig. 1; Heat conduction head (1), pipeline (2), water tank (3), pump (4), radiating tube (5), fin (6).
The heat conduction head is the cavity of a hollow, and having a face at least is that thermal conductive surface and thermal conductive surface are the fluid path that vertical stratification is provided with labyrinth structure, and this fluid path connects two pipe joints that are arranged on a heat conduction outside wall surface of conducting.The thermal conductive surface of heat conduction head is a metal material.
Every covering device can be worn; A plurality of heat conduction heads of connecting.
Water tank (3) is that a box body the inside with sealing of water-in and water-out joint is marked with heat-conducting liquid, has the water filling port of a lid that can be tightly connected, a salable connection on water tank at least.
Pump (4) can be provided with water tank connects, and also can be that submerged type is arranged on the water tank the inside.Every cover system has a pump at least.
Heat pipe (5) is the metal tubes of complications, and heat pipe (5) outside wall surface and fin (6) paste and touch the formation radiator that is fixed together.Heat pipe can also be fit together by two sheet material and be shaped to pipeline and constitute radiator, and radiator can be that the multi-disc fin vertically passes and heat conduction is fixed on the heat pipe.
Pipeline (2) can be materials such as metal, plastics, rubber, utilizes pipeline that above-mentioned parts are connected successively and forms the fluid path of a sealing, the heat that the heat conduction head is drawn can be transported to radiator rapidly.
Heat carrier in the pipeline of above-mentioned sealing is oils or the liquid with antifreeze function.
Be a kind of kind of refrigeration cycle and heat radiation loop structure of semiconductor freezer in the embodiment of Fig. 2, also can only use at arbitrary end.The casing of part (8) refrigerator.Parts (7) are semiconductor chilling plates, and the A face is that chill surface, B face are heating faces.
The heat radiation circulation is; In order efficiently the heat of B face to be distributed, the thermal conductive surface of heat conduction head (1) pasted touch on the B face, utilize the liquid after pump will be heated to be transported to radiator, be dispersed into by fin in the air of refrigerator.
Kind of refrigeration cycle is; The thermal conductive surface of heat conduction head (1) pastes and touches on chill surface A, liquid delivery pump promotes heat-conducting liquid the heat delivery of collecting on the radiator is reached the purpose that reduces the temperature inside the box to the heat conduction head, and the radiator of being made up of the radiating tube fin in this application has been carried out the function of efficient heat absorption.
Be a kind of application on the semiconductor refrigerating water dispenser in the embodiments of figure 3, the A face of semiconductor chilling plate is a chill surface, its direct and cold water box conducting.In order efficiently the heat of B face to be distributed, the thermal conductive surface of heat conduction head (1) pasted touch on the B face, utilize pump to be transported to fin and to be dispersed in the outer air of cabinet by the pipeline back liquid of will heating.
Claims (8)
1, a kind of liquid circulation heat conducting and heat radiating device; On the heat generating components or refrigeration part be provided with the heat conduction head, it is characterized in that: connect heat conduction head, radiator, liquid delivery pump successively by pipeline, all coupling components form the fluid path of a sealing.
2, the described a kind of liquid circulation heat conducting and heat radiating device of claim 1, it is characterized in that: the heat conduction head is the cavity of a hollow, having a face at least is thermal conductive surface, be vertical stratification with thermal conductive surface and be provided with fluid path, this fluid path connects two pipe joints that are arranged on a heat conduction outside wall surface of conducting, and the thermal conductive surface of heat conduction head is a metal material.
3, the described a kind of liquid circulation heat conducting and heat radiating device of claim 1, it is characterized in that: every device can have a plurality of heat conduction heads.
4, by the described a kind of liquid circulation heat conducting and heat radiating device of claim 1, it is characterized in that: pump can be provided with water tank and connect, and also can be that submerged type is arranged on the water tank the inside, and every cover system has a pump at least.
5, by the described a kind of liquid circulation heat conducting and heat radiating device of claim 1, it is characterized in that: water tank is that a box body the inside with sealing of two pipe joints is marked with heat-conducting liquid, has a lid that can be tightly connected, a liquid injection port on water tank at least.
6, by the described a kind of liquid circulation heat conducting and heat radiating device of claim 1, it is characterized in that: heat pipe is the metal tubes of complications, and heat pipe outside wall surface and fin paste and touch the formation radiator that is fixed together.
7, by the described a kind of liquid circulation heat conducting and heat radiating device of claim 1, it is characterized in that: heat pipe can also be fit together by two sheet material and be shaped to pipeline and fin integrative-structure, and heat pipe has into water and two pipe joints of water outlet.
8, by the described a kind of liquid circulation heat conducting and heat radiating device of claim 1, it is characterized in that: the heat-conducting liquid in the pipeline of above-mentioned sealing is oils, water or the liquid with heat conduction antifreeze function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02236224 CN2651942Y (en) | 2002-05-23 | 2002-05-23 | Liquid circulating heat conductive radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02236224 CN2651942Y (en) | 2002-05-23 | 2002-05-23 | Liquid circulating heat conductive radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2651942Y true CN2651942Y (en) | 2004-10-27 |
Family
ID=34318959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02236224 Expired - Fee Related CN2651942Y (en) | 2002-05-23 | 2002-05-23 | Liquid circulating heat conductive radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2651942Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249400A (en) * | 2014-12-23 | 2017-10-13 | 火石工程有限公司 | Heat transfer unit (HTU) |
| CN108133919A (en) * | 2017-12-29 | 2018-06-08 | 加弘科技咨询(上海)有限公司 | Closed loop liquid cooling apparatus and its electronic equipment of application |
| CN109168298A (en) * | 2018-10-18 | 2019-01-08 | 中国科学院合肥物质科学研究院 | A kind of radiator for PCR detector temperature control system |
-
2002
- 2002-05-23 CN CN 02236224 patent/CN2651942Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249400A (en) * | 2014-12-23 | 2017-10-13 | 火石工程有限公司 | Heat transfer unit (HTU) |
| CN107249400B (en) * | 2014-12-23 | 2021-12-07 | 火石工程有限公司 | Heat transfer device |
| CN108133919A (en) * | 2017-12-29 | 2018-06-08 | 加弘科技咨询(上海)有限公司 | Closed loop liquid cooling apparatus and its electronic equipment of application |
| CN109168298A (en) * | 2018-10-18 | 2019-01-08 | 中国科学院合肥物质科学研究院 | A kind of radiator for PCR detector temperature control system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20041027 Termination date: 20100523 |