I276393 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種散熱裝置，特別係關於-種用於電腦系統散敎 式散熱裝置。 u ^ 【先前技術】 隨著中央處理器等電子元件的發熱量越來越大且電子產品的體積 越小型化，傳統的散熱器受到可佔用空間、成本等多種因素的制約，其 性能很難大幅提昇，同時噪音問題越發受到關注。因此，在pc產品的散= 問題日舰峻的今天’利用液體作為媒介的新型散熱裝置因低噪=優^二 度成為散熱領域的研究及應用之寵兒，並且某些液體，如水且有L熱大無 污染、成本低等衆多優點，使得液冷式散熱裝置於將來的散熱領域市場中更 具優勢。 目前，業界亦獨推出各種齡式散熱裝置。如巾華關專利公 545870號揭露之-種液冷式散熱裝£，該散熱裝置包括—散熱器、—風^ =抽^器’該散熱器由上下本體結構組成，並具有互相連接之諸多迴路^ 道及管路料，該風扇和抽水器皆於該散熱器上安裝，其結構非常複雜^ 造較麻煩且成本高，容易出現漏水等不安全問題，整體重量較大 承受過量負荷而導致損壞。板 中華民國相公告第55細號亦揭露另—驗冷式散錄置，該散 =包括與電子元件大小接近的盒體及一泵浦，並通過一些管線將盒體與栗浦 、接起來以供冷卻液體在其中循環。雖然盒體内設有的複數隔板可增加盘冷 =體的熱交換面積，但是該盒體本身體積太小，其所能提供的熱交換面積 Γ卜大散二盒體從電子元件處吸收的熱量主要是触液體的循環來向 很 =為有限。該裝置無論是從電子元件處贿妓向外散熱 不僅崎⑽循環， 1仏南本身力要成本’而且泵浦的工作還需要外部能源如電能來驅動，這 1276393 引起成本昇高，且由於使用泵浦，難免帶來噪音問題。 【發明内容】 本發明之目的在於提供_種結構簡單、成本低、噪音小、散熱效果好的 液冷式散熱裝置。 本發明液冷式散齡置，包括_與發熱電子元件細之餘器、一盛裝 有液體之餘液箱及至少-熱管，該儲液箱獨立於散熱器並安裝在機箱之適當 部位，該熱管一端與散熱器連接，另一端與儲液箱連接並浸泡於其液體中"。 本發明液冷式散熱裝置由散熱器、儲液箱及熱管組合而成，結構簡單， 製造方便，相對降低製造成本，且儲液箱獨立於散熱器並由熱管連接，其安 裝空間好搭配；其次是儲液箱中的儲熱介質不作循環流動，管路接頭少，密 封成本低；再者，携裝置中無需設置泵浦通 挫麵二丝解煙還有，在本散熱裝置中一 部分熱量由散熱器散熱，另一部分熱量由熱管傳熱至儲液箱並由儲熱液體儲 熱，其儲熱量大，儲液箱再向外散熱，散熱穩定，可以達到最佳散熱效果。 【實施方式】 凊參閱第一圖至第三圖，本發明液冷式散熱裝置10包括一安裝於機箱2〇 内的中央處理器等電子元件（圖未示）上進行散熱用之散熱器12、一獨立於 散熱器12並安裝於機箱2〇適當部位之儲液箱14及分別藉由其兩端連接該散 熱器12和儲水箱14之數個熱管16。 上述散熱器12包括一接觸電子元件上並固定於電路板3〇上之基座12〇及 該基座120上排列形成的複數散熱鰭片122，該基座12〇上還設有數個凹槽 124 ’供上述熱管μ—端熱性連接。 倚液箱14大體上呈長方體空腔，其具有較大容積以盛裝大量的液體，如 水。為了增大儲液箱14内部容積，其一表面上可設置一連通之小長方體空腔 140。儲液箱14一般安裝於機箱2〇之一端或一角落，以便節省機箱2〇内部的 空間’其底部可以作為機箱20外殼的一部分，也可以獨立於機箱20外殼，或 者固定於機箱2〇外殼的外部。儲液箱14上還設有一對連通機箱2〇外側之進液 1276393 閥142和放液閥144,以便機箱20搬運時亦可將其液體放出來，然後需要散熱 時可注入液體。該儲液箱14上還設有一可供上述熱管16另一端插入之開口 146 ’該開口146插入熱管16之後藉由一密封部件148進行密封。儲液箱14内、 外壁上形成褶皺149或者設有散熱片以進一步增加儲液箱14與其内盛裝的液 體及儲液箱14與其外的空氣間的熱交換面積。 上述每一熱管16具有與上述散熱器12的基座12〇連接而吸熱之一蒸發段 162、由該洛發段162延伸並位於散熱器12和儲液箱14之間的一絕熱段164及 由該絕熱段164延伸插入儲液箱14並浸泡於儲液箱14内的液體卡之一冷凝段 166。其中’該冷凝段166插入儲液箱14内的深度及該開口146範圍内橫向可 適當調整，使得上述散熱器12和儲液箱14之間的距離及角度皆可適當調整，春 從而更方便了安裝散熱裝置1〇於機箱20内的空間搭配。 本實施方式中，電子元件開始運行發熱時，其一部分熱量藉由上述散熱 器12散發，而另一部分熱量藉由上述數個熱管16傳送至儲液箱14内的液體， 通過熱管16冷凝段166與儲液箱14中的液體進行熱交換而將熱量釋放到儲液 箱14中的液體中。儲液箱14中的液體再與儲液箱14的内壁進行熱交換，將熱 轉移到儲液箱14表面，進而再利用儲液箱14外壁的較大散熱面將熱散發到周 圍的空氣中。上述散熱器12和儲液箱14位于機箱内部時所散發之熱量可通過 系統風扇40排出至機箱2〇外部。 本發明中，液體主要是作為一種儲熱介質，它不在散熱裝置1〇中作循拳 環，因此，無需較高的密封成本且使用時較安全。此外，本散熱裝置1〇中無 需設置泵浦及風扇，也使其生産成本有所降低且不會消耗其他能源，並大幅 減少噪音來源。 綜上所述，本發明確已符合發明專利之要件，遂依法提出專利申請。惟， 以上所述者僅為本發明之較佳實施例，自不能以此限制本案之申請專利範 圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 7 1276393 第一圖係本發明液冷式散熱裝置安裝於機箱内之立體狀態圖。 第二圖係本發明液冷式散熱裝置立體組合圖。 第三圖係本發明液冷式散熱裝置立體分解圖。 【主要元件符號說明】 液冷式散熱裝置 10 散熱器 12 基座 120 散熱鰭片 122 凹槽 124 儲水箱 14 小長方體空腔 140 進液閥 142 放液閥 144 開口 146 密封部件 148 褶皺 149 献管 16 蒸發段 162 絕熱段 164 冷凝段 166 機箱 20 電路板 30 系統風扇 40I276393 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat dissipating device, and more particularly to a diverging heat sink for a computer system. u ^ [Prior Art] With the increasing heat generation of electronic components such as central processing units and the smaller size of electronic products, traditional heat sinks are constrained by various factors such as space and cost, and their performance is difficult. Significantly improved, while noise issues have received more attention. Therefore, in the dispersion of pc products = the problem of today's ship, the new heat sink using liquid as a medium because of low noise = excellent second degree has become the darling of research and application in the field of heat dissipation, and some liquids, such as water and L The advantages of heat, pollution, and low cost make the liquid-cooled heat sink more advantageous in the future heat dissipation market. At present, the industry also introduces various age-type heat sinks. As disclosed in the Huaguan Patent No. 545870, the liquid-cooling type of heat-dissipating device includes a heat sink, a wind, a wind pump, and a heat sink. The heat sink is composed of an upper and lower body structure and has a plurality of interconnecting structures. The circuit and the pipeline material are installed on the radiator. The structure is very complicated. The construction is troublesome and the cost is high, and it is prone to unsafe problems such as water leakage. The overall weight is large and the load is excessive. damage. In the board of the Republic of China, the No. 55 number also reveals another - cold-type scatter recording, which includes a box body and a pump close to the size of the electronic components, and connects the box to the Lipu through some pipelines. The cooling liquid is circulated therein. Although the plurality of partitions provided in the casing can increase the heat exchange area of the disk cooling body, the volume of the casing itself is too small, and the heat exchange area that can be provided is absorbed by the electronic components. The heat is mainly limited to the circulation of the liquid. The device radiates heat from the electronic components, not only the Saki (10) cycle, but also the cost of the pump itself. The pumping work also requires external energy sources such as electric energy to drive. This 1273393 causes cost increase and is used due to Pumping, it is inevitable to bring noise problems. SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid-cooled heat sink having a simple structure, low cost, low noise, and good heat dissipation effect. The liquid-cooled type of the present invention comprises: a thinner device with a heat-generating electronic component, a residual liquid tank containing a liquid, and at least a heat pipe, the liquid storage tank being independent of the heat sink and mounted at an appropriate part of the chassis, One end of the heat pipe is connected to the radiator, and the other end is connected to the liquid storage tank and immersed in the liquid ". The liquid cooling heat dissipating device of the invention is composed of a heat sink, a liquid storage tank and a heat pipe, has a simple structure, is convenient to manufacture, relatively reduces the manufacturing cost, and the liquid storage tank is independent of the heat sink and is connected by the heat pipe, and the installation space is well matched; Secondly, the heat storage medium in the liquid storage tank is not used for circulation flow, the pipe joint is small, and the sealing cost is low; in addition, there is no need to set the pump through the frustration surface to dispel the smoke, and a part of the heat in the heat sink device The heat is dissipated by the heat sink, and the other part of the heat is transferred from the heat pipe to the liquid storage tank and stored by the heat storage liquid. The heat storage is large, and the liquid storage tank is further radiated outward, and the heat dissipation is stable, and the optimal heat dissipation effect can be achieved. [Embodiment] Referring to the first to third figures, the liquid-cooling heat sink 10 of the present invention includes a heat sink 12 for heat dissipation on an electronic component (not shown) such as a central processing unit mounted in the casing 2A. A liquid storage tank 14 independent of the radiator 12 and mounted to the appropriate portion of the casing 2, and a plurality of heat pipes 16 respectively connected to the radiator 12 and the water storage tank 14 by both ends thereof. The heat sink 12 includes a base 12 that contacts the electronic component and is fixed on the circuit board 3, and a plurality of heat dissipation fins 122 arranged on the base 120. The base 12 is further provided with a plurality of grooves. 124 'For the above heat pipe μ-end thermal connection. The reclining tank 14 is generally a rectangular parallelepiped cavity having a relatively large volume to hold a large amount of liquid, such as water. In order to increase the internal volume of the reservoir 14, a small rectangular parallelepiped cavity 140 may be provided on one surface thereof. The liquid storage tank 14 is generally installed at one end or a corner of the casing 2 to save space inside the casing 2'. The bottom portion can be used as a part of the casing 20 casing, or can be independent of the casing 20 casing, or fixed to the casing 2 casing. The outside. The liquid storage tank 14 is further provided with a pair of inlet liquid 1276393 valve 142 and a liquid discharge valve 144 which communicate with the outside of the casing 2 so that the liquid can be discharged when the casing 20 is handled, and then the liquid can be injected when heat is required. The liquid storage tank 14 is further provided with an opening 146' for inserting the other end of the heat pipe 16 into the heat pipe 16, and is sealed by a sealing member 148. Wrinkles 149 are formed in the inner and outer walls of the reservoir 14, or fins are provided to further increase the heat exchange area between the reservoir 14 and the liquid contained therein and the air reservoir 14 and the air outside it. Each of the heat pipes 16 has a heat-dissipating section 162 which is connected to the base 12 of the heat sink 12 and absorbs heat, and a heat insulating section 164 extending from the Luofa section 162 and located between the radiator 12 and the liquid storage tank 14 and A condensation section 166 of the liquid card inserted into the reservoir 14 and immersed in the reservoir 14 is extended by the adiabatic section 164. The depth of the condensation section 166 inserted into the liquid storage tank 14 and the lateral direction of the opening 146 can be appropriately adjusted, so that the distance and the angle between the radiator 12 and the liquid storage tank 14 can be appropriately adjusted, and the spring is more convenient. The space in which the heat sink 1 is mounted in the chassis 20 is matched. In this embodiment, when the electronic component starts to run hot, a part of the heat is dissipated by the heat sink 12, and another part of the heat is transferred to the liquid in the liquid storage tank 14 by the plurality of heat pipes 16, and the condensation section 166 is passed through the heat pipe 16. Heat is exchanged with the liquid in the reservoir 14 to release heat into the liquid in the reservoir 14. The liquid in the liquid storage tank 14 is then exchanged with the inner wall of the liquid storage tank 14 to transfer heat to the surface of the liquid storage tank 14, and then the heat is dissipated into the surrounding air by the large heat dissipating surface of the outer wall of the liquid storage tank 14. . The heat radiated from the heat sink 12 and the liquid storage tank 14 located inside the casing can be discharged to the outside of the casing 2 through the system fan 40. In the present invention, the liquid is mainly used as a heat storage medium, and it does not perform a punching ring in the heat dissipating device 1 因此, so that it does not require a high sealing cost and is safe to use. In addition, there is no need to install pumps and fans in the heat sink 1〇, which also reduces the production cost and consumes no other energy, and greatly reduces the noise source. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS 7 1276393 The first figure is a perspective view of a liquid-cooled heat sink of the present invention installed in a chassis. The second figure is a three-dimensional combination diagram of the liquid cooling heat sink of the present invention. The third figure is a perspective exploded view of the liquid cooling heat sink of the present invention. [Main component symbol description] Liquid-cooled heat sink 10 Heat sink 12 Base 120 Heat sink fin 122 Groove 124 Water tank 14 Small rectangular cavity 140 Inlet valve 142 Drain valve 144 Opening 146 Sealing member 148 Pleated 149 16 Evaporation section 162 Adiabatic section 164 Condensation section 166 Chassis 20 Circuit board 30 System fan 40