TW200624027A - Liquid cooling type heat dissipating device - Google Patents

Liquid cooling type heat dissipating device

Info

Publication number
TW200624027A
TW200624027A TW093141684A TW93141684A TW200624027A TW 200624027 A TW200624027 A TW 200624027A TW 093141684 A TW093141684 A TW 093141684A TW 93141684 A TW93141684 A TW 93141684A TW 200624027 A TW200624027 A TW 200624027A
Authority
TW
Taiwan
Prior art keywords
liquid cooling
cooling type
dissipating device
heat dissipating
type heat
Prior art date
Application number
TW093141684A
Other languages
Chinese (zh)
Other versions
TWI276393B (en
Inventor
Li He
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW93141684A priority Critical patent/TWI276393B/en
Publication of TW200624027A publication Critical patent/TW200624027A/en
Application granted granted Critical
Publication of TWI276393B publication Critical patent/TWI276393B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A liquid cooling type heat dissipating device includes a heat sink for contacting with a heat generating member, a case containing fluid, and at least one heat pipe. The case is installed in a computer enclosure and separated from the heat sink. One end of the heat pipe contacts the heat sink and the other end is dunk in the case.
TW93141684A 2004-12-31 2004-12-31 Liquid cooling type heat dissipating device TWI276393B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93141684A TWI276393B (en) 2004-12-31 2004-12-31 Liquid cooling type heat dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93141684A TWI276393B (en) 2004-12-31 2004-12-31 Liquid cooling type heat dissipating device

Publications (2)

Publication Number Publication Date
TW200624027A true TW200624027A (en) 2006-07-01
TWI276393B TWI276393B (en) 2007-03-11

Family

ID=38646244

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93141684A TWI276393B (en) 2004-12-31 2004-12-31 Liquid cooling type heat dissipating device

Country Status (1)

Country Link
TW (1) TWI276393B (en)

Also Published As

Publication number Publication date
TWI276393B (en) 2007-03-11

Similar Documents

Publication Publication Date Title
TW200605766A (en) Heat dissipating device
GB2430084A (en) Cooling electronic devices in computer systems
TWI265775B (en) Portable electronic device and heat dissipation method and cradle thereof
TW200619584A (en) Boiling chamber cooling device
TW200610482A (en) Heat pipe heatsink
ATE490553T1 (en) CLOSED AND PRESSURIZED LIQUID COOLING SYSTEM
TW200704356A (en) Thermal solution for portable electronic devices
TW200506587A (en) Heat sink for power device on computer motherboard
TW200614465A (en) Liquid metal thermal interface for an integrated circuit device
TW200707167A (en) Housing for a computer
ATE443289T1 (en) COOLER
TW200633630A (en) A structure for dissipating heat used in the flat panel display
TW577578U (en) Heat dissipation device of low flow resistance for notebook computer
WO2008073775A3 (en) System and method that dissipate heat from an electronic device
TW200624027A (en) Liquid cooling type heat dissipating device
US20080024993A1 (en) Electronic device having heat spreader
MY141920A (en) Heat sink pedestal with interface medium chamber
TW200724020A (en) Heat transfer cooling system
DE50214835D1 (en) COMPUTER CASE
TW200801429A (en) Heat dissipation device for display adapter card
WO2007127320A3 (en) Improved heat sink
TWM500441U (en) Heat conduction structure having flexible floating and sliding
TW200714180A (en) Heat dissipating device incorporating heat pipe
TWI265268B (en) Heat dissipating device incorporating heat pipe
TW200725233A (en) Heat dissipation device