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Publication date
Application filed by Foxconn Tech Co LtdfiledCriticalFoxconn Tech Co Ltd
Priority to TW93141684ApriorityCriticalpatent/TWI276393B/en
Publication of TW200624027ApublicationCriticalpatent/TW200624027A/en
Application grantedgrantedCritical
Publication of TWI276393BpublicationCriticalpatent/TWI276393B/en
Cooling Or The Like Of Electrical Apparatus
(AREA)
Abstract
A liquid cooling type heat dissipating device includes a heat sink for contacting with a heat generating member, a case containing fluid, and at least one heat pipe. The case is installed in a computer enclosure and separated from the heat sink. One end of the heat pipe contacts the heat sink and the other end is dunk in the case.
TW93141684A2004-12-312004-12-31Liquid cooling type heat dissipating device
TWI276393B
(en)