CN1787209A - Combined structure of electronic assembly with radiating apparatus - Google Patents
Combined structure of electronic assembly with radiating apparatus Download PDFInfo
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- CN1787209A CN1787209A CN 200410100294 CN200410100294A CN1787209A CN 1787209 A CN1787209 A CN 1787209A CN 200410100294 CN200410100294 CN 200410100294 CN 200410100294 A CN200410100294 A CN 200410100294A CN 1787209 A CN1787209 A CN 1787209A
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- electronic building
- heat abstractor
- building brick
- hole
- assembly
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Abstract
The invention relates a combined structure of electronic component and radiator, comprising: a locking component; an electronic component with a first hole; an insulating piece with a second hole, where the second hole is opposite to the first one; an insulating component, arranged in the first hole and comprising a channel; and a radiator, where the locking component locks in order the electronic component and the insulating piece through the insulating component to the radiator, therefore the insulating component insulates the electronic component from the radiator so as to avoid the defect of generating electric arc, spark or smoke, caused by conduction between the electronic component and the radiator in the traditional technique.
Description
Technical field
The present invention is about the combining structure of a kind of electronic building brick and heat abstractor, especially electronic building brick is locked in a kind of electronic building brick on the fin and the combining structure of heat abstractor.
Background technology
Along with computer industry develop rapidly and the trend of electronic installation diversification under, the integration of electronic building brick increases day by day on the circuit board, make that the insulation and the heat dissipation problem of electronic building brick are more important, especially the power transistor assembly that in device such as many control appliances, measuring instrument, electric equipment, computer peripheral equipment, must use, because its major function is signal processing or power drive, and normally handle more powerful signal, therefore the heat that is sent is bigger, more needs to handle insulation and the problem of dispelling the heat.
In general, the power transistor assembly usually can be by locking radiating effect with raising power transistor assembly on fin.See also Fig. 1, it shows that the conventional power transistors assembly is locked in the STRUCTURE DECOMPOSITION figure of fin.As shown in Figure 1, in conventional art, power transistor assembly 12 locks it on fin 14 by screw 11, in order to increase insulation and radiating effect, can be provided with insulating trip 13 between power transistor assembly 12 and the fin 14, and the two sides, front and back of insulating trip 13 all can be coated with thermal grease.Because insulating trip 13 is generally that the plastic material of thinner thickness constitutes and fin 14 is constituted by metal conductive materials, therefore in the process of assembling, regular meeting punctures or destroys around the hole 131 of insulating trip 13 when causing screw 11 to lock because assemble not very; Or bad because of hole 131 designs of insulating trip 13, cause the insulation distance deficiency, make power transistor assembly 12 in the process of operation, too high voltage causes electric arc, spark and smog by hole 131 direct and fin 14 conductings of insulating trip 13.Yet along with the lifting of the use power of power transistor assembly 12, such problem can be more beneficial serious, and remote-effects are to the stability of product facility.
Therefore, because existing defective in the aforementioned conventional technology, be necessary in fact to propose more effective insulation and locked instrument, be locked in insulation and radiating efficiency on the fin, guarantee the equipment quality in the hope of enhancement power transistor assembly at the assembling demand of power transistor assembly and fin.
Summary of the invention
The object of the present invention is to provide the combining structure of a kind of electronic building brick and heat abstractor, it can make between electronic building brick and the heat abstractor and insulate, to improve in the conventional art, because of the high pressure of power transistor assembly make the power transistor assembly via hole by screw and heat abstractor conducting, or because of the insulation distance deficiency directly via insulating trip hole and heat abstractor conducting, and cause the defective of electric arc, spark and smog.
To achieve the above object, the invention provides the combining structure of a kind of electronic building brick and heat abstractor, it comprises: a locked assembly; One electronic building brick, it has one first hole; One insulating trip, it has one second hole, and wherein this second hole is with respect to this first hole of this electronic building brick; One insulation assembly, it is arranged in this first hole of this electronic building brick, and has a passage; An and heat abstractor.Wherein, this locked assembly is locked in this heat abstractor with this electronic building brick and this insulating trip in regular turn by this passage of this insulation assembly, utilizes this insulation assembly to make between this electronic building brick and this heat abstractor and insulate.
The above-mentioned conception according to the present invention, wherein this locked assembly is a screw, with a locking hole of heat abstractor in tapping lock mutually.
The above-mentioned conception according to the present invention, wherein this locked assembly is screw and nut combination, a through hole that passes heat abstractor by screw is to lock with this nut.
The above-mentioned conception according to the present invention, wherein this electronic building brick is a power transistor assembly.
The above-mentioned conception according to the present invention, wherein this insulation assembly is a sleeve pipe.
The above-mentioned conception according to the present invention, wherein this insulation assembly comprises a sleeve pipe and a base.
The above-mentioned conception according to the present invention, wherein this heat abstractor also comprises a groove, with this base of ccontaining this insulation assembly.
The above-mentioned conception according to the present invention also comprises a fin, and it is located between this insulating trip and this electronic building brick, and has one the 3rd hole, and wherein the 3rd hole is with respect to this first hole of this electronic building brick.
The above-mentioned conception according to the present invention, wherein the area of this fin is less than the area of this insulating trip.
The above-mentioned conception according to the present invention, wherein this insulation assembly and this insulating trip are one-body molded.
The above-mentioned conception according to the present invention, wherein this heat abstractor is fixed on the circuit board.
The present invention further provides the combining structure of a kind of electronic building brick and heat abstractor, it comprises: a locked assembly; One heat abstractor, it has a through hole; Two electronic building bricks, it is located at the both sides of this heat abstractor, and has one first hole respectively; Two insulating trips, it is located at respectively between this heat abstractor and this electronic building brick, and has one second hole respectively, and wherein this second hole is with respect to this first hole of this electronic building brick; At least one insulation assembly, it is arranged in this first hole of described two electronic building bricks at least, and has a passage.Wherein, this locked assembly is locked in this heat abstractor with described two electronic building bricks and described two insulating trips in regular turn by this passage, utilizes this insulation assembly to make between described two electronic building bricks and this heat abstractor and insulate.
The above-mentioned conception according to the present invention, wherein this locked assembly is screw and nut combination, a through hole that passes heat abstractor by screw is to lock with this nut.
The above-mentioned conception according to the present invention, wherein this electronic building brick is a power transistor assembly.
The above-mentioned conception according to the present invention, wherein this insulation assembly is a sleeve pipe.
The above-mentioned conception according to the present invention, wherein this insulation assembly comprises a sleeve pipe and a base.
The above-mentioned conception according to the present invention, wherein this heat abstractor also comprises a groove, with this base of ccontaining this insulation assembly.
The above-mentioned conception according to the present invention, wherein this heat abstractor has circular hole or through hole always, with this base of ccontaining this insulation assembly.
The above-mentioned conception according to the present invention, wherein the length of this base of this insulation assembly equates in fact with the thickness of this heat abstractor.
The above-mentioned conception according to the present invention, wherein this heat abstractor is fixed on the circuit board.
Description of drawings
Fig. 1: it shows that the conventional power transistors assembly is locked in the STRUCTURE DECOMPOSITION figure of fin.
Fig. 2: it is the STRUCTURE DECOMPOSITION figure of first preferred embodiment of the present invention.
Fig. 3: it is the STRUCTURE DECOMPOSITION figure of second preferred embodiment of the present invention.
Fig. 4 (a): it is the STRUCTURE DECOMPOSITION figure of the 3rd preferred embodiment of the present invention.
Fig. 4 (b): it is the sectional side view of structure shown in Fig. 4 of the present invention (a).
Fig. 5: it is the STRUCTURE DECOMPOSITION figure of the 4th preferred embodiment of the present invention.
Fig. 6: it is the sectional side view of the 5th preferred embodiment of the present invention.
Fig. 7: it is the sectional side view of the 6th preferred embodiment of the present invention.
Wherein, description of reference numerals is as follows:
11 screws, 12 power transistor assemblies
13 insulating trips, 131 holes
14 fin, 121 holes
21 locked assemblies, 22 electronic building bricks
221 first holes, 23 insulating trips
231 second holes, 24 heat abstractors
241 through holes, 25 insulation assemblies
251 passages, 26 heat abstractors
261 grooves, 27 insulation assemblies
271 sleeve pipes, 272 bases
28 fin 281 the 3rd hole
29 nuts, 30 circuit boards
Embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back segment.Be understood that the present invention can have various variations on different aspects, its neither departing from the scope of the present invention, and explanation wherein and the icon usefulness that ought explain in itself, but not in order to restriction the present invention.
Below will be locked in heat abstractor with power transistor assembly coordinated insulation assembly is example, further specify the technology contents of the combining structure of electronic building brick of the present invention and heat abstractor, right other is locked in that any electronic building brick on the heat abstractor also can be used technology of the present invention and the purpose that reaches effective insulation, and its neither disclosed technical scope of the present invention and technological thought of taking off.
See also Fig. 2, it is the STRUCTURE DECOMPOSITION figure of first preferred embodiment of the present invention.As shown in Figure 2, the combining structure of electronic building brick of the present invention and heat abstractor comprises a locked assembly 21, an electronic building brick 22, an insulating trip 23, a heat abstractor 24 and an insulation assembly 25.Wherein, locked assembly 21 can be general screw commonly used or cooperates nut (not icon) to use, electronic building brick 22 has one first hole 221, insulating trip 23 has one second hole 231, insulation assembly 25 then is arranged in this first hole 221 of this electronic building brick 22, and has a passage 251, in this embodiment, insulation assembly 25 is the sleeve pipe of hollow form, it not only is located in this first hole 221 of this electronic building brick 22 and more passes second hole 231 of insulating trip 23, this passage 251 that this locked assembly 21 just can be by this insulation assembly 25 electronic building brick 22 and this insulating trip 23 are locked on this heat abstractor 24 in regular turn thus, and make and be able between electronic building brick 22 and the heat abstractor 24 insulate against the existence of insulation assembly 25.Thus,, also can not allow conducting between electronic building brick 22 and the heat abstractor 24 under high pressure conditions, the defective of the electric arc described in the prior art, spark and smog so just can not take place yet even electronic building brick 22 is to use.Through hole shown in Figure 2 241 in addition, in this embodiment, can have a through hole 241 or a groove on the heat abstractor 24, if then can utilize nut (not icon) to cooperate locked assembly 21 lockings.In addition, also can utilize a little groove (not icon) on the heat abstractor 24 to replace an end of right cylinder insulation assembly 25, and on heat abstractor 24, do tapping and make an end of itself and locked assembly 21 sealed, so also can reach same locking effect, and the use that can save nut.
In technology of the present invention, insulation assembly 25 can integrated mode be made with insulating trip 23.See also Fig. 3, it is the STRUCTURE DECOMPOSITION figure of second preferred embodiment of the present invention.In this embodiment, insulation assembly 25 is stretched out by the periphery of second hole 231 of insulating trip shown in Figure 2 23, also or the sleeve pipe of insulating trip 23 is directly gone out by insulating trip 23 pulls.Insulation assembly 25 also is arranged in first hole 221 of this electronic building brick 22, therefore, locked assembly 21 just can pass the passage 251 of this insulation assembly 25 and electronic building brick 22 is locked on heat abstractor 24, thus, not only can increase insulation distance, and can make and utilize insulating trip 23 and insulation assembly 25 between electronic building brick 22 and the heat abstractor 24 and effectively insulation.
See also Fig. 4 (a) and Fig. 4 (b), wherein Fig. 4 (a) is the STRUCTURE DECOMPOSITION figure of the 3rd preferred embodiment of the present invention, and Fig. 4 (b) is the sectional side view of structure shown in Fig. 4 of the present invention (a).Shown in Fig. 4 (a), in this embodiment, insulation assembly 27 is designed to comprise a sleeve pipe 271 and a base 272, form passages in its middle sleeve 271 and the base 272, and the sleeve pipe 271 of insulation assembly 27 is sheathed in second hole 231 of first hole 221 of electronic building brick 22 and insulating trip 23.In addition, heat abstractor 26 is provided with a groove 261, with the base 272 of ccontaining insulation assembly 27.Shown in Fig. 4 (b), locked assembly 21 can be locked in electronic building brick 22 and insulating trip 23 on the heat abstractor 26 by the passage by insulation assembly 27, and makes between electronic building brick 22 and the heat abstractor 26 and can insulate against the existence of insulation assembly 27.Via so design, the insulation effect between electronic building brick 22 and the heat abstractor 26 just can be strengthened, and therefore also just can prevent to produce between electronic building brick 22 and the heat abstractor 26 situation of unnecessary electric arc, spark or smog.
Certainly, in order further to promote the effect of heat radiation, the combining structure of electronic building brick of the present invention and heat abstractor more can comprise a fin.See also Fig. 5, it is the STRUCTURE DECOMPOSITION figure of the 4th preferred embodiment of the present invention.As shown in Figure 5, the combining structure of electronic building brick of the present invention and heat abstractor also comprises a fin 28 and is located between this insulating trip 23 and this electronic building brick 22, this fin 28 has one the 3rd hole 281, wherein the 3rd hole 281 is with respect to this first hole 221 of this electronic building brick 22, passes for the sleeve pipe 271 of insulation assembly 27.In this embodiment, add the conduction surface that can strengthen electronic building brick 22 behind the fin 28, so the heat that produced of electronic building brick 22 can reach just and help heat radiation on the heat abstractor 26 by fin 28, make more quick heat radiating of electronic building brick 22 thus.Yet, in this embodiment, can make the area of the area of fin 28, so that also be state of insulation between fin 28 and the heat abstractor 26 less than this insulating trip 23 in order more to guarantee between fin 28 and the heat abstractor 26 the conducting phenomenon is not arranged.
In addition, the combining structure of electronic building brick of the present invention and heat abstractor subtend two electronic building bricks that lock simultaneously also.See also Fig. 6, it is the sectional side view of the 5th preferred embodiment of the present invention.As shown in Figure 6, the combining structure of electronic building brick of the present invention and heat abstractor has a locked assembly 21, two electronic building bricks 22, two insulating trips 23, a heat abstractor 26 and two insulation assemblies 27.Electronic building brick 22 is arranged at the both sides of heat abstractor 26, and two insulating trips 23 are arranged at respectively between electronic building brick 22 and the heat abstractor 26, and two insulation assemblies 27 then are arranged at the both sides of heat abstractor 26 respectively, uses so that electronic building brick 22 and heat abstractor 26 insulation.In this embodiment, each insulation assembly 27 comprises a sleeve pipe 271 and a base 272, its middle sleeve 271 and the base 272 interior passages (not icon) that form, and the sleeve pipe 271 of insulation assembly 27 is sheathed in second hole 231 of first hole 221 of electronic building brick 22 and insulating trip 23, therefore, this locked assembly 21 just can be by the passage of insulation assembly 27, two electronic building bricks, 22 subtends are locked on the heat abstractor 26, and the isolation by this insulation assembly 27, just can effectively insulate between described two electronic building bricks 22 and this heat abstractor 26.Simultaneously, so design can also make full use of the space of heat abstractor 26, to set up electronic building brick under area identical.Certainly, in embodiment, locked assembly 21 can cooperate the mode of nut 29 to use by screw, so that whole group structure is more firm.In addition, in embodiments of the invention, electronic building brick 22 can be fixed in heat abstractor 26 and electronic building brick on the circuit board 30, as shown in Figure 6 after being fixed in heat abstractor 26 again.
See also Fig. 7, it is the sectional side view of the 6th preferred embodiment of the present invention.As shown in Figure 7, the combining structure of electronic building brick of the present invention and heat abstractor has a locked assembly 21, two electronic building bricks 22, two insulating trips 23, a heat abstractor 26 and an insulation assembly 27.Two electronic building bricks 22 are arranged at the both sides of heat abstractor 26 respectively, two insulating trips 23 are arranged at respectively between electronic building brick 22 and the heat abstractor 26, heat abstractor 26 then has circular hole or through hole always, 27 of insulation assemblies comprise a sleeve pipe 271 and a base 272, its middle sleeve 271 is stretched out by the both sides of base 272, the length of base 272 can or be slightly less than the thickness of heat abstractor 26 with the thickness of heat abstractor 26, makes the base 272 of insulation assembly 27 be arranged in the straight circular hole or through hole of heat abstractor 26.Also form a passage (not icon) in sleeve pipe 271 and the base 272, and the sleeve pipe 271 of insulation assembly 27 is sheathed in second hole 231 of first hole 221 of electronic building brick 22 and insulating trip 23, therefore, this locked assembly 21 just can be by the passage of insulation assembly 27, two electronic building bricks, 22 subtends are locked on the heat abstractor 26, and the isolation by this insulation assembly 27, just can effectively insulate between described two electronic building bricks 22 and this heat abstractor 26.Simultaneously, so design also can be in the space that makes full use of heat abstractor 26, to set up electronic building brick under area identical.Certainly, in embodiment, locked assembly 21 can cooperate the mode of nut 29 to use by screw, so that whole group structure is more firm.Heat abstractor 26 changes to straight circular hole or through hole not only can reach identical locking and insulation effect, and more can save and produce the bilateral man-hour that need respectively put an insulation assembly in the line operation, can reduce expense and save cost.
In sum, the combining structure of electronic building brick of the present invention and heat abstractor is mainly utilized insulation assembly to make between electronic building brick and the heat abstractor to insulate, and utilize locked assembly that all component is combined, to increase the insulation distance between electronic building brick and the heat abstractor, make the conducting of to switch between electronic building brick and the heat abstractor, can avoid the described generation electric arc of prior art fully, defective such as spark or smog, can firmly electronic building brick be installed on the heat abstractor again simultaneously, also can increase space availability ratio greatly, be enough to solve the many disadvantages described in the prior art.Therefore, the combining structure of electronic building brick of the present invention and heat abstractor has the value of industry.
The present invention must be thought and is to modify right neither disengaging protection scope of the present invention as all by the personage Ren Shi craftsman who knows this technology.
Claims (11)
1. the combining structure of electronic building brick and heat abstractor wherein comprises:
One locked assembly;
One electronic building brick, it has one first hole;
One insulating trip, it has one second hole, and wherein this second hole is with respect to this first hole of this electronic building brick;
One insulation assembly, it is arranged in this first hole of this electronic building brick, and has a passage; And
One heat abstractor;
Wherein, this locked assembly is locked in this heat abstractor with this electronic building brick and this insulating trip in regular turn by this passage of this insulation assembly, utilizes this insulation assembly to make between this electronic building brick and this heat abstractor and insulate.
2. the combining structure of electronic building brick as claimed in claim 1 and heat abstractor is characterized in that this locked assembly is a screw, or also comprises a nut.
3. the combining structure of electronic building brick as claimed in claim 1 and heat abstractor is characterized in that this electronic building brick is a power transistor assembly.
4. the combining structure of electronic building brick as claimed in claim 1 and heat abstractor is characterized in that this insulation assembly is a sleeve pipe, or is a sleeve pipe and a base.
5. the combining structure of electronic building brick as claimed in claim 4 and heat abstractor is characterized in that this heat abstractor also comprises a groove, with this base of ccontaining this insulation assembly.
6. the combining structure of electronic building brick as claimed in claim 1 and heat abstractor, it is characterized in that also comprising a fin, it is located between this insulating trip and this electronic building brick, and has one the 3rd hole, wherein the 3rd hole is with respect to this first hole of this electronic building brick, and wherein the area of this fin less than the area of this insulating trip.
7. the combining structure of electronic building brick as claimed in claim 1 and heat abstractor it is characterized in that this insulation assembly and this insulating trip are one-body molded, and this heat abstractor is fixed on the circuit board.
8. the combining structure of electronic building brick and heat abstractor wherein comprises:
One locked assembly;
One heat abstractor, it has a through hole;
Two electronic building bricks, it is located at the both sides of this heat abstractor, and has one first hole respectively;
Two insulating trips, it is located at respectively between this heat abstractor and this electronic building brick, and has one second hole respectively, and wherein this second hole is with respect to this first hole of this electronic building brick; And
At least one insulation assembly, it is arranged in this first hole of described two electronic building bricks at least, and has a passage;
Wherein, this locked assembly is locked in this heat abstractor with described two electronic building bricks and described two insulating trips in regular turn by this passage, utilizes this insulation assembly to make between described two electronic building bricks and this heat abstractor and insulate.
9. the combining structure of electronic building brick as claimed in claim 8 and heat abstractor is characterized in that this insulation assembly comprises a sleeve pipe and a base.
10. the combining structure of electronic building brick as claimed in claim 9 and heat abstractor is characterized in that this heat abstractor also comprises a groove or a through hole, with this base of ccontaining this insulation assembly.
11. the combining structure of electronic building brick as claimed in claim 10 and heat abstractor is characterized in that the length of this base of this insulation assembly equates with the thickness of this heat abstractor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101002941A CN100380640C (en) | 2004-12-10 | 2004-12-10 | Combined structure of electronic assembly with radiating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101002941A CN100380640C (en) | 2004-12-10 | 2004-12-10 | Combined structure of electronic assembly with radiating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1787209A true CN1787209A (en) | 2006-06-14 |
| CN100380640C CN100380640C (en) | 2008-04-09 |
Family
ID=36784596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004101002941A Active CN100380640C (en) | 2004-12-10 | 2004-12-10 | Combined structure of electronic assembly with radiating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100380640C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101155498B (en) * | 2006-09-29 | 2010-05-12 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat radiating device |
| CN102306638A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Assembled radiating fin with transistor |
| CN102412214A (en) * | 2010-09-25 | 2012-04-11 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat dissipation device, and insulation component thereof |
| CN104039112A (en) * | 2013-03-07 | 2014-09-10 | 台达电子工业股份有限公司 | Heat dissipation module |
| CN111542201A (en) * | 2020-04-14 | 2020-08-14 | 珠海格力电器股份有限公司 | Assembly structure and aluminum radiator with same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE64808T1 (en) * | 1985-12-13 | 1991-07-15 | Hasler Ag Ascom | METHOD AND DEVICE FOR REMOVAL OF HEAT LOSS OF AT LEAST ONE ASSEMBLY OF ELECTRICAL ELEMENTS. |
| CN2065806U (en) * | 1989-12-21 | 1990-11-14 | 中国矿业大学 | Electronic device radiating device in explosion-proof casing |
| CN2281585Y (en) * | 1996-07-15 | 1998-05-13 | 董东甫 | Heat radiator for semiconductor devices in use of electric power industry |
| CN1253772C (en) * | 2003-12-04 | 2006-04-26 | 河海大学 | Process for the manufacture of CPU heat pipe radiator |
-
2004
- 2004-12-10 CN CNB2004101002941A patent/CN100380640C/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101155498B (en) * | 2006-09-29 | 2010-05-12 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat radiating device |
| CN102412214A (en) * | 2010-09-25 | 2012-04-11 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat dissipation device, and insulation component thereof |
| CN102412214B (en) * | 2010-09-25 | 2014-10-22 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat dissipation device, and insulation component thereof |
| CN102306638A (en) * | 2011-08-31 | 2012-01-04 | 昆山锦泰电子器材有限公司 | Assembled radiating fin with transistor |
| CN104039112A (en) * | 2013-03-07 | 2014-09-10 | 台达电子工业股份有限公司 | Heat dissipation module |
| CN111542201A (en) * | 2020-04-14 | 2020-08-14 | 珠海格力电器股份有限公司 | Assembly structure and aluminum radiator with same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100380640C (en) | 2008-04-09 |
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