CN101155498B - Combination structure of electronic component and heat radiating device - Google Patents
Combination structure of electronic component and heat radiating device Download PDFInfo
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- CN101155498B CN101155498B CN200610142318A CN200610142318A CN101155498B CN 101155498 B CN101155498 B CN 101155498B CN 200610142318 A CN200610142318 A CN 200610142318A CN 200610142318 A CN200610142318 A CN 200610142318A CN 101155498 B CN101155498 B CN 101155498B
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Abstract
The invention is a composite structure of electric components and a heat dissipating device, and which comprises a locking component with a head, a electric component with a first cavity, a dissipating device, and a first insulation component with a first opening and a second opening, wherein the first opening and the second opening, relative to the first cavity of the electric device, have a capacity groove between them. The locking component is locked on the heat dissipating device by the first opening of the first insulation component, the capacity groove, the second opening, and the firstcavity of the electric component. And the head of the locking component is contained in the capacity groove of the first insulation component, ensuring the heat of the locking component disconnected with other electric components surrounding.
Description
Technical field
The present invention relates to the combining structure of a kind of electronic building brick and heat abstractor, relate in particular to electronic building brick is locked in a kind of electronic building brick on the fin and the combining structure of heat abstractor.
Background technology
Along with developing rapidly of computer industry, require at electronic installation under the trend of diversification and miniaturization, the integration of electronic building brick increases day by day on the circuit board, make that the insulation and the heat dissipation problem of electronic building brick are more important, especially the power transistor that in device such as many control appliances, measuring instrument, electric equipment, computer peripheral equipment, must use, because its major function is signal processing or power drive, and normally handle more powerful signal, therefore the heat that is sent is bigger, just more needs to handle insulation and the problem of dispelling the heat.
In general, power transistor usually can be by locking radiating effect with the raising power transistor on fin.See also Fig. 1 and Fig. 2, it is respectively STRUCTURE DECOMPOSITION figure and side cutaway view that known power transistor assembly is locked in fin.As shown in Figure 1, in known technology, power transistor 13 is locked on the fin 16 by screw 11, packing ring 17 and nut 18, and utilize plastic bushing 12, insulating trip 14 and separator 15 in the structure that the sheet metal on the power transistor 13 131 and screw 11 and fin 16 obstructs are come, block the path that produces the spark effect thus, also avoided producing the voltage breakdown phenomenon therebetween.
But at electronic installation day by day under the situation of miniaturization; the quantity of electronic building brick will be more on the circuit board; arrangement each other is also more tight; and in known technology; when assembling is finished the head construction 111 of screw 11 expose outside plastic bushing 12 and be not subjected to any insulation assembly protect (as shown in Figure 2); in case rock accidentally when using electronic installation or collide; head construction 111 that screw 11 is exposed is contacted with adjacent other electronic building brick, and then be short-circuited even cause assembly to damage.
For preventing that said circumstances from taking place, known improvement method is to place an insulating trip with manual type outside screw 11, with screw 11 any contact taken place to block other electronic building brick, but insulating trip is not located owing to traditional artificial modes of emplacement, in case electronic installation rocks accidentally or collides, will make easily insulating trip break away from original position of placing and can't realize blocking other electronic building brick and screw 11 comes in contact, therefore known mode with artificial placement insulating trip can increase human cost, program and risk, can't make screw 11 and other adjacent component insulation again effectively, thereby it improves DeGrain.
Therefore, the problem that presses for solution at present just provides a kind of combining structure of improving the electronic building brick and the heat abstractor of above-mentioned known technology defective.
Summary of the invention
Main purpose of the present invention is to provide the combining structure of a kind of electronic building brick and heat abstractor, when locked assembly is locked in electronic building brick on the heat abstractor, the head of locked assembly will be placed in the storage tank of insulation assembly, make the head of locked assembly wherein avoid coming in contact with other electronic building brick on every side because of being placed in, thus solve in the known technology because of not have to completely cut off or isolated poor effect make locked assembly and on every side other electronic building brick touch easily and be short-circuited or the shortcoming of fault etc.
For achieving the above object, the invention provides the combining structure of a kind of electronic building brick and heat abstractor, it comprises: locked assembly, and it has head; Electronic building brick, it has first hole, first side and second side adjacent with this first side; First insulation assembly, it has first opening, second opening and sidewall, wherein, this first opening and this second opening form storage tank corresponding to this first hole and this sidewall of this electronic building brick, and the sidewall of this first insulation assembly contacts with this first side of this electronic building brick in fact, and protrudes with respect to second side of this electronic building brick; And heat abstractor; Wherein, this locked assembly is locked in this heat abstractor by this first hole of this first opening, this storage tank and this second opening and this electronic building brick of this first insulation assembly with this electronic building brick, and this head captured of this locked assembly is in this storage tank of this first insulation assembly, thereby this head of this locked assembly and other electronic building brick are on every side isolated.
According to conception of the present invention, wherein this locked assembly is a screw, and it comprises the body of rod that is connected with this head.
According to conception of the present invention, wherein this locked assembly also comprises nut, and it is arranged on the side of this heat abstractor, in order to be connected with this screw, so that this electronic building brick is locked on this heat abstractor.
According to conception of the present invention, wherein also comprise insulating trip, it is arranged between this heat abstractor and this electronic building brick, and has corresponding second hole of this first hole with this electronic building brick, with so that this electronic building brick and this heat abstractor mutually insulated.
According to conception of the present invention, wherein this heat abstractor has penetrating via, uses so that this body of rod of this screw passes through this penetrating via.
According to conception of the present invention, wherein also comprise second insulation assembly, it is arranged between this heat abstractor and this nut, with so that this heat abstractor insulate mutually with this nut.
According to conception of the present invention, wherein this electronic building brick is to be power transistor.
According to conception of the present invention, wherein this electronic building brick has the insulation-encapsulated structure.
According to conception of the present invention, wherein this first insulation assembly is to be cylindrical structure, comprises this first opening and this second opening, and the diameter of this first opening is in fact greater than this second opening.
According to conception of the present invention, wherein this second insulation assembly has the 3rd opening and the 4th opening with respect to this penetrating via of this heat abstractor, and the diameter of the 3rd opening is in fact less than the 4th opening.
According to conception of the present invention, wherein has storage tank between the 3rd opening of this second insulation assembly and the 4th opening, pass through this first opening of this first insulation assembly successively when this body of rod of this screw, this storage tank and this second opening, this of this electronic building brick first hole, this of this insulating trip second hole, this penetrating via of this heat abstractor and the 3rd opening of this second insulation assembly and when locking mutually with this nut, this nut is arranged in this storage tank of this second insulation assembly, thus make this nut of this locked assembly with other electronic building brick is isolated on every side.
According to conception of the present invention, wherein this electronic building brick has sheet metal.
According to conception of the present invention, wherein this first insulation assembly is to comprise first sleeve part and second sleeve part that is connected, this first sleeve part comprises this first opening and this storage tank, this second sleeve part has passage and this second opening, this passage is connected with this storage tank and this second opening, and the diameter of this first opening is in fact greater than this second opening.
According to conception of the present invention, wherein this second sleeve part is placed in this penetrating via of this second hole of this first hole, this insulating trip of this electronic building brick and this heat abstractor, with so that this body of rod of this screw and this electronic building brick and this heat abstractor insulate.
According to conception of the present invention, wherein this second insulation assembly has the 3rd opening and the 4th opening with respect to this penetrating via of this heat abstractor, and the diameter of the 3rd opening is in fact less than the 4th opening.
According to conception of the present invention, wherein has storage tank between the 3rd opening of this second insulation assembly and the 4th opening, pass through this first opening and this storage tank of this first sleeve part of this first insulation assembly successively when this body of rod of this screw, this passage of this second sleeve part and this second opening, this of this electronic building brick first hole, this of this insulating trip second hole, this penetrating via of this heat abstractor and the 3rd opening of this second insulation assembly and when locking mutually with this nut, this nut is arranged in this storage tank of this second insulation assembly, thereby makes this nut of this locked assembly and other electronic building brick isolation on every side.
According to conception of the present invention, wherein this heat abstractor is fixed on the circuit board.
Description of drawings
Fig. 1 is that known power transistor assembly is locked in the STRUCTURE DECOMPOSITION figure on the fin;
Fig. 2 is Fig. 1 assembling structure side pseudosection after finishing;
Fig. 3 is the STRUCTURE DECOMPOSITION figure of first preferred embodiment of the invention;
Fig. 4 is Fig. 3 assembling structure side pseudosection after finishing;
Fig. 5 (a)-5 (e) is the execution mode schematic diagram of first insulation assembly shown in Figure 3;
Fig. 6 is the STRUCTURE DECOMPOSITION figure of second preferred embodiment of the invention;
Fig. 7 is Fig. 6 assembling structure side pseudosection after finishing;
Fig. 8 (a)-8 (e) is the first insulation assembly execution mode schematic diagram shown in Figure 6; And
Fig. 9 (a)-9 (e) is Fig. 3 and the second insulation assembly execution mode schematic diagram shown in Figure 6.
Wherein, description of reference numerals is as follows:
11,31: screw 111: head construction
12: plastic bushing 13: power transistor
131,331: sheet metal 14: insulating trip
15: separator 16: fin
17,37: packing ring 18,38: nut
311: head 312: the body of rod
32,51,52,53,61,81,82,83: the first insulation assemblies
322: the second sleeve parts of 321: the first sleeve parts
323,611: the first openings 324,612: the second openings
325,532,613,633,832,932: storage tank 326: passage
33,62: electronic building brick 332,622: the first holes
34: 341: the second holes of insulating trip
361: 371: the four holes of penetrating via
531,831,931: enclosing cover 621: the insulation-encapsulated structure
63,91,92,93: the second insulation assemblies
632: the four openings of 631: the three openings
334: the second sides, 333: the first sides
328: sidewall 35: insulating bushing
Embodiment
Hereinafter, will the exemplary embodiments that embody feature of the present invention and advantage be described in detail.It is to be understood that do not depart from the scope of the present invention in, the present invention can have various multi-form variations, and explanation herein and being shown in is used in essence that the present invention will be described, but not in order to restriction the present invention.
Below will be locked in heat abstractor and be example in the storage tank of insulation assembly with power transistor assembly coordinated insulation assembly with the head captured of locked assembly, further specify the technology contents of the combining structure of electronic building brick of the present invention and heat abstractor, yet, other is locked in that any electronic building brick on the heat abstractor all can be used technology of the present invention and the purpose that reaches effective insulation, and it does not all break away from technical scope disclosed in this invention and technological thought.
See also Fig. 3 and Fig. 4, Fig. 3 is the STRUCTURE DECOMPOSITION figure of first preferred embodiment of the invention, Fig. 4 is Fig. 3 assembling structure side profile after finishing, as shown in Figure 3, the combining structure of electronic building brick of the present invention and heat abstractor mainly is made up of locked assembly, first insulation assembly 32, electronic building brick 33, insulating trip 34 and heat abstractor 36, wherein, locked assembly can be the combination of screw 31 and nut 38, screw 31 can comprise the head 311 and the body of rod 312 that is connected with this head 311, and 38 on nut and screw 31 are arranged at the two relative side of heat abstractor 36.
Although the electronic building brick of present embodiment 33 can be power transistor, but be not limited to this, it is typically provided with sheet metal 331, the heat energy that the time is produced in work in order to the electronic building brick 33 that leaves, to avoid electronic building brick 33 temperature when working too high, and has first hole 332 on the sheet metal 331, and electronic building brick 33 has first side 333 and second side 334 adjacent with first side 333, and first insulation assembly 32 comprises and is connected and is first sleeve part 321 of hollow form structure and second sleeve part 322, this first sleeve part 321 comprises first opening 323 and reaches by sidewall 328 formed storage tanks 325, and this second sleeve part 322 has second opening 324 and passage 326 (shown in Fig. 5 (a)), this passage 326 is connected with this storage tank 325 and this second opening 324, and the diameter of this first opening 323 is in fact greater than this second opening 324, thereby make this head 311 of screw 31 be placed in this storage tank 325, and the passage 326 that the body of rod 312 of screw 31 can be by second sleeve part 322 and run through this second opening 324 by this first opening 323.
Moreover, in the present embodiment, insulating trip 34 is arranged between electronic building brick 33 and the heat abstractor 36, be mainly used to make mutually insulated between electronic building brick 33 and the heat abstractor 36, and insulating trip 34 has these first hole, 332 corresponding one second holes 341 with electronic building brick 33, and heat abstractor 36 is fixed on the circuit board (not shown) and has penetrating via 361, in this preferred embodiment, also can comprise insulating bushing 35 between heat abstractor 36 and the insulating trip 34, in addition, between heat abstractor 36 and nut 38, also can comprise second insulation assembly, can be packing ring 37, insulating bushing 35 and packing ring 37 are arranged at the two opposite sides of heat abstractor 36 respectively and have penetrating via 361 corresponding the 3rd hole 351 and the 4th holes 371 with heat abstractor 36 respectively.
Number of assembling steps between electronic building brick of the present invention and the heat abstractor is first opening 323 and the storage tank 325 that passes first sleeve part 321 of first insulation assembly 32 by this body of rod 312 with this screw 31 successively, the passage 326 of second sleeve part 322 and second opening 324, first hole 332 on the sheet metal 331 of electronic building brick 33, second hole 341 of insulating trip 34, the 3rd hole 351 of insulating bushing 35, this penetrating via 361 of heat abstractor 36 and the 4th hole 371 of packing ring 37, be connected to nut 38 at last and the body of rod 312 is locked in the nut 38, thereby above-mentioned all component is combined (as shown in Figure 4), and then electronic building brick 33 is locked on the heat abstractor 36, to improve the effect of heat radiation.
Please consult Fig. 4 again, simultaneously, this head 311 of screw 31 will be placed in these storage tank 325 inside of first sleeve part 321 of first insulation assembly 32 fully, thereby this head 311 that makes screw 31 is able to other electronic building brick isolation on every side and avoids being short-circuited, and, the sidewall 328 of first insulation assembly 32 contacts with first side 333 of electronic building brick 33 in fact and protrudes with respect to second side 334, second sleeve part 322 will be placed in this first hole 332 of electronic building brick 33, this second hole 341 of insulating trip 34, in the 3rd hole 351 of insulating bushing 35 and this penetrating via 361 of heat abstractor 36, can make the sheet metal 331 and heat abstractor 36 insulation of this body of rod 312 with the electronic building brick 33 of screw 31, and insulating trip 34 and insulating bushing 35 are arranged at can reach between electronic building brick 33 and the heat abstractor 36 and make both isolated to avoid forming the effect of short circuit phenomenon, certainly, packing ring 37 is arranged at and can reaches the effect that completely cuts off both between nut 38 and the heat abstractor 36.
See also Fig. 5 (a)-5 (e) and Fig. 3 and Fig. 4; wherein; Fig. 5 (a)-5 (e) is the execution mode schematic diagram of the present invention's first insulation assembly shown in Figure 3; in the combining structure of electronic building brick of the present invention and heat abstractor; the execution mode of first insulation assembly 32 is not limited to mode shown in Figure 3; so long as when electronic building brick 33 is locked on the heat abstractor 36; just the head 311 of the screw 31 of locked assembly 31 can be placed in first insulation assembly in the storage tank 325; the scope that can make the head of locked assembly all to fall into the present invention to be protected with first insulation assembly that other electronic building brick on every side comes in contact; can select difform first insulation assembly 32 of use shown in Fig. 5 (a)-5 (e) according to the different demands of spatial configuration; 51; 52 or 53; and when implementing, can suitably adjust its setting angle to reach preferable insulation effect according to the actual disposition demand; wherein first insulation assembly 53 shown in Fig. 5 (d) also has enclosing cover 531; after the head 311 of screw 31 is placed in the storage tank 532 of this first insulation assembly 53, this enclosing cover 531 can be covered to reach better isolated effect (shown in Fig. 5 (e)).
See also Fig. 6 and Fig. 7, Fig. 6 is the STRUCTURE DECOMPOSITION figure of second preferred embodiment of the invention, Fig. 7 is the structure side pseudosection of Fig. 6 after having assembled, as shown in Figure 6, the electronic building brick of present embodiment and the combining structure of heat abstractor mainly are made up of locked assembly, first insulation assembly 61, electronic building brick 62, insulating trip 34, insulating bushing 35, heat abstractor 36 and second insulation assembly 63, wherein locked assembly is made up by screw 31 and nut 38 equally, and screw 31 body of rod 312 that comprises head 311 and be connected with this head 311.
Wherein, the structure of screw 31, nut 38, head 311, the body of rod 312, insulating trip 34, second hole 341, insulating bushing 35, the 3rd hole 351, heat abstractor 36 and penetrating via 361, position and the purpose that can realize and effect are set all in first preferred embodiment, describe in detail, therefore repeat no more.
In the present embodiment, electronic building brick 62 also can be power transistor, can comprise the insulation-encapsulated structure 621 and first hole 622, with so that this body of rod 312 of screw 31 pass through, because make by insulating material (not shown) such as plastics this insulation-encapsulated structure 621 and this first hole, 622 inside, therefore it can make the body of rod 312 and electronic building brick 62 and heat abstractor 36 insulation of screw 31, therefore first insulation assembly 61 in the present embodiment does not have described second sleeve part as first embodiment, it only is cylindrical structure and has corresponding first opening 611 and second opening 612, the diameter of this first opening 611 is equally greater than this second opening 612, this first opening 611 and this second opening 612 are corresponding to this first hole 622 of electronic building brick 62 and be formed with storage tank 613 between the two, the body of rod 312 of screw 31 is then inserted storage tank 613 by first opening 611 and is passed second opening 612, and the head 311 of screw 31 will be placed in the storage tank 613 less than the diameter of first opening 611 because of second opening 612.
Please consult Fig. 7 again; number of assembling steps between electronic building brick of the present invention and the heat abstractor is this first opening 611 that earlier this body of rod 312 of this screw 31 is passed successively first insulation assembly 61; this storage tank 613 and this second opening 612; first hole 622 of electronic building brick 62; this second hole 341 of insulating trip 34; the 3rd hole 351 of insulating bushing 35; the 3rd opening 631 of the penetrating via 361 of heat abstractor 36 and second insulation assembly 63; and when this nut 38 is inserted storage tank 633 by the 4th opening 632 of second insulation assembly 63 and nut 38 lock; so that above-mentioned all component is combined; and electronic building brick 62 is locked on the heat abstractor 36; this head 311 of screw 31 will be placed in these storage tank 613 inside of first insulation assembly 61 simultaneously; and nut 38 also is placed in this storage tank 633 (as shown in Figure 7) inside of second insulation assembly 63; thereby this head 311 of screw 31 and nut 38 are able to and other electronic building brick isolation on every side; thereby avoid being short-circuited to reach the purpose of insulation; certainly; the present invention is not limited to this execution mode; locked assembly in any combining structure that can make electronic building brick and heat abstractor is isolated with other electronic building brick on every side and is reached the mode of insulation, all meets the scope of institute of the present invention desire protection.
See also Fig. 8 and Fig. 9; Fig. 8 (a)-8 (e) is the execution mode schematic diagram of first insulation assembly shown in Figure 6; Fig. 9 (a)-9 (e) then is the execution mode schematic diagram of the present invention's second insulation assembly shown in Figure 6; in the combining structure of electronic building brick of the present invention and heat abstractor; first insulation assembly and second insulation assembly are not limited to use mode shown in Figure 6; as long as when electronic building brick 62 is locked on the heat abstractor 36; the head 311 of screw 31 can be placed in the storage tank 613 of first insulation assembly 61 and nut 38 also can be placed in this storage tank 633 (as shown in Figure 7) of second insulation assembly 63; the scope that can make first insulation assembly that this head 311 of screw 31 and nut 38 can't come in contact with other electronic building brick on every side and second insulation assembly all fall into the present invention to be protected; therefore; can select first insulation assembly 61 of the different modes shown in Fig. 8 (a)-8 (e) and Fig. 9 (a)-9 (e) equally according to the different demands of spatial configuration; 81; 82 and 83 or second insulation assembly 63; 91; 92 and 93; and when implementing, can suitably adjust its setting angle to reach preferable insulation effect; wherein; this first insulation assembly 83 shown in Fig. 8 (d) also can have enclosing cover 831 in addition; after the head 311 of screw 31 is placed in the storage tank 832 of this first insulation assembly 83; this enclosing cover 831 can be covered to reach better isolated effect (shown in Fig. 8 (e)); similarly; second insulation assembly 93 shown in Fig. 9 (d) also can have enclosing cover 931; after nut 38 is placed in the storage tank 932 of this second insulation assembly 93, this enclosing cover 931 can be covered, equally can more effective insulation effect protect nut 38 that it is not contacted with other electronic building brick on every side to reach better isolated effect (shown in Fig. 9 (e)).
Certainly, in order to prevent that the nut 38 in first preferred embodiment shown in Figure 3 from contacting with other electronic building brick on every side, second insulation assembly 63 shown in also can Fig. 9 (a)-Fig. 9 (e), 91,92 and 93 substitute this packing ring 37 in the first preferred embodiment of the invention, when nut 38 and screw 31 are locked in electronic building brick 33 on the heat abstractor 36, nut 38 can be placed in second insulation assembly 63,91, in 92 and 93 the storage tank, to reach the ccontaining and isolation effect that is had as this storage tank 325 in first insulation assembly 32, make nut 38 chance that contacts be arranged with other electronic building brick on every side.
In sum, the combining structure of electronic building brick of the present invention and heat abstractor not only can make between electronic building brick and the locked assembly and insulate, and can utilize locked assembly that all component is combined, the more important thing is under the spatial configuration that does not influence miniaturization originally, when electronic building brick is locked on the heat abstractor, by the mode of head captured in the storage tank of insulation assembly with locked assembly, make the head of locked assembly with other electronic building brick is isolated on every side, avoided in the known technology because of contacting with each other easily or being short-circuited even cause damaging because of the insulating trip displacement, the chance of fault, can firmly electronic building brick be installed on the heat abstractor again simultaneously, be enough to solve the many disadvantages in the prior art.Therefore, the combining structure of electronic building brick of the present invention and heat abstractor has the value of industry.
The above only is used to illustrate the preferred embodiments of the present invention, but not is intended to scope of patent protection of the present invention is limited, and the equivalence variation of using specification of the present invention and accompanying drawing content to be carried out, and all should be included in the scope of the present invention.
Claims (17)
1. the combining structure of electronic building brick and heat abstractor, it comprises:
Locked assembly, it has head;
Electronic building brick, it has first hole, first side and second side adjacent with this first side;
First insulation assembly, it has first opening, second opening and sidewall, wherein, this first opening and this second opening form storage tank corresponding to this first hole and this sidewall of this electronic building brick, and this sidewall of this first insulation assembly contacts with this first side of this electronic building brick, and protrudes with respect to this second side of this electronic building brick; And
Heat abstractor;
Wherein, this locked assembly is locked in this heat abstractor by this first hole of this first opening, this storage tank and this second opening and this electronic building brick of this first insulation assembly with this electronic building brick, and this head captured of this locked assembly is in this storage tank of this first insulation assembly, thereby this head of this locked assembly and other electronic building brick are on every side isolated.
2. the combining structure of electronic building brick as claimed in claim 1 and heat abstractor, wherein this locked assembly is a screw, it comprises the body of rod that is connected with this head.
3. the combining structure of electronic building brick as claimed in claim 2 and heat abstractor, wherein this locked assembly also comprises nut, and it is arranged on the side of this heat abstractor, in order to be connected with this screw, so that this electronic building brick is locked on this heat abstractor.
4. the combining structure of electronic building brick as claimed in claim 3 and heat abstractor, wherein also comprise insulating trip, it is arranged between this heat abstractor and this electronic building brick, and has corresponding second hole of this first hole with this electronic building brick, with so that this electronic building brick and this heat abstractor mutually insulated.
5. the combining structure of electronic building brick as claimed in claim 4 and heat abstractor, wherein this heat abstractor has penetrating via, uses so that this body of rod of this screw passes through this penetrating via.
6. the combining structure of electronic building brick as claimed in claim 5 and heat abstractor wherein also comprises second insulation assembly, and it is arranged between this heat abstractor and this nut, with so that this heat abstractor insulate mutually with this nut.
7. the combining structure of electronic building brick as claimed in claim 6 and heat abstractor, wherein this electronic building brick is a power transistor.
8. the combining structure of electronic building brick as claimed in claim 7 and heat abstractor, wherein this electronic building brick has the insulation-encapsulated structure.
9. the combining structure of electronic building brick as claimed in claim 8 and heat abstractor, wherein this first insulation assembly is a cylindrical structure, comprise this first opening and this second opening, and the diameter of this first opening is greater than this second opening.
10. the combining structure of electronic building brick as claimed in claim 9 and heat abstractor, wherein this second insulation assembly has the 3rd opening and the 4th opening with respect to this penetrating via of this heat abstractor, and the diameter of the 3rd opening is less than the 4th opening.
11. the combining structure of electronic building brick as claimed in claim 10 and heat abstractor, wherein has storage tank between the 3rd opening of this second insulation assembly and the 4th opening, pass through this first opening of this first insulation assembly successively when this body of rod of this screw, this storage tank and this second opening, this of this electronic building brick first hole, this of this insulating trip second hole, this penetrating via of this heat abstractor and the 3rd opening of this second insulation assembly and when locking mutually with this nut, this nut is arranged in this storage tank of this second insulation assembly, thereby makes this nut of this locked assembly and other electronic building brick isolation on every side.
12. the combining structure of electronic building brick as claimed in claim 7 and heat abstractor, wherein this electronic building brick has sheet metal.
13. the combining structure of electronic building brick as claimed in claim 12 and heat abstractor, wherein this first insulation assembly comprises first sleeve part and second sleeve part that is connected, this first sleeve part comprises this first opening and this storage tank, this second sleeve part has passage and this second opening, this passage is connected with this storage tank and this second opening, and the diameter of this first opening is greater than this second opening.
14. the combining structure of electronic building brick as claimed in claim 13 and heat abstractor, wherein this second sleeve part is placed in this penetrating via of this second hole of this first hole, this insulating trip of this electronic building brick and this heat abstractor, with so that this body of rod of this screw and this electronic building brick and this heat abstractor insulate.
15. the combining structure of electronic building brick as claimed in claim 14 and heat abstractor, wherein this second insulation assembly has the 3rd opening and the 4th opening with respect to this penetrating via of this heat abstractor, and the diameter of the 3rd opening is less than the 4th opening.
16. the combining structure of electronic building brick as claimed in claim 15 and heat abstractor, wherein has storage tank between the 3rd opening of this second insulation assembly and the 4th opening, pass through this first opening and this storage tank of this first sleeve part of this first insulation assembly successively when this body of rod of this screw, this passage of this second sleeve part and this second opening, this of this electronic building brick first hole, this of this insulating trip second hole, this penetrating via of this heat abstractor and the 3rd opening of this second insulation assembly and when locking mutually with this nut, this nut is arranged in this storage tank of this second insulation assembly, thereby makes this nut of this locked assembly and other electronic building brick isolation on every side.
17. the combining structure of electronic building brick as claimed in claim 1 and heat abstractor, wherein this heat abstractor is fixed on the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN200610142318A CN101155498B (en) | 2006-09-29 | 2006-09-29 | Combination structure of electronic component and heat radiating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610142318A CN101155498B (en) | 2006-09-29 | 2006-09-29 | Combination structure of electronic component and heat radiating device |
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| CN101155498A CN101155498A (en) | 2008-04-02 |
| CN101155498B true CN101155498B (en) | 2010-05-12 |
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| CN102412214B (en) * | 2010-09-25 | 2014-10-22 | 台达电子工业股份有限公司 | Combination structure of electronic component and heat dissipation device, and insulation component thereof |
| CN103871986A (en) * | 2012-12-14 | 2014-06-18 | 上海五零盛同信息科技有限公司 | Insulation spacer with T-shaped hole and assembly structure of high-power IGBT (Insulated Gate Bipolar Transistor) |
| CN104039112A (en) * | 2013-03-07 | 2014-09-10 | 台达电子工业股份有限公司 | Heat dissipation module |
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| CN205334044U (en) * | 2015-10-29 | 2016-06-22 | 中兴通讯股份有限公司 | Projector's radiator and projector |
| CN107567244A (en) * | 2017-08-29 | 2018-01-09 | 广东美的制冷设备有限公司 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
| CN107371356A (en) * | 2017-08-29 | 2017-11-21 | 广东美的制冷设备有限公司 | The electric-controlled box and air conditioner of a kind of circuit board assemblies, air conditioner |
| TWI660381B (en) * | 2018-05-30 | 2019-05-21 | 台達電子工業股份有限公司 | Connection structure of inductive element |
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| US3238425A (en) * | 1960-09-30 | 1966-03-01 | Siemens Ag | Encapsuled semiconductor device and method of its manufacture |
| FR2558645B1 (en) * | 1984-01-23 | 1986-09-19 | Telemecanique Electrique | CLAMP FOR POWER SEMICONDUCTOR MOUNTING |
| US5653564A (en) * | 1995-05-25 | 1997-08-05 | Shinagawa Shoko Co., Ltd. | Screw head cap |
| CN1787209A (en) * | 2004-12-10 | 2006-06-14 | 台达电子工业股份有限公司 | Combined structure of electronic assembly with radiating apparatus |
-
2006
- 2006-09-29 CN CN200610142318A patent/CN101155498B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3238425A (en) * | 1960-09-30 | 1966-03-01 | Siemens Ag | Encapsuled semiconductor device and method of its manufacture |
| FR2558645B1 (en) * | 1984-01-23 | 1986-09-19 | Telemecanique Electrique | CLAMP FOR POWER SEMICONDUCTOR MOUNTING |
| US5653564A (en) * | 1995-05-25 | 1997-08-05 | Shinagawa Shoko Co., Ltd. | Screw head cap |
| CN1787209A (en) * | 2004-12-10 | 2006-06-14 | 台达电子工业股份有限公司 | Combined structure of electronic assembly with radiating apparatus |
Non-Patent Citations (1)
| Title |
|---|
| 说明书第4栏第62行-第75行、图3. |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101155498A (en) | 2008-04-02 |
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Assignee: Taida Electronic and Power Source (Dongguang) Co., Ltd. Assignor: Delta Optoelectronics Inc. Contract record no.: 2011990000746 Denomination of invention: Combination structure of electronic component and heat radiating device Granted publication date: 20100512 License type: Exclusive License Open date: 20080402 Record date: 20110803 |