CN102306638A - Assembled radiating fin with transistor - Google Patents
Assembled radiating fin with transistor Download PDFInfo
- Publication number
- CN102306638A CN102306638A CN201110255055A CN201110255055A CN102306638A CN 102306638 A CN102306638 A CN 102306638A CN 201110255055 A CN201110255055 A CN 201110255055A CN 201110255055 A CN201110255055 A CN 201110255055A CN 102306638 A CN102306638 A CN 102306638A
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- Prior art keywords
- transistor
- radiating fin
- radiating surface
- close
- heat radiation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an assembled radiating fin with a transistor. The radiating fin comprises a radiating fin main body and a transistor. The radiating fin is characterized in that: the radiating fin main body is composed of a heat radiation surface and a clinging surface; the heat radiation surface is superposed on the clinging surface in transplacement and is provided with a screw hole that is used for fixing the transistor; the transistor is fixed above the heat radiation surface; the clinging surface is provided with a fixed screw hole and a surface of the transistor is provided with an insulating silica gel protective layer. According to the invention, the assembled radiating fin is mainly used for auxiliary heat radiation for a circuit board; and the assembled radiating fin has advantages of simple structure, good anti-breakthrough performance and good heat radiation effect for a transistor.
Description
Technical field
The invention belongs to circuit board heat radiation field, particularly a kind of assembling fin that has transistor.
Background technology
On the circuit board owing to integrated a large amount of electronic components; Can discharge a large amount of heats during work; Cause the circuit board temperature to raise; The too high job stability that can influence electronic component of temperatures at localized regions; Therefore need to improve the radiating effect of circuit board; Reduce working temperature, guarantee its stability, increase the service life.
Common radiating mode is a finned on circuit board; And will need the electronic component of emphasis heat radiation to be installed on the fin; Through the heat fast Absorption of fin with circuit board and electronic component; And heat transferred is gone out through its radiating surface; Thereby reach cooling-down effect; But traditional fin shape only is the plane of a full wafer; It is simple in structure; But radiating effect is limited; In addition, in the manufacturing and preprocessing process of transistor, its surface possibly stay trachoma or blind hole; Influenced by static etc. breakdown lacking for such semiconductor trisome pipe, influences useful life.
Summary of the invention
Technical problem to be solved by this invention is to overcome the deficiency that exists in the prior art, provides a kind of simple in structure, and anti-breakdown is good, the assembling fin that has transistor of good heat dissipation effect.
For solving the problems of the technologies described above; The present invention provides a kind of assembling fin that has transistor; Comprise heat sink body and transistor; It is characterized in that: said heat sink body by radiating surface be close to face and form; Said radiating surface dislocation is stacked in is close to the face top; Said radiating surface is provided with the screw that is used for fixing transistor; Said transistor is fixed on the radiating surface top; The said face of being close to is provided with fixing threaded hole, and said transistor surface is provided with the Silicon-On-Insulator compound protective layer.The said face of being close to links to each other through screw with circuit board; Said radiating surface dislocation overlays is close to the face top; Therefore when heat sink body is fixed on the circuit board; Can leave a dead slot between radiating surface and the circuit board; Be convenient to the radiating surface heat radiation; Transistor links to each other with screw on the radiating surface through screw, and the transistor surface is provided with the Silicon-On-Insulator compound protective layer, to improve anti-breakdown.
The aforesaid assembling fin that has transistor is characterized in that: be provided with the insulating heat-conductive silica gel pad between said transistor and the radiating surface.The insulating heat-conductive silica gel pad has insulation property, can further improve anti-breakdown, and conduction that simultaneously can accelerated heat improves radiating effect, can play damping effect simultaneously, prolongs the useful life of transistor.
The aforesaid assembling fin that has transistor is characterized in that: the material of said radiating surface is a copper, and the said material of being close to face is an aluminium.Copper radiating surface heat radiation is faster and better, and aluminum is close to face and has been reduced production cost.
The beneficial effect that the present invention reached:
Simple in structure, anti-breakdown is good, to the good heat dissipation effect of transistor.
Description of drawings
Fig. 1 is a side-looking structural representation of the present invention;
Fig. 2 is a plan structure sketch map of the present invention.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing.
Like Fig. 1, shown in Figure 2; Said heat sink body is close to face 2 by copper radiating surface 1 with aluminum and is formed; Said aluminum is close to face 2 and is provided with fixing threaded hole 3; Use screw to connect aluminum and be close to the screw of reserving on fixing threaded hole 3 and the circuit board on the face 2 that is connected; Aluminum is close to face 2 to link to each other with circuit board; Said copper radiating surface 1 dislocation is stacked in aluminum and is close to face 2 tops; Said copper radiating surface 1 is provided with transistor 4; Transistor 4 links to each other with installation screw 6 on the copper radiating surface 1 by screw 5; Transistor 4 surfaces are provided with SOI compound protective layer 7; Its SOI compound protective layer 7 is complete with transistor 4 surface coverage, is provided with insulating heat-conductive silica gel pad 8 between transistor 4 and the copper radiating surface 1.
The present invention is mainly used in circuit board is carried out auxiliary heat dissipation, and is simple in structure, and anti-breakdown is good, to the good heat dissipation effect of transistor.
Above embodiment limits the present invention never in any form, and every other improvement and application that above embodiment is made with the equivalent transformation mode all belongs to protection scope of the present invention.
Claims (3)
1. the assembling fin that has transistor; Comprise heat sink body and transistor; It is characterized in that: said heat sink body by radiating surface be close to face and form; Said radiating surface dislocation is stacked in is close to the face top; Said radiating surface is provided with the screw that is used for fixing transistor; Said transistor is fixed on the radiating surface top, and the said face of being close to is provided with fixing threaded hole, and said transistor surface is provided with the Silicon-On-Insulator compound protective layer.
2. the assembling fin that has transistor according to claim 1 is characterized in that: be provided with the insulating heat-conductive silica gel pad between said transistor and the radiating surface.
3. the assembling fin that has transistor according to claim 2 is characterized in that: the material of said radiating surface is a copper, and the said material of being close to face is an aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110255055A CN102306638A (en) | 2011-08-31 | 2011-08-31 | Assembled radiating fin with transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110255055A CN102306638A (en) | 2011-08-31 | 2011-08-31 | Assembled radiating fin with transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102306638A true CN102306638A (en) | 2012-01-04 |
Family
ID=45380475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110255055A Pending CN102306638A (en) | 2011-08-31 | 2011-08-31 | Assembled radiating fin with transistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102306638A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190020A (en) * | 2019-07-03 | 2019-08-30 | 中国振华集团云科电子有限公司 | A kind of lithographic method and system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5946192A (en) * | 1997-03-21 | 1999-08-31 | Mitsubishi Denki Kabushiki Kaisha | Power transistor module packaging structure |
| JP2003264388A (en) * | 2002-03-08 | 2003-09-19 | Toshiba Kyaria Kk | Electric component device |
| CN1787209A (en) * | 2004-12-10 | 2006-06-14 | 台达电子工业股份有限公司 | Combined structure of electronic assembly with radiating apparatus |
| JP2007019065A (en) * | 2005-07-05 | 2007-01-25 | Matsushita Electric Ind Co Ltd | Printed circuit board unit |
| CN101511159A (en) * | 2008-02-14 | 2009-08-19 | 华硕电脑股份有限公司 | Radiating structure and use method thereof |
| CN101873784A (en) * | 2009-04-27 | 2010-10-27 | 台达电子工业股份有限公司 | Heat dispersion module of electronic element and assembling method thereof |
| CN202206715U (en) * | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | Assembled radiating fin with electronic component |
-
2011
- 2011-08-31 CN CN201110255055A patent/CN102306638A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5946192A (en) * | 1997-03-21 | 1999-08-31 | Mitsubishi Denki Kabushiki Kaisha | Power transistor module packaging structure |
| JP2003264388A (en) * | 2002-03-08 | 2003-09-19 | Toshiba Kyaria Kk | Electric component device |
| CN1787209A (en) * | 2004-12-10 | 2006-06-14 | 台达电子工业股份有限公司 | Combined structure of electronic assembly with radiating apparatus |
| JP2007019065A (en) * | 2005-07-05 | 2007-01-25 | Matsushita Electric Ind Co Ltd | Printed circuit board unit |
| CN101511159A (en) * | 2008-02-14 | 2009-08-19 | 华硕电脑股份有限公司 | Radiating structure and use method thereof |
| CN101873784A (en) * | 2009-04-27 | 2010-10-27 | 台达电子工业股份有限公司 | Heat dispersion module of electronic element and assembling method thereof |
| CN202206715U (en) * | 2011-08-31 | 2012-04-25 | 昆山锦泰电子器材有限公司 | Assembled radiating fin with electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190020A (en) * | 2019-07-03 | 2019-08-30 | 中国振华集团云科电子有限公司 | A kind of lithographic method and system |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120104 |