CN1775458A - 一种低熔点无铅焊锡 - Google Patents
一种低熔点无铅焊锡 Download PDFInfo
- Publication number
- CN1775458A CN1775458A CN 200510061945 CN200510061945A CN1775458A CN 1775458 A CN1775458 A CN 1775458A CN 200510061945 CN200510061945 CN 200510061945 CN 200510061945 A CN200510061945 A CN 200510061945A CN 1775458 A CN1775458 A CN 1775458A
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- CN
- China
- Prior art keywords
- quartz glass
- pure
- melting point
- temperature
- glass tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000002844 melting Methods 0.000 title claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 19
- 230000008018 melting Effects 0.000 title abstract description 6
- 238000005476 soldering Methods 0.000 title description 4
- 239000012535 impurity Substances 0.000 claims abstract description 15
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 3
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 15
- 239000000203 mixture Substances 0.000 abstract description 13
- 229910052761 rare earth metal Inorganic materials 0.000 abstract description 7
- 150000002910 rare earth metals Chemical class 0.000 abstract description 7
- 239000006023 eutectic alloy Substances 0.000 abstract description 2
- 239000007791 liquid phase Substances 0.000 abstract 1
- 239000007790 solid phase Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 29
- 239000000956 alloy Substances 0.000 description 24
- 229910052797 bismuth Inorganic materials 0.000 description 7
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 238000010792 warming Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
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- Glass Compositions (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
No | 成分(重量%) | 熔点(℃) | ||||||
Bi | Zn | Al | Mg | 混合稀土 | Sn | 固相点 | 液相点 | |
1 | 34.5 | 0.01 | 0.5 | 1.0 | 余量 | 139.0 | 151.2 | |
2 | 34.3 | 2.0 | 余量 | 134.1 | 170.7 | |||
3 | 32.9 | 4.0 | 2.0 | 余量 | 134.0 | 171.2 | ||
4 | 33.6 | 4.0 | 余量 | 133.9 | 165.9 | |||
5 | 32.2 | 8.0 | 余量 | 134.2 | 202.4 | |||
6 | 25.5 | 6.5 | 余量 | 135.5 | 207.2 | |||
7 | 38.4 | 4.0 | 余量 | 134.0 | 157.0 | |||
8 | 33.3 | 4.0 | 1.0 | 余量 | 134.2 | 162.9 | ||
9 | 32.9 | 6.0 | 余量 | 124.8 | 164.5 | |||
10 | 20.0 | 0.01 | 0.1 | 余量 | 138.1 | 185.3 | ||
11 | 28.0 | 3.0 | 2.0 | 余量 | 135.6 | 187.4 | ||
12 | 25.3 | 4.0 | 2.0 | 余量 | 132.4 | 178.3 |
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100619455A CN100413634C (zh) | 2005-12-12 | 2005-12-12 | 一种低熔点无铅焊锡 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100619455A CN100413634C (zh) | 2005-12-12 | 2005-12-12 | 一种低熔点无铅焊锡 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1775458A true CN1775458A (zh) | 2006-05-24 |
CN100413634C CN100413634C (zh) | 2008-08-27 |
Family
ID=36765243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100619455A Expired - Fee Related CN100413634C (zh) | 2005-12-12 | 2005-12-12 | 一种低熔点无铅焊锡 |
Country Status (1)
Country | Link |
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CN (1) | CN100413634C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102615446A (zh) * | 2011-01-31 | 2012-08-01 | 富士通株式会社 | 焊料、焊接方法和半导体器件 |
CN106514032A (zh) * | 2016-12-29 | 2017-03-22 | 安徽华众焊业有限公司 | 一种低熔点高硬度无铅焊料及其制备方法 |
CN109202328A (zh) * | 2017-06-29 | 2019-01-15 | 中航光电科技股份有限公司 | 一种用于钎焊铝合金和镁合金的钎料及其制备方法 |
CN110125571A (zh) * | 2019-06-21 | 2019-08-16 | 深圳市唯特偶新材料股份有限公司 | 一种高强度低温无铅焊料及其焊锡膏 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3232963B2 (ja) * | 1994-10-11 | 2001-11-26 | 株式会社日立製作所 | 有機基板接続用鉛レスはんだ及びそれを用いた実装品 |
CN1087994C (zh) * | 1995-09-29 | 2002-07-24 | 松下电器产业株式会社 | 无铅钎料合金 |
JP2000126890A (ja) * | 1999-11-08 | 2000-05-09 | Matsushita Electric Ind Co Ltd | はんだ材料 |
JP4462721B2 (ja) * | 2000-06-07 | 2010-05-12 | 清仁 石田 | はんだ合金及びはんだボール |
CN1176779C (zh) * | 2001-11-27 | 2004-11-24 | 深圳市格林美环境材料有限公司 | 一种无铅焊料及其制备方法 |
-
2005
- 2005-12-12 CN CNB2005100619455A patent/CN100413634C/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102615446A (zh) * | 2011-01-31 | 2012-08-01 | 富士通株式会社 | 焊料、焊接方法和半导体器件 |
US8673762B2 (en) | 2011-01-31 | 2014-03-18 | Fujitsu Limited | Solder, soldering method, and semiconductor device |
CN102615446B (zh) * | 2011-01-31 | 2014-09-03 | 富士通株式会社 | 焊料、焊接方法和半导体器件 |
CN106514032A (zh) * | 2016-12-29 | 2017-03-22 | 安徽华众焊业有限公司 | 一种低熔点高硬度无铅焊料及其制备方法 |
CN109202328A (zh) * | 2017-06-29 | 2019-01-15 | 中航光电科技股份有限公司 | 一种用于钎焊铝合金和镁合金的钎料及其制备方法 |
CN110125571A (zh) * | 2019-06-21 | 2019-08-16 | 深圳市唯特偶新材料股份有限公司 | 一种高强度低温无铅焊料及其焊锡膏 |
Also Published As
Publication number | Publication date |
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CN100413634C (zh) | 2008-08-27 |
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Owner name: SUZHOU ZHIQIAO NEW MATERIALS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HUANG DEHUAN Effective date: 20101220 |
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Free format text: CORRECT: ADDRESS; FROM: 200060 ROOM 301, NO. 13, LANE 288, MACAO ROAD, PUTUO DISTRICT, SHANGHAI TO: 215200 WEST OF PANGJIN ROAD, SCIENCE AND TECHNOLOGY VENTURE PARK, WUJIANG ECONOMIC DEVELOPMENT ZONE, WUJIANG CITY, SUZHOU CITY, JIANGSU PROVINCE |
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Effective date of registration: 20101220 Address after: 215200 Jiangsu city of Suzhou province Wujiang City Economic Development Zone of Wujiang science and Technology Park Pang Road West Patentee after: Suzhou Zhiqiao New Materials S&T Co., Ltd. Address before: 200060, room 13, No. 288, Lane 301, Macao Road, Shanghai, Putuo District Patentee before: Huang Dehuan |
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Effective date of registration: 20170626 Address after: 215299 science and Technology Pioneer Park, Wujiang Economic Development Zone, Suzhou, Jiangsu Patentee after: Wujiang Haibo Technology Venture Investment Company Limited Address before: 215200 Jiangsu city of Suzhou province Wujiang City Economic Development Zone of Wujiang science and Technology Park Pang Road West Patentee before: Suzhou Zhiqiao New Materials S&T Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080827 Termination date: 20191212 |
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CF01 | Termination of patent right due to non-payment of annual fee |