CN1748285B - 用于均匀加热基片的腔室 - Google Patents

用于均匀加热基片的腔室 Download PDF

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Publication number
CN1748285B
CN1748285B CN200380109616.2A CN200380109616A CN1748285B CN 1748285 B CN1748285 B CN 1748285B CN 200380109616 A CN200380109616 A CN 200380109616A CN 1748285 B CN1748285 B CN 1748285B
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CN
China
Prior art keywords
mentioned
substrate
heater
chamber
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN200380109616.2A
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English (en)
Chinese (zh)
Other versions
CN1748285A (zh
Inventor
稻川真
细川昭弘
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Publication of CN1748285A publication Critical patent/CN1748285A/zh
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Publication of CN1748285B publication Critical patent/CN1748285B/zh
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Furnace Details (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
CN200380109616.2A 2002-12-17 2003-12-15 用于均匀加热基片的腔室 Expired - Lifetime CN1748285B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43406402P 2002-12-17 2002-12-17
US60/434,064 2002-12-17
PCT/US2003/039783 WO2004061914A2 (fr) 2002-12-17 2003-12-15 Chambre permettant de chauffer un substrat de maniere uniforme

Publications (2)

Publication Number Publication Date
CN1748285A CN1748285A (zh) 2006-03-15
CN1748285B true CN1748285B (zh) 2010-04-28

Family

ID=32713006

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200380109616.2A Expired - Lifetime CN1748285B (zh) 2002-12-17 2003-12-15 用于均匀加热基片的腔室

Country Status (6)

Country Link
JP (1) JP2006515433A (fr)
KR (1) KR101035828B1 (fr)
CN (1) CN1748285B (fr)
AU (1) AU2003297065A1 (fr)
TW (1) TWI279828B (fr)
WO (1) WO2004061914A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7326877B2 (en) * 2004-12-01 2008-02-05 Ultratech, Inc. Laser thermal processing chuck with a thermal compensating heater module
KR100707788B1 (ko) * 2005-02-04 2007-04-13 주식회사 테라세미콘 박막 트랜지스터 액정표시장치 열처리방법 및 그 열처리장치
KR101073550B1 (ko) 2009-10-29 2011-10-14 삼성모바일디스플레이주식회사 기판 열처리 장치
CN102300342A (zh) * 2010-06-24 2011-12-28 北京北方微电子基地设备工艺研究中心有限责任公司 一种载板加热装置及应用该装置的等离子体处理设备
US8517657B2 (en) * 2010-06-30 2013-08-27 WD Media, LLC Corner chamber with heater
CN102508381B (zh) * 2011-11-29 2015-02-11 深圳市华星光电技术有限公司 一种用于液晶面板的烘烤设备
CN104269368A (zh) * 2014-08-29 2015-01-07 沈阳拓荆科技有限公司 一种利用前端模块为晶圆加热的装置及方法
JP2019119903A (ja) * 2017-12-28 2019-07-22 キヤノントッキ株式会社 基板加熱装置及び成膜装置
JP7078752B2 (ja) * 2018-12-27 2022-05-31 株式会社アルバック 真空処理装置
CN112363335A (zh) * 2020-11-12 2021-02-12 深圳市华星光电半导体显示技术有限公司 一种液晶面板烘烤设备
CN114959659B (zh) * 2022-03-31 2023-11-28 松山湖材料实验室 用于样品加热的加热装置
WO2024144129A1 (fr) * 2022-12-30 2024-07-04 주성엔지니어링(주) Appareil de traitement de substrat et procédé de traitement de substrat

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5626680A (en) * 1995-03-03 1997-05-06 Silicon Valley Group, Inc. Thermal processing apparatus and process

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3474258B2 (ja) * 1994-04-12 2003-12-08 東京エレクトロン株式会社 熱処理装置及び熱処理方法
KR100245260B1 (ko) * 1996-02-16 2000-02-15 엔도 마코토 반도체 제조장치의 기판 가열장치
US6310328B1 (en) * 1998-12-10 2001-10-30 Mattson Technologies, Inc. Rapid thermal processing chamber for processing multiple wafers
US6765178B2 (en) * 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5626680A (en) * 1995-03-03 1997-05-06 Silicon Valley Group, Inc. Thermal processing apparatus and process

Also Published As

Publication number Publication date
KR20040054514A (ko) 2004-06-25
KR101035828B1 (ko) 2011-05-20
CN1748285A (zh) 2006-03-15
TW200416798A (en) 2004-09-01
WO2004061914A2 (fr) 2004-07-22
AU2003297065A8 (en) 2008-03-13
TWI279828B (en) 2007-04-21
JP2006515433A (ja) 2006-05-25
AU2003297065A1 (en) 2004-07-29
WO2004061914A3 (fr) 2008-01-17

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Granted publication date: 20100428