CN1681967A - 用于锌和锌合金的非氰化物铜电镀方法 - Google Patents

用于锌和锌合金的非氰化物铜电镀方法 Download PDF

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Publication number
CN1681967A
CN1681967A CNA038057441A CN03805744A CN1681967A CN 1681967 A CN1681967 A CN 1681967A CN A038057441 A CNA038057441 A CN A038057441A CN 03805744 A CN03805744 A CN 03805744A CN 1681967 A CN1681967 A CN 1681967A
Authority
CN
China
Prior art keywords
zinc
copper
nickel
pyrophosphate
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA038057441A
Other languages
English (en)
Chinese (zh)
Inventor
罗纳德·斯图尔特
卡尔·P·施泰内克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of CN1681967A publication Critical patent/CN1681967A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
CNA038057441A 2002-03-12 2003-01-30 用于锌和锌合金的非氰化物铜电镀方法 Pending CN1681967A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/096,411 2002-03-12
US10/096,411 US6827834B2 (en) 2002-03-12 2002-03-12 Non-cyanide copper plating process for zinc and zinc alloys

Publications (1)

Publication Number Publication Date
CN1681967A true CN1681967A (zh) 2005-10-12

Family

ID=28039015

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA038057441A Pending CN1681967A (zh) 2002-03-12 2003-01-30 用于锌和锌合金的非氰化物铜电镀方法

Country Status (7)

Country Link
US (1) US6827834B2 (https=)
EP (1) EP1483430B1 (https=)
JP (1) JP4027320B2 (https=)
CN (1) CN1681967A (https=)
AU (1) AU2003217279A1 (https=)
ES (1) ES2477589T3 (https=)
WO (1) WO2003078686A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101724870B (zh) * 2008-10-22 2011-04-27 中国科学院宁波材料技术与工程研究所 锌合金无氰电沉积镀镍溶液及镀镍方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4815120B2 (ja) * 2004-10-20 2011-11-16 株式会社オーディオテクニカ コンデンサマイクロホン
US20100084278A1 (en) * 2008-10-02 2010-04-08 Rowan Anthony J Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components
US9783901B2 (en) 2014-03-11 2017-10-10 Macdermid Acumen, Inc. Electroplating of metals on conductive oxide substrates
CN110760904A (zh) * 2019-10-31 2020-02-07 武汉奥邦表面技术有限公司 一种无氰碱性亚铜镀铜添加剂
CN113430595A (zh) * 2021-06-24 2021-09-24 惠州市安泰普表面处理科技有限公司 一种在黄铜铸件表面镀铜的方法
CN116536541B (zh) * 2023-04-10 2025-05-06 南京工程学院 一种适用于电弧喷涂的锌基合金丝材及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4273837A (en) * 1975-04-18 1981-06-16 Stauffer Chemical Company Plated metal article
US4599279A (en) * 1984-10-01 1986-07-08 Ball Corporation Zinc alloy for reducing copper-zinc diffusion
JP2673829B2 (ja) * 1989-05-26 1997-11-05 日新製鋼株式会社 銅被覆鉄粉の製造法
JP2832224B2 (ja) * 1990-04-03 1998-12-09 三井金属鉱業株式会社 ニッケル被覆亜鉛基合金金型の製造方法
JPH10241697A (ja) * 1997-02-21 1998-09-11 Matsushita Electric Ind Co Ltd アルカリ蓄電池用電極及びその製造法
JP3715743B2 (ja) * 1997-04-15 2005-11-16 株式会社神戸製鋼所 Ｍｇ合金部材の製造方法
JPH11181593A (ja) * 1997-12-16 1999-07-06 Totoku Electric Co Ltd 銅被覆アルミニウム線の製造方法
US6007758A (en) * 1998-02-10 1999-12-28 Lucent Technologies Inc. Process for forming device comprising metallized magnetic substrates
US6054037A (en) * 1998-11-11 2000-04-25 Enthone-Omi, Inc. Halogen additives for alkaline copper use for plating zinc die castings
US6656606B1 (en) * 2000-08-17 2003-12-02 The Westaim Corporation Electroplated aluminum parts and process of production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101724870B (zh) * 2008-10-22 2011-04-27 中国科学院宁波材料技术与工程研究所 锌合金无氰电沉积镀镍溶液及镀镍方法

Also Published As

Publication number Publication date
EP1483430A1 (en) 2004-12-08
EP1483430A4 (en) 2007-12-19
ES2477589T3 (es) 2014-07-17
WO2003078686A1 (en) 2003-09-25
AU2003217279A1 (en) 2003-09-29
EP1483430B1 (en) 2014-06-18
US20030183532A1 (en) 2003-10-02
US6827834B2 (en) 2004-12-07
JP4027320B2 (ja) 2007-12-26
JP2005520048A (ja) 2005-07-07

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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RJ01 Rejection of invention patent application after publication

Open date: 20051012