CN1678166A - Flexible copper-coated laminated board and mfg. method - Google Patents
Flexible copper-coated laminated board and mfg. method Download PDFInfo
- Publication number
- CN1678166A CN1678166A CNA2005100595821A CN200510059582A CN1678166A CN 1678166 A CN1678166 A CN 1678166A CN A2005100595821 A CNA2005100595821 A CN A2005100595821A CN 200510059582 A CN200510059582 A CN 200510059582A CN 1678166 A CN1678166 A CN 1678166A
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- copper foil
- copper
- heat treatment
- laminated board
- coated laminated
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- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62C—FIRE-FIGHTING
- A62C37/00—Control of fire-fighting equipment
- A62C37/08—Control of fire-fighting equipment comprising an outlet device containing a sensor, or itself being the sensor, i.e. self-contained sprinklers
- A62C37/10—Releasing means, e.g. electrically released
- A62C37/11—Releasing means, e.g. electrically released heat-sensitive
- A62C37/14—Releasing means, e.g. electrically released heat-sensitive with frangible vessels
-
- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62C—FIRE-FIGHTING
- A62C31/00—Delivery of fire-extinguishing material
- A62C31/28—Accessories for delivery devices, e.g. supports
-
- A—HUMAN NECESSITIES
- A62—LIFE-SAVING; FIRE-FIGHTING
- A62C—FIRE-FIGHTING
- A62C35/00—Permanently-installed equipment
- A62C35/58—Pipe-line systems
- A62C35/68—Details, e.g. of pipes or valve systems
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- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provided a flexible copper-clad laminate which can be easily handled during manufacturing a copper-clad laminate without thinning a copper foil; and shows high pliability, successful bending properties and a high stress relaxation effect after molding. In the flexible copper-clad laminate with a copper foil layer formed on one surface or both surfaces of a polyimide resin layer through a heat treatment process, the modulus of elasticity (p2) of the copper foil layer before heat treatment is 50 to 80 GPa and the ratio (p2/p3) of the modulus of elasticity (p2) before heat treatment to the modulus of elasticity (p3) after heat treatment at higher than 300[deg.]C is 3.5 to 5.5.
Description
Technical field
The present invention relates to the good flexible copper-coated laminated board of a kind of flexible copper-coated laminated board, particularly resistance to bend(ing).
Background technology
[patent documentation 1] spy opens the 2001-58203 communique
No. 3009383 communique of [patent documentation 2] special permission
Flexible copper-coated laminated board is widely used in to be had in the electronic equipments of requirement bendability, flexibility and high-density installation.In recent years, along with the increase of apparatus memory span, the narrow spacingization of distribution, high-density installationization are constantly upgraded, and the requirement of the mechanical performance of laminated plate is also improved thereupon.In the narrow spacing countermeasure of flexible copper-coated laminated board, origin is in the characteristic of method for manufacturing copper foil, so it is generally acknowledged that electrolytic copper foil is good.On the other hand, in nearest high-density installation, the sweep when storing cabinet after the laminated plate bending has increased, and crooked angle has also diminished.Therefore, as traditional electrolytic copper foil, its rigidity and tensile strength height, poor ductility, so, with the flexible copper-coated laminated board of such Copper Foil manufacturing, will be because of the ductility fatigue of Copper Foil, and make distribution break easily, in most cases can not get the reliability that is electrically connected.
According to patent documentation 1, put down in writing the intensity (I) of (200) face of trying to achieve, with respect to the intensity (I of the face of trying to achieve with the X-ray diffraction of micropowder copper with the X-ray diffraction of the calendering face behind the annealing recrystallization tissue
0) be I/I
0＞20, visible Copper Foil has high bendability, and has shown and the control by crystalline structure can realize high bendability.According to patent documentation 2, put down in writing in order to obtain the crystalline structure in the patent documentation 1, with final annealing before cold rolling, be to carry out under the condition of 5～20 μ m in the average grain diameter of the crystalline particle again that this annealing obtains, final cold rolling rolling degree of finish thereafter is defined as more than 90%.
Traditional electrolytic copper foil, even after heat treated annealing, its tensile strength or rigidity also not too change, because the annealing effect is little, be conceived to the resistance to bend(ing) of moulding product, the Copper Foil of the softness of the stage use inhibition Copper Foil tensile strength before heat treatment of having to, in this case, when making flexible copper-coated laminated board, tension force is difficult to adjust, and becomes the low major reason of production efficiency.
According to such background, up to now, in order to make ductility, resistance to bend(ing) and the coexistence of fine grain characteristic, the method that adopts the thickness attenuation that makes Copper Foil to improve the flexibility of laminated plate integral body is made rerum natura up usually., this technology is restricted in the design of copper-coated laminated board, thereby a kind of thickness that need not adjust Copper Foil that waits in expectation just can satisfy the exploitation of the flexible copper-coated laminated board of above-mentioned ductility, resistance to bend(ing) and fine grain characteristic.
Summary of the invention
The object of the present invention is to provide a kind of not attenuation of thickness of Copper Foil, simple to operate when copper-coated laminated board is made, the flexibility height after the moulding, bendability well reach the tangible flexible copper-coated laminated board of stress relaxation.
The inventor etc. have carried out deep discussion for addressing the above problem, and found that by the specific Copper Foil of use in flexible copper-coated laminated board to address the above problem, thereby have finished the present invention.
That is to say, the invention relates to a kind of flexible copper-coated laminated board, it is characterized in that through heat treatment step, make copper foil layer be formed on the copper-coated laminated board of the one or both sides of polyimides resin, the spring rate of copper foil layer wherein before heat treatment is 50～80GPa, the spring rate (p2) before the heat treatment and more than 300 ℃ the ratio (p2/p3) of the spring rate after the heat treatment (p3) be 3.5～5.5.
In flexible copper-coated laminated board of the present invention, preferred 12～18 μ m of the thickness of Copper Foil, preferred 15～25 μ m of the thickness of resin bed.
Flexible copper-coated laminated board of the present invention is made of copper foil layer and polyimides resin.Copper foil layer can only be located at a side of polyimide resin layer, also can be located at both sides.
Embodiment
Below, be described further with regard to flexible copper-coated laminated board of the present invention.
As the Copper Foil that constitutes copper-coated laminated board, can use the rolled copper foil made by known method, electrolytic copper foil etc.Employed Copper Foil among the present invention, the copper foil layer spring rate (p2) before heat treatment is necessary it is 50～80GPa.If spring rate is lower than 50GPa, when making flexible copper-coated laminated board, deform easily so, if cross the low possibility that fracture is just arranged.If spring rate surpasses 80GPa, rigidity will increase so, and the relexation of flexible copper-coated laminated board extension stress during fabrication also can descend, and plastic deformation takes place easily.In addition, the spring rate (p2) before this Copper Foil heat treatment and more than 300 ℃ the ratio (p2/p3) of the spring rate after the heat treatment (p3) be necessary it is 3.5～5.5.If the ratio of spring rate less than 3.5, can only obtain the flexible copper-coated laminated board of flexibility difference so.
Flexible copper-coated laminated board of the present invention use to show the Copper Foil of the ratio of above-mentioned spring rate and spring rate, is made by the manufacturing process of the heat treatment step with flexible copper-coated laminated board.The heat treatment temperature of heat treatment step is more than 300 ℃, preferred 300～450 ℃.If heat treatment temperature is lower than 300 ℃, though just infer, recrystallizing of Copper Foil just might be insufficient, and spring rate can not show variation, and is therefore not preferred.On the other hand,, will cause Copper Foil, and the polyimides that can cause using in flexible copper-coated laminated board is that resin decomposes because of former thereby deteriorations such as oxidations if surpass 450 ℃, thus not preferred.Though at the heat treatment time more than 300 ℃ is arbitrarily, preferred 3～40 minutes.Heat treatment step has concurrently for the drying of coating polyimides on the Copper Foil or its presoma and imidization and the heat treatment step that carries out is favourable.
The thickness of employed Copper Foil is 8～35 μ m, preferred 12～18 μ m.If the thickness deficiency of Copper Foil 8 μ m, so, when making flexible copper-coated laminated board, it is difficult that the adjustment of tension force becomes; If surpass 35 μ m, the bendability of flexible copper-coated laminated board will variation so.In addition, in the Copper Foil that even surface and matsurface are arranged, the roughness of Copper Foil is preferred: Rz in even surface (10 mean roughness)=0.5～1.5 μ m, Ra (arithmetic average roughness)=0.05～0.25 μ m, Rz=0.5 in matsurface～1.5 μ m, Ra=0.05～0.30 μ m.Use the roughness of the Copper Foil in this scope, can form trickle circuit pattern and obtain copper-coated laminated board.The roughness of matsurface particularly is because the pattern exquisiteness can influence circuit fabrication the time is the Copper Foil of 0.05～0.27 μ m so preferably use Ra.
As the object lesson of the Copper Foil of the ratio that satisfies above-mentioned spring rate, spring rate, thickness condition, can enumerate the BHY-HA paper tinsel that Nippon Mining and Metals Co., Ltd makes.
Next, the polyimides resin for copper-coated laminated board describes.
This polyimides resin forms by polyimide precursor resin (polyamic acid) is heat-treated, and this polyimide precursor resin is to obtain with known diamines and the anhydride reaction of making in the presence of solvent.
The synthetic employed diamines of polyamic acid can be enumerated: 4,4 '-diaminodiphenyl ether, 2 '-methoxyl group-4,4 '-diaminobenzene anilid, 1,4-two (4-amino-benzene oxygen) benzene, 1,3-two (4-amino-benzene oxygen) benzene, 2,2-two [4-(4-amino-benzene oxygen) phenyl] propane, 2,2 '-dimethyl-4,4 '-diaminourea hexichol, 3,3 '-dihydroxy-4,4 '-diaminourea hexichol, 4,4 '-diaminobenzene anilid.Acid anhydrides can be enumerated: PMA acid anhydride, 3,3 ', 4,4 '-hexichol tetracarboxylic dianhydride, 3,3 ', 4,4 '-diphenylsulfone acid dianhydride, 4,4 '-oxygen ether, two phthalic anhydrides etc.Diamines and acid anhydrides can only use a kind of respectively, and be perhaps two or more and with also can.
For example can enumerate as solvent: dimethyl acetyl ammonia, n-methyl pyrrolidone, 2-butanone, diethylene glycol dimethyl ether, dimethylbenzene etc., can use a kind of, perhaps two or more and with also can.
Polyimide precursor solution coated directly on the Copper Foil to form the polyimides resin be comparative optimization, the resin viscosity of presoma can be 500～35000cps.The presoma resin that has been coated with is realized the drying and the imidizate of solvent by heat treatment, and heat treated condition can be: 100～400 ℃ of temperature, and about 20～40 minutes processing times.
The heat treatment that this heat treatment has Copper Foil concurrently is favourable.In this case, preferred more than 3 minutes at the heat treatment time that carries out more than 300 ℃.Here, the spring rate (p2) of the Copper Foil before the heat treatment, be to after the Copper Foil manufacturing, be in Copper Foil under the state that did not have the thermal history Copper Foil fully and measure and obtain.Spring rate after the heat treatment more than 300 ℃ (p2) is the Copper Foil of 300～450 ℃ of heat treatments after 3～40 minutes to be measured obtain.About the mensuration of the spring rate of the Copper Foil after the actual heat treatment, in making, do not have the Copper Foil of coating resin part to measure.
Polyimide resin layer can only be made of individual layer, also can be made of multilayer.Under the situation that forms the multilayer polyimide resin bed, can be on the polyimide resin layer that heterogeneity constitutes, the polyimide resin that is coated with other more successively forms.When polyimide resin layer when constituting more than 3 layers, same polyimide resin can use more than 2 times.
Flexible copper-coated laminated board of the present invention, can by aforesaid on Copper Foil the solution of coating polyimide precursor, dry then, heat treatment prepares, and also can adopt the polyimide film more than 1 layer is stacked on the Copper Foil to prepare.So the flexible copper-coated laminated board of preparation can be the single face copper-coated laminated board that a side contains copper foil layer, also can be the double-sided copper-clad laminate plate that copper foil layer is all contained in both sides.The double-sided copper-clad laminate plate can adopt following method preparation: after the single face copper-coated laminated board forms, and the method that adopts drop stamping that copper foil lamination is connect; Between 2 copper foil layers, the method for clamping polyimide film; Adopt the method for drop stamping crimping etc.
The present invention can provide a kind of folding resistance of flexible copper-coated laminated board and resistance to bend(ing) of making to improve, and the flexible circuit material that also has very high reliability under the crooked situation about using in electrical equipment and electronic product.
Below, by embodiment the present invention is done more detailed explanation.In addition.In the following embodiments, short of special restriction, various evaluations are as described below.
[mensuration of spring rate]
Use the smart mechanism of (strain) Japan to make the universal testing machine (STROGRAPH-R1) of manufacturing, under 23 ℃, the environment of 50%RH, measure.
[evaluation of folding resistance]
Wide: 8mm, long: on the experiment slice of the flexible copper-coated laminated board of 150mm, form 200 μ m wide row and interval circuit, use the CISV-1215 of ニ Star カ Application industry (strain) manufacturing as lining material, make the coated material material at the circuit superimposed layer by punching press, at curvature r:1.25mm, vibrating stroke: 20mm, vibration velocity: under 1500 times/minute the condition, the IPC crooked experiment machine that uses SHIN-ETSU HANTOTAI's engineering (strain) to make carries out accelerated test.In this experiment, the resistance value of trying to achieve sample rises to 5% number of times.
The polyimide precursor resin solution of Shi Yonging is synthetic according to following method in an embodiment.
Synthesis example 1
In the reaction vessel that thermocouple, blender and nitrogen gatherer are housed, add N, N-dimethylacetylamide (DMA) is as solvent.In this reaction vessel, add 4,4 '-diaminourea-2,2 '-dimethyl hexichol (DADMB) and 1,3-two (4-amino-benzene oxygen) benzene (BAB), the limit is stirred and is made dissolving.Next, add 3,3 ', 4 again, 4-hexichol tetracarboxylic dianhydride (BPDA) and PMA acid anhydride (PMDA).Inventory is as follows: the otal investment of monomer is 15wt%, the mol ratio of each diamines (DADMB: BAB) be 90: 10, the mol ratio of each acid anhydrides (BPDA: PMDA) be 20: 79.Then, continue to stir 3 hours, the viscosity of the polyimide precursor resin solution that obtains is 20000cps.
Synthesis example 2
In the reaction vessel that adds DMA, add 2,2-two [4-(4-amino-benzene oxygen) phenyl] propane, the limit is stirred and is made dissolving.Then, add BPDA and PMDA.Press the otal investment 15% of monomer, the mol ratio of each acid anhydrides (BPDA: be like that to feed intake at 4: 69 PMDA).Then, continue to stir 3 hours, the viscosity of the polyimide precursor resin solution that obtains is 5000cps.
Embodiment 1
Use day BHY-HA paper tinsel (thick 18 μ m) of ore deposit metal (strain) manufacturing as Copper Foil, the polyimide precursor resin solution that coating synthesis example 2 obtains on this Copper Foil, dry, be coated with the polyimide precursor resin solution that synthesis example 1 obtains then thereon, dry, be coated with the polyimide precursor resin solution that synthesis example 2 obtains again thereon, drying has so just obtained being formed at laminate on the copper foil layer by the polyimide precursor resin bed.
This laminate is put into drying box, and 360 ℃ of heat treatments 3 minutes, obtaining the polyimide precursor resin thick was the single face copper-coated laminated board of 25 μ m.The spring rate of the Copper Foil before the heat treatment is 62GPa, and the spring rate of the Copper Foil after the heat treatment is 17GPa, and the ratio of spring rate is 3.6.
The folding resistant test result of the flexible copper-coated laminated board that obtains shows that its folding number is 55000 times.
Comparative example 1
Except that Copper Foil used day BHY-22BT paper tinsel (thick 18 μ m) of ore deposit metal (strain) manufacturing, all the other were identical with embodiment 1, make flexible copper-coated laminated board.
The spring rate of the Copper Foil before the heat treatment is 53GPa, and the spring rate of the Copper Foil after the heat treatment is 23GPa, and the ratio of spring rate is 2.3.
The folding resistant test result of the flexible copper-coated laminated board that obtains shows that its folding number is 12500 times.
Embodiment 2
Use day BHY-HA paper tinsel (thick 18 μ m) of ore deposit metal (strain) manufacturing as Copper Foil, the polyimide precursor resin solution that coating synthesis example 2 obtains on this Copper Foil, after the drying, be coated with the polyimide precursor resin solution that synthesis example 1 obtains thereon, dry, be coated with the polyimide precursor resin solution that synthesis example 2 obtains again thereon, drying has so just obtained being formed at laminate on the copper foil layer by the polyimide precursor resin bed.This laminate, 360 ℃ of heat treatments 6 minutes, obtaining the polyimide precursor resin thick was the single face copper-coated laminated board of 25 μ m.
The spring rate of the Copper Foil before the heat treatment is 62GPa, and the spring rate of the Copper Foil after the heat treatment is 16GPa, and the ratio of spring rate is 3.9.
The folding resistant test result of the flexible copper-coated laminated board that obtains shows that its folding number is 54000 times.
Comparative example 2
Except that Copper Foil used day BHY-22BT paper tinsel (thick 18 μ m) of ore deposit metal (strain) manufacturing, all the other were identical with embodiment 2, make flexible copper-coated laminated board.
The spring rate of the Copper Foil before the heat treatment is 53GPa, and the spring rate of the Copper Foil after the heat treatment is 21GPa, and the ratio of spring rate is 2.5.
The folding resistant test result of the flexible copper-coated laminated board that obtains shows that its folding number is 12000 times.
Embodiment 3
Use day BHY-HA paper tinsel (thick 18 μ m) of ore deposit metal (strain) manufacturing as Copper Foil, the polyimide precursor resin solution that coating synthesis example 2 obtains on this Copper Foil, after the drying, be coated with the polyimide precursor resin solution that synthesis example 1 obtains thereon, dry, be coated with the polyimide precursor resin solution that synthesis example 2 obtains again thereon, drying has so just obtained being formed at laminate on the copper foil layer by the polyimide precursor resin bed.This laminate, 360 ℃ of heat treatments 13 minutes, obtaining the polyimide precursor resin thick was the single face copper-coated laminated board of 25 μ m.
The spring rate of the Copper Foil before the heat treatment is 62GPa, and the spring rate of the Copper Foil after the heat treatment is 15GPa, and the ratio of spring rate is 4.1.
The folding resistant test result of the flexible copper-coated laminated board that obtains shows that its folding number is 52000 times.
Comparative example 3
Except that Copper Foil used day BHY-22BT paper tinsel (thick 18 μ m) of ore deposit metal (strain) manufacturing, all the other were identical with embodiment 3, make flexible copper-coated laminated board.
The spring rate of the Copper Foil before the heat treatment is 53GPa, and the spring rate of the Copper Foil after the heat treatment is 21GPa, and the ratio of spring rate is 2.5.
The folding resistant test result of the flexible copper-coated laminated board that obtains shows that its folding number is 12000 times.
Claims (2)
1, flexible copper-coated laminated board, it is characterized in that through heat treatment step, make copper foil layer be formed on the copper-coated laminated board of the one or both sides of polyimides resin, the spring rate of copper foil layer wherein before heat treatment is 50～80GPa, the spring rate (p2) before the heat treatment and more than 300 ℃ the ratio (p2/p3) of the spring rate after the heat treatment (p3) be 3.5～5.5.
2, the described flexible copper-coated laminated board of claim 1, wherein, the thickness of copper foil layer is 12～18 μ m, the thickness of resin bed is 15～25 μ m.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004098865A JP4443977B2 (en) | 2004-03-30 | 2004-03-30 | Flexible copper clad laminate and manufacturing method thereof |
| JP2004098865 | 2004-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1678166A true CN1678166A (en) | 2005-10-05 |
| CN100521866C CN100521866C (en) | 2009-07-29 |
Family
ID=35050394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100595821A Expired - Fee Related CN100521866C (en) | 2004-03-30 | 2005-03-30 | Flexible copper-coated laminated board and mfg. method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4443977B2 (en) |
| KR (1) | KR101009128B1 (en) |
| CN (1) | CN100521866C (en) |
| TW (1) | TW200536628A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917042A (en) * | 2012-12-28 | 2014-07-09 | 新日铁住金化学株式会社 | Flexible copper-coated laminated plate |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101180178B (en) | 2005-04-04 | 2011-11-09 | 宇部兴产株式会社 | Copper clad laminate |
| JP4757645B2 (en) * | 2006-01-31 | 2011-08-24 | 新日鐵化学株式会社 | Method for producing double-sided metal-clad laminate |
| JP2007273766A (en) * | 2006-03-31 | 2007-10-18 | Nippon Steel Chem Co Ltd | Laminate for wiring board |
| JP5689277B2 (en) * | 2009-10-22 | 2015-03-25 | 新日鉄住金化学株式会社 | Flexible circuit board and multilayer circuit board |
| JP5689284B2 (en) * | 2009-11-11 | 2015-03-25 | 新日鉄住金化学株式会社 | Method for producing flexible double-sided copper-clad laminate |
| JP2012001786A (en) * | 2010-06-18 | 2012-01-05 | Jx Nippon Mining & Metals Corp | Flexible copper-clad laminate, and method of manufacturing the same |
| JP6461540B2 (en) * | 2014-09-30 | 2019-01-30 | 日鉄ケミカル＆マテリアル株式会社 | Flexible circuit board, method of using the same, and electronic device |
| KR102404294B1 (en) * | 2014-09-30 | 2022-05-31 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | Flexible printed circuit board and electronic device |
| JP6578419B2 (en) * | 2018-06-25 | 2019-09-18 | 日鉄ケミカル＆マテリアル株式会社 | Method for producing copper clad laminate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6480521A (en) * | 1987-09-24 | 1989-03-27 | Mitsui Toatsu Chemicals | Novel flexible metal plastic laminated sheet |
| CN1045014A (en) * | 1990-02-28 | 1990-08-29 | 航空工业部南方动力机械公司 | Flexible printed circuit board and manufacture method thereof |
| DE4009182A1 (en) * | 1990-03-22 | 1991-09-26 | Bayer Ag | LAMINATED AREA |
| JPH06338667A (en) * | 1993-05-28 | 1994-12-06 | Sumitomo Bakelite Co Ltd | Single surface copper-clad laminate for printed circuit board |
| CN2216318Y (en) * | 1994-11-24 | 1995-12-27 | 刘宝申 | Flexible polyester film coated copper foil plate and film-coated circuit board |
| JPH08335607A (en) * | 1995-06-05 | 1996-12-17 | Hitachi Cable Ltd | One-layer wiring tcp tape |
-
2004
- 2004-03-30 JP JP2004098865A patent/JP4443977B2/en not_active Expired - Fee Related
-
2005
- 2005-03-24 TW TW094109146A patent/TW200536628A/en not_active IP Right Cessation
- 2005-03-30 KR KR1020050026663A patent/KR101009128B1/en active IP Right Grant
- 2005-03-30 CN CNB2005100595821A patent/CN100521866C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103917042A (en) * | 2012-12-28 | 2014-07-09 | 新日铁住金化学株式会社 | Flexible copper-coated laminated plate |
| CN103917042B (en) * | 2012-12-28 | 2018-03-30 | 新日铁住金化学株式会社 | Flexible copper-clad laminate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4443977B2 (en) | 2010-03-31 |
| KR101009128B1 (en) | 2011-01-18 |
| TW200536628A (en) | 2005-11-16 |
| CN100521866C (en) | 2009-07-29 |
| KR20060045029A (en) | 2006-05-16 |
| TWI317658B (en) | 2009-12-01 |
| JP2005280163A (en) | 2005-10-13 |
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