CN1947476A - Flexible printed wiring board and manufacturing method thereof - Google Patents

Flexible printed wiring board and manufacturing method thereof Download PDF

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Publication number
CN1947476A
CN1947476A CNA2005800075295A CN200580007529A CN1947476A CN 1947476 A CN1947476 A CN 1947476A CN A2005800075295 A CNA2005800075295 A CN A2005800075295A CN 200580007529 A CN200580007529 A CN 200580007529A CN 1947476 A CN1947476 A CN 1947476A
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thickness
conductor
printed wiring
top layer
polyimide
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Inventor
日笠山伊知郎
佐藤诚治
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Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

A flexible printed wiring board having a stable quality, not generating curls on a film even after circuit process on a conductor side, and a method of manufacturing such flexible printed wiring board are provided. The flexible printed wiring board is provided with a base layer, which is composed of at least one type of low thermal expansion polyimide resin, between a bottom layer contacting the conductor and a top layer on the opposite side to the conductor. The bottom layer and the top layer are composed of a thermoplastic polyimide rein having a larger thermal expansion coefficient than that of the base layer, and a thickness P1 of the bottom layer and a thickness P2 of the top layer satisfy a condition of P1<P2.

Description

Flexible printed wiring board and manufacture method thereof
Technical field
The present invention relates to corresponding flexible printed wiring board of miniaturization, lightweight requirements and manufacture method thereof with the electronic equipment class.Particularly relate to flexible printed wiring board and manufacture method thereof that polyimides membranous part after the distribution processing does not produce the high-quality single face conductor of warpage.
Background technology
In recent years, along with the mobile phone of multifunction, digital camera, navigator, the miniaturization of other various electronic equipment classes, light-weighted development, require surging as the small-sized densification of the flexible printed wiring board (wiring substrate) of use therein electrical harnesses material, multiple stratification, precise treatment, low dielectricization etc.About this flexible printed wiring board, be in the past to make with the bonding agent applying polyimide film of low-temperature curable and metal forming.But bond layer makes as the characteristic of wiring board and descends, and particularly diminishes the excellent heat resistance, anti-flammability of polyimide base film etc.And as the other problems with bond layer, the circuit fabrication variation of distribution.
Particularly, comprise problems such as size changing rate when through hole adds the generation of the resin stain that man-hour boring causes, the processing of conductor through hole is big.Particularly the occasion of two sides through-hole structure is that basement membrane is the center with insulator layer, and the structure that Copper Foil by bonding agent applying conductor on its two sides etc. forms is compared with the flexible printed wiring board of single-sided structure, and its flexibility is low usually.On the other hand, along with densification, the miniaturization of printed circuit, the densification of IC, heating increases, and need fit with the good conductor of heat.In addition, also exist for compact more and make shell and the incorporate method of distribution.And then need the different distribution of electric capacity, need more resistant to elevated temperatures wiring material.Therefore, proposed not use bonding agent, the polyamic acid solution before directly coating is solidified on conductors such as Copper Foil, heating makes the manufacture method of the various flexible printed wiring boards of its curing.
For example, can enumerate thermal coefficient of expansion with solidfied material smaller or equal to 3.0 * 10 -5By the synthetic polyamic acid of diamines and tetracarboxylic anhydride be coated on the metal forming, heating makes its curing (reference example such as patent documentation 1), the resin solution that will contain the polyamidoimide precursor compound with specific structure unit is coated on the conductor, makes its imidizate (reference example such as patent documentation 2), and the precursor solution that will have an insulating material of the construction unit that is obtained by two amines that comprise diamino-N-benzanilide or derivatives thereof and aromatic tetracarboxylic acid reaction directly is coated on the conductor and makes its curing (reference example such as patent documentation 3) etc.But also proposed in order to improve the adaptation with metal forming, by on conductor, using multiple polyimide precursor resin solution, repeatedly be coated with and drying, make the method (reference example such as patent documentation 4) of flexible printed wiring board with a plurality of polyimide resin layers.
Patent documentation 1: the spy opens clear 62-212140 communique
Patent documentation 2: the spy opens clear 63-84188 communique
Patent documentation 3: the spy opens clear 63-245988 communique
Patent documentation 4: special fair 6-49185 communique
Summary of the invention
Adopt the manufacture method of the flexible printed wiring board in the above-mentioned patent documentation 4, can access the curling the second best in quality flexible printed wiring board that is inhibited of the substrate that causes by coefficient of thermal expansion differences as the adaptation of the metal forming of conductor and resin and metal forming and resin.But, even such substrate, when the formation of the multilayer polyimide resin on the single face in its metal forming did not satisfy certain conditions, the known reality of working as was implemented circuit fabrication in the conductor side, when the metal forming of not wanting is removed, exist on the polyimide film that exposes to be easy to generate curling problem.
The main cause that this phenomenon produces, supposition is with polyimide precursor resin solution coating, drying, undertaken by heat treated in the process of imidizate, producing difference on the degree of orientation at polyimide molecule on the thickness direction of formed polyimide resin layer.But, it be unclear that for its mechanism.
Therefore, the object of the present invention is to provide flexible printed wiring board and the manufacture method thereof that after the conductor side is carried out circuit fabrication, on film, does not also produce curling stay in grade.
The inventor etc. have carried out lucubrate to the problems referred to above, found that, the thickness direction thermal coefficient of expansion that the difference of the degree of orientation of the polyimide molecule of the thickness direction of the polyimide layer that is made of multilayer by prediction produces poor, at the layer that joins with conductor and top layer configuration thermal coefficient of expansion than the high polyimide resin layer of basic unit that is present in both centres, and make the thickness of the layer that joins with conductor littler than the thickness of top layer, realize purpose of the present invention, thereby finished the present invention.
Promptly, flexible printed wiring board of the present invention, be the flexible printed wiring board that on the single face of conductor, has the different multilayer polyimide layer of thermal coefficient of expansion, it is characterized in that: the bottom that joins with conductor and with the intermediate configurations of the top layer of conductor opposite side be 30 * 10 by at least a kind of thermal coefficient of expansion -6The basic unit that (1/ ℃) following low heat expansion polyimide based resin constitutes, and bottom and top layer be made of the thermal coefficient of expansion thermoplastic polyimide resinoid bigger than basic unit, and the thickness P of bottom 1Thickness P with top layer 2Satisfy P 1＜P 2Condition.
In addition, the thickness P of basic unit in preferred the invention described above mRatio P with the aggregate thickness of the bottom of its both sides and top layer m/ (P 1+ P 2) be 2～100 scope.
In addition, the thickness P of bottom in preferred the invention described above 1Be the scope of 0.2～10 μ m, and with the thickness P of top layer 2Ratio P 1/ P 2It is 0.2～0.8 scope.
The manufacture method of flexible printed wiring board of the present invention is by being heating and curing after direct polyimide precursor resin solution coating with multilayer, the drying on the single face of conductor, thereby make the method for flexible printed wiring board, it is characterized in that with the different multilayer polyimide layer of thermal coefficient of expansion: the bottom that joins with conductor and with the intermediate configurations of the top layer of conductor opposite side be 30 * 10 by at least a kind of be converted into thermal coefficient of expansion that constitutes -6The basic unit of the low heat expansion polyimide based resin that (1/ ℃) is following, and can be converted into the resinoid polyimide precursor resin solution of the thermal coefficient of expansion thermoplastic polyimide bigger than basic unit at bottom and top layer coating, drying, be heating and curing then, make the thickness P of bottom 1Thickness P with top layer 2Satisfy P 1＜P 2Condition.
In addition, in the invention described above, the thickness P of preferred basic unit mRatio P with the aggregate thickness of the bottom of its both sides and top layer m/ (P 1+ P 2) be 2～100 scope.
In addition, in the invention described above, preferably be coated with the polyimide precursor resin solution, make the thickness P of bottom 1Be the scope of 0.2～10 μ m, and with the thickness P of top layer 2Ratio P 1/ P 2Satisfy 0.2～0.8 scope.
According to the present invention, even flexible printed wiring board is implemented circuit fabrication and the metal forming of not wanting is removed, polyimide film can not produce curling, warpage yet, the printed substrate that the result can the manufacturing dimension excellent in stability.
Embodiment
Below, be elaborated to being used to implement best mode of the present invention.
At first, as the conductor that uses in the present invention, can enumerate copper, aluminium, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc and their the conductive metal paper tinsels such as alloy of thickness 5～150 μ m, preferably copper.Under the situation of copper, comprise rolled copper foil and electrolytic copper foil, all can use.In order to improve bonding force, also can implement siding, nickel plating, copper facing-kirsite in its surface or utilize the chemistry or the mechanical surface treatment of aluminum alcoholate, aluminium chelate compound, silane coupler etc.
By on as the single face of the conductive metal paper tinsel of conductor, forming a plurality of polyimide based resin layers, can form insulator layer, the so-called polyimide based resin that uses as insulator layer is the general name with resin of imide ring structure, can enumerate for example polyimides, polyamidoimide, polyesterimide etc.In addition, as the polyimide based resin layer, fusion or softening thermoplastic polyimide etc. are not particularly limited in the time of can utilizing in the above-mentioned patent documentation 1～4 low heat expansion material, the heating of record.But particularly preferred insulator layer is to be 30 * 10 with thermal coefficient of expansion (or coefficient of linear expansion) -6Low heat expansion resin bed (1/k) is as basic unit, disposed the insulator layer that the polyimide based resin layer by at least three layers of 2 layers (bottom and top layers) being made of the thermal coefficient of expansion thermoplastic polyimide resinoid bigger than basic unit constitutes down thereon.
Wherein, as the low-thermal-expansion polyimide based resin that forms basic unit, its thermal coefficient of expansion preferred 30 * 10 -6Below (1/ ℃), has excellent performance in the thermal endurance of film, aspect flexible.Wherein, thermal coefficient of expansion is to use the test portion after imidization reaction is fully finished, and utilizes thermomechanical analyzer (TMA), obtain be warmed up to 250 ℃ after, with the cooling of 10 ℃/minute speed, the mean thermal expansion coefficients in 240～100 ℃ scope.As the object lesson of low-thermal-expansion polyimide based resin, preferably has the polyimide based resin of cellular construction shown in the following general formula (I) with such character.
(R in the formula 1～R 4Expression low alkyl group, lower alkoxy, halogen radical or hydrogen).
And, as being formed on the bottom that uses up and down of basic unit and the thermoplastic polyimide resinoid of top layer, as long as thermal coefficient of expansion is bigger than basic unit, its glass transition temperature is just passable below 350 ℃.The adhesive strength at its interface is enough when preferably carrying out crimping under heating and pressurizing.At this moment,, can have identical cellular construction, also can have different cellular constructions as long as the thermoplastic polyimide resinoid of bottom and top layer satisfies above-mentioned condition.Here said thermoplastic polyimide resinoid is also contained under the above common state of glass transition temperature may not demonstrate sufficient flowability, can carry out bonding resin by pressurization.As the resinoid object lesson of the thermoplastic polyimide with such character, has the cellular construction of following general formula (II), general formula (III) expression.
Figure A20058000752900071
(Ar in the formula 1Be the aromatic group of divalent, its carbon number is more than or equal to 12).
(Ar in the formula 2Be the aromatic group of divalent, its carbon number is more than or equal to 12).
Wherein, as the aromatic group Ar of divalent 1Or Ar 2Object lesson, for example can enumerate:
Deng.
In addition, as the flexible printed wiring board method of making the single face conductor, as record in the above-mentioned patent documentation 4, in polyimide precursor solution or polyimide solution, add curing agent such as known anhydrides, amine curing agent, cementability imparting agents such as silane coupler, titanate coupling agent, epoxy compounds, various additives and catalyst such as flexible imparting agent such as rubber are applied on the single face of conductive metal paper tinsel.Make it hot curing by heat treatment then, can access single face conductor laminate.And, the laminate of preferred single face conductor be on the conductive metal paper tinsel stacked thermal coefficient of expansion than the big thermoplastic polyimide resinoid layer of basic unit as bottom, at the polyimide based resin layer of the stacked at least a kind low heat expansion of the basic unit of centre, stacked again thermal coefficient of expansion is than the top layer of the big thermoplastic polyimide resinoid layer of basic unit as outermost.
Wherein, Zhong Jian basic unit must be the thermal coefficient of expansion polyimide based resin layer littler than the thermoplastic polyimide resinoid layer of bottom, top layer.Basic unit have the flexible printed wiring board that suppresses manufacturing produce curl, the effect of warpage, the bottom that joins with conductor has the effect of guaranteeing with the cementability of conductive metal paper tinsel, the expectation top layer has and suppresses the whole effect of curling of film and use.In addition, sometimes at stacked other conductive metal paper tinsels of top layer and heat crimping and during, expect that also it guarantees cementability and use as the flexible printed wiring board of both-sided conductor.
At this moment, the thickness P of low heat expansion polyimide based resin layer (basic unit) mThermoplastic polyimide resinoid layer (bottom P with its both sides 1With top layer P 2) the ratio P of aggregate thickness m/ (P 1+ P 2) be 2～100 scope, preferred 5～20 scope.If this thickness is 2 little frequently, then to compare with the thermal coefficient of expansion of metal forming, the thermal coefficient of expansion of polyimide based resin layer integral body becomes too high, and the bending of the flexible printed wiring board that obtains, curling becomes big, and the operability during circuit fabrication significantly descends.And, if the aggregate thickness (P of the thermoplastic polyimide resinoid layer of both sides 1+ P 2) too small, the ratio of thickness increases to and surpasses 100, then can produce situation about not given full play to the bonding force of conductive metal paper tinsel.
Thickness (the P of the bottom that joins with conductor 1) and with the thickness (P of the top layer of conductor opposite layer 2) be P 1＜P 2Be important.The ratio of its thickness changes P because of the thickness of basic unit with low heat expansion 1/ P 2=0.2～0.8, more preferably 0.3～0.7.If littler than this scope, the curling correction effect of film is strong excessively, produces on the contrary and curls, and on the other hand, if bigger than this scope, then the curling effect that suppresses of film does not have to embody.In addition, the thickness (P of the bottom that joins with conductor layer 1) be preferably the scope of 0.2～10 μ m.If thinner than this scope, then can not guarantee and the bonding force of conductor layer, if thicker, cause that then thermal endurance reduces than this scope.
These multiple polyimide precursors that can be converted into polyimide based resin are resin-coated to the conductive metal paper tinsel, can carry out with the form of its resin solution, but preferably as record in the above-mentioned patent documentation 4, form with its precursor solution, disposable or be coated with multiple precursor solution successively or after the desolventizing below the acid imide closed loop thermal is handled, carry out the thermal conversion of precursor together to polyimides.If changing into further other polyimide precursor solution of coating on the layer of polyimides fully, heat-treat and make it carry out the acid imide closed loop, the situation that then exists the bonding force between each polyimide based resin layer not given full play to becomes the reasons for quality decrease of the two sides laminate that makes goods.
As coating polyimide precursor resin solution (polyamic acid solution) on the conductive metal paper tinsel or contain the method for the resin solution of its precursor compound, can use for example scraper-type coating machine, pressing mold coating machine, roll coater, curtain formula coating machine etc., the employing known method is carried out, particularly carry out the thick occasion that is coated with, be fit to adopt pressing mold coating machine, scraper-type coating machine.And the polymer concentration of the polyimide precursor resin solution that uses during coating also depends on the degree of polymerization of polymer, but is generally 5～30 weight %, preferred 10～20 weight %.If polymer concentration is lower than 5 weight %, then once coating can not obtain enough thickness, if be higher than 30 weight %, then solution viscosity is too high, is not easy coating.
Then, remove and desolvate, and then make it carry out the acid imide closed loop on the conductive metal paper tinsel, heat-treating with the polyimide precursor resin solution (polyamic acid solution) of homogeneous thickness coating.At this moment, if at high temperature heat-treat fast, then generate the top layer at resin surface, solvent is difficult to evaporation, perhaps bubbles, so preferably heat-treating when low temperature slowly rises to high temperature.This moment, final heat treatment temperature was preferably 300～400 ℃ usually, greater than 400 ℃ the time, if the thermal decomposition that slowly begins to produce polyimides is less than 300 ℃, then the polyimides tunicle fully is not orientated on the conductive metal paper tinsel, does not obtain the good single face conductor laminate of flatness.The integral thickness as the polyimide based resin layer of insulator that forms like this is generally 10～150 μ m.
Embodiment
Below, based on embodiment and comparative example, embodiments of the present invention are specifically described.In following embodiment, cover curling of curling of copper products and bonding force and film with following method mensuration thermal coefficient of expansion, single face.
That is, thermal coefficient of expansion is the thermomechanical analyzer (TMA100) that utilizes Seiko Instruments Inc to make, be warmed up to 250 ℃ after, with 10 ℃/minute speed cooling, the average coefficient of linear expansion that calculates between 240 ℃～100 ℃ is obtained.
It is the radius of curvature of covering copper products of size 100mm * 100mm behind mensuration heat treatment, the imidizate that single face covers the curling of copper products.
The bonding force that single face covers copper products is according to JIS C5016:7.1 item, uses the pattern of conductor width 3mm, obtains the value (kg/cm) when 180 ° direction is peeled off Copper Foil with the speed of 50mm/ branch.
The scolding tin thermal endurance is the method according to JIS C5016, gently the solder bath temperature is raise from 260 ℃ of intervals with 10 ℃, measures up to the highest 400 ℃.
In addition, in embodiment and comparative example, used following abbreviation.
PMDA: pyromellitic dianhydride
BTDA:3,3 ', 4,4 '-the benzophenone tetracarboxylic acid anhydride
DDE:4,4 '-diaminodiphenyl ether
MABA:2 '-methoxyl group-4,4 '-diamino-N-benzanilide
(synthesis example 1)
Put into the N of 2532g while feeding nitrogen in the glass reactor, the N-dimethylacetylamide then adds the DDE of 0.5mol and the MABA of 0.5mol under condition of stirring, it is dissolved fully.This solution is cooled to 10 ℃, adds the PMDA of 1mol bit by bit, after adding end, continue at room temperature to stir 2 hours, polymerization reaction is finished so that reactant liquor remains on the temperature smaller or equal to 30 ℃.The polyimide precursor solution that obtains has the polymer concentration of 15 weight %, utilizes Brookfield viscometer to be 1000mPas 25 ℃ of apparent viscosities that record.
(synthesis example 2)
Except the DDE that uses 1mol as two amine components, the BTDA that uses 1mol similarly modulates polyimide precursor solution as outside the acid anhydrides composition with synthesis example 1.The polyimide precursor solution that obtains has the polymer concentration of 15 weight %, utilizes Brookfield viscometer to be 300mPas 25 ℃ of apparent viscosities that record.
Embodiment 1
On the roughened surface of the electrolytic copper foil (Nikko Gould society system) of 35 μ m roller shapes, utilize the pressing mold coating machine to be uniformly coated on the polyimide precursor solution 2 of modulation in the synthesis example 2 as bottom with the thickness of 20 μ m, handle continuously with 120 ℃ hot-air drying stove then, remove and desolvate.Then on this polyimide precursor layer, utilize the reversible type roll coater to be uniformly coated on the polyimide precursor solution 1 of modulation in the synthesis example 1 as basic unit with the thickness of 200 μ m, hot-air drying stove with 120 ℃ is handled continuously, remove and desolvate, and then be uniformly coated on the polyimide precursor solution 2 of modulation in the synthesis example 2 as top layer with the thickness of 40 μ m, next in hot-air drying stove, be warmed up to 360 ℃ from 120 ℃ with 30 minutes, heat-treat and make its imidizate, the thickness that obtains polyimide resin layer is 25 μ m, (single face covers copper products a) to the good single face conductor laminate of flatness that does not have warpage and curl.Wherein, the basic point of the thickness of bottom is measured as 1/2 of the surface roughness of the matsurface of conductor.Measure the copper foil layer of this single face conductor laminate a and the 180 ° of peel strengths (JIS C-5016) between the polyimide resin layer, the result is 1.8Kg/cm.Then the conductor side of this single face conductor laminate a is implemented circuit fabrication, do not produce on the polyimide film that exposes when the metal forming of not wanting is removed and curl, and the coefficient of linear expansion of etched film is 23.5 * 10 -6(1/ ℃).
Embodiment 2～3 and comparative example 1～3
The thickness of the polyimide resin layer of the bottom among the embodiment 1, basic unit and top layer is carried out various variations, similarly carry out drying, in hot-air drying stove, be warmed up to 360 ℃ from 120 ℃ then, obtain single face conductor laminate (single face covers copper products) a with 30 minutes.The curling generation situation of the warpage of this single face conductor laminate a and the generation situation of curling, 180 ° of peel strengths and the polyimide film that exposes when the conductor side is implemented circuit fabrication and the metal forming of not wanting removed and the coefficient of linear expansion of etched film etc. are shown in table 1 and table 2 in the lump.
Table 1
Embodiment Bottom thick (μ m) Basic unit thick (μ m) Top layer thick (μ m) Bonding force (kg/cm) Single face covers the curling situation of copper products
1 1.1 21.5 2.4 1.8 Do not curl
2 1.5 20.7 2.8 2.0 Do not curl
3 2.0 20.0 3.0 1.9 Do not curl
Table 2
Comparative example Bottom thick (μ m) Basic unit thick (μ m) Top layer thick (μ m) Bonding force (kg/cm) Single face covers the curling situation of copper products
1 2.4 21.5 1.1 1.7 6mm (generation is curled in the top side)
2 2.8 20.7 1.5 1.6 2mm (generation is curled in the top side)
3 3.0 20.0 2.0 1.6 10mm (generation is curled in the top side)
4 2.5 20.0 2.5 1.6 7mm (generation is curled in the top side)
Soft printing distributing board of the present invention and manufacture method thereof since the bottom that joins with conductor and with the intermediate configurations of the top layer of conductor opposite side be 30 * 10 by at least a kind of thermal coefficient of expansion -6The basic unit that (1/ ℃) following low heat expansion polyimide based resin constitutes, and bottom and top layer are made of the thermal coefficient of expansion thermoplastic polyimide resinoid bigger than basic unit, can access on the industry that does not also produce curling stay in grade on the processing caudacoria and utilize the high substrate of possibility.

Claims (5)

1. flexible printed wiring board, be the flexible printed wiring board that on the single face of conductor, has the different multilayer polyimide layer of thermal coefficient of expansion, it is characterized in that: the bottom that joins with conductor and with the intermediate configurations of the top layer of conductor opposite side be 30 * 10 by at least a kind of thermal coefficient of expansion -6The basic unit that (l/ ℃) following low heat expansion polyimide based resin constitutes, and bottom and top layer be made of the thermal coefficient of expansion thermoplastic polyimide resinoid bigger than basic unit, and the thickness P of bottom 1Thickness P with top layer 2Satisfy P 1＜P 2Condition.
2. the described flexible printed wiring board of claim 1, wherein, the thickness P of basic unit mRatio P with the aggregate thickness of the bottom of its both sides and top layer m/ (P 1+ P 2) satisfy 2～100 scope.
3. claim 1 or 2 described flexible printed wiring boards, wherein, the thickness P of bottom 1Be the scope of 0.2～10 μ m, and with the thickness P of top layer 2Ratio P 1/ P 2Satisfy 0.2～0.8 scope.
4. the manufacture method of flexible printed wiring board, be by being heating and curing after direct polyimide precursor resin solution coating, the drying on the single face of conductor with multilayer, thereby make the method for flexible printed wiring board, it is characterized in that with the different multilayer polyimide layer of thermal coefficient of expansion: the bottom that joins with conductor and with the intermediate configurations of the top layer of conductor opposite side be 30 * 10 by at least a kind of be converted into thermal coefficient of expansion that constitutes -6The basic unit of the low heat expansion polyimide based resin that (l/ ℃) is following, and can be converted into the thermal coefficient of expansion thermoplastic polyimide resinoid polyimide precursor resin solution bigger than basic unit at bottom and top layer coating, drying, be heating and curing then, thereby make the thickness P of bottom 1Thickness P with top layer 2Satisfy P 1＜P 2Condition.
5. the manufacture method of the described flexible printed wiring board of claim 4 wherein, is coated with polyimide precursor resin solution, makes the thickness P of bottom 1Be the scope of 0.2～10 μ m, and with the thickness P of top layer 2Ratio P 1/ P 2Satisfy 0.2～0.8 scope.
CNA2005800075295A 2004-03-09 2005-03-09 Flexible printed wiring board and manufacturing method thereof Pending CN1947476A (en)

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JP2004065854A JP2005259790A (en) 2004-03-09 2004-03-09 Flexible printed wiring board and its production method

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CN107950081A (en) * 2015-09-10 2018-04-20 株式会社电装 The manufacture method of printed circuit board (PCB)
CN109575283A (en) * 2017-09-29 2019-04-05 日铁化学材料株式会社 Polyimide film, metal-clad and circuit substrate

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JP5291006B2 (en) * 2008-02-08 2013-09-18 新日鉄住金化学株式会社 Method for manufacturing circuit wiring board
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Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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JP3518992B2 (en) * 1998-06-05 2004-04-12 ソニーケミカル株式会社 Flexible printed wiring board
JP3405242B2 (en) * 1998-12-21 2003-05-12 ソニーケミカル株式会社 Flexible board

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CN109575283B (en) * 2017-09-29 2022-08-09 日铁化学材料株式会社 Polyimide film, metal-clad laminate, and circuit board

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