CN1665036A - 红外接收器芯片 - Google Patents

红外接收器芯片 Download PDF

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CN1665036A
CN1665036A CN2005100518187A CN200510051818A CN1665036A CN 1665036 A CN1665036 A CN 1665036A CN 2005100518187 A CN2005100518187 A CN 2005100518187A CN 200510051818 A CN200510051818 A CN 200510051818A CN 1665036 A CN1665036 A CN 1665036A
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chip
infrared receiver
contact
lead frame
making surface
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CN100578822C (zh
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亚历山大·库尔茨
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Atmel Germany GmbH
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Abstract

本发明涉及用于装入到一个红外接收模块的标准化引线框中的红外接收器芯片，具有用于通过压焊丝与引线框的所属功能位置相连接的多个接触面，其中至少一个接触面与红外接收器芯片的周边这样地隔有距离及所有的接触面彼此被这样地定位，以使得当红外接收器芯片装入到任何一个标准化引线框中时压焊丝在相应地压焊丝的从每个所属的接触面到相应地所属的功能位置直接延伸路径上彼此不相交。

Description

红外接收器芯片
技术领域
本发明涉及一种用于装入到一个红外接收模块的标准化引线框(leadframe)中的红外接收器芯片。
背景技术
上述类型的红外接收器例如使用于载频调制的传输应用领域中的数据连接。红外接收器尤其在娱乐用电子装置方面被公知，这些装置例如为电视机，DVD播放器，卫星接收器，录像机，CD播放器或类似装置。在此情况下例如由一个遥控器在向着红外接收模块的方向上发送红外(IR)光信号，在该模块中所接收的光信号被转换成电流信号。
通常存在不同布置的红外接收模块，其中迄今至少使用两种不同布置的红外接收器芯片，以便符合各个红外接收模块的不同构型的引线框的安装要求。通常存在三种标准化引线框构型，以下将参照图5至7来详细描述它们。
图5表示一个置入第一标准化引线框2中的红外接收器芯片1的俯视图。如图5中可看到的，适合安装在第一标准化引线框2中的红外接收器芯片1具有至少一个信号输入接触面5，一个接地接触面6，一个信号输出接触面7及一个电源接触面8。信号输入接触面5用于一个引线框侧信号输入位置IN的连接端子，接地接触面6用于一个引线框侧接地位置GND的连接端子，信号输出接触面7用于引线框侧信号输出位置OUT的连接端子及电源接触面8用于引线框侧电源位置VCC的连接端子。各个端子或连接点借助压焊丝9连接。
此外红外接收器芯片1还具有另外的接触面10，用于在所属引线框2中红外接收器芯片1的焊接。
图6及7表示一个红外接收器芯片1的俯视图，该红外接收器芯片被置入一个第二标准化引线框3或一个第三标准化引线框4中。这些红外接收器芯片1也具有上述的用于所属引线框侧信号输入位置、接地位置、信号输出位置及电源位置的接触面5，6，7，8及10。
这里这三种标准化引线框2，3及4的区别在于：各个端子位置IN，GND，OUT及VCC被设置在不同的位置上，如在图5，6及7中可看到的。
根据图6的第二标准化引线框3与根据图5的第一标准化引线框2的区别在于：相对于置入的红外接收器芯片1，电源位置VCC被布置在信号输出位置OUT的相对的面，而不是被布置在同一侧上。
根据图7的第三标准化引线框4与根据图5的第一标准化引线框2的区别在于：相对于置入的红外接收器芯片1，信号输出位置OUT被布置在接地位置GND的对面并位于信号输入位置IN与电源位置VCC之间。与根据图6的第二标准化引线框3相比，电源位置被附加地设置在芯片1的另一侧边。
这种连接端子位置与设置在红外接收器芯片1上的接触面的连接的基本问题在于，压焊丝9必需尽可能直接地从相应地端子位置延伸到所对应的接触面，以便使压焊丝的长度保持尽可能地短，因此可使电磁干扰影响减至最小。此外各个连接的各个压焊丝9不能交叉或相交，以避免这些导线的短路。
为了满足在装入到不同结构的标准化引线框2，3，4中的这些要求，当前存在的多种不同结构的红外接收器芯片1具有各个接触面的不同几何布置。
为了将一个红外接收器芯片1装入到根据图5的第一标准化引线框2及根据图6的第二标准化引线框3中，可使用统一的红外接收器芯片1，它仅通过转动可作到各个接触面相对所对应的端子位置的合适定向。
但将一个红外接收器芯片1装入根据图7的第三标准化引线框4时这种红外接收器芯片不能满足上述要求，由此必需使用另一种结构的红外接收器芯片1，其上的各个接触面具有另一种几何布置，如图7中可看到的。
但在此考虑方面以下的事实被证实是不利的，即两种不同结构的芯片-它们可能还具有不同的传输协议-的物流供件操作是很费事的及导致增高的物流管理成本并由此导致销售价格的上升。
发明内容
因此本发明的任务在于，提供一种红外接收器芯片，它可同样地适合在根据图5，6及7的三种标准化引线框2，3及4中使用并可满足上述要求。
根据本发明，提出了一种用于装入到一个红外接收模块的标准化引线框中的红外接收器芯片，具有用于通过多个印制导线与该引线框的信号输入位置、接地位置、信号输出位置和/或电源位置相连接的接触面；其中这些用于与接地位置、信号输出位置及电源位置相连接的接触面被定位在一个共同的直线上，该直线具有从该红外接收器芯片的一个第一周边向其第二周边的倾斜的延伸；其中用于连接信号输入位置的接触面与用于连接接地位置的接触面被定位在一个直线上，该直线具有相对于分配给接地位置或输入位置的、红外接收器芯片的第一周边大致平行的延伸；由此当该红外接收器芯片装入到任何一个标准化引线框中时这些印制导线在相应的印制导线从每个所属的接触面到相应地所属的功能位置的直接延伸路径中彼此不相交。
根据本发明，还提供了另一种用于装入到一个红外接收模块的标准化引线框中的红外接收器芯片，具有用于通过多个印制导线与该引线框的信号输入位置、接地位置、信号输出位置和/或电源位置相连接的接触面；其中这些接触面被定位在一个共同的直线上，该直线具有从该红外接收器芯片的第一周边向其第二周边的倾斜的延伸；由此当该红外接收器芯片装入到任何一个标准化引线框中时这些印制导线在相应的印制导线从每个所属的接触面到相应地所属的功能位置的直接延伸路径中彼此不相交。
根据本发明，该任务将通过具有上述特征的红外接收器芯片来解决。
因此设计了一种用于装入到一个红外接收模块的标准化引线框中的红外接收器芯片，它具有用于通过压焊丝与引线框的所属功能位置相连接的多个接触面，其中至少一个接触面与红外接收器芯片的周边这样地隔有距离并且所有的接触面彼此被这样地定位，以使得当红外接收器芯片装入到任何一个标准化引线框中时这些压焊丝在相应压焊丝的从每个所属的接触面到相应地所属的功能位置直接延伸路径上彼此不相交。
作为本发明基础的构思在于，将接触面在红外接收器芯片上这样新地定位，以使得当红外接收器芯片适合地装入到任何一个标准化引线框中时压焊丝在相应在的压焊丝从每个所属的接触面到相应地所属的功能位置或连接端子位置的直接延伸路径上彼此不交叉。在此情况下各个接触面不是全部布置在红外接收器芯片的周边区域，而是至少一部分向着红外接收器芯片的表面中心的方向移动。换言之，至少一个接触面这样地与红外接收器芯片的周边隔有距离并且所有接触面彼此被这样定位，以使得被构造得尽可能短的、相应地压焊丝彼此不会相交。
因此本发明相对现有技术具有其优点，即在三种标准化引线框中可这样地仅使用一种统一的红外接收器芯片，以致可满足压焊丝尽可能地短及各个压焊丝彼此不相交的要求。因而避免了在不同结构的红外接收器芯片的情况下存在的物流供件问题，由此可节省成本。
根据一个优选的进一步构型，用于与接地位置、信号输出位置及电源位置相连接的接触面被定位在一个共同的直线上，该直线在红外接收器芯片表面上具有从红外接收器芯片的一个周边的大致中间位置向另一周边的大致中间位置的倾斜的延伸；其中用于连接信号输入位置的接触面与用于连接接地位置的接触面被定位在一个直线上，该直线具有相对于分配给接地位置或输入位置的、红外接收器芯片的周边平行的延伸。
根据另一优选实施例，所有接触面被定位在一个共同的直线上，该直线在红外接收器芯片表面上具有从该红外接收器芯片的一个周边向-最好相邻的-另一周边倾斜的延伸。
这些接触面例如可被共同地定位在红外接收器芯片的一个对角线上或相对该对角线被稍微偏移地定位。
红外接收器芯片最好被构成半导体芯片。
附图说明
以下将借助附图中的概要示图来详细描述本发明的优选实施例。
附图说明：
图1：根据本发明的一个实施例的红外接收模块的俯视图；
图2：根据本发明的一个实施例的红外接收器芯片的概要俯视图，该芯片被装在第一标准化引线框中；
图3：根据本发明的一个实施例的红外接收器芯片的概要俯视图，该芯片被装在第二标准化引线框中；
图4：根据本发明的一个实施例的红外接收器芯片的概要俯视图，该芯片被装在第三标准化引线框中；
图5：根据现有技术的第一方式的一个红外接收器芯片的概要俯视图，该芯片被装在第一标准化引线框中；
图6：根据现有技术的第一方式的一个红外接收器芯片的概要俯视图，该芯片被装在第二标准化引线框中；及
图7：根据现有技术的第二方式的一个红外接收器芯片的概要俯视图，该芯片被装在第三标准化引线框中。
在附图的各图中相同的或功能相同的元件或部分-只要无其它的说明-均设有相同的标号。
具体实施方式
图1表示根据本发明的一个优选实施例的红外接收模块的俯视图，其中集成了根据本发明的红外接收器芯片1。如图1可看到的，该接收模块具有向外指向的触针11，它们例如可与成品装置的相应配置的接地位置、信号接收位置及电源位置相连接。
图2表示根据本发明的一个实施例的红外接收器芯片1的概要俯视图，该芯片被装置入在仅是被局部地表示的第一标准化引线框2中。
根据该实施例的红外接收器芯片1具有一个信号输入接触面5，一个接地接触面6，一个信号输出接触面7及一个电源接触面8。如参照根据现有技术的图5，6及7已描述的、各个接触面5，6，7及8通过压焊丝9与引线框2的所对应的端子位置连接或结合。
在第一标准化引线框2中，信号输入位置IN被布置在芯片安装位置的上面，即红外接收器芯片1的上侧边的上面。接地位置GND、信号输出位置OUT及电源位置VCC被布置在芯片安装位置的左面，即在红外接收器芯片1的左侧边的区域中。
如在图3中以概要俯视图表示地，第二标准化引线框与上述不同地具有的电源位置VCC在芯片安装位置的右面，即在红外接收器芯片1的右侧边的区域中。
如在图4中以概要俯视图表示地，第三标准化引线框4也与上述不同地具有被布置在芯片安装位置的下面、即在红外接收器芯片1的下侧边的区域中的电源位置VCC，及被布置在芯片安装位置的右面、即在红外接收器芯片1的右侧边的区域中的信号输出位置OUT。
根据本发明的该实施例的红外接收器芯片具有各个接触面5，6，7及8的这样的专门布置，使得当该红外接收器芯片1安装到这三种标准化引线框2，3或4的任何一种中时可实现压焊丝9的尽可能短的布置，即各个压焊丝从相应地接触面大致直接地延伸到所对应的端子位置上，其中各个压焊丝9在各个标准化引线框2，3或4中的任何所示安装状态中均不交叉或相交。
根据该实施例，信号输入接触面5及接地接触面6彼此相邻地被定位在一个第一周边(Umfangskante)12的区域中，其中电源接触位置8被布置在一个与此相邻的第二周边13的区域中。信号输出接触面7优选被这样地布置在接地接触面6与电源接触面8之间，使得信号输出接触面7与第一周边12及第二周边13隔有距离。例如接地接触面6、信号输出接触面7及电源接触面8可被布置在一个共同的直线上，该直线从第一周边12倾斜地延伸到第二周边13上，如图2，3及4中所示。
因此本发明提供了一种在芯片上具有各个接触面的有利布置的红外接收器芯片，借助本发明这种相同的接收器芯片可这样地安装在三种不同结构的标准化引线框中，即可保证短压焊丝连接及各个压焊丝彼此不交叉的要求。
虽然以上借助了一个优选实施例对本发明作出了描述，但本发明不被限制在其上，而它能以各种各样的方式变换。
例如信号输入接触面5、接地接触面6、信号输出接触面7及电源接触面8可位于一个共同的直线上，该直线从第一周边12倾斜地延伸到第二周边13的方向上。
此外还可以这样：各接触面5，6，7及8被布置在红外接收器芯片合适的对角线上。另外对于技术人员来说显而易见地，各个接触面5，6，7及不一定必需被布置在一个共同的直线上，而可以有利地彼此相对地稍微错开一些。起决定作用的仅在于，信号输出接触面7相对电源接触面8被这样位移地定位，使得当红外接收器芯片装入到这三种不同结构的标准化引线框2，3及4中的情况时压焊丝在直接连接的路径上不会交叉。
                      参考标号表
1          红外接收器芯片
2          第一标准化引线框
3          第二标准化引线框
4          第三标准化引线框
5          信号输入接触面
6          接地接触面
7          信号输出接触面
8          电源接触面
9          印制导线
10         焊接接触面
11         触针
12         第一周边
13         第二周边
IN         信号输入位置
GND        接地位置
OUT        信号输出位置
VCC        电源位置

Claims (6)

1.用于装入到一个红外接收模块的标准化引线框(2，3，4)中的红外接收器芯片(1)，具有用于通过多个印制导线(9)与该引线框(2，3，4)的一个信号输入位置(IN)、一个接地位置(GND)、一个信号输出位置(OUT)和/或一个电源位置(VCC)相连接的接触面(5，6，7，8)；
其中这些用于与接地位置(GND)、信号输出位置(OUT)及电源位置(VCC)相连接的接触面(6，7，8)被定位在一个共同的直线上，该直线具有从该红外接收器芯片(1)的一个第一周边(12)向其一个第二周边(13)的倾斜的延伸；
其中用于连接信号输入位置(IN)的该接触面(5)与用于连接该接地位置(GND)的接触面(6)被定位在一个直线上，该直线具有相对于分配给该接地位置或输入位置的、该红外接收器芯片(1)的该第一周边(12)大致平行的延伸；
由此当该红外接收器芯片(1)装入到任何一个标准化引线框(2，3，4)中时这些印制导线(9)在相应的印制导线(9)从每个所属的接触面(5，6，7，8)到相应地所属的功能位置(IN，GND，OUT，VCC)的直接延伸路径中彼此不相交。
2.用于装入到一个红外接收模块的标准化引线框(2，3，4)中的红外接收器芯片(1)，具有用于通过多个印制导线(9)与该引线框(2，3，4)的一个信号输入位置(IN)、一个接地位置(GND)、一个信号输出位置(OUT)和/或一个电源位置(VCC)相连接的接触面(5，6，7，8)；
其中这些接触面(5，6，7，8)被定位在一个共同的直线上，该直线具有从该红外接收器芯片(1)的一个第一周边(12)向其一个第二周边(13)的倾斜的延伸；
由此当该红外接收器芯片(1)装入到任何一个标准化引线框(2，3，4)中时这些印制导线(9)在相应的印制导线(9)从每个所属的接触面(5，6，7，8)到相应地所属的功能位置(IN，GND，OUT，VCC)的直接延伸路径中彼此不相交。
3.根据权利要求2的红外接收器芯片，其特征在于：这些接触面(5，6，7，8)被共同地定位在该红外接收器芯片(1)的一个对角线上或相对该对角线被稍微偏移地定位。
4.根据以上权利要求中一项的红外接收器芯片，其特征在于：该第二周边(13)相对第一周边(12)被相邻地布置。
5.根据以上权利要求中一项的红外接收器芯片，其特征在于：该红外接收器芯片(1)由半导体芯片构成。
6.根据以上权利要求中一项的红外接收器芯片，其特征在于：所述各个印制导线(9)由压焊丝构成。
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