CN1662929A - 用于在芯片卡上产生导电连接的方法 - Google Patents

用于在芯片卡上产生导电连接的方法 Download PDF

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CN1662929A
CN1662929A CN038145308A CN03814530A CN1662929A CN 1662929 A CN1662929 A CN 1662929A CN 038145308 A CN038145308 A CN 038145308A CN 03814530 A CN03814530 A CN 03814530A CN 1662929 A CN1662929 A CN 1662929A
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约瑟夫·里德尔
安多·韦林
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Huangshi G&D Wanda Security Card Co Ltd
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Abstract

本发明涉及用于在数据载体、特别是芯片卡的线圈接触表面和芯片模块之间产生导电连接的方法。用于上述方法的粘接剂，特征在于具有有限的导电性。

Description

用于在芯片卡上产生导电连接的方法
技术领域
本发明涉及根据权利要求1前序部分所述的用于在数据载体、特别是芯片卡的线圈接触表面和芯片模块之间产生导电连接的方法。此外，本发明涉及根据权利要求17和18的前序部分所述的粘接剂的使用，以在数据载体、特别是芯片卡的线圈接触表面和芯片模块之间产生导电连接；以及由该方法产生的数据载体。
背景技术
芯片卡目前用于日常生活的各个领域。芯片卡用在非现金支付交易领域中，用于检验访问权限，作为私人特征的数据载体，作为身份证，等等。在处于流通的某些芯片卡中，数据和能量交换是通过设置在卡体内部的天线借助感应耦合而非接触地实现的。天线形成为线圈并且例如印刷在卡体上或者由金属穿孔。所用的被称作“双重界面卡(dual interface cards)”的大量芯片卡既适于非接触的数据交换又适于(经由现有的接触表面)用在读取装置中。
为了在天线的线圈接触表面和芯片模块之间产生导电连接，各向异性导电的粘接剂得以频繁使用。这类粘接剂具有微观级别的小的金属粒子，通常为银粒子，所述粒子由非导电的支承材料包围。在施加压力时，金属粒子在压力方向上形成导电路径，而在与材料受压方向成横向上仍然具有高电阻并因而在该方向上不导电。
实践中，使用各向异性导电的粘接剂具有缺点，即，该粘接剂昂贵并且当受到机械负荷时所生成的结合点在芯片模块和线圈接触表面之间形成不充分的导电连接。而且，各向异性粘接剂不能用于与印刷的天线的连接，这是因为在芯片模块和线圈接触表面之间建立的压强不足以形成永久的导电路径。
从现有技术可知使用导电的粘接剂，例如EP0682321。这种粘接剂的缺点是当其已经施加后，不仅在芯片模块和线圈接触表面之间生成导电连接而且在天线的两个线圈接触表面之间也生成导电连接，这会引起天线短路。因此提供了应用导电的粘接剂使得两个线圈接触表面彼此保持隔离。这是通过以点状方式施加粘接剂或者通过随后去除已经以点状方式施加的粘接剂而获得的。但是在任何情况下，粘接剂连接的产生是精细的，因而涉及到成本增加。
发明内容
因而，本发明要解决的问题是提供一种用于在数据载体、特别是芯片卡的线圈接触表面和芯片模块之间产生导电连接的方法，其导致芯片模块和线圈接触表面之间较高程度的导电连接、使得线圈接触表面彼此充分隔离、并且同时易于实现。
该问题通过独立权利要求中陈述的特征解决。
本发明的基本思想是使用有限导电的粘接剂在线圈接触表面和芯片模块之间产生粘接剂连接。粘接剂的应用可使得线圈接触表面和芯片模块经由单一的粘接剂连接而互连。选择粘接剂的特定导电性，使得在施加粘接剂之后，在通常隔开大致30μm的芯片模块和特定的线圈接触表面之间形成例如3欧姆的低电阻。但是，同样从粘接剂的全方位施加中生成的两个线圈接触表面的互连具有高电阻性，是因为线圈接触表面与其小横截面积之间的多倍较大的距离；电阻通常为1000欧姆或者更大。以此方式，可以在一个工作步骤中施加粘接剂，而无需采用特殊措施来防止线圈接触表面之间的短路。
还可以构想将粘接剂不是全方位地施加在线圈接触表面和芯片模块之间的空腔中，而是采用在各种情况下都将线圈接触表面与芯片模块导电连接的粘接剂点的形式。
附图说明
本发明的另外的特性和优点将从下文参照附图对不同实施例的更详细地解释中得到，附图中：
图1是芯片卡的视图；
图2为通过使用根据本发明第一实施例的粘接剂的芯片卡的基板截取的示意性剖视图；
图3为通过根据本发明第二实施例的以粘接剂点的形式施加粘接剂的芯片卡的基板截取的示意性剖视图；
具体实施方式
图1示出上面设置有线圈2的芯片卡1，该线圈用作天线并且导电地连接到线圈接触表面3，4。这种配置的载体是基板5。芯片卡1还具有容纳在基板5的例如被称作空腔的间隙中的芯片模块6，并且通过粘接剂(未示出)导电地连接到线圈接触表面3，4。
图2示出芯片卡1的基板5的剖视图(并非按照1比1比例)。线圈接触表面3，4设置在基板5上，而且可以与基板5的表面齐平或者部分埋置于基板5中。在所示的配置中，芯片模块6设置在线圈接触表面3，4的上方，由此芯片模块6的接触元件7与线圈接触表面3，4相对。根据本发明第一实施例的本发明有限导电的粘接剂8施加在线圈接触表面3，4上并且将该表面连接到芯片模块6。当然还可以构想首先将粘接剂8施加到芯片模块6上，然后产生向线圈接触表面3，4的连接。
优选的是，粘接剂8是热溶性粘接剂，从而在芯片模块6和线圈接触表面3，4之间形成特别稳定的机械连接。
根据本发明的进一步的实施例，线圈接触表面3，4还彼此机械地隔离。为此，全方位施加的粘接剂8可随后在线圈接触表面3，4之间除去或者单独地施加给每个线圈接触表面3，4，使得粘接剂8不会在线圈接触表面3，4之间形成机械桥。例如，可以在粘接剂平面的横向上轧制出一道沟槽，粘接剂8可以通过该沟槽完全去除或者至少大部分去除。以此方式，进一步增强了线圈接触表面3，4的电隔离。
根据该配置的几何形状，芯片模块6的接触元件7和线圈接触表面3，4之间的距离a比两个线圈接触表面之间距离d小许多倍。根据所用的芯片卡的结构，当a的值大约为30μm时，d大约为8mm。
优选的是，导电的粘接剂8的特殊导电性要选择使得芯片模块6的接触元件7和线圈接触表面3，4之间的电阻具有低值(通常为3欧姆或更小)，而在两个线圈接触表面3，4之间形成高欧姆的电阻值(通常为1000欧姆或更大)，其可靠地防止了天线短路。
如图3所示，在芯片模块6和线圈接触表面3，4之间产生导电连接的另一可能性是一方面借助非导电的粘接剂9在芯片模块6和基板5之间产生连接，另一方面，当将本发明有限导电的粘接剂8的粘接剂点10单独地设置在线圈接触表面3，4上以及芯片模块6的接触元件7上。优选选择有限导电的粘接剂8的特殊导电性使得芯片模块6和一个线圈接触表面3，4之间所形成的总电阻是低欧姆值且基本上不超出3欧姆。代之以使用非导电的粘接剂9的方法，当然还可以使用其他期望的方法，诸如熔融焊接或超声波焊接，其确保了芯片模块6和基板5之间连接的充分机械稳定性。
粘接剂点10可以在例如轧制出芯片模块空腔之后施加。还可以构想在卡的叠层结构之前通过丝网印刷提供粘接剂点10。在将要设置粘接剂点10的地方，可以省略非导电的粘接剂9，或者可以通过适当的方法在施加该非导电的粘接剂9之后将其去除。
此外，可以从有限导电的粘接剂8中冲压出粘接剂点10，然后将粘接剂点10施加到芯片模块6中。一种热激活的粘接剂带可用于将芯片模块6固定于卡体中，从而被冲压出的粘接剂点10还可以插入粘接剂带中的相应间隙中并且与其一起在一个工作步骤中叠层在芯片模块6之上。
根据本发明进一步实施例，被冲压出的粘接剂点10施加到线圈接触表面3，4上。

Claims (18)

1.一种在数据载体、特别是芯片卡(1)的线圈接触表面(3，4)和芯片模块(6)之间产生导电连接的方法，其特征在于，使用了有限导电的粘接剂(8)。
2.如权利要求1所述的方法，其特征在于，粘接剂(8)借助粘接剂连接作用将两个线圈接触表面(3，4)彼此连接并且将两个线圈接触表面(3，4)连接到芯片模块(6)。
3.如权利要求1或2所述的方法，其特征在于，粘接剂(8)的导电性的选择要使得线圈接触表面(3，4)至芯片模块(6)的连接形成为导电性的，并且两个线圈接触表面(3，4)彼此的连接形成高电阻。
4.如前述权利要求任一项所述的方法，其特征在于，线圈接触表面(3，4)和芯片模块(6)之间的电阻基本上不超过3欧姆。
5.如前述权利要求任一项所述的方法，其特征在于，两个线圈接触表面(3，4)之间的电阻基本上至少为1000欧姆。
6.如前述权利要求任一项所述的方法，其特征在于，粘接剂(8)是热溶性粘接剂。
7.如前述权利要求任一项所述的方法，其特征在于，线圈接触表面(3，4)彼此机械地隔离。
8.如前述权利要求任一项所述的方法，其特征在于，粘接剂(8)以粘接剂点(10)的形式施加到线圈接触表面(3，4)上。
9.如前述权利要求任一项所述的方法，其特征在于，芯片模块(6)通过非导电的粘接剂(9)紧固到基板(5)上。
10.如前述权利要求任一项所述的方法，其特征在于，在轧制出芯片模块空腔之后施加粘接剂点(10)。
11.如前述权利要求任一项所述的方法，其特征在于，通过丝网印刷施加粘接剂点(10)。
12.如前述权利要求任一项所述的方法，其特征在于，从有限导电的粘接剂(8)冲压出粘接剂点(10)。
13.如权利要求12所述的方法，其特征在于，粘接剂点(10)插入热激活的粘接剂带中的空隙之中。
14.如权利要求13所述的方法，其特征在于，粘接剂点(10)和粘接剂带在一个工作步骤中叠置在芯片模块(6)中。
15.如权利要求12所述的方法，其特征在于，粘接剂点(10)施加到线圈接触表面(3，4)上。
16.如前述权利要求任一项所述的方法，其特征在于，芯片卡(1)是双重界面卡。
17.粘接剂的使用，用于在数据载体、特别是芯片卡(1)的线圈接触表面(3，4)和芯片模块(6)之间产生导电连接，其特征在于，粘接剂(8)具有有限的导电性。
18.数据载体，特别是芯片卡(1)，其在线圈接触表面(3，4)和芯片模块(6)之间产生导电连接，其特征在于，所述连接具有带有有限导电性的粘接剂(8)。
CNB038145308A 2002-07-03 2003-07-02 用于在芯片卡上产生导电连接的方法 Expired - Fee Related CN100365653C (zh)

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DE10229902A DE10229902A1 (de) 2002-07-03 2002-07-03 Verfahren zur Herstellung von elektrisch leitfähigen Verbindungen auf Chipkarten
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EP0688051B1 (fr) * 1994-06-15 1999-09-15 De La Rue Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré.
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