CN1397048A - 便携式数据载体 - Google Patents
便携式数据载体 Download PDFInfo
- Publication number
- CN1397048A CN1397048A CN01804414.XA CN01804414A CN1397048A CN 1397048 A CN1397048 A CN 1397048A CN 01804414 A CN01804414 A CN 01804414A CN 1397048 A CN1397048 A CN 1397048A
- Authority
- CN
- China
- Prior art keywords
- chip
- portable data
- data medium
- bending point
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
提出了一个具有卡式体(1)的便携式数据载体,具有一个用于接收一个芯片模块(3)的凹槽(2),该芯片模块包含:位于连接到卡式体(18)的芯片载体的第一主侧(5)上的至少一个半导体芯片(4),和在芯片载体的第二主侧(6)上的具有接触片的一个金属化层。在这种情况下,芯片载体具有所需弯曲点(9),如果发生弯曲应力,则可减少半导体芯片和接合线连接上的压力。
Description
本发明涉及具有卡式体的便携式数据载体,该便携式数据载体具有一个用于接收芯片模块的凹槽,该芯片模块包括在连接到卡式体的芯片载体的第一主侧上的至少一个半导体芯片,以及在芯片载体的第二主侧上的具有接触片的金属化层。
这种类型的便携式数据载体从现有技术中已经公知了。它们通常以具有一个包含的集成电路模块的卡的形式(例如以信用卡的格式)实现。这些数据载体被称为智能卡。在使用中上述类型的数据载体容易遭受各种各样的载荷。由于具有卡体和芯片模块的结构状况,高的压弯载荷能对这种装置起作用,而且依赖于该结构状况,能导致如由芯片折断或电连接撕裂所引起的失败。这种类型的装置的灵敏度依赖于芯片大小以及在半导体芯片的接触垫片之间的接合线连接的长度和所使用的材料。
现有技术中已知的芯片模块通常具有一个由环氧树脂组成的载体。半导体芯片被应用到该载体的第一主侧上,该半导体芯片连接到该载体,如通过粘接连接或叠片。金属化层被应用到与第一主侧相对的该载体的第二主侧上。金属化层具有接触片,并形成其后可外部访问的芯片模块的触点。金属化层通常具有相互电绝缘的六个或八个接触片,并且在所有情况下均通过接合线连接到半导体芯片的接触垫片。在这种情况下,接合线被引入到载体中的凹槽。为机械保护半导体芯片和接合线,灌注混合物被应用到第一主侧并包裹半导体芯片和接合线。
如果例如在邮政发送中在邮件分类装置中发生数据载体遭到压弯载荷,则所述数据载体会被损坏。取决于结构条件,高动能将对信封中的数据载体起作用,高动能一方面是由于高速引起的,另一方面是由于经邮件分类装置的可移动滚筒在方向方面的频率改变引起。
为减小对数据载体装置起作用的压力,曾尝试通过使用特别硬的盖来增加半导体芯片和接合线区域中的模块抗弯力,或通过使用加固元件如芯片载体的第一主测上的框架来将所施加的张力和压缩力转向到在数据载体的芯片模块和卡式体间的粘接处。由于良好的实际经验,有一种替换是使用一种所谓的“热熔性”粘接剂,用于将芯片模块连接到卡式体上,这是由于已经证明由于其弹性特性而具有特别的优点。
尽管如此,如果发生高弯曲应力,也会发生对半导体芯片或芯片模块中的接合线连接的损坏。
因此本发明的目的包括提供即使发生高弯曲应力也具有高可靠性的便携式数据载体装置。
该目的通过权利要求1的特征来实现。
本发明是基于这样的理解:芯片模块的尺寸越小,则半导体芯片或整个芯片模块的弯曲越小。然而,由于在前序部分描述的芯片模块或便携式数据载体设备必须符合预定标准(ISO标准),所以不可能任意地缩减芯片模块的大小。因此,本发明规定芯片载体具有所需要的弯曲点。由于在原则上如果发生弯曲应力,则最弱点产生,所以通过在芯片载体中所需弯曲点的合适装置来容纳半导体芯片和在抗弯曲的区域上的电连接(接合线)是可能的。换句话说,本发明因此提供了被扩展的芯片模块的刚性区域,用这种方式半导体芯片和接合线连接均位于该刚性区域中。
有利的改进在从属权利要求中描述。
在一有利改进中,所需弯曲点位于半导体芯片外的一区域中。如果所需弯曲点被排列在包裹该半导体芯片的盖外,则更加有利。如果所需弯曲点同时位于在凹槽的边缘内的区域中,则对便携式数据载体起作用的压力将最大限度地远离半导体芯片和电连接。
在本发明的一改进中,所需弯曲点通过在金属化层的每一接触片中的至少一个断流器(cutout)来形成,该断流器将各个接触片细分为第一和第二区域。在每一接触片中的至少一个断流器削弱在具有整个芯片模块的最高抗弯曲性的区域中的金属化层。比金属化层厚的芯片载体本身具有一个更低的抗弯曲性。为此,在断流器的点上产生所寻找的所需弯曲点。
通过至少一连接板将第一和第二区域彼此有利地连接。在这种情况下,可能通过电镀改进该接触片而不改变已存在的生产工具和生产切割,这是经过试验和检测的并且合算的方法。如果第一和第二区域的断流器完全彼此分离,则接触片必须通过无电喷镀来改进。
断流器在各个接触片的方向中有利滑动,其中接触片相互靠近。在这种情况下,相邻接触片的断流器位于一个轴上。该轴实质上与半导体芯片的边缘平行。它决不穿过半导体芯片。在这种情况下,推荐使用穿孔的半导体芯片。
各个连接板具有比至少一个断流器更小的宽度。在接触片中剩余的连接板的宽度实质上决定了所需弯曲点的抗弯曲性。连接板的最小可能宽度由电镀需要引起。
作为选择,金属化层也可在所需弯曲点的区域中终止。这只不过表示由断流器形成的接触片的第一区域可消除。
本发明将参考以下的附图详细说明。在附图中:
图1表示根据本发明第一实施例的便携式数据载体的剖面图;
图2表示图1的芯片模块的金属化层的平面图;
图3表示根据本发明,便携式数据载体的第二示范性实施例的剖面图;
图4表示芯片模块的金属化层的可选结构的平面图;以及
图5表示一个便携式数据载体,其中所需弯曲点的位置相对于该卡式体变得更清楚。
图1示出了根据本发明的便携式数据载体的详细情况。芯片模块3用一种公知的方式被引入到卡式体1的凹槽2中。芯片模块3包括一个芯片载体18,一个半导体芯片4被应用到该芯片载体的第一主侧5上。金属化层7被应用到芯片载体18的第二主侧6上。金属化层具有许多接触片(在该图中不可见),经接合线11每一接触片被连接到半导体芯片4的接触垫片。在这种情况下,接合线11经芯片载体18被引入凹槽19中以便与凹槽19中的接触片相接。半导体芯片4和接合线11另外由一盖10如塑料灌注混合物来覆盖。经粘接连接23芯片模块3在芯片载体的侧边缘连接到卡式体1。
粘接连接23以及由例如环氧化物组成的芯片载体18由于它们的材料而具有很高的弹性。然而,比较起来,由铜组成的金属化层7具有高的抗弯曲性。因此,在金属化层被穿孔的接近金属化层的地方形成所需的弯曲点。因此由芯片载体和金属化层的特定结构形成的所需的弯曲点9理论上位于该区域的外面,在该区域中具有半导体芯片4和接合线11。当后者位于凹槽2的侧边12中以及盖10之外时,获得所需弯曲点的最大可能结果。在这种情况下,所需弯曲点执行“万向轴承(cardanic mount)”的功能。当弯曲应力发生时,在所需弯曲点处芯片载体弯曲,但由于它们位于芯片模块的刚性区域中,所以仅有小的压力被传送到半导体芯片和接合线。
图2示出了金属化层7的平面图,金属化层的结构使得其可能在芯片载体中产生所需的弯曲点。金属化层具有八个接触片8。后者通过断流器22彼此电绝缘。在由21标识的刚性区域中,半导体芯片位于芯片载体的相对主侧上(未示出)。所述半导体芯片的边缘不能超出由21标识的区域。19表示如下的点,在该点处,芯片载体(未示出)具有凹槽,通过这些凹槽,接合线被引入并与接触片电连接。矩形区域C1,...C8是用ISO标准7816定义的位置,在该位置处接触片通过外部读/写单元被接触连接。在接触片上的接触区域的位置和大小以及相对于彼此的排列由ISO标准精确定义。
为减小在弯曲应力情况下发生的压力,在大小方面金属化层被缩减到由ISO标准定义的接触区域为止。然而,由于根据本发明的便携式数据载体装置以巨大数量生产,所以本发明的改进和对必要工具的改变与额外的高成本有关。因此,本发明提供了被引入到金属化层中的断流器13,该断流器在任何情况下细分该接触片8为第一区域14和第二区域15。在本示范性实施例中,第一和第二区域14、15通过窄连接板16彼此连接。剩余连接板16被做得越小,在所需弯曲点处的便携式数据载体装置的弯曲能力越大。理论上连接板宽度X在0和0.2mm之间。当意图使接触区域或接触片通过电镀改进时,这种结构是很有利的。电镀所需要的电极被提供在如图7中所示的金属化区域以外。在该金属化层与模块的其它许多金属化层处于连续的带上时执行电镀。在图2中,仍可能看出各个点24,通过这些点,金属化层被连接到载体带(未示出)。
图3示出了根据本发明的一个便携式数据载体装置的第二示范性实施例,与图1中所示的装置的区别仅在于:金属化层7被完全从由ISO标准定义的接触区域C1,...C8中省略了。这导致在卡式体1和芯片模块3的金属化层7之间产生一个不平区域。尽管从技术立场看,这不是缺点,但从美学出发这可能是不希望的。
图4示出了一个替换结构的金属化层7、位于上面区域中的接触片8的平面图,其中每一接触片具有两个断流器13以便在每一接触片中大约中央的位置产生一连接板16。相邻接触片的断流器13位于一轴上。该轴约平行于芯片载体的相对主侧上的半导体芯片(未示出)的位置。在所示的示范性实施例中,连接板16被做成比接触片的宽度更窄。这并不是必然的情形;连接板16越宽,从而,断流器13也相应地更窄。根据本发明,连接板16的宽度在所需的弯曲点处产生所需的弯曲能力。
在下半部中,图4示出了如何在芯片载体中产生所需弯曲点的另一个变体。在该变体中,在所有情况下,接触片8仅由第二区域15组成。如上半部分所述,由断流器13形成的第一区域14被完全从下面的接触片中省略。这在便携式数据载体装置的表面中产生上面已描述过的凹陷。然而这种变型仅在通过电镀精制接触区域时是适当的。因为通过电镀精制不再可能使用常规的工具。
图5以平面图示出了根据本发明的便携式数据载体的卡式体1。数据载体具有在由ISO标准定义的位置处提供了相应接触片8的一个芯片模块3。直接并排排列的接触片8形成与卡式体的短边17a,17b平行的轴。被引入接触片8的断流器13同样位于平行于卡式体的短边17a,17b的一轴上。这是因为最大的弯曲应力平行于卡式体1的长边17c、17d。
在半导体芯片和接合线连接上的弯曲应力可以通过在芯片模块的芯片载体中提供所需的弯曲点而被减小。通过应用到芯片载体上的金属化层的特殊布局来产生所需的弯曲点,同时考虑到ISO7816标准。这使得省却常规的加固元件成为可能,由此节约了成本。
Claims (9)
1、一种具有卡式体(1)的便携式数据载体,具有一个用于接收一个芯片模块(3)的凹槽(2),芯片模块(3)包含在连接到卡式体(1)的芯片载体(18)的第一主侧(5)上的至少一个半导体芯片(4),以及在芯片载体(18)的第二主侧(6)上的具有接触片的金属化层(7),其特征在于:
芯片载体(18)具有所需的弯曲点(9)。
2、如权利要求1所述的便携式数据载体,其特征在于:所需弯曲点(9)位于半导体芯片(4)之外的一个区域中。
3、如权利要求1或2所述的便携式数据载体,其特征在于:所需弯曲点(9)位于包裹半导体芯片(4)的一个盖(10)之外。
4、如权利要求1至3中任何一个所述的便携式数据载体,其特征在于:所需的弯曲点(9)位于凹槽(2)的侧边(12)之内的一个区域中。
5、如权利要求1至4中任何一个所述的便携式数据载体,其特征在于:所需弯曲点由在每一接触片(8)中的至少一个断流器(13)形成,断流器细分各个接触片(8)为第一区域和第二区域(14、15)。
6、如权利要求5所述的便携式数据载体,其特征在于:第一和第二区域(14、15)通过至少一个连接板彼此连接。
7、如权利要求5或6所述的便携式数据载体,其特征在于:断流器(13)沿如下方向延伸,在该方向上接触片(8)彼此相邻。
8、如权利要求5至7中任何一个所述的便携式数据载体,其特征在于:连接板(16)具有比至少一个断流器(13)小得多的宽度。
9、如权利要求1至4中任何一个所述的便携式数据载体,其特征在于:金属化层(7)在所需弯曲点(9)之内的一个区域中终止。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00102073.4 | 2000-02-02 | ||
EP00102073A EP1122685B1 (de) | 2000-02-02 | 2000-02-02 | Chipkarte mit Sollbiegestellen |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1397048A true CN1397048A (zh) | 2003-02-12 |
CN1213386C CN1213386C (zh) | 2005-08-03 |
Family
ID=8167756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN01804414.XA Expired - Fee Related CN1213386C (zh) | 2000-02-02 | 2001-01-15 | 便携式数据载体 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6778407B2 (zh) |
EP (1) | EP1122685B1 (zh) |
JP (1) | JP4284021B2 (zh) |
CN (1) | CN1213386C (zh) |
AT (1) | ATE404941T1 (zh) |
DE (1) | DE50015305D1 (zh) |
ES (1) | ES2312310T3 (zh) |
RU (1) | RU2234130C2 (zh) |
WO (1) | WO2001057793A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1322468C (zh) * | 2003-03-27 | 2007-06-20 | 株式会社电装 | Ic卡 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10208172B4 (de) * | 2002-02-26 | 2005-07-07 | Infineon Technologies Ag | Zwischenträger zum Einsetzen in einen Träger und Träger mit einem Zwischenträger |
US7556746B2 (en) * | 2004-06-03 | 2009-07-07 | Nantero, Inc. | Method of making an applicator liquid for electronics fabrication process |
US7911699B2 (en) * | 2005-12-22 | 2011-03-22 | Guardian Industries Corp. | Optical diffuser with UV blocking coating |
DE602005013807D1 (de) * | 2005-12-30 | 2009-05-20 | Incard Sa | IC Karte mit verbesserter Leiterplatine |
EP1804201B1 (en) * | 2005-12-30 | 2009-05-13 | Incard SA | Module for an IC card |
US7850468B2 (en) * | 2007-06-28 | 2010-12-14 | Super Talent Electronics, Inc. | Lipstick-type USB device |
WO2010040645A2 (de) * | 2008-10-08 | 2010-04-15 | Osram Gesellschaft mit beschränkter Haftung | Schaltungsträger |
TWM362572U (en) * | 2009-04-13 | 2009-08-01 | Phytrex Technology Corp | Signal convertor |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
CN104182793B (zh) * | 2014-08-28 | 2017-03-08 | 绵阳市绵州通有限责任公司 | 一种自调式抗扭曲公交卡 |
US10410996B2 (en) * | 2016-12-02 | 2019-09-10 | Dialog Semiconductor (Uk) Limited | Integrated circuit package for assembling various dice in a single IC package |
DE102021001814A1 (de) | 2021-04-08 | 2022-10-13 | Giesecke+Devrient Mobile Security Gmbh | Chipmodul und Chipkarte |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2580416B1 (fr) * | 1985-04-12 | 1987-06-05 | Radiotechnique Compelec | Procede et dispositif pour fabriquer une carte d'identification electronique |
FR2634095A1 (fr) * | 1988-07-05 | 1990-01-12 | Bull Cp8 | Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit |
JPH0230598A (ja) * | 1988-07-20 | 1990-01-31 | Dainippon Printing Co Ltd | Icモジュールおよびicカード |
FR2639763B1 (fr) * | 1988-11-29 | 1992-12-24 | Schlumberger Ind Sa | Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede |
DE4406704C1 (de) * | 1994-03-02 | 1995-07-20 | Angewandte Digital Elektronik | Chipkarte |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
DE19710144C2 (de) * | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
-
2000
- 2000-02-02 DE DE50015305T patent/DE50015305D1/de not_active Expired - Lifetime
- 2000-02-02 AT AT00102073T patent/ATE404941T1/de not_active IP Right Cessation
- 2000-02-02 EP EP00102073A patent/EP1122685B1/de not_active Revoked
- 2000-02-02 ES ES00102073T patent/ES2312310T3/es not_active Expired - Lifetime
-
2001
- 2001-01-15 JP JP2001556973A patent/JP4284021B2/ja not_active Expired - Fee Related
- 2001-01-15 RU RU2002123376/09A patent/RU2234130C2/ru not_active IP Right Cessation
- 2001-01-15 CN CN01804414.XA patent/CN1213386C/zh not_active Expired - Fee Related
- 2001-01-15 WO PCT/DE2001/000143 patent/WO2001057793A1/de active Application Filing
-
2002
- 2002-08-02 US US10/211,077 patent/US6778407B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1322468C (zh) * | 2003-03-27 | 2007-06-20 | 株式会社电装 | Ic卡 |
Also Published As
Publication number | Publication date |
---|---|
JP4284021B2 (ja) | 2009-06-24 |
DE50015305D1 (de) | 2008-09-25 |
US6778407B2 (en) | 2004-08-17 |
RU2002123376A (ru) | 2004-02-20 |
ES2312310T3 (es) | 2009-03-01 |
JP2003521787A (ja) | 2003-07-15 |
WO2001057793A1 (de) | 2001-08-09 |
ATE404941T1 (de) | 2008-08-15 |
EP1122685A1 (de) | 2001-08-08 |
CN1213386C (zh) | 2005-08-03 |
RU2234130C2 (ru) | 2004-08-10 |
US20030016507A1 (en) | 2003-01-23 |
EP1122685B1 (de) | 2008-08-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1213386C (zh) | 便携式数据载体 | |
EP0992366B1 (en) | Card mounted with circuit chip and circuit chip module | |
CN1143381C (zh) | 用于制作芯片卡-模块的方法 | |
EP1514698B1 (en) | Card mounted with circuit chip and circuit chip module | |
CN1295645C (zh) | 非接触式数据载体的制造方法 | |
CN101405752B (zh) | 存储卡 | |
CN1200460C (zh) | 用于芯片模块的芯片载体及芯片模块的制造方法 | |
CN1238856A (zh) | 芯片模块及制造芯片模块的方法 | |
CN100359682C (zh) | 电子标签及其制造方法 | |
KR100346803B1 (ko) | Ic 카드, ic 카드용 안테나 및 그 안테나 프레임 | |
CN1577389A (zh) | 能进行无接触式通信的通信媒介及其生产方法 | |
US20040256150A1 (en) | Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formed | |
KR20090031209A (ko) | 스마트 카드용 테이프 기판, 반도체 모듈 및 그 제조 방법,및 스마트 카드 | |
EP2472439A1 (en) | Non-contact communication medium | |
CN1156002C (zh) | 半导体芯片载体元件制作方法 | |
CN1203153A (zh) | 具有用于保护ic模块免受外界应力的缝隙的ic卡 | |
EP1002296B1 (en) | Data carrier comprising an implanted module based on a metal lead frame with a double-sided chip cover | |
US6992898B2 (en) | Smart-card module with an anisotropically conductive substrate film | |
CN1647105B (zh) | 数据载体用模块结构及带有该模块结构的数据载体 | |
JP2002500794A (ja) | 金属リードフレームを主体とする差し込みモジュールを有するデータ媒体 | |
CN1208487A (zh) | 用于制造一种含有线圈的芯片卡的芯片卡体 | |
CN1460291A (zh) | 具有小回路高度的接线连接的片状模块 | |
US8331100B2 (en) | Device having several contact areas | |
CN112435982A (zh) | 智能设备、智能卡组件和载带 | |
EP1947594A1 (en) | Circuit carrier laminate and circuit carrier for mounting a semicaonductor chip of a smartcard module, and manufacturing methods thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050803 Termination date: 20200115 |