CN1647105B - 数据载体用模块结构及带有该模块结构的数据载体 - Google Patents
数据载体用模块结构及带有该模块结构的数据载体 Download PDFInfo
- Publication number
- CN1647105B CN1647105B CN038083477A CN03808347A CN1647105B CN 1647105 B CN1647105 B CN 1647105B CN 038083477 A CN038083477 A CN 038083477A CN 03808347 A CN03808347 A CN 03808347A CN 1647105 B CN1647105 B CN 1647105B
- Authority
- CN
- China
- Prior art keywords
- raised portion
- jointing
- coupling part
- data carrier
- reserve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 230000008878 coupling Effects 0.000 claims description 59
- 238000010168 coupling process Methods 0.000 claims description 59
- 238000005859 coupling reaction Methods 0.000 claims description 59
- 239000000463 material Substances 0.000 claims description 10
- 230000007704 transition Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000012856 packing Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229920002994 synthetic fiber Polymers 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000003518 caustics Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L23/00—Apparatus or local circuits for systems other than those covered by groups H04L15/00 - H04L21/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81385—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02100383 | 2002-04-16 | ||
EP02100383.5 | 2002-04-16 | ||
PCT/IB2003/001356 WO2003088140A1 (en) | 2002-04-16 | 2003-04-03 | Module for a data carrier with improved bump counterparts |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1647105A CN1647105A (zh) | 2005-07-27 |
CN1647105B true CN1647105B (zh) | 2010-05-05 |
Family
ID=29225712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN038083477A Expired - Fee Related CN1647105B (zh) | 2002-04-16 | 2003-04-03 | 数据载体用模块结构及带有该模块结构的数据载体 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7045711B2 (zh) |
EP (1) | EP1500041B1 (zh) |
JP (1) | JP2005520261A (zh) |
KR (1) | KR20040103744A (zh) |
CN (1) | CN1647105B (zh) |
AT (1) | ATE515000T1 (zh) |
AU (1) | AU2003214547A1 (zh) |
TW (1) | TWI280508B (zh) |
WO (1) | WO2003088140A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4851981B2 (ja) * | 2007-04-11 | 2012-01-11 | 日精樹脂工業株式会社 | 配線基板の製造方法及び装置 |
CN110099314B (zh) * | 2019-04-30 | 2021-08-10 | 广东省广播电视网络股份有限公司中山分公司 | 基于光纤和同轴电缆的网络系统及其控制方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297562B1 (en) * | 1999-09-20 | 2001-10-02 | Telefonaktieboalget Lm Ericsson (Publ) | Semiconductive chip having a bond pad located on an active device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0513419A (ja) * | 1991-07-03 | 1993-01-22 | Rohm Co Ltd | 半導体素子のバンプ部形成方法 |
US5326428A (en) * | 1993-09-03 | 1994-07-05 | Micron Semiconductor, Inc. | Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
US5483741A (en) * | 1993-09-03 | 1996-01-16 | Micron Technology, Inc. | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice |
US6192581B1 (en) * | 1996-04-30 | 2001-02-27 | Matsushita Electric Industrial Co., Ltd. | Method of making printed circuit board |
DE19831565C1 (de) * | 1998-07-14 | 1999-10-28 | Muehlbauer Ag | Verfahren zum Freilegen von Antennenanschlußflächen einer Chipkarte |
JP2000114314A (ja) * | 1998-09-29 | 2000-04-21 | Hitachi Ltd | 半導体素子実装構造体およびその製造方法並びにicカード |
US6365967B1 (en) | 1999-05-25 | 2002-04-02 | Micron Technology, Inc. | Interconnect structure |
US6465879B1 (en) * | 1999-10-19 | 2002-10-15 | Citizen Watch Co., Ltd. | Structure for mounting semiconductor device, method of mounting same, semiconductor device, and method of fabricating same |
JP2001274323A (ja) * | 2000-03-24 | 2001-10-05 | Hitachi Ltd | 半導体装置とそれを搭載した半導体モジュール、および半導体装置の製造方法 |
US6864423B2 (en) * | 2000-12-15 | 2005-03-08 | Semiconductor Component Industries, L.L.C. | Bump chip lead frame and package |
-
2003
- 2003-04-03 WO PCT/IB2003/001356 patent/WO2003088140A1/en active Application Filing
- 2003-04-03 AU AU2003214547A patent/AU2003214547A1/en not_active Abandoned
- 2003-04-03 KR KR10-2003-7015608A patent/KR20040103744A/ko not_active Application Discontinuation
- 2003-04-03 AT AT03710126T patent/ATE515000T1/de not_active IP Right Cessation
- 2003-04-03 JP JP2003585003A patent/JP2005520261A/ja active Pending
- 2003-04-03 CN CN038083477A patent/CN1647105B/zh not_active Expired - Fee Related
- 2003-04-03 US US10/511,460 patent/US7045711B2/en not_active Expired - Fee Related
- 2003-04-03 EP EP03710126A patent/EP1500041B1/en not_active Expired - Lifetime
- 2003-04-11 TW TW092108387A patent/TWI280508B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297562B1 (en) * | 1999-09-20 | 2001-10-02 | Telefonaktieboalget Lm Ericsson (Publ) | Semiconductive chip having a bond pad located on an active device |
Also Published As
Publication number | Publication date |
---|---|
EP1500041A1 (en) | 2005-01-26 |
TW200405215A (en) | 2004-04-01 |
AU2003214547A8 (en) | 2003-10-27 |
TWI280508B (en) | 2007-05-01 |
US20050230482A1 (en) | 2005-10-20 |
KR20040103744A (ko) | 2004-12-09 |
ATE515000T1 (de) | 2011-07-15 |
JP2005520261A (ja) | 2005-07-07 |
CN1647105A (zh) | 2005-07-27 |
WO2003088140A1 (en) | 2003-10-23 |
AU2003214547A1 (en) | 2003-10-27 |
US7045711B2 (en) | 2006-05-16 |
EP1500041B1 (en) | 2011-06-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: NXP CO., LTD. Free format text: FORMER OWNER: ROYAL PHILIPS ELECTRONICS CO., LTD. Effective date: 20091225 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20091225 Address after: Holland Ian Deho Finn Applicant after: NXP Limited by Share Ltd Co-applicant after: Heraeus GmbH W. C. Address before: Holland Ian Deho Finn Applicant before: Royal Philip Electronics Co., Ltd. Co-applicant before: Heraeus GmbH W. C. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Holland Ian Deho Finn Patentee after: Koninkl Philips Electronics NV Patentee after: Heraeus GmbH W. C. Address before: Holland Ian Deho Finn Patentee before: Koninkl Philips Electronics NV Patentee before: Heraeus GmbH W. C. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100505 Termination date: 20210403 |