CN1208487A - 用于制造一种含有线圈的芯片卡的芯片卡体 - Google Patents

用于制造一种含有线圈的芯片卡的芯片卡体 Download PDF

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CN1208487A
CN1208487A CN97191733A CN97191733A CN1208487A CN 1208487 A CN1208487 A CN 1208487A CN 97191733 A CN97191733 A CN 97191733A CN 97191733 A CN97191733 A CN 97191733A CN 1208487 A CN1208487 A CN 1208487A
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M·格鲁伯
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Abstract

本说明描述了用于制造一种含有线圈的芯片卡的芯片卡体。所描述的芯片卡体的特征在于,线圈是由一个与芯片卡体(1)形成为一个整体的导电通路(20)来形成的。

Description

用于制造一种含有线圈的芯片卡的芯片卡体
本发明涉及用于制造一种含有线圈的芯片卡的芯片卡体。
这类芯片卡可以被用作例如无接触芯片卡(识别系统)，在它里面发生在芯片卡中所提供的芯片与芯片卡读和/或写系统之间的信号传递是通过作为发射器和/或接收器的线圈以无线方式实现的。
一般的这类芯片卡由一个芯片卡体和一个嵌进芯片卡体中相应的凹槽里的芯片模块所组成。
在下面所考虑的情况下，芯片模块含有一个载体元件，一个安装在载体元件上的芯片和一个同样也安装在载体元件上的绕制的线圈；此外，为保护芯片和/或线圈，一些加固元件和/或浇注材料也可以附加地被提供在芯片模块上，但这里不作任何更详细的讨论。
可使用的芯片模块尺寸是由芯片卡体中容纳芯片模块的凹槽的尺寸来决定的。芯片卡体中的凹槽的最大尺寸依次取决于所希望的芯片卡的机械性能，特别是它的稳定性和耐用性。
芯片卡体中的凹槽，并因而还有嵌进其中的芯片模块，通常被做成是相对较小的。在机械上和/或电学上被连接而形成芯片模块的元件封装密度可以因此变得非常高，使得这类芯片卡的生产非常困难，费时且容易失效。
因此本发明的任务就是依据权利要求1的前叙部分如此改进一种芯片卡体，使得含有一个线圈的一种芯片卡的生产可以更为简单。
依据本发明利用权利要求1的特征部分所要求的特征，使这一任务得以实现。
据此它是这样来提供的，即通过一个导电通路形成线圈，该通路与芯片卡体形成一个整体。
通过提供的这种特征，线圈本质上可以在凹槽的外边被形成，因此芯片卡凹槽中待容纳的元件数目可以被减少。这依次又使得减少被安放在凹槽中的分立元件封装密度是可能的(在其它条件不变的情况下)，因此对机械装配和/或电气装配的高的要求就可以被降低。
此外提供了一种芯片卡体，它使得简化含有线圈的芯片卡的生产成为可能。
本发明的一些有利的改进是从属权利要求的课题。
下面参照附图借助一个具体实施例对本发明进行更详细的说明。其中：
图1给出了部分制成的含有一种依据本发明的芯片卡体的芯片卡的一个平面视图，
图2给出了沿图1中所示的A-A线的剖视图，而
图3给出了沿图1中所示的B-B线的剖视图。
这些图中所示芯片卡的芯片卡体1本质上具有制成的芯片卡形式。为了制成芯片卡，所需要的是用一薄膜或其它同类东西去覆盖在图1中平面视图所示的(上)表面区域和在反面的(下)表面区域。
芯片卡体1有一个凹槽10，它在图1的平面视图中及图2和图3的剖视图中均被表示出来，但在其它部分它提供一种本质上是平面的表面。
凹槽10本质上具有一种矩形形状。它的两个边墙，依据图1中的描绘即凹槽10的一个左侧边墙11和一个右侧边墙12垂直地从芯片卡表面下降到凹槽的底面部分13。另外两个边墙，依据图1中描绘的即凹槽10的一个上边墙14和一个下边墙15相对逐渐地从芯片卡表面下降到凹槽10的底面部分13，正如图3中特别清楚地显示出来的那样。
在本实施例中，凹槽10的深度约为0.4mm，芯片卡体1有一个大约0.6mm的总厚度。然而，本发明并不被限定仅为这种尺寸的芯片卡或芯片卡体。
一个线圈第一终端21和一个线圈第二终端22被提供在凹槽10内。
根据图1中的描绘，线圈第一终端12被提供在底面部分13上靠近凹槽10的左侧边墙11，根据图1中的描绘，线圈第二终端22被提供在底面部分13上靠近凹槽10的右侧边墙11。
从线圈第一终端21开始设置一条导电体20，它形成一个导电通路，经过凹槽10的底面部分13，再经过凹槽10的上边墙14出凹槽10，而后以图1所示的方式沿芯片卡的外边沿顺时针方向走线，最后经凹槽10的下边墙15返回到凹槽10的底面部分13，由此形成了一个相应一匝线圈的标准线圈。通过重复或者继续这种导体布线过程，一种(成螺旋形延伸的)相应多匝数的标准线圈就可以被制作出来。在图1中所示具体实施例的情况下，如此形成了一个含有5匝的线圈。导电体20终止在线圈第二终端22。
标准线圈，包括线圈第一终端21和线圈第二终端22，如图1的平面视图所示，布线在芯片卡体的表面上(包括凹槽10的表面)，或者布线在相应的表面部分所提供的并用于对线圈样式的保护和/或绝缘和/或防止移动定位作用的凹痕中。
因而，使用的线圈不再是一个嵌进凹槽中的分立的线圈而是一个与芯片卡体集成在一起的，或者与芯片卡体形成一个不可分的整体的线圈，并且可以完全或至少在本质上在凹槽外边被提供。
虽然严格地说它是一种三维设计，但在所给出的具体实施例中标准线圈表现出了一种本质上的平面(二维)结构(面线圈或者表面线圈)。
导电体20和线圈终端21,22最好是作为一种印刷导线来实现的，它通过涂敷一个导电材料层而形成。通常优先采用的涂敷方法是印刷方法(例如丝网印刷)和/或电镀方法。然而，本发明并不限定为这些方法。原则上，用所希望的材料可以生产具有标准线圈的涂层的所有方法都可以作为涂敷方法而被使用。
标准线圈也可以用一种电学上导电的导线来制作，导线可以被连接到芯片卡体，例如通过粘结和/或熔合。
不管实现标准线圈的方式如何，在凹槽10中提供的线圈终端之间，最好在线圈第一终端21和标准线圈经过凹槽的布线部分之间提供芯片30，该芯片例如通过粘结被固着在凹槽10的底面部分13。
被分配到线圈终端21,22的芯片30的连接端用导线压焊方法在电学上连接到线圈终端21,22。不言而喻，除导线压焊以外的任何其它连接技术也可以被使用；尤其，例如采用所谓冲压焊接技术的直接触点接通也是可能的。
对于制造一种含有芯片并被安放在芯片卡体中的芯片模块的中间步骤可以被省掉，因为芯片直接被安装在芯片卡体上了。
安装在芯片卡体上的芯片30用一种必要时在紫外线下可硬化的包封材料31被密封起来，(所谓的球形包封)，以便保护芯片30和它与线圈的连接。
为了制成芯片卡，在这种情况下就是最后在图1至图3中所示的芯片卡体的上侧和它的下侧装配上薄膜或其它同类东西(这些都更优先以薄片层压形式实现)。如果需要的话，凹槽10可以再用上述包封材料31完全充满或者用单独的包封物所覆盖。
在图中所示具体实施例的情况下，标准线圈被形成在芯片卡体的表面上。如果芯片卡体是由多层结构制成的话，不言而喻，也可在芯片卡体的任何希望的层面上形成标准线圈而不是在芯片卡体的表面上形成标准线圈来提供。这样就可能例如实现，即标准线圈沿着非弯曲表面区域布线，其高度对应着承载线圈终端21,22的凹槽10的底面部分13的高度；因而就可能没有了在凹槽10的上边墙14和凹槽10的下边墙15上的导体布线路线，并且也尤其不必要为此目的去提供这些边墙的倾斜的斜坡了。
标准线圈也不必被迫在芯片卡体的表面上或芯片卡体的一个层的表面上或在这些表面中提供的沟槽里去布线了。代替地也可以被提供的是，标准线圈被提供在芯片卡体内部或芯片卡体的一个层的内部，即处于所有方面(线圈终端除外)都被芯片卡体材料或者芯片卡体层材料或其它材料包围起来(埋置)的状态。
在图中所示具体实施例的情况下，标准线圈在芯片卡体的一个单一(弯曲的)表面区域内本质上是以二维形式构成的。然而，对此同样也没有限制。相反，标准线圈可以以任何所希望的方式在芯片卡体内和在芯片卡体上布线。特别是，也可以想象，例如利用芯片卡体的几个部分作为线圈架，导体20可以用类似在一个层中绕制线圈的方式反复绕着线圈架布线。
不管进入芯片卡体的集成线圈形式如何，与通常的芯片卡体相对比，依据本发明的芯片卡体至少部分地给出了一种线路板的功能，一定数量的元件(例如芯片及其它同类元件)可以被直接安装在它上面，并且如果需要的话，一定的数量的其它元件(除所提到的线圈外，例如也还有电阻器，电容器，晶体管等等)也可以在凹槽外面被集成到它里面(例如用薄膜或厚膜技术)；原来承载所有电气元件和电子元件的芯片模块可以从它的元件载体功能中解放出来，并且被完全省去或者被覆盖凹槽的包封材料所代替。

Claims (14)

1．用于制作含有线圈的芯片卡的芯片卡体，其特征为，线圈由一个与芯片卡体(1)构成一个整体的导电通路(20)来形成。
2．根据权利要求1的芯片卡体，其特征为，芯片卡体(1)是由一种多层芯片卡体层组成的。
3．根据权利要求1或2的芯片卡体，其特征为，导电通路(20)是在芯片卡体的一个或多个表面上和/或在芯片卡体的一个或多个层面上作为一个导电的标准线圈涂敷层，或者作为一个导电的标准线圈导线排布而形成的。
4．根据权利要求3的芯片卡体，其特征为，标准线圈涂敷层和/或标准线圈导线排布是在芯片卡体表面被挖槽部分里面和/或在芯片卡体某些层表面被挖槽部分里面布线的。
5．根据权利要求1或2的芯片卡体，其特征为，导电通路(20)是作为被嵌进芯片卡体(1)中或被嵌进芯片卡体一层中的导电的标准线圈涂敷层或导电的标准线圈导线排布而被形成的。
6．根据前面的权利要求之一的芯片卡体，其特征为，导电通路布线路线本质上是平面展开的，并且以不同的间隔围绕一个预先确定的区域范围多次缠绕的。
7．根据权利要求3至6之一的芯片卡体，其特征为，标准线圈敷层用印刷方法和/或用电镀方法来形成。
8．根据前面的权利要求之一的芯片卡体，其特征为，芯片卡体(1)有一个凹槽(10)用于嵌进一个芯片(30)。
9．根据权利要求8的芯片卡体，其特征为，凹槽(10)和线圈终端(21,22)以如此彼此相关安排，即经过凹槽线圈终端是可以任意接近的。
10．根据权利要求8或9的芯片卡体，其特征为，形成线圈的导电通路(20)其布线的一部分经过凹槽(10)的表面。
11．根据权利要求8至10之一的芯片卡体，其特征为，凹槽(10)是如此形成的，即芯片(30)可以被粘结到它里面。
12．根据权利要求11的芯片卡体，其特征为，凹槽(10)和线圈终端(21,22)是如此彼此相关地安排的，即，在把芯片(30)粘结到凹槽里面之后，线圈终端仍是可以任意地接近的。
13．根据前面的权利要求之一的芯片卡体，其特征为，芯片(30)的连接点，可以用一种压焊方法在电学上被连接到线圈终端(21,22)。
14．根据前面的权利要求之一的芯片卡体，其特征为，芯片(30)的连接点可以用一种冲压焊接方法在电学上被连接到线圈终端(21,22)。
CN97191733A 1996-01-16 1997-01-13 用于制造一种含有线圈的芯片卡的芯片卡体 Pending CN1208487A (zh)

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DE19601391.7 1996-01-16
DE19601391A DE19601391A1 (de) 1996-01-16 1996-01-16 Chipkartenkörper zur Herstellung einer eine Spule enthaltenden Chipkarte

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US6651891B1 (en) 1997-11-04 2003-11-25 Elke Zakel Method for producing contactless chip cards and corresponding contactless chip card

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EP0749614B1 (de) * 1991-05-14 1999-07-14 SkiData AG Kartenförmiger datenträger
NL9200835A (nl) * 1992-05-11 1993-12-01 Nedap Nv Flexibele spoelconstructie in identificatiekaart.
DE4311493C2 (de) * 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
NL9301457A (nl) * 1993-08-23 1995-03-16 Nedap Nv Contactloze identificatiekaart of smart card.
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