CN1657298A - 热敏头及其结合连接方法 - Google Patents

热敏头及其结合连接方法 Download PDF

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Publication number
CN1657298A
CN1657298A CN2005100090899A CN200510009089A CN1657298A CN 1657298 A CN1657298 A CN 1657298A CN 2005100090899 A CN2005100090899 A CN 2005100090899A CN 200510009089 A CN200510009089 A CN 200510009089A CN 1657298 A CN1657298 A CN 1657298A
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mentioned
closing line
weld tabs
discrete electrodes
electrode weld
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CN1326707C (zh
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真岛英臣
诸江道明
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Abstract

本发明提供一种即使以窄间距间隔也能准确地结合连接分立电极和IC电极焊片，从而得到廉价且高性能的热敏头及其结合连接方法。所述热敏头具有头基板和驱动IC基板，所述头基板具有：多个发热电阻器；公用电极；多个分立电极，所述驱动IC基板具有：多个驱动IC；多个IC电极焊片，通过接合线连接了对应的分立电极和IC电极焊片，在上述热敏头中，接合线的线径在23μm以下，具有接合部和上升部，所述接合部的宽度比线径宽，与分立电极或上述IC电极焊片接合，所述上升部是从该接合部上升后从分立电极和IC电极焊片浮上来的状态，IC电极焊片的间距间隔在60μm以下，接合线的接合部的表面积在0.0015mm2以上，并且，接合线的上升部的截面积在0.00025mm2以上。

Description

热敏头及其结合连接方法
技术领域
本发明涉及搭载在例如热转印型打印机上的高性能(300dpi以上)的热敏头及其结合连接(焊接)方法。
背景技术
热敏头具有头基板和驱动IC基板，所述头基板具有由例如玻璃等高绝热材料构成的蓄热层、由通电进行发热的多个发热电阻器、个别地与各发热电阻器导通连接的多个分立电极(单个电极)、和与全部发热电阻器导通连接的公用电极，所述驱动IC基板具有设置于各分立电极、分别控制向多个分立电极的通电/非通电的多个驱动IC、和用于使多个驱动IC与对应的分立电极连接的多个IC电极焊片，通过使经由公用电极和分立电极而使其发热的发热电阻器与墨带和卷绕在压纸辊上的状态的被印刷物压接来进行印刷工作。
在上述热敏头中，能够通过使用了接合线的引线接合来连接对应的IC电极焊片和分立电极。由于按照比发热电阻器的排列间隔窄的间距间隔来配置IC电极焊片，因此，作为接合线，使用线径25μm左右的Au线。在进行引线接合连接时，如图13所示，一般使用热敏头接合用的毛细管(キヤピラリ)40’，其在尖端具有使接合线31’插通的插通支承孔41’和按压插通在该插通支承孔41’中的接合线的圆形按压面42’。具体地说，将毛细管的尖端圆形按压面42’和突出于该尖端圆形按压面42’的接合线31’一起接触在IC电极焊片或分立电极上，通过在该状态下施加超声波振动，使接合线31’与IC电极焊片或分立电极连接。
近年来一直谋求热敏头的进一步高性能化(高记录密度化)，一片头基板的平面大小不变或变小，而使形成在该头基板上的发热电阻器的数量即印刷点数增加。随之，由于分立电极和IC电极焊片的数量也增大，因此，将分立电极和IC电极焊片按多列配置成阶梯状(交错配置)。若在驱动IC基板上进行这样的交错配置，则随着印刷点数增大而基板的大小(宽度尺寸)也增大，能由单一薄板形成的驱动IC基板的数量减少，因此成本增加了。为了使能由一片薄板形成的驱动IC基板的数量增加来谋求低成本化，最好使IC电极焊片的间距间隔尽可能地窄，在与发热电阻器的排列方向大致平行的方向上单列排列地配置多个IC电极焊片。同样地，最好也使分立电极的间距间隔尽可能地窄。
【专利文献1】日本专利公开公报平8-90811号
但是，若分立电极和IC电极焊片(パツド)的间距间隔窄，就限制了结合连接时使用的毛细管的线径，由该毛细管，分立电极和IC电极焊片接合的接合线的接合面积就变小。由Al在硬质的陶瓷基板和玻璃上形成分立电极和IC电极焊片，为了使Au接合线直接接合在该Al上，就需要破坏Al表面的氧化膜而后充分地生成Al和Au的合金(Al的热扩散的共晶相)。这样，若不能确保与接合线的接合表面积在一定以上，就得不到充分的接合强度，由于接触不稳定而电阻率变得不稳定，可靠性(有无断线)就降低。要增大接合表面积，就可以增大对接合线的按压力，增大生成Al和Au的合金所需的能量，但若对接合线的按压力增大，接合线的上升部的厚度(截面积)就变薄，抗拉强度就降低。这样，接合线的接合表面积的增大与接合线的上升部的厚度就成相反关系，特别是在窄间距间隔的分立电极和IC电极焊片中，很难同时满足双方。
发明内容
本发明是鉴于上述课题而作出的，其目的在于即使用窄间距间隔也能够准确地结合连接分立电极和IC电极焊片，得到廉价且高性能的热敏头及其结合(ボンデイング)连接方法。
本发明以接合线与分立电极和IC电极焊片的接合形状(引线楔子形状)为着眼点，规定用于得到理想的接合状态的引线楔子形状的条件，由毛细管形成该引线楔子(リ一ドウエツジ)形状。
即，本发明具有头基板和驱动IC基板，所述头基板具有：按一定间隔排列的多个发热电阻器；与该多个发热电阻器全部连接的公用电极；分别与多个发热电阻器连接的多个分立电极，所述驱动IC基板具有：分别控制向多个分立电极通电/非通电的多个驱动IC；分别与多个驱动IC连接的多个IC电极焊片，其按照比该发热电阻器的排列间隔窄的间距间隔排列在大致平行于发热电阻器的排列方向的方向上，通过接合线结合连接了多个分立电极和多个IC电极焊片，在上述热敏头中，上述接合线的线径在23μm以下，具有接合部和上升部，所述接合部的宽度比线径宽，与分立电极或上述IC电极焊片接合，所述上升部分是从该接合部上升预定角度后从分立电极和IC电极焊片浮上来的状态，IC电极焊片的间距间隔在60μm以下，接合线的接合部的表面积在0.0015mm2以上，并且，接合线的上升部的截面积在0.00025mm2以上。
实际上接合线由Au构成，多个分立电极和多个IC电极焊片的至少一方由Al形成。
此外，根据本发明结合连接方法的方式，热敏头具有头基板和驱动IC基板，所述头基板具有：按一定间隔配置成列状的多个发热电阻器、与该多个发热电阻器全部连接的公用电极、分别与多个发热电阻器连接的多个分立电极，所述驱动IC基板具有：分别控制向多个分立电极通电/非通电的多个驱动IC、分别与多个驱动IC连接的多个IC电极焊片，其按照比该发热电阻器的排列间隔窄的60μm以下的间距间隔排列在大致平行于发热电阻器的排列方向的方向上，在上述热敏头中，准备具有23μm以下的线径的接合线，在通过该接合线结合连接分立电极和IC电极焊片时，使接合线与分立电极和IC电极焊片的接合部的表面积在0.0015mm2以上，并且，使从接合部上升的接合线的上升部的截面积在0.00025mm2以上。
在上述结合连接方法中，为了使接合线与分立电极和IC电极焊片的接合部的表面积在0.0015mm2以上，并且，使从接合部上升的接合线的上升部的截面积在0.00025mm2以上，有以下三种具体实施例。
作为第一实施例，其特征在于，具有下述工序：准备毛细管的工序，所述毛细管具有插通接合线的插通支承孔和按压插通到该插通支承孔中的接合线的尖端按压面，该尖端按压面的平面形状为非圆形状，与分立电极或IC电极焊片的排列方向相正交的方向上的尺寸比该排列方向上的尺寸大；使插通到毛细管的插通支承孔中的接合线位于分立电极或IC电极焊片上，并通过尖端按压面进行按压，对该按压后的接合线给予超声波振动，使其与分立电极或IC电极焊片相接合的工序。最好在该实施例中，毛细管的尖端按压面的与发热电阻器的排列方向相正交的方向上的两端部由曲率大于0.03mm小于0.05mm的曲面构成。
作为第二实施例，具有下述工序：准备毛细管的工序，所述毛细管具有插通接合线的插通支承孔和按压插通到该插通支承孔中的接合线的尖端按压面；使插通到毛细管的插通支承孔中的接合线位于分立电极或IC电极焊片上，并通过尖端按压面进行按压，一边对该按压的接合线给予超声波振动，一边使毛细管在与分立电极或IC电极焊片的排列方向相正交的方向上移动，使接合线与分立电极或IC电极焊片相接合的工序。
作为第三实施例，具有下述工序：在分立电极和上述IC电极焊片的上面形成表面积在0.002mm2以上的Au焊片层的工序；在该Au焊片上连接Au接合线的一端的工序。
本发明具有如下的效果。
根据本发明，即使用窄间距间隔也能够准确地结合连接分立电极和IC电极焊片，能够得到廉价且高性能的热敏头及其结合连接方法。
附图说明
图1是示出本发明的一个实施例涉及的热敏头的平面图。
图2是示出该热敏头的分立电极侧的剖面图。
图3是示出该热敏头的公用电极侧的剖面图。
图4是概略地示出驱动单元的结构的方框图。
图5(a)是示出通过本发明的方法结合连接的Au接合线的接合形状的平面图，(b)是其剖面图。
图6是示出Au接合线的接合有效面积S(mm2)与结合连接成功率(％)的关系的图表。
图7是示出Au接合线的断裂部截面积E(mm2)与引线强度(g)的关系的图表。
图8是示出使Au接合线的断裂部截面积E在本发明方式和现有方式中相同，该断裂部截面积E、本发明涉及的接合有效面积S、现有方式涉及的接合有效面积S’、和毛细管的尖端按压面的两端部的曲率OR的关系的图表。
图9(a)是示出毛细管的侧面图，(b)是示出毛细管的尖端按压面的平面图，(c)是示出该尖端按压面附近的剖面图。
图10(a)是说明第一实施例涉及的结合连接方法的透视剖面图，(b)是其剖面图。
图11是说明第二实施例涉及的结合连接方法的剖面图。
图12是说明第三实施例涉及的结合连接方法的剖面图。
图13(a)是示出现有结构的毛细管的平面图，(b)是示出该毛细管的尖端按压面的平面图，(c)是示出该尖端按压面附近的剖面图。
具体实施方式
图1～图3示出适用了本发明的热敏头1。热敏头1在头基板2上具有蓄热层3，所述头基板2由陶瓷材料或金属材料构成，散热性优良，所述蓄热层3由例如玻璃等绝热材料构成，在该蓄热层3的上面具有在图1的左右方向上按一定间隔排列的多个发热电阻器4。各发热电阻器4是使用Ta2N或Ta-SiO2等金属陶瓷材料形成在蓄热层3上面的整个面上的电阻层4’的一部分，由绝缘势垒(バリア)层5覆盖着该表面。绝缘势垒层5由例如SiO2、SiON、SiAlON等绝缘材料形成，规定着各发热电阻器4的平面大小(长度尺寸L、宽度尺寸W)。在相邻的发热电阻器4之间存在着散热性基板2露出的间隙区域α。在本实施例中，由相邻的一对发热电阻器4(4a、4b)形成一个印刷点部D，多个印刷点部D列状地被配置在与发热电阻器4的通电方向相正交的方向(图1的左右方向)上。
由相互的电阻纵向的一端部为平面コ字形的导体6，连接着一对发热电阻器4a、4b，如图2所示，在一个发热电阻器4a的电阻纵向的另一端部连接着分立电极7，如图3所示，在另一个发热电阻器4b的另一端部连接着公用电极8。该分立电极7和公用电极8对于印刷点部D按同一方向连接，在印刷点部D(发热电阻器4)的排列方向上具有特定的规则性地整齐排列着。在各分立电极7与公用电极8之间存在间隙区域α，由该间隙区域，与发热电阻器4的宽度尺寸W大致相同地规定着分立电极7和公用电极8的宽度尺寸。
在每个印刷点部D上设置着分立电极7，形成为向各发热电阻器4a的电阻纵向延长。该分立电极7在与发热电阻器4a相反的一侧的端部，与驱动单元10的IC电极焊片11引线接合。分立电极7由Al形成。
在每相邻的两个印刷点部D设置有公用电极8，分别配置在设置于该两个印刷点部D上的分立电极7之间。该公用电极8构成大致Y字形，具有与相邻的两个发热电阻器4a相连接的コ字形部、和从该コ字形部向发热电阻器4a的电阻纵向平行延长的直线部。各公用电极8在与发热电阻器4b相反的一侧的端部与公用线9连接。在多个印刷点部D(或多个发热电阻器4)的排列方向上延伸形成着公用线9，从设置在纵向(图1的左右方向)的两端上的一对供电点9a供电。一对供电点9a分别与散热性基板2外面的电源20相连接。将来自公用线9的电力，通过各公用电极8，供给到全部的印刷点部D上。本实施例的导体6、分立电极7和公用电极8的各发热电阻器4侧的端部，覆盖在绝缘势垒层5上。上述导体6、公用电极8和公用线9由例如Cr、Ti、Ni、W等导电材料形成。
无图示，但在绝缘势垒层5、导体6、分立电极7、公用电极8和公用线9的上面形成着耐磨保护层，保护与压纸辊的接触等。
驱动IC基板10与上述头基板2另外设置，如图4所示，具有：多个驱动IC12，分别控制与多个分立电极7的通电/非通电；多个IC电极焊片11，分别与多个驱动IC12相连接；多个外部连接端子14，与各驱动IC12的接地端子相连接。多个外部连接端子14与同驱动IC基板10和头基板2不同的接地焊垫片15相连接，来自该接地焊垫片15的接地电压，通过IC电极焊片11和分立电极7，被给予到各驱动IC12中。多个外部连接端子14各自导通。
IC电极焊片11按照比该发热电阻器4的排列间隔窄的间距间隔，排列在大致平行于发热电阻器4的排列方向的方向(图1的左右方向)上。为了实现300dpi以上的高性能，IC电极焊片11的间距间隔最好在60μm以下，本实施例的IC电极焊片11的间距间隔是58μm。图1中为了方便而简略且放大地示出，但实际上是按上述窄间距间隔配置的。各IC电极焊片11是由Au接合线31与对应的分立电极7引线接合的。
上述结构的热敏头在分立电极7与IC电极焊片11的引线接合中具有特征。以下参照图5，关于Au接合线31的接合形状(引线楔子形状)进行说明。再有，Au接合线31的接合形状在与分立电极7接合的情况下和与IC电极焊片11接合的情况下相同，因此，就对与IC电极焊片11接合的情况进行说明。
Au接合线31具有23μm以下的线径φ。Au接合线31的线径φ被IC电极焊片11和分立电极7的间距间隔限制，通过满足上述范围，就能够不从IC电极焊片11和分立电极7露出，而能够对于两方良好地与Au接合线31相接合。与IC电极焊片11接合的Au接合线31如图5(a)(b)所示，具有比线径φ宽的接合部(图5的阴影线区域)31a和从该接合部31a上升预定角度的上升部31b。接合部31a是在结合连接时接受来自毛细管40(图9)的按压和超声波振动而形成的，由构成IC电极焊片11的Al的热扩散，通过在Au接合线31与IC电极焊片11的界面上生成的合金层(Au与Al的共晶相)，而与IC电极焊片11接合。换言之，在结合连接时、形成在Au接合线31与IC电极焊片11之间的合金层的区域，就成为接合部31a，接合部31a的表面积越大，Au接合线31的接合强度也越大。上升部31b不与IC电极焊片11接合，而保持从该IC电极焊片11浮上了微小距离t的状态。该上升部31b的厚度尺寸、即图5(b)的用A-A线切断后的截面积越大，接合线31的抗拉强度就越大。
图6是示出Au接合线31的接合有效面积S(mm2)与接合成功率(％)的关系的图表。在此，所述Au接合线31的接合有效面积S是Au接合线31的接合部31的表面积。从图6可知，接合有效面积S在0.0003mm2左右时接合成功率低到20％，随着接合有效面积S接近0.001mm2，接合成功率急剧上升。然后，接合有效面积S超过0.0015mm2时，接合成功率就达到100％。这样，若接合有效面积S至少在0.0015mm2以上，就能够准确地结合连接Au接合线31，该结合连接部的电阻值也稳定。
图7是示出Au接合线31的断裂部截面积E(mm2)与引线强度(g)的关系的图表。在此，所述Au接合线31的断裂部截面积是施加预定的拉力后使Au接合线31断线时所产生的断裂部的截面积，实质上与Au接合线31的上升部31b的截面积大致相等。现状的热敏头要求4g以上的引线强度，在图7中用粗线示出该下限值。从图7可知，Au接合线31的断裂部截面积E与引线强度成比例关系，若断裂部截面积E变大，则引线强度也变大。断裂部截面积E大约在0.00025mm2时，到达最低限需要的引线强度4g。这样，若Au接合线31的上升部31b的截面积至少在0.00025mm2以上，就能够确保接合线31的抗拉强度和可靠性。
从上述图6和图7可知，为了使具有23μm以下的线径φ的Au接合线31准确地结合连接，需要满足下面的条件。
(条件1)S≥0.0015mm2
(条件2)E≥0.00025mm2
若满足该结合连接条件1和2，即使按60μm以下的窄间距间隔也能准确地结合连接IC电极焊片。
图9示出结合连接时使用的毛细管40。毛细管40具有插通Au接合线31的插通支承孔41、和按压插通到该插通支承孔41中的Au接合线31的尖端按压面42。插通支承孔41位于尖端按压面42的中心部，插通到该插通支承孔41中的Au接合线31从尖端按压面42的中心突出。尖端按压面42构成非圆形状，与分立电极7和IC电极焊片11的排列方向相正交的方向上(图示X方向)的尺寸比该排列方向上的尺寸(图示Y方向)长，与上述排列方向相正交的方向上的两端部弯曲。该弯曲的尖端按压面42的两端部构成具有预定的曲率OR的曲面。尖端按压面42的两端部的曲率OR越大，该两端部的弯曲就越大，实际按压尖端按压面42中的Au接合线31的有效区域就越少。因此，如图8所示，随着接合部31a的表面积减少，反之上升部31b的截面积(厚度尺寸)就增大。这样，尖端按压面42的两端部的曲率OR就是规定结合连接后的Au接合线31的接合部31a的表面积和上升部31a的截面积(厚度尺寸)的参数。将该曲率OR最优化成满足上述结合连接条件1和2，在本实施例中，从图8可知，设为曲率OR≥0.03mm。曲率OR最好大于0.03mm小于0.05mm，更好的是大于0.03mm小于0.04mm。若是该范围内的曲率OR，就能够最优化接合部31a的表面积和上升部31a的截面积双方。再有，尖端按压面42的平面形状不限于略椭圆形，也可以是矩形、菱形、椭圆形。
下面，关于用于满足上述结合连接条件1和2的结合连接方法的第一实施例进行说明。
首先，分别准备具有23μm以下的线径的Au接合线31、和具有图9中示出的插通支承孔41和非圆形状的尖端按压面42的毛细管40。接着，在毛细管40的插通支承孔41中插通Au接合线31后，使其从尖端按压面42的中心部突出，在该状态下用毛细管40支承Au接合线31。
接着，如图10所示，使Au接合线31位于分立电极7和IC电极焊片11的上面，从其上方开始，用尖端按压面42按压该Au接合线31，在该按压状态下，从毛细管40向Au接合线31给予超声波振动。通过该超声波振动，由Al形成的分立电极7和IC电极焊片11的表面氧化膜被破坏，在该分立电极7或IC电极焊片11与Au接合线31的界面上形成Au或Al的合金。即，Au接合线31与分立电极7或IC电极焊片11相连接，形成依存于毛细管40的尖端按压面42的平面形状和该两端部的曲率OR的接合部31a(图10的阴影线部分)和上升部31b。由于最优化成满足上述结合连接条件1和2，因此，能充分确保接合部31a的表面积和上升部31b的厚度尺寸(截面积)，得到充分的接合强度。
图8中示出了根据图示矩形指标、使用图13中示出的毛细管40’结合连接Au接合线31的现有方式中的接合有效面积S’和断裂部截面积E与毛细管40’的曲率OR的关系。若使断裂部截面积E在本实施例和现有方式中相同，则现有方式涉及的接合有效面积S’就大幅度地小于本实施例涉及的接合有效面积S，若确保断裂部截面积E在0.00025mm2以上，就不能满足上述结合连接条件1。
以上的第一实施例依存于毛细管40的尖端按压面42的平面形状和其两端部的曲率OR，形成为Au接合线31的接合形状。下面，对于不同于上述第一实施例的第二实施例所涉及的结合连接方法进行说明。
在该第二实施例中，与毛细管40的尖端按压面42的平面形状和其两端部的曲率OR无关。然后，如图11所示，一边对由尖端按压面42按压的接合线31给予超声波振动，一边使毛细管40在图示箭头方向(与分立电极7和IC电极焊片的排列方向相正交的方向)上移动，使Au接合线31连接。这样，若使毛细管40在图示箭头方向上移动，就能够使Au接合线31的接合部31a的表面积在与图示箭头方向相正交的方向上延长，既确保上升部31b的截面积，又能使接合部31a的表面积增大。
此外，作为其他实施例，如图12所示，用满足上述结合连接条件1的表面积，在分立电极7和IC电极焊片11的上面预先形成Au焊片51，在该Au焊片51上结合连接Au接合线31。该实施例中也与毛细管40的尖端按压面42的平面形状和其两端部的曲率OR无关。根据该实施例，由于能通过Au焊片51充分确保接触面积，因此，可以使Au接合线31的上升部31b的截面积(厚度尺寸)满足上述连接条件2地接合Au接合线31。
在以上的各实施例中，本发明适用于分立电极7和公用电极8配置于同一方向上的公用折叠结构的热敏头，但本发明也可以适用于分立电极7和公用电极8配置在一条直线上的一般的热敏头。

Claims (7)

1.一种热敏头，具有头基板和驱动IC基板，所述头基板具有：按一定间隔排列的多个发热电阻器；与该多个发热电阻器全部连接的公用电极；分别与上述多个发热电阻器连接的多个分立电极，所述驱动IC基板具有：分别控制向上述多个分立电极通电/非通电的多个驱动IC；分别与上述多个驱动IC连接的多个IC电极焊片，其按照比该发热电阻器的排列间隔窄的间距间隔排列在大致平行于上述发热电阻器的排列方向的方向上，由接合线结合连接了上述多个分立电极和上述多个IC电极焊片，
上述接合线的线径在23μm以下，具有接合部和上升部，所述接合部的宽度比上述线径宽，与上述分立电极或上述IC电极焊片接合，所述上升部分是从该接合部上升预定角度后从上述分立电极和上述IC电极焊片浮上来的状态，
上述IC电极焊片的间距间隔在60μm以下，
上述接合线的接合部的表面积在0.0015mm2以上，并且，
上述接合线的上升部的截面积在0.00025mm2以上。
2.如权利要求1所述的热敏头，其特征在于，上述接合线由Au构成，上述多个分立电极和上述多个IC电极焊片的至少一方由Al形成。
3.一种热敏头的结合连接方法，所述热敏头具有头基板和驱动IC基板，所述头基板具有：按一定间隔配置成列状的多个发热电阻器、与该多个发热电阻器全部连接的公用电极、分别与上述多个发热电阻器连接的多个分立电极，所述驱动IC基板具有：分别控制向上述多个分立电极通电/非通电的多个驱动IC、分别与上述多个驱动IC连接的多个IC电极焊片，其按照比该发热电阻器的排列间隔窄的60μm以下的间距间隔排列在大致平行于上述发热电阻器的排列方向的方向上，
准备具有23μm以下的线径的接合线，在通过该接合线结合连接上述分立电极和上述IC电极焊片时，使上述接合线与上述分立电极和上述IC电极焊片的接合部的表面积在0.0015mm2以上，并且，使从上述接合部上升的上述接合线的上升部的截面积在0.00025mm2以上。
4.如权利要求3所述的热敏头的结合连接方法，其特征在于，具有下述工序：
准备毛细管的工序，所述毛细管具有插通上述接合线的插通支承孔和按压插通到该插通支承孔中的接合线的尖端按压面，该尖端按压面的平面形状为非圆形状，与上述分立电极或上述IC电极焊片的排列方向相正交的方向上的尺寸比该排列方向上的尺寸大；
使插通到上述毛细管的插通支承孔中的接合线位于上述分立电极或上述IC电极焊片上，并通过上述尖端按压面进行按压，对该按压的接合线给予超声波振动，使其与上述分立电极或上述IC电极焊片相接合的工序。
5.如权利要求4所述的热敏头的结合连接方法，其特征在于，上述毛细管的尖端按压面的与上述发热电阻器的排列方向相正交的方向上的两端部，由曲率大于0.03mm小于0.05mm的曲面构成。
6.如权利要求3所述的热敏头的结合连接方法，其特征在于，具有下述工序：
准备毛细管的工序，所述毛细管具有插通上述接合线的插通支承孔和按压插通到该插通支承孔中的接合线的尖端按压面；
使插通到上述毛细管的插通支承孔中的接合线位于上述分立电极或上述IC电极焊片上，并通过上述尖端按压面进行按压，一边对该按压的接合线给予超声波振动，一边使上述毛细管在与上述分立电极或上述IC电极焊片的排列方向相正交的方向上移动，使上述接合线与上述分立电极或上述IC电极焊片相接合的工序。
7.如权利要求3所述的热敏头的结合连接方法，其特征在于，具有下述工序：
在上述分立电极和上述IC电极焊片的上面形成表面积在0.002mm2以上的Au焊片层的工序；
在该Au焊片上连接上述Au接合线的一端的工序。
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